Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (IEC 62435-9:2021)

This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor
device building blocks of all types that are integrated together to into products in the form of
either packages or boards that can be stored as fully assembled units or partial assemblies.
Special attention is given to memories as components and assemblies although methods also
apply to heterogeneous components. Guidelines and requirements for customer-supplier
interaction are provided to manage the complexity.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and
packaged devices.

Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauteile – Teil 9: Sonderfälle (IEC 62435-9:2021)

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 9: Cas particuliers (IEC 62435-9:2021)

Elektronske komponente - Dolgoročno skladiščenje elektronskih polprevodniških elementov - 9. del: Posebni primeri (IEC 62435-9:2021)

General Information

Status
Published
Publication Date
13-Oct-2021
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
07-Oct-2021
Due Date
12-Dec-2021
Completion Date
14-Oct-2021

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SLOVENSKI STANDARD
SIST EN IEC 62435-9:2021
01-december-2021
Elektronske komponente - Dolgoročno skladiščenje elektronskih polprevodniških
elementov - 9. del: Posebni primeri (IEC 62435-9:2021)

Electronic components - Long-term storage of electronic semiconductor devices - Part 9:

Special Cases (IEC 62435-9:2021)

Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauteile – Teil 9:

Sonderfälle (IEC 62435-9:2021)

Composants électroniques - Stockage de longue durée des dispositifs électroniques à

semiconducteurs - Partie 9: Cas particuliers (IEC 62435-9:2021)
Ta slovenski standard je istoveten z: EN IEC 62435-9:2021
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 62435-9:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62435-9:2021
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SIST EN IEC 62435-9:2021
EUROPEAN STANDARD EN IEC 62435-9
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2021
ICS 31.020
English Version
Electronic components - Long-term storage of electronic
semiconductor devices - Part 9: Special cases
(IEC 62435-9:2021)

Composants électroniques - Stockage de longue durée des Elektronische Bauteile - Langzeitlagerung elektronischer

dispositifs électroniques à semiconducteurs - Partie 9: Cas Halbleiterbauteile - Teil 9: Sonderfälle

particuliers (IEC 62435-9:2021)
(IEC 62435-9:2021)

This European Standard was approved by CENELEC on 2021-09-29. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62435-9:2021 E
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SIST EN IEC 62435-9:2021
EN IEC 62435-9:2021 (E)
European foreword

The text of document 47/2700/FDIS, future edition 1 of IEC 62435-9, prepared by IEC/TC 47

"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 62435-9:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022-06-29

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024-09-29

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 62435-9:2021 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 60721 series NOTE Harmonized as EN 60721 series
IEC 60721-3-1 NOTE Harmonized as EN IEC 60721-3-1
IEC 60812 NOTE Harmonized as EN IEC 60812
IEC 62435 series NOTE Harmonized as EN IEC 62435 series
IEC 62435-1 NOTE Harmonized as EN 62435-1
IEC 62435-3 NOTE Harmonized as EN IEC 62435-3
IEC 62435-6 NOTE Harmonized as EN IEC 62435-6
IEC 62435-7 NOTE Harmonized as EN IEC 62435-7
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SIST EN IEC 62435-9:2021
EN IEC 62435-9:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-192 - International electrotechnical vocabulary - - -
Part 192: Dependability
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SIST EN IEC 62435-9:2021
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SIST EN IEC 62435-9:2021
IEC 62435-9
Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor
devices –
Part 9: Special cases
Composants électroniques – Stockage de longue durée des dispositifs
électroniques à semiconducteurs –
Partie 9: Cas particuliers
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-1016-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 62435-9:2021
– 2 – IEC 62435-9:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 7

4 Component storage cases ............................................................................................... 9

5 Storage of memory devices ............................................................................................. 9

5.1 General ................................................................................................................... 9

5.2 Semiconductor memory device types ...................................................................... 9

6 Storage of other devices and partial assembly ............................................................... 11

6.1 General ................................................................................................................. 11

6.2 Wafer-level chip-scale packages ........................................................................... 11

6.3 Heterogeneous devices......................................................................................... 12

6.4 Modules ................................................................................................................ 12

7 Storage in alternative environments ............................................................................... 12

7.1 General ................................................................................................................. 12

7.2 Alternative environments ....................................................................................... 12

7.3 Storage environment effect on use reliability ......................................................... 13

Annex A (informative) Customer-supplier interaction ........................................................... 14

Bibliography .......................................................................................................................... 15

Table 1 – Example failure mechanisms and stimuli for memory devices ................................ 10

Table A.1 – Supplier – customer interaction template............................................................ 14

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SIST EN IEC 62435-9:2021
IEC 62435-9:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –
Part 9: Special cases
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 62435-9 has been prepared by IEC technical committee 47: Semiconductor devices. It is

an International Standard.
The text of this International Standard is based on the following documents:
DRAFT Report on voting
47/2700/FDIS 47/2716/RVD

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
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SIST EN IEC 62435-9:2021
– 4 – IEC 62435-9:2021 © IEC 2021

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 62435 series, published under the general title Electronic

components – Long-term storage of electronic semiconductor devices, can be found on the IEC

website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under webstore.iec.ch in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SIST EN IEC 62435-9:2021
IEC 62435-9:2021 © IEC 2021 – 5 –
INTRODUCTION

This document applies to the long-term storage of electronic components in special cases of

configuration. The custom-client relationship for storage of all cases is also included.

This document deals with the long-term storage (LTS) of electronic devices drawing on the best

long-term storage practices currently known. For the purposes of this document, LTS is defined

as any device storage whose duration can be more than 12 months for product scheduled for

long duration storage. While intended to address the storage of unpackaged semiconductors

and packaged electronic devices, nothing in this document precludes the storage of other items

under the storage levels defined herein.

Although it has always existed to some extent, obsolescence of electronic components and

particularly of integrated circuits, has become increasingly intense over the last few years.

Indeed, with the existing technological boom, the commercial life of a component has become

very short compared with the life of industrial equipment such as that encountered in the

aeronautical field, the railway industry or the energy sector.

The many solutions enabling obsolescence to be resolved are now identified. However,

selecting one of these solutions should be preceded by a case-by-case technical and economic

feasibility study, depending on whether storage is envisaged for field service or production, for

example:
• remedial storage as soon as components are no longer marketed;
• preventive storage anticipating declaration of obsolescence.

Taking into account the expected life of some installations, sometimes covering several

decades, the qualification times, and the unavailability costs, which can also be very high, the

solution to be adopted to resolve obsolescence should often be rapidly implemented. This is

why the solution retained in most cases consists in systematically storing components which

are in the process of becoming obsolescent.

The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery

of the implemented process and especially of the storage environment, although this mastery

becomes critical when it comes to long-term storage. All handling, protection, storage and test

operations are recommended to be performed according to the state of the art.

The application of the approach proposed in this document in no way guarantees that the stored

components are in perfect operating condition at the end of this storage. It only comprises a

means of minimizing potential and probable degradation factors.

Some electronic device users have the need to store electronic devices for long periods of time.

Lifetime buys are commonly made to support production runs of assemblies that well exceed

the production timeframe of its individual parts. This puts the user in a situation requiring careful

and adequate storage of such parts to maintain the as-received solderability and minimize any

degradation effects to the part over time. Major degradation concerns are moisture, electrostatic

fields, ultra-violet light, large variations in temperature, air-borne contaminants, and outgassing.

Warranties and sparing also present a challenge for the user or repair agency as some systems

have been designated to be used for long periods of time, in some cases for up to 40 years or

more. Some of the devices needed for repair of these systems will not be available from the

original supplier for the lifetime of the system or the spare assembly may be built with the

original production run but then require long-term storage. This document was developed to

provide a standard for storing electronic devices for long periods of time.

The storage of devices that are moisture sensitive but that do not need to be stored for long

periods of time is dealt with in IEC TR 62258-3.
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SIST EN IEC 62435-9:2021
– 6 – IEC 62435-9:2021 © IEC 2021

Long-term storage assumes that the device is going to be placed in uninterrupted storage for a

number of years. It is essential that it be useable after storage. It is important that storage

media, the local environment and the associated part data be considered together.

Local environments for long term storage can be unique to the application or to the type of

subassembly being stored for further assembly. Different device types that are integrated into

a single package or module can have different storage requirements that should be considered

during long term storage. A product can contain a single die or multiple dice (example: a CMOS

processor, a GaN radio, sensors and a new type of memory). Each device technology can

impose storage requirements. For example: the memory can be removed from x-ray or high

magnetic field sources and the sensors can be stored in a dark environment or low-pressure

environment.

Such practice requires good communication interactions and agreements for storage that

should account for the possibility and complexity of intermediate assembly of heterogeneous

devices. Successful customer supplier interaction involves clear expectations for device

provenance, traceability and identification.

These guidelines do not imply any warranty of product or guarantee of operation beyond the

storage time given by the manufacturer.

The IEC 62435 series is intended to ensure that adequate reliability is achieved for devices in

user applications after long-term storage. Users are encouraged to request data from suppliers

to applicable specifications to demonstrate a successful storage life as requested by the user.

These standards are not intended to address built-in failure mechanisms that would take place

regardless of storage conditions.

These standards are intended to give practical guide to methods of long-duration storage of

electronic components where this is intentional or planned storage of product for a number of

years. Storage regimes for work-in-progress production are managed according to company

internal process requirements and are not detailed in IEC 62435 (all parts).

The overall standard is split into a number of parts. Parts 1 to 4 apply to any long-term storage

and contain general requirements and guidance, whereas Parts 5 to 9 are specific to the type

of product being stored.
The structure of the IEC 62435 series consists of the following:
– Part 1: General
– Part 2: Deterioration mechanisms
– Part 3: Data
– Part 4: Storage
– Part 5: Die and wafer devices
– Part 6: Packaged or finished devices
– Part 7: MEMS
– Part 8: Passive electronic devices
– Part 9: Special cases
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