High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

This part of IEC 62025 specifies a test method for the non-electrical characteristics of the
surface mounted device (SMD) inductors to be used for electronic and telecommunication
equipment. The object of this part of this document is to define methods for measuring
mechanical performance only. As the reliability performances and specifications relative to
non-electrical performances are defined in IEC 62211, detailed measuring methods for
mechanical performance of reliability testing are defined in this document.

Induktive Hochfrequenzbauelemente - Nichtelektrische Eigenschaften und Messmethoden - Teil 2: Messverfahren für nichtelektrische Eigenschaften

Composants inductifs à haute fréquence - Caractéristiques non électriques et méthodes de mesure - Partie 2: Méthodes d'essai pour caractéristiques non électriques

IEC 62025-2:2019 est disponible sous forme de IEC 62025-2:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L’IEC 62025-2:2019 spécifie une méthode d’essai pour les caractéristiques non électriques pour inductances à montage en surface (CMS) utilisées pour les équipements électroniques et de télécommunications. L’objet du présent document concerne uniquement les méthodes de mesure de la performance mécanique. Comme les performances de fiabilité ainsi que les spécifications relatives aux performances non électriques sont spécifiées dans l’IEC 62211, les méthodes de mesures détaillées pour les performances mécaniques des essais de fiabilité sont définies dans le présent document. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- révision du Tableau 5;
- révision des références normatives.

Visokofrekvenčne induktivne komponente - Neelektrične karakteristike in merilne metode - 2. del: Preskusne metode za neelektrične karakteristike

General Information

Status
Published
Publication Date
03-May-2021
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
15-Apr-2021
Due Date
20-Jun-2021
Completion Date
04-May-2021

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SLOVENSKI STANDARD
SIST EN IEC 62025-2:2021
01-junij-2021
Nadomešča:
SIST EN 62025-2:2005
Visokofrekvenčne induktivne komponente - Neelektrične karakteristike in merilne
metode - 2. del: Preskusne metode za neelektrične karakteristike

High frequency inductive components - Non-electrical characteristics and measuring

methods - Part 2: Test methods for non-electrical characteristics
Induktive Hochfrequenzbauelemente - Nichtelektrische Eigenschaften und
Messmethoden - Teil 2: Messverfahren für nichtelektrische Eigenschaften

Composants inductifs à haute fréquence - Caractéristiques non électriques et méthodes

de mesure - Partie 2: Méthodes d'essai pour caractéristiques non électriques
Ta slovenski standard je istoveten z: EN IEC 62025-2:2019
ICS:
29.100.10 Magnetne komponente Magnetic components
SIST EN IEC 62025-2:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 62025-2:2021
---------------------- Page: 2 ----------------------
SIST EN IEC 62025-2:2021
EUROPEAN STANDARD EN IEC 62025-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2019
ICS 29.100.10 Supersedes EN 62025-2:2005 and all of its amendments
and corrigenda (if any)
English Version
High frequency inductive components - Non-electrical
characteristics and measuring methods - Part 2: Test methods
for non-electrical characteristics
(IEC 62025-2:2019)

Composants inductifs à haute fréquence - Caractéristiques Induktive Hochfrequenzbauelemente - Nichtelektrische

non électriques et méthodes de mesure - Partie 2: Eigenschaften und Messmethoden - Teil 2: Messverfahren

Méthodes d'essai pour caractéristiques non électriques für nichtelektrische Eigenschaften

(IEC 62025-2:2019) (IEC 62025-2:2019)

This European Standard was approved by CENELEC on 2019-10-25. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62025-2:2019 E
---------------------- Page: 3 ----------------------
SIST EN IEC 62025-2:2021
EN IEC 62025-2:2019 (E)
European foreword

The text of document 51/1273/CDV, future edition 2 of IEC 62025-2, prepared by IEC/TC 51

"Magnetic components, ferrite and magnetic powder materials" was submitted to the IEC-CENELEC

parallel vote and approved by CENELEC as EN IEC 62025-2:2019.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2020-07-25

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2022-10-25

document have to be withdrawn

This document supersedes EN 62025-2:2005 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62025-2:2019 was approved by CENELEC as a European

Standard without any modification.
---------------------- Page: 4 ----------------------
SIST EN IEC 62025-2:2021
EN IEC 62025-2:2019 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 - Environmental testing - Part 1: General EN 60068-1 -
and guidance
IEC 60068-2-6 2007 Environmental testing - Part 2-6: Tests - EN 60068-2-6 2008
Test Fc: Vibration (sinusoidal)
IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - EN 60068-2-20 -
Test T: Test methods for solderability and
resistance to soldering heat of devices with
leads

IEC 60068-2-21 2006 Environmental testing - Part 2-21: Tests - EN 60068-2-21 2006

Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-27 - Environmental testing - Part 2-27: Tests - EN 60068-2-27 -
Test Ea and guidance: Shock
IEC 60068-2-45 1980 Basic environmental testing procedures - EN 60068-2-45 1992
Part 2-45: Tests - Test XA and guidance:
Immersion in cleaning solvents
+ A1 1993 + A1 1993

IEC 60068-2-58 2015 Environmental testing - Part 2-58: Tests - EN 60068-2-58 2015

Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
+ A1 2017 + A1 2018
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – EN 60068-2-69 -
Test Te/Tc: Solderability testing of
electronic components and printed boards
by the wetting balance (force
measurement) method
IEC 60068-2-77 - Environmental testing - Part 2-77: Tests - EN 60068-2-77 -
Test 77: Body strength and impact shock
---------------------- Page: 5 ----------------------
SIST EN IEC 62025-2:2021
EN IEC 62025-2:2019 (E)
Publication Year Title EN/HD Year
IEC 61188-5-2 - Printed boards and printed board EN 61188-5-2 -
assemblies - Design and use - Part 5-2:
Attachment (land/joint) considerations -
Discrete components
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly - Part 1-2: Requirements for
soldering pastes for high-quality
interconnects in electronics assembly
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic
soldering applications
IEC 62211 2017 Inductive components – Reliability EN 62211 2017
management
---------------------- Page: 6 ----------------------
SIST EN IEC 62025-2:2021
IEC 62025-2
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics
Composants inductifs à haute fréquence – Caractéristiques non électriques et
méthodes de mesure –
Partie 2: Méthodes d’essai pour caractéristiques non électriques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10 ISBN 978-2-8322-7375-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 62025-2:2021
– 2 – IEC 62025-2:2019  IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 7

4 Test conditions ................................................................................................................ 7

4.1 Standard atmospheric conditions for test ................................................................ 7

4.2 Referee conditions .................................................................................................. 7

5 Mechanical characteristics test ........................................................................................ 7

5.1 Body strength test ................................................................................................... 7

5.1.1 Body strength test procedures ......................................................................... 7

5.1.2 Information to be given in the detail specification ............................................. 9

5.2 Robustness of terminations (electrodes) ................................................................. 9

5.2.1 Resistance to bending of printed-circuit board ................................................. 9

5.2.2 Adherence test (see test of Ue of IEC 60068-2-21) ...................................... 13

5.3 Solderability .......................................................................................................... 15

5.3.1 General ......................................................................................................... 15

5.3.2 Preconditioning .............................................................................................. 15

5.3.3 Initial measurement ....................................................................................... 15

5.3.4 Test method .................................................................................................. 15

5.3.5 Recovery ....................................................................................................... 17

5.3.6 Final measurement ........................................................................................ 17

5.3.7 Items to be specified in detail specification .................................................... 17

5.4 Resistance to soldering heat ................................................................................. 18

5.4.1 General ......................................................................................................... 18

5.4.2 Preconditioning .............................................................................................. 18

5.4.3 Initial measurement ....................................................................................... 18

5.4.4 Test method .................................................................................................. 18

5.4.5 Recovery ....................................................................................................... 19

5.4.6 Final measurement ........................................................................................ 19

5.4.7 Items to be specified in detail specification .................................................... 19

5.5 Resistance to dissolution of metallization .............................................................. 20

5.5.1 General ......................................................................................................... 20

5.5.2 Preconditioning .............................................................................................. 20

5.5.3 Initial measurement ....................................................................................... 20

5.5.4 Test methods ................................................................................................. 20

5.5.5 Final measurements ...................................................................................... 20

5.5.6 Items to be specified in detail specification .................................................... 21

5.6 Vibration ............................................................................................................... 21

5.6.1 Test equipment .............................................................................................. 21

5.6.2 Preparation .................................................................................................... 21

5.6.3 Test method .................................................................................................. 21

5.6.4 Items to be specified in detail specification .................................................... 21

5.7 Resistance to shock .............................................................................................. 22

5.7.1 Mechanical shock method .............................................................................. 22

5.7.2 Items to be specified in detail specification .................................................... 22

---------------------- Page: 8 ----------------------
SIST EN IEC 62025-2:2021
IEC 62025-2:2019  IEC 2019 – 3 –

Annex A (normative) Mounting of surface mounting inductor on test printed-circuit

board .................................................................................................................................... 23

A.1 General ................................................................................................................. 23

A.2 Mounting printed-circuit board and mounting land ................................................. 23

A.3 Solder ................................................................................................................... 23

A.4 Preparation ........................................................................................................... 24

A.5 Preheating ............................................................................................................ 24

A.6 Soldering .............................................................................................................. 24

A.7 Cleaning ............................................................................................................... 24

Figure 1 – Method for pressurizing the body ........................................................................... 8

Figure 2 – Pressurizing jig ...................................................................................................... 9

Figure 3 – Example of printed-circuit board ........................................................................... 10

Figure 4 – Layout .................................................................................................................. 12

Figure 5 – Pressurizing jig .................................................................................................... 12

Figure 6 – Pressurizing ......................................................................................................... 12

Figure 7 – Pressurizing and shape of jig ............................................................................... 14

Figure 8 – Reflow temperature profile ................................................................................... 17

Table 1 – Size of soldering lands according to the code of multi-layer chip inductors ........... 10

Table 2 – Thickness of solder paste by the size code of inductors ........................................ 11

Table 3 – Conditions of immersion into solder ....................................................................... 16

Table 4 – Reflow temperature ............................................................................................... 16

Table 5 – Severity ................................................................................................................. 18

Table 6 – Reflow temperature ............................................................................................... 19

Table 7 – Conditions of vibration ........................................................................................... 21

---------------------- Page: 9 ----------------------
SIST EN IEC 62025-2:2021
– 4 – IEC 62025-2:2019  IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
Part 2: Test methods for non-electrical characteristics
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62025-2 has been prepared by IEC technical committee 51:

Magnetic components, ferrite and magnetic powder materials.

This second edition cancels and replaces the first edition published in 2005. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) revision of Table 5;
b) revision of normative references.
---------------------- Page: 10 ----------------------
SIST EN IEC 62025-2:2021
IEC 62025-2:2019  IEC 2019 – 5 –
The text of this standard is based on the following documents:
CDV Report on voting
51/1273/CDV 51/1301/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62025 series, published under the general title High frequency

inductive components – Non-electrical characteristics and measuring methods, can be found

on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
---------------------- Page: 11 ----------------------
SIST EN IEC 62025-2:2021
– 6 – IEC 62025-2:2019  IEC 2019
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
Part 2: Test methods for non-electrical characteristics
1 Scope

This part of IEC 62025 specifies a test method for the non-electrical characteristics of the

surface mounted device (SMD) inductors to be used for electronic and telecommunication

equipment. The object of this part of this document is to define methods for measuring

mechanical performance only. As the reliability performances and specifications relative to

non-electrical performances are defined in IEC 62211, detailed measuring methods for

mechanical performance of reliability testing are defined in this document.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance

IEC 60068-2-6:2007, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)

IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-21:2006, Environmental testing – Part 2-21: Tests – Test U: Robustness of

terminations and integral mounting devices

IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock

IEC 60068-2-45:1980, Basic environmental testing procedures – Part 2-45: Tests – Test XA

and guidance: Immersion in cleaning solvents
IEC 60068-2-45:1980/AMD1:1993

IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)
IEC 60068-2-58:2015/AMD1:2017

IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing

of electronic components and printed boards by the wetting balance (force measurement)

method

IEC 60068-2-77, Environmental testing – Part 2-77: Tests – Test 77: Body strength and

impact shock

IEC 61188-5-2, Printed boards and printed board assemblies – Design and use – Part 5-2:

Attachment (land/joint) considerations – Discrete components
---------------------- Page: 12 ----------------------
SIST EN IEC 62025-2:2021
IEC 62025-2:2019  IEC 2019 – 7 –

IEC 61190-1-2:2014, Attachment materials for electronic assembly – Part 1-2: Requirements

for soldering pastes for high-quality interconnections in electronics assembly

IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for

electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering

applications
IEC 62211:2017, Inductive components – Reliability management
3 Terms and definitions
No terms and definitions are listed in this document.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Test conditions
4.1 Standard atmospheric conditions for test

Unless otherwise specified in the detail specification, the tests and measurements shall be

carried out under the standard atmospheric conditions for test as given in the requirements for

standard reference atmosphere of IEC 60068-1:
– temperature: 15 °C to 35 °C;
– relative humidity: 25 % to 75 %;
– air pressure: 86 kPa to 106 kPa.

In the event of dispute or where required, the measurements shall be repeated using the

referee temperatures (as given in 4.2) and such other conditions as are specified in this

document.

In addition, when it is difficult to make measurements in standard atmospheric conditions,

unless a doubt arises about the validity of the result, the tests and measurements may be

performed in non-standard atmospheric conditions.
4.2 Referee conditions

For referee purposes, one of the standard atmospheric conditions for referee tests taken from

the requirements for standard atmospheres for referee measurements and tests of
IEC 60068-1, shall be selected and shall be as follows:
– temperature: 20 °C ± 2 °C;
– relative humidity: 60 % to 70 %;
– air pressure: 86 kPa to 106 kPa.
5 Mechanical characteristics test
5.1 Body strength test
5.1.1 Body strength test procedures

The body strength test procedure, as specified in IEC 60068-2-77, shall be as follows:

---------------------- Page: 13 ----------------------
SIST EN IEC 62025-2:2021
– 8 – IEC 62025-2:2019  IEC 2019
a) Preconditioning

If required, preconditioning shall be performed on the specimens in accordance with the

detail specification.
b) Initial measurement

The appearance of the specimen shall be checked with a magnification of at least 10×

under adequate light.

If specified in the detail specification, the electrical performances shall be measured.

c) Layout

Unless otherwise specified in the detail specification, the specimen shall be placed on

the supporting base, as shown in Figure 1, so that both ends of the specimen are

symmetrically positioned on the supporting base. The test table shall be placed on a plane,

robust platform so that the test result is not affected when a force is applied.
Dimensions en millimètres
NOTE The angle of the taper in part A shall be between 70° and 90°.
Figure 1 – Method for pressurizing the body
d) Applied force

The force shall be applied to the centre of the specimen by the pressurizing jig as shown

in Figure 2, for a duration of (10 ± 1) s. Unless otherwise specified in the detail

specification, the force shall be selected from either (one of) 10 N, 20 N or 30 N.

If specified in the detail specification, the electrical performances shall be measured

during the application of the force.
---------------------- Page: 14 ----------------------
SIST EN IEC 62025-2:2021
IEC 62025-2:2019  IEC 2019 – 9 –
Dimensions in millimetres

NOTE 1 Dimension W of the pressurizing jig is wider than the width of the specimen.

NOTE 2 Hardness: HV 500 and more.

When the length of the specimen is 2 mm or less, the radius of the pressurizing jig should be 0,2 mm.

Figure 2 – Pressurizing jig
e) Recovery

If required, recovery conditioning shall be performed for the specimens in accordance with

the detail specification.
f) Final measurement

After the test, the appearance of the specimen shall be checked with a magnification of at

least 10× under adequate light. There shall be no signs of damage such as cracks or flaws.

If specified in the detail specification, the electrical performances shall be measured.

5.1.2 Information to be given in the detail specification
The following information shall be given in the detail specification:
a) preconditioning (if required) – see 5.1.1.a);

b) initial measurement items, final measurement items (if required) – see 5.1.1.b) and f);

c) measurement during applied force (if required) – see 5.1.1.d);
d) recovery (if required) – see 5.1.1.e).
5.2 Robustness of terminations (electrodes)
5.2.1 Resistance to bending of printed-circuit board
5.2.1.1 General

The test for the resistance of terminations and electrodes mounted on a printed-circuit board

shall be as follows.
5.2.1.2 Specification of soldering lands
The s
...

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