SIST EN IEC 62433-1:2019

EMC IC modelling - Part 1: General modelling framework (IEC 62433-1:2019)

This part of IEC 62433 specifies the framework and methodology for EMC IC macro-modelling.
Terms that are commonly used in IEC 62433 (all parts), different modelling approaches,
requirements and data-exchange format for each model category that is standardized in this
series are defined in this document.

EMV-IC-Modellierung - Teil 1: Allgemeine Modellierungsstruktur

Modèles de circuits intégrés pour la CEM - Partie 1: Cadre de modèle général

L'IEC 62433-1:2019 spécifie le cadre et la méthodologie pour des macromodèles de circuits intégrés pour la CEM (EMC IC). Les termes couramment utilisés dans l'IEC 62433 (toutes les parties), différentes approches pour la modélisation, des exigences et un format d’échange de données pour chaque catégorie de modèle normalisée dans cette série sont définis dans le présent document.
L’IEC 62433-1 annule et remplace l’IEC TS 62433-1 parue en 2011. Cette édition constitue une révision technique.
L'IEC 62433-1 inclut les modifications techniques majeures suivantes par rapport à l'IEC TS 62433-1:2011:
– Introduction d’un format d’échange de données pour la représentation d’un modèle de circuit intégré

Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 1. del: Splošni modelirni okvir (IEC 62433-1:2019)

Ta del standarda IEC 62433 določa okvir in metodologijo za makro modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC). V tem dokumentu so opredeljeni izrazi, ki se pogosto uporabljajo v standardu IEC 62433 (vsi deli), različni pristopi z modeliranjem, zahteve in format za izmenjavo podatkov za vsako modelno kategorijo, ki je standardizirana v tej skupini standardov.

General Information

• Status: Published
• Publication Date: 21-May-2019
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 33.100.01 - Electromagnetic compatibility in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 10-May-2019
• Due Date: 15-Jul-2019
• Completion Date: 22-May-2019
• Ref Project: EN IEC 62433-1:2019 - EMC IC modelling - Part 1: General modelling framework

Relations

• Corrected By: SIST EN IEC 62433-1:2019/AC:2020 - EMC IC modelling - Part 1: General modelling framework (IEC 62433-1:2019/COR1:2020)
• Effective Date: 03-Aug-2020

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 62433-1:2019
01-julij-2019
Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 1. del:
Splošni modelirni okvir (IEC 62433-1:2019)
EMC IC modelling - Part 1: General modelling framework (IEC 62433-1:2019)
EMV-IC-Modellierung - Teil 1: Allgemeine Modellierungsstruktur
Modèles de circuits intégrés pour la CEM - Partie 1: Cadre de modèle général
Ta slovenski standard je istoveten z: EN IEC 62433-1:2019
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.01 Elektromagnetna združljivost Electromagnetic compatibility
na splošno in general
SIST EN IEC 62433-1:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62433-1:2019

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SIST EN IEC 62433-1:2019


EUROPEAN STANDARD EN IEC 62433-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
April 2019
ICS 31.200

English Version
EMC IC modelling - Part 1: General modelling framework
(IEC 62433-1:2019)
Modèles de circuits intégrés pour la CEM - Partie 1: Cadre EMV-IC-Modellierung - Teil 1: Allgemeine
de modèle général Modellierungsstruktur
(IEC 62433-1:2019) (IEC 62433-1:2019)
This European Standard was approved by CENELEC on 2019-04-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62433-1:2019 E

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SIST EN IEC 62433-1:2019
EN IEC 62433-1:2019 (E)
European foreword
The text of document 47A/1042/CDV, future edition 1 of IEC 62433-1, prepared by SC 47A "Integrated
circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN IEC 62433-1:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-01-12
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-04-12
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62433-1:2019 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
CISPR 17 NOTE Harmonized as EN 55017


2

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SIST EN IEC 62433-1:2019
EN IEC 62433-1:2019 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 62433 series EMC IC modelling EN 62433 series
ISO 8879 -  Information processing - Text and office - -
systems - Standard Generalized Markup
Language (SGML)
ANSI INCITS 4 1986 Information Systems - Coded Character - -
Sets - 7-Bit American National Standard
Code for Information Interchange (7-Bit
ASCII)




3

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SIST EN IEC 62433-1:2019




IEC 62433-1

®


Edition 1.0 2019-03




INTERNATIONAL



STANDARD








colour

inside










EMC IC modelling –

Part 1: General modelling framework



























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.200 ISBN 978-2-8322-6601-4




  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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SIST EN IEC 62433-1:2019
– 2 – IEC 62433-1:2019 © IEC 2019
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms and conventions . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 10
3.3 Conventions . 11
4 Definition of models . 11
4.1 General . 11
4.2 Conducted emission model . 11
4.3 Radiated emission model . 11
4.4 Conducted immunity model . 12
4.5 Radiated immunity model . 12
4.6 Conducted pulse immunity model . 12
5 Modelling approaches . 12
5.1 General . 12
5.2 Black box modelling approach . 13
5.3 Equivalent circuit modelling approach . 13
5.4 Other modelling approaches . 14
5.4.1 General . 14
5.4.2 Electromagnetic modelling approach . 14
5.4.3 Statistical modelling approach . 14
6 Requirements of model description . 14
7 Model data exchange format . 14
7.1 General . 14
7.2 IC_EMCML structure . 15
7.3 IC_EMCML components . 16
7.3.1 Root element . 16
7.3.2 Global element . 16
7.3.3 Header section . 16
7.3.4 Lead element . 17
7.3.5 Lead_definitions section . 17
7.3.6 Macromodels section . 17
7.3.7 Frequency section . 18
7.3.8 Validity section . 19
7.3.9 Pdn section . 20
7.3.10 Nlb section . 21
7.3.11 Ibc section . 21
7.3.12 Ia section . 21
7.3.13 Ib section . 22
7.3.14 Fb section . 22
7.3.15 Voltage, Current and Power sections . 23
7.3.16 Table section . 23
7.3.17 Coordinate_system section . 24
7.3.18 Reference section . 24
Annex A (normative) Requirements for EMC IC models . 25

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IEC 62433-1:2019 © IEC 2019 – 3 –
Annex B (normative)  Preliminary definitions for XML representation . 26
B.1 XML basics . 26
B.1.1 XML declaration . 26
B.1.2 Basic elements . 26
B.1.3 Root element . 26
B.1.4 Comments . 26
B.1.5 Line terminations . 27
B.1.6 Element hierarchy . 27
B.1.7 Element attributes . 27
B.2 Keyword requirements . 27
B.2.1 General . 27
B.2.2 Keyword characters . 27
B.2.3 Keyword syntax . 28
B.2.4 File structure . 28
B.2.5 Values . 30
Annex C (normative) IC_EMCML valid keywords and usage . 32
C.1 Root element keywords . 32
C.2 Global keywords . 33
C.3 File header keywords . 33
C.4 Lead keyword attributes . 35
C.5 Submodel element attributes . 36
C.6 Vector element keywords . 36
C.7 Lead_definitions section attributes . 37
C.7.1 General . 37
C.7.2 Lead element attributes . 38
C.8 Validity section keywords . 38
C.9 Subckt section attributes . 38
C.10 Netlist section keywords . 39
C.11 Pdn and Ibc section keywords . 39
C.11.1 General . 39
C.11.2 Lead element attributes in the Pdn section . 40
C.11.3 Lead element attributes in the Ibc section . 42
C.12 Ia section keywords . 44
C.12.1 General . 44
C.12.2 Lead element attributes . 44
C.12.3 Voltage section keywords . 45
C.12.4 Current section keywords . 46
C.12.5 Pulse element keywords . 48
C.13 Ib section keywords . 50
C.13.1 Lead element keywords . 50
C.13.2 Max_power_level section keywords . 51
C.13.3 Voltage section keywords . 51
C.13.4 Current section keywords . 52
C.13.5 Power section keywords . 53
C.13.6 Test_criteria section keywords . 54
C.14 Nlb section keywords . 55
C.15 Fb section keywords . 56
C.15.1 Lead element keywords . 56
C.15.2 Table element keywords . 57

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C.15.3 Test_characteristics element attributes . 58
Bibliography . 59

Figure B.1 – Multiple XML files . 29
Figure B.2 – XML files with data files (*.dat) . 29
Figure B.3 – XML files with additional files . 30
Figure C.1 – Pulse signal as defined using the Pulse element . 50

Table 1 – Attributes of Lead keyword in the Lead_definitions section . 17
Table 2 – General definition of the Subckt attributes . 18
Table 3 – Definition of the Validity section . 19
Table A.1 − Requirements for model description . 25
Table B.1 – Valid logarithmic units . 31
Table C.1 – Root element keywords . 32
Table C.2 – Global keywords . 33
Table C.3 – Header element keywords . 34
Table C.4 – Lead element keywords . 35
Table C.5 – Submodel element keywords . 36
Table C.6 – Vector element keywords . 37
Table C.7 – Valid elements in the Lead_definitions section . 37
Table C.8 – Attributes of the Lead element in the Lead_definitions section . 38
Table C.9 – Validity element keywords . 38
Table C.10 – Subckt element keywords . 39
Table C.11 – Netlist element keywords . 39
Table C.12 – Pdn element keywords . 40
Table C.13 – Attributes of the Lead element in the Pdn section . 41
Table C.14 – Attributes of the Lead element in the Ibc section . 43
Table C.15 – Valid keywords in the Ia section . 44
Table C.16 – Attributes of the Lead element in the Ia section . 44
Table C.17 – Voltage element keywords . 45
Table C.18 – Current element keywords . 47
Table C.19 – Attributes of the Pulse element . 48
Table C.20 – Lead element keywords in the Ib section . 50
Table C.21 – Max_power_level section keywords . 51
Table C.22 – Voltage section keywords . 52
Table C.23 – Current section keywords . 53
Table C.24 – Power section keywords. 54
Table C.25 – Test_criteria section keywords . 55
Table C.26 – Lead element keywords in the Nlb section . 55
Table C.27 – Lead element keywords in the Fb section . 56
Table C.28 – Table element keywords in the Fb section . 57
Table C.29 – Test_charactetistics element keywords in the Fb section . 58

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SIST EN IEC 62433-1:2019
IEC 62433-1:2019 © IEC 2019 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

EMC IC MODELLING –

Part 1: General modelling framework

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62433-1 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes
a technical revision.
This edition includes the following significant technical changes with respect to
IEC TS 62433 1:2011:
Incorporation of a data exchange format for an integrated circuit’s model representation.

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SIST EN IEC 62433-1:2019
– 6 – IEC 62433-1:2019 © IEC 2019
The text of this International Standard is based on the following documents:
CDV Report on voting
47A/1042/CDV 47A/1055/RVC

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62433 series, under the general title EMC IC modelling, can be
found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
 reconfirmed,
 withdrawn,
 replaced by a revised edition, or
 amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.


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SIST EN IEC 62433-1:2019
IEC 62433-1:2019 © IEC 2019 – 7 –
EMC IC MODELLING –

Part 1: General modelling framework



1 Scope
This part of IEC 62433 specifies the framework and methodology for EMC IC macro-modelling.
Terms that are commonly used in IEC 62433 (all parts), different modelling approaches,
requirements and data-exchange format for each model category that is standardized in this
series are defined in this document.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62433 (all parts), EMC IC modelling
ISO 8879, Information processing – Text and office systems – Standard Generalized Markup
Language (SGML)
ANSI INCITS 4:1986, Information Systems – Coded Character Sets – 7-Bit American National
Standard Code for Information Interchange (7-Bit ASCII)
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
ICEM-CE
Integrated Circuit Emission Model – Conducted Emissions
macro-model of an integrated circuit (IC) to simulate the conducted electromagnetic emissions
Note 1 to entry: An ICEM-CE macro-model can be used for modelling an IC-die, a functional block and an
Intellectual Property (IP) block.
3.1.2
ICEM-RE
Integrated Circuit Emission Model – Radiated Emissions
macro-model of an integrated circuit (IC) to simulate the radiated electromagnetic emissions

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3.1.3
ICIM-CI
Integrated Circuit Immunity Model – Conducted Immunity
macro-model of an integrated circuit (IC) to simulate the susceptibility levels of the IC to
conducted disturbances applied
...