SIST EN IEC 61967-4:2021
(Main)Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method (IEC 61967-4:2021)
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method (IEC 61967-4:2021)
This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission
(EME) of integrated circuits by direct radio frequency (RF) current measurement with a
1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These
methods ensure a high degree of reproducibility and correlation of EME measurement results.
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen – Teil 4: Messung der leitungsgeführten Aussendungen - Messung mit direkter 1-Ohm-/150-Ohm-Kopplung (IEC 61967-4:2021)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 4 : Mesure des émissions conduites - Méthode par couplage direct 1 ohm/150 ohm (IEC 61967-4:2021)
IEC 61967-4:2021 est disponible sous forme de IEC 61967-4:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 61967-4:2021 spécifie une méthode de mesure de l’émission électromagnétique (EME) conduite des circuits intégrés par mesure directe des courants RF avec une sonde résistive de 1 Ω et mesure des tensions RF en utilisant un réseau de couplage de 150 Ω. Ces méthodes assurent un degré élevé de reproductibilité, ainsi que la corrélation des résultats des mesures EME. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- la gamme de fréquences de 150 kHz à 1 GHz a été supprimée du titre;
- la gamme de fréquences recommandée pour la méthode à 1 Ω a été réduite à 30 MHz;
- l’Annexe G avec les recommandations et les lignes directrices pour l’extension de gamme de fréquences au-dessus de 1 GHz a été ajoutée.
Integrirana vezja - Meritve elektromagnetnega sevanja - 4. del: Meritve prevajanega sevanja, metoda neposrednega sklopa 1 ohm/150 ohmov (IEC 61967-4:2021)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 61967-4:2021
01-julij-2021
Nadomešča:
SIST EN 61967-4:2005
SIST EN 61967-4:2005/A1:2006
SIST EN 61967-4:2005/AC:2017
Integrirana vezja - Meritve elektromagnetnega sevanja - 4. del: Meritve prevajanega
sevanja, metoda neposrednega sklopa 1 ohm/150 ohmov (IEC 61967-4:2021)
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement
of conducted emissions, 1 ohm/150 ohm direct coupling method (IEC 61967-4:2021)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen – Teil 4:
Messung der leitungsgeführten Aussendungen - Messung mit direkter 1-Ohm-/150-Ohm-
Kopplung (IEC 61967-4:2021)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 4 : Mesure des
émissions conduites - Méthode par couplage direct 1 ohm/150 ohm (IEC 61967-4:2021)
Ta slovenski standard je istoveten z: EN IEC 61967-4:2021
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN IEC 61967-4:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 61967-4:2021
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SIST EN IEC 61967-4:2021
EUROPEAN STANDARD EN IEC 61967-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2021
ICS 31.200 Supersedes EN 61967-4:2002 and all of its amendments
and corrigenda (if any)
English Version
Integrated circuits - Measurement of electromagnetic emissions
- Part 4: Measurement of conducted emissions - 1 Ω/150 Ω
direct coupling method
(IEC 61967-4:2021)
Circuits intégrés - Mesure des émissions Integrierte Schaltungen - Messung von
électromagnétiques - Partie 4: Mesure des émissions elektromagnetischen Aussendungen - Teil 4: Messung der
conduites - Méthode par couplage direct 1 Ω/150 Ω leitungsgeführten Aussendungen - Messung mit direkter 1-
(IEC 61967-4:2021) Ohm-/150-Ohm-Kopplung
(IEC 61967-4:2021)
This European Standard was approved by CENELEC on 2021-04-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61967-4:2021 E
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SIST EN IEC 61967-4:2021
EN IEC 61967-4:2021 (E)
European foreword
The text of document 47A/1101/CDV, future edition 2 of IEC 61967-4, prepared by SC 47A "Integrated
circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN IEC 61967-4:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-01-20
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-04-20
document have to be withdrawn
This document supersedes EN 61967-4:2002 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61967-4:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
CISPR 16-1-2 NOTE Harmonized as EN 55016-1-2
CISPR 25 NOTE Harmonized as EN 55025
2
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SIST EN IEC 61967-4:2021
EN IEC 61967-4:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61000-4-6 - Electromagnetic compatibility (EMC) - Part 4-6: EN 61000-4-6 -
Testing and measurement techniques -
Immunity to conducted disturbances, induced by
radio-frequency fields
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1: General
conditions and definitions
3
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SIST EN IEC 61967-4:2021
IEC 61967-4
®
Edition 2.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 4: Mesure des émissions conduites – Méthode par couplage direct
1 Ω/150 Ω
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-9568-7
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 61967-4:2021
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CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General . 7
4.1 Measurement basics . 7
4.2 RF current measurement . 9
4.3 RF voltage measurement at IC pins . 9
4.4 Assessment of the measurement technique . 9
5 Test conditions . 9
6 Test equipment . 10
6.1 RF measuring instrument . 10
6.2 RF current probe specification . 10
6.3 Test of the RF current probe capability . 11
6.4 Matching network specification . 11
7 Test setup . 12
7.1 General test configuration . 12
7.2 Printed circuit test board layout . 12
8 Test procedure . 13
9 Test report . 13
Annex A (informative) Probe verification procedure . 14
Annex B (informative) Classification of conducted emission levels . 18
B.1 Introductory remark . 18
B.2 General . 18
B.3 Definition of emission levels . 18
B.4 Presentation of results . 18
B.4.1 General . 18
B.4.2 Examples. 20
Annex C (informative) Example of reference levels for automotive applications. 22
C.1 Introductory remark . 22
C.2 General . 22
C.3 Reference levels . 22
C.3.1 General . 22
C.3.2 Measurements of conducted emissions, 1 Ω method . 23
C.3.3 Measurements of conducted emissions, 150 Ω method . 23
Annex D (informative) EMC requirements and how to use EMC IC measurement
techniques . 24
D.1 Introductory remark . 24
D.2 Using EMC measurement procedures . 24
D.3 Assessment of the IC influence to the EMC behaviour of the modules . 24
Annex E (informative) Example of a test setup consisting of an EMC main test board
and an EME IC test board . 26
E.1 Introductory remark . 26
E.2 EMC main test board . 26
E.3 EME IC test board. 28
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E.3.1 General explanation of the test board . 28
E.3.2 How to build the test system . 28
E.3.3 PCB layout and component positioning . 30
Annex F (informative) 150 Ω direct coupling networks for common mode emission
measurements of differential mode data transfer ICs and similar circuits . 32
F.1 Basic direct coupling network . 32
F.2 Example of a common-mode coupling network alternative for LVDS or
RS485 or similar systems . 33
F.3 Example of a common-mode coupling network alternative for differential IC
outputs to resistive loads (e.g. airbag ignition driver) . 34
F.4 Example of a common-mode coupling network for CAN systems . 34
Annex G (informative) Measurement of conducted emissions in extended frequency
range . 35
G.1 General . 35
G.2 Guidelines . 35
G.2.1 Measurement network . 35
G.2.2 Network components . 36
G.2.3 Network layout . 38
G.2.4 Network verification . 38
G.2.5 Test board . 39
G.3 Application area . 41
Bibliography . 43
Figure 1 – Example of two emitting loops returning to the IC via common ground . 8
Figure 2 – Example of IC with two ground pins, a small I/O loop and two emitting loops . 8
Figure 3 – Construction of the 1 Ω RF current probe . 10
Figure 4 – Impedance matching network corresponding with IEC 61000-4-6 . 12
Figure 5 – General test configuration . 12
Figure A.1 – Test circuit . 14
Figure A.2 – Insertion loss of the 1 Ω probe . 14
Figure A.3 – Layout of the verification test circuit . 15
Figure A.4 – Connection of the verification test circuit . 16
Figure A.5 – Minimum decoupling limit versus frequency . 16
Figure A.6 – Example of 1 Ω probe input impedance characteristic . 17
Figure B.1 – Emission level scheme. 19
Figure B.2 – Example of the maximum emission level G8f . 20
Figure C.1 – 1 Ω method − Examples of reference levels for conducted disturbances
from semiconductors (peak detector) . 23
Figure C.2 – 150 Ω method − Examples of reference levels for conducted disturbances
from semiconductors (peak detector) . 23
Figure E.1 – EMC main test board . 27
Figure E.2 – Jumper field . 27
Figure E.3 – EME IC test board (contact areas for the spring connector pins of the
main test board) . 28
Figure E.4 – Example of an EME IC test system . 29
Figure E.5 – Component side of the EME IC test board . 30
Figure E.6 – Bottom side of the EME IC test board . 31
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Figure F.1 – Basic direct coupling for common mode EMC measurements . 32
Figure F.2 – Measurement setup for the S21 measurement of the common-mode
coupling . 33
Figure F.3 – Using split load termination as coupling for measuring equipment . 33
Figure F.4 – Using split load termination as coupling for measuring equipment . 34
Figure F.5 – Example of an acceptable adaptation for special network requirements
(e.g. for CAN systems) . 34
Figure G.1 – Example of a 150 Ω measurement network . 36
Figure G.2 – Example of RF characteristic of network components . 37
Figure G.3 – Examples of S21 characteristic by simulation . 39
Figure G.4 – Examples of test board section . 40
Figure G.5 – Examples of unwanted cross coupling between measurement network
and traces on test PCB . 40
Figure G.6 – Examples of unwanted signal line cross coupling on S21 transfer
characteristic of RF measurement network . 40
Figure G.7 – Examples of test board with additional signal line connected to IC pin . 41
Figure G.8 – Examples of stub lines length effects on S21 transfer characteristic of
RF measurement network . 41
Table 1 – Specification of the RF current probe . 11
Table 2 – Characteristics of the impedance matching network . 12
Table B.1 – Emission levels . 21
Table D.1 – Examples in which the measurement procedure can be reduced . 24
Table D.2 – System- and module-related ambient parameters . 25
Table D.3 – Changes at the IC which influence the EMC. 25
Table G.1 – Draft selection table for conducted emission measurements at pins above
1 GHz . 42
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SIST EN IEC 61967-4:2021
IEC 61967-4:2021 © IEC:2021 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –
Part 4: Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61967-4 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2002 and
Amendment 1:2006. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) frequency range of 150 kHz to 1 GHz has been deleted from the title;
b) recommended frequency range for 1 Ω method has been reduced to 30 MHz;
c) Annex G with recommendations and guidelines for frequency range extension beyond
1 GHz has been added.
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The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1101/CDV 47A/1107/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
Measurement of electromagnetic emissions can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
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SIST EN IEC 61967-4:2021
IEC 61967-4:2021 © IEC:2021 – 7 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –
Part 4: Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method
1 Scope
This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission
(EME) of integrated circuits by direct radio frequency (RF) current measurement with a
1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These
methods ensure a high degree of reproducibility and correlation of EME measurement results.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61000-4-6, Electromagnetic compatibility (EMC) – Part 4-6: Testing and measurement
techniques – Immunity to conducted disturbances, induced by radio-frequency fields
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
3 Terms and definitions
For the purposes of this document, the terms and definitions of IEC 61967-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 General
4.1 Measurement basics
The maximum tolerated emission level from an integrated circuit (IC) depends on the permitted
maximum emission level of the electronic system, which includes the IC, and also on the
immunity level of other parts of the electronic system itself (so called inherent EMC). The value
of this emission level is dependent on system and application specific (ambient) parameters.
To characterise ICs, i.e. to provide typical EME values for a data sheet, a simple measurement
procedure and non-resonant measurement setup are required to guarantee a high degree of
reproducibility. Subclause 4.1 describes the basis of this test procedure.
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Figure 1 – Example of two emitting loops returning to the IC via common ground
The emission of an IC is generated by sufficiently fast changes of voltages and currents inside
the IC. These changes drive RF currents inside and outside the IC. The RF currents cause
conducted EME, which is mainly distributed via the IC pins conductor loops in the printed circuit
board (PCB) and the cabling. These loops are regarded as the emitting loop antennas. In
comparison to the dimension of these loops, the loops in the internal IC structure are considered
to be small.
The RF currents that accompany ICs action are different in amplitude, phase a
...
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