Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).
This standard provides procedures for determining the solderability and resistance to
soldering heat of devices in applications using solder alloys, which are eutectic or near
eutectic tin lead (Pb), or lead-free alloys.
The procedures use either a solder bath or reflow method and are applicable only to
specimens or products designed to withstand short term immersion in molten solder or limited
exposure to reflow systems.
The solder bath method is applicable to SMDs designed for flow soldering and SMDs
designed for reflow soldering when the solder bath (dipping) method is appropriate.
The reflow method is applicable to the SMD designed for reflow soldering, to determine the
suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not
appropriate.
The objective of this standard is to ensure solderability of component lead or termination. In
addition, test methods are provided to ensure that the component body can resist against the
heat load to which it is exposed during soldering.

Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelementen (SMD)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS)

L'IEC 60068-2-58:2015 décrit l'essai Td applicable aux composants pour montage en surface (CMS). La présente norme fournit des procédures pour déterminer la brasabilité et la résistance à la chaleur de brasage des composants dans les applications qui utilisent des alliages de brasure, qui sont des alliages étain-plomb eutectiques ou quasi eutectiques (Pb), ou des alliages sans plomb. Les procédures utilisent soit une méthode du bain de brasage, soit une méthode de brasage par fusion, et sont applicables uniquement aux éprouvettes ou produits conçus pour résister à une immersion de courte durée dans une brasure fondue ou à une exposition limitée aux systèmes de brasage par fusion. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout d'un alliage de brasure Sn-Bi à faible température; - ajout de plusieurs conditions d'essai de brasage par fusion dans le Tableau 7 - Résistance à la chaleur de brasage - Conditions d'essai et sévérité, méthode de brasage par fusion; - introduction d'une méthode d'essai de brasage par fusion pour l'essai Td3: Démouillage et résistance de la métallisation à la dissolution; - application de lignes directrices pour le choix de la sévérité d'essai à l'article B.3.

Okoljsko preskušanje - 2-58. del: Preskusi - Preskus Td: preskusna metoda za spajkanje, odpornost površinsko montiranih komponent (SMD) proti razkrajanju pokovinjenja in vročini spajke

Ta del standarda IEC 60068 opisuje preskus Td, ki velja za površinsko montirane komponente (SMD). Ta standard določa postopke za določanje spajkanja in odpornosti naprav proti vročini spajke pri uporabi zlitin za spajke, ki so evtektične zlitine, skoraj evtektične zlitine kositer-svinec ali zlitine brez svinca.
V postopkih se uporablja staljena spajkalna zlitina ali metoda pretaljevanja z vročim zrakom ali v dušikovi atmosferi, veljajo pa samo za preskušance ali izdelke, ki so zasnovani, da zdržijo kratkotrajno potopitev v staljeno spajkalno zlitino ali omejeno izpostavljenost sistemom za pretaljevanje z vročim zrakom.
Metoda staljene spajkalne zlitine velja za površinsko montirane komponente, zasnovane za valovno spajkanje, in površinsko montirane komponente, zasnovane za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, ko je primerna metoda s staljeno spajkalno zlitino. Metoda pretaljevanja z vročim zrakom ali v dušikovi atmosferi velja za površinsko montirane komponente, zasnovane za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, za določanje primernosti površinsko montiranih komponent za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, in kadar metoda s staljeno spajkalno zlitino ni primerna.
Cilj tega standarda je zagotoviti spajkanje elektrod ali končnikov komponent. Preskusne metode zagotavljajo tudi, da je telo komponente odporno proti toplotni obremenitvi, ki ji je izpostavljeno med spajkanjem.

General Information

Status
Published
Publication Date
13-Aug-2015
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
15-Jun-2015
Due Date
20-Aug-2015
Completion Date
14-Aug-2015

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SLOVENSKI STANDARD
SIST EN 60068-2-58:2015
01-september-2015
1DGRPHãþD
SIST EN 60068-2-58:2005
2NROMVNRSUHVNXãDQMHGHO3UHVNXVL3UHVNXV7GSUHVNXVQDPHWRGD]D
VSDMNDQMHRGSRUQRVWSRYUãLQVNRPRQWLUDQLKNRPSRQHQW 60' SURWLUD]NUDMDQMX
SRNRYLQMHQMDLQYURþLQLVSDMNH

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability,

resistance to dissolution of metallization and to soldering heat of surface mounting

devices (SMD)

Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit,

Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit

bei oberflächenmontierbaren Bauelementen (SMD)
Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la

soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de

brasage des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: EN 60068-2-58:2015
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 60068-2-58:2015 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60068-2-58:2015
---------------------- Page: 2 ----------------------
SIST EN 60068-2-58:2015
EUROPEAN STANDARD EN 60068-2-58
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2015
ICS 19.040; 31.190 Supersedes EN 60068-2-58:2004
English Version
Environmental testing - Part 2-58: Tests - Test Td: Test methods
for solderability, resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
(IEC 60068-2-58:2015)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td:

Méthodes d'essai de la soudabilité, résistance de la Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit

métallisation à la dissolution et résistance à la chaleur de gegenüber Auflösen der Metallisierung und

brasage des composants pour montage en surface (CMS) Lötwärmebeständigkeit bei oberflächenmontierbaren

(IEC 60068-2-58:2015) Bauelementen (SMD)
(IEC 60068-2-58:2015)

This European Standard was approved by CENELEC on 2015-05-01. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60068-2-58:2015 E
---------------------- Page: 3 ----------------------
SIST EN 60068-2-58:2015
EN 60068-2-58:2015 - 2 -
Foreword

The text of document 91/1222/FDIS, future edition 4 of IEC 60068-2-58, prepared by IEC/TC 91

"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN 60068-2-58:2015.
The following dates are fixed:
(dop) 2016-02-01
• latest date by which the document has to be implemented at
national level by publication of an identical national
standard or by endorsement
(dow) 2018-05-01
• latest date by which the national standards conflicting with
the document have to be withdrawn
This document supersedes EN 60068-2-58:2004.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such

patent rights.
Endorsement notice

The text of the International Standard IEC 60068-2-58:2015 was approved by CENELEC as a

European Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-54 NOTE Harmonized as EN 60068-2-54.
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69.
IEC 60749-20 NOTE Harmonized as EN 60749-20.
IEC 61760-3 NOTE Harmonized as EN 61760-3.
IEC 61760-4 NOTE Harmonized as EN 61760-4 .
1) To be published.
---------------------- Page: 4 ----------------------
SIST EN 60068-2-58:2015
- 3 - EN 60068-2-58:2015
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is

available here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 - Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering
heat of devices with leads
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 -
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in
electronics assembly
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly -
Part 1-2: Requirements for soldering
pastes for high-quality interconnects in
electronics assembly
IEC 61190-1-3 2007 Attachment materials for electronic EN 61190-1-3 2007
assembly -
+ A1 2010 + A1 2010
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications
IEC 61191-2 - Printed board assemblies - EN 61191-2 -
Part 2: Sectional specification -
Requirements for surface mount soldered
assemblies
---------------------- Page: 5 ----------------------
SIST EN 60068-2-58:2015
EN 60068-2-58:2015 - 4 -
Publication Year Title EN/HD Year
IEC 61249-2-22 - Materials for printed boards and other EN 61249-2-22 -
interconnecting structures -
Part 2-22: Reinforced base materials, clad
and unclad - Modified non-halogenated
epoxide woven E-glass laminated sheets of
defined flammability (vertical burning test),
copper-clad
IEC 61249-2-35 - Materials for printed boards and other EN 61249-2-35 -
interconnecting structures -
Part 2-35: Reinforced base materials, clad
and unclad - Modified epoxide woven
E-glass laminate sheets of defined
flammability (vertical burning test), copper-
clad for lead-free assembly
IEC 61760-1 - Surface mounting technology - EN 61760-1 -
Part 1: Standard method for the
specification of surface mounting
components (SMDs)
ISO 9454-2 1998 Soft soldering fluxes - Classification and EN ISO 9454-2 2000
requirements -
Part 2: Performance requirements
---------------------- Page: 6 ----------------------
SIST EN 60068-2-58:2015
IEC 60068-2-58
Edition 4.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
Essais d’environnement –

Partie 2-58: Essais – Essai Td: Méthodes d’essai de la soudabilité, résistance de

la métallisation à la dissolution et résistance à la chaleur de brasage des
composants pour montage en surface (CMS)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-2436-6

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN 60068-2-58:2015
– 2 – IEC 60068-2-58:2015 © IEC 2015
CONTENTS

FOREWORD ......................................................................................................................... 5

1 Scope ............................................................................................................................ 7

2 Normative references..................................................................................................... 7

3 Terms and definitions .................................................................................................... 8

4 Grouping of soldering processes and related test severities ............................................ 9

5 Test equipment ............................................................................................................ 10

5.1 Solder bath ......................................................................................................... 10

5.2 Reflow equipment ............................................................................................... 10

6 Test Td : Solderability of terminations ......................................................................... 11

6.1 Object and general description of the test ............................................................ 11

6.2 Specimen preparation ......................................................................................... 11

6.3 Accelerated ageing ............................................................................................. 11

6.4 Initial measurements ........................................................................................... 11

6.5 Method 1: Solder bath ......................................................................................... 11

6.5.1 Solder bath .................................................................................................. 11

6.5.2 Solder and flux ............................................................................................. 11

6.5.3 Test procedure and conditions ...................................................................... 12

6.6 Method 2: Reflow ................................................................................................ 14

6.6.1 Reflow equipment ........................................................................................ 14

6.6.2 Solder paste ................................................................................................ 14

6.6.3 Test substrates ............................................................................................ 14

6.6.4 Test procedure ............................................................................................. 14

6.6.5 Reflow temperature profile for Test Td ........................................................ 15

6.6.6 Test conditions ............................................................................................ 16

7 Test Td : Resistance to soldering heat ........................................................................ 16

7.1 Object and general description of the test ............................................................ 16

7.2 Specimen preparation ......................................................................................... 16

7.3 Preconditioning ................................................................................................... 16

7.4 Initial measurements ........................................................................................... 16

7.5 Method 1: Solder bath ......................................................................................... 17

7.5.1 Solder bath .................................................................................................. 17

7.5.2 Solder and flux ............................................................................................. 17

7.5.3 Test procedure and conditions ...................................................................... 17

7.6 Method 2: Reflow ................................................................................................ 19

7.6.1 Reflow equipment ........................................................................................ 19

7.6.2 Solder paste ................................................................................................ 19

7.6.3 Test substrates ............................................................................................ 19

7.6.4 Test procedure and conditions ...................................................................... 19

8 Test Td : Dewetting and resistance to dissolution of metallization ................................ 21

8.1 Object and general description of the test ............................................................ 21

8.2 Specimen preparation ......................................................................................... 21

8.3 Initial measurements ........................................................................................... 22

8.4 Method 1: Solder bath ......................................................................................... 22

8.4.1 Solder bath .................................................................................................. 22

8.4.2 Solder and flux ............................................................................................. 22

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SIST EN 60068-2-58:2015
IEC 60068-2-58:2015 © IEC 2015 – 3 –

8.4.3 Test procedure and conditions ...................................................................... 22

8.5 Method 2: Reflow ................................................................................................ 22

8.5.1 Reflow equipment ........................................................................................ 22

8.5.2 Specimen..................................................................................................... 22

8.5.3 Solder paste ................................................................................................ 22

8.5.4 Flux ............................................................................................................. 22

8.5.5 Reflow profile ............................................................................................... 22

8.5.6 Placement of the specimen .......................................................................... 23

8.5.7 Application of the reflow profile..................................................................... 23

8.5.8 Evaluation .................................................................................................... 23

9 Final measurements .................................................................................................... 23

9.1 Flux removal ....................................................................................................... 23

9.2 Recovery conditions ............................................................................................ 23

9.3 Evaluation ........................................................................................................... 23

9.3.1 Wetting ........................................................................................................ 23

9.3.2 Dewetting .................................................................................................... 24

9.3.3 Resistance to soldering heat ........................................................................ 24

9.3.4 Resistance to dissolution of metallization ...................................................... 24

10 Information to be given in the relevant specification ...................................................... 25

10.1 General ............................................................................................................... 25

10.2 Solderability ........................................................................................................ 25

10.3 Resistance to soldering heat, dewetting and resistance to dissolution of

metallization........................................................................................................ 25

Annex A (normative) Criteria for visual examination ............................................................ 27

A.1 Wetting ............................................................................................................... 27

A.2 Evaluation of wetting ........................................................................................... 27

A.3 Evaluation of method 2 (Td ) ............................................................................... 28

A.4 Evaluation of method 2 (Td ) ............................................................................... 29

Annex B (informative) Guidance ......................................................................................... 30

B.1 General ............................................................................................................... 30

B.2 Limitations .......................................................................................................... 30

B.3 Choice of severity ............................................................................................... 30

B.3.1 Test Td : Solderability by solder bath method ............................................... 30

B.3.2 Test Td : Resistance to soldering heat – Solder bath method ....................... 31

B.3.3 Test Td : Resistance to soldering heat –Reflow method ............................... 31

B.3.4 Immersion attitude ....................................................................................... 32

B.3.5 Test Td : Dewetting and resistance to dissolution of metallization for

30 s at 260 °C .............................................................................................. 32

Annex C (normative) Application of the test methods to through hole reflow soldering

components (THR) .............................................................................................................. 33

C.1 Solderability ........................................................................................................ 33

C.2 Resistance to soldering heat ............................................................................... 33

C.3 Dewetting............................................................................................................ 33

C.4 Criteria for evaluation .......................................................................................... 33

Annex X (informative) Cross reference for references to the prior revision of this

specification ....................................................................................................................... 34

Bibliography ....................................................................................................................... 36

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SIST EN 60068-2-58:2015
– 4 – IEC 60068-2-58:2015 © IEC 2015

Figure 1 – Examples of immersion attitudes ........................................................................ 13

Figure 2 – Reflow temperature profile for solderability ......................................................... 15

Figure 3 – Examples of immersion attitude .......................................................................... 18

Figure 4 – Reflow temperature profile for resistance to soldering heat .................................. 20

Figure 5 – Example for placement of a specimen to a test substrate .................................... 23

Figure 6 – Identification of areas on metallic termination ...................................................... 24

Figure A.1 – Evaluation of wetting ....................................................................................... 28

Table 1 – Grouping of soldering processes and typical test severities – Overview ................ 10

Table 2 – Solder alloy and flux for test Td .......................................................................... 12

Table 3 – Solderability – Test conditions and severity, solder bath method ........................... 14

Table 4 – Solder paste specification .................................................................................... 14

Table 5 – Solderability – Test conditions – Method 2: Reflow ............................................... 16

Table 6 – Resistance to soldering heat – Test conditions and severity, solder bath

method ............................................................................................................................... 19

Table 7 – Resistance to soldering heat – Test conditions and severity, reflow method .......... 21

Table 8 – Dewetting and resistance to dissolution of metallization – Test conditions

and severity, solder bath method ......................................................................................... 22

Table B.1 – Test conditions ................................................................................................. 31

Table C.1 – Test conditions for solderability test .................................................................. 33

---------------------- Page: 10 ----------------------
SIST EN 60068-2-58:2015
IEC 60068-2-58:2015 © IEC 2015 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-58: Tests –
Test Td: Test methods for solderability, resistance
to dissolution of metallization and to soldering heat
of surface mounting devices (SMD)
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60068-2-58 has been prepared by IEC technical committee 91:

Electronics assembly technology.

This fourth edition cancels and replaces the third edition, published in 2004 and constitutes a

technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
– the addition of Sn-Bi low temperature solder alloy;

– the addition of several reflow test conditions in Table 7 – Resistance to soldering heat –

Test conditions and severity, reflow method;

– introduction of reflow test method for Test Td : Dewetting and resistance to dissolution of

metallization;
---------------------- Page: 11 ----------------------
SIST EN 60068-2-58:2015
– 6 – IEC 60068-2-58:2015 © IEC 2015
– implementation of guidance for the choice of a test severity in Clause B.3.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1222/FDIS 91/1250/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60068, published under the general title Environmental testing,

can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 12 ----------------------
SIST EN 60068-2-58:2015
IEC 60068-2-58:2015 © IEC 2015 – 7 –
ENVIRONMENTAL TESTING –
Part 2-58: Tests –
Test Td: Test methods for solderability, resistance
to dissolution of metallization and to soldering heat
of surface mounting devices (SMD)
1 Scope

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).

This standard provides procedures for determining the solderability and resistance to

soldering heat of devices in applications using solder alloys, which are eutectic or near

eutectic tin lead (Pb), or lead-free alloys.

The procedures use either a solder bath or reflow method and are applicable only to

specimens or products designed to withstand short term immersion in molten solder or limited

exposure to reflow systems.

The solder bath method is applicable to SMDs designed for flow soldering and SMDs

designed for reflow soldering when the solder bath (dipping) method is appropriate.

The reflow method is applicable to the SMD designed for reflow soldering, to determine the

suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not

appropriate.

The objective of this standard is to ensure solderability of component lead or termination. In

addition, test methods are provided to ensure that the component body can resist against the

heat load to which it is exposed during soldering.
This standard covers tests Td , Td and Td as listed be
...

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