SIST EN 60664-3:2017
(Main)Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution (IEC 60664-3:2016)
Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution (IEC 60664-3:2016)
Applies to rigid printed board assemblies protected by a coating of insulating material on one or both sides. Describes the requirements and test procedures. Has the status of a basic safety publication in accordance with IEC Guide 104.
Isolationskoordination für elektrische Betriebsmittel in Niederspannungsanlagen - Teil 3: Anwendung von Beschichtungen, Eingießen oder Vergießen zum Schutz gegen Verschmutzung (IEC 60664-3:2016)
Coordination de l'isolement des matériels dans les systèmes (réseaux) à basse tension - Partie 3: Utilisation de revêtement, d'empotage ou de moulage pour la protection contre la pollution (IEC 60664-3:2016)
S'applique aux cartes imprimées rigides équipées protégées par un revêtement de matériau isolant déposé sur une de leurs faces ou sur les deux. Décrit les prescriptions et les modes opératoires des essais. A le statut d'une publication fondamentale de sécurité conformément au Guide 104.
Uskladitev izolacije za opremo v okviru nizkonapetostnih sistemov - 3. del: Zaščita pred onesnaženjem s prevlekami, zapiranjem v ohišja ali zalivanjem (IEC 60664-3:2016)
Uporablja se za nepremične sestave plošč tiskalnih vezij, zaščitenih s prevleko izolacijskega materiala na eni ali obeh straneh. Opisuje zahteve in preskusne postopke. Ta standard ima status osnovne varnostne publikacije v skladu z vodilom 104 Mednarodne elektrotehniške komisije.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60664-3:2017
01-september-2017
1DGRPHãþD
SIST EN 60664-3:2004
SIST EN 60664-3:2004/A1:2010
8VNODGLWHYL]RODFLMH]DRSUHPRYRNYLUXQL]NRQDSHWRVWQLKVLVWHPRYGHO =DãþLWD
SUHGRQHVQDåHQMHPVSUHYOHNDPL]DSLUDQMHPYRKLãMDDOL]DOLYDQMHP ,(&
Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating,
potting or moulding for protection against pollution (IEC 60664-3:2016)
Isolationskoordination für elektrische Betriebsmittel in Niederspannungsanlagen - Teil 3:
Anwendung von Beschichtungen, Eingießen oder Vergießen zum Schutz gegen
Verschmutzung (IEC 60664-3:2016)
Coordination de l'isolement des matériels dans les systèmes (réseaux) à basse tension -
Partie 3: Utilisation de revêtement, d'empotage ou de moulage pour la protection contre
la pollution (IEC 60664-3:2016)
Ta slovenski standard je istoveten z: EN 60664-3:2017
ICS:
29.080.30 Izolacijski sistemi Insulation systems
SIST EN 60664-3:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 60664-3:2017
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SIST EN 60664-3:2017
EUROPEAN STANDARD EN 60664-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 29.080.30 Supersedes EN 60664-3:2003
English Version
Insulation coordination for equipment within low-voltage systems
- Part 3: Use of coating, potting or moulding for protection
against pollution
(IEC 60664-3:2016)
Coordination de l'isolement des matériels dans les Isolationskoordination für elektrische Betriebsmittel in
systèmes (réseaux) à basse tension - Partie 3: Utilisation Niederspannungsanlagen - Teil 3: Anwendung von
de revêtement, d'empotage ou de moulage pour la Beschichtungen, Eingießen oder Vergießen zum Schutz
protection contre la pollution gegen Verschmutzung
(IEC 60664-3:2016) (IEC 60664-3:2016)
This European Standard was approved by CENELEC on 2016-12-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60664-3:2017 E
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SIST EN 60664-3:2017
EN 60664-3:2017
European foreword
The text of document 109/153/FDIS, future edition 3 of IEC 60664-3, prepared by IEC/TC 109
“Insulation co-ordination for low-voltage equipment" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN 60664-3:2017.
The following dates are fixed:
(dop) 2017-12-16
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-06-16
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60664-3:2003.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CENELEC by the European Commission
and the European Free Trade Association.
Endorsement notice
The text of the International Standard IEC 60664-3:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60194:2006 NOTE Harmonized as EN 60194:2006
2
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SIST EN 60664-3:2017
EN 60664-3:2017
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 - Environmental testing -- Part 2-1: Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing -- Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-14 - Environmental testing -- Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-78 - Environmental testing -- Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 60326-2 1990 Printed boards -- Part 2: Test methods - -
+ A1 2001 + A1 2001
IEC 60664-1 2007 Insulation coordination for equipment EN 60664-1 2007
within low-voltage systems -- Part 1:
Principles, requirements and tests
IEC 61189-2 2006 Test methods for electrical materials, EN 61189-2 2006
printed boards and other interconnection
structures and assemblies -- Part 2: Test
methods for materials for interconnection
structures
IEC 61189-3 2007 Test methods for electrical materials, EN 61189-3 2008
printed boards and other interconnection
structures and assemblies -- Part 3: Test
methods for interconnection structures
(printed boards)
IEC 61249-2 series Materials for printed boards and other EN 61249-2 series
interconnecting structures
IEC Guide 104 2010 The preparation of safety publications and - -
the use of basic safety publications and
group safety publications
ISO/IEC Guide 51 - Safety aspects - Guidelines for their - -
inclusion in standards
3
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SIST EN 60664-3:2017
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SIST EN 60664-3:2017
IEC 60664-3
®
Edition 3.0 2016-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
BASIC SAFETY PUBLICATION
PUBLICATION FONDAMENTALE DE SÉCURITÉ
Insulation coordination for equipment within low-voltage systems –
Part 3: Use of coating, potting or moulding for protection against pollution
Coordination de l'isolement des matériels dans les systèmes (réseaux) à basse
tension –
Partie 3: Utilisation de revêtement, d'empotage ou de moulage pour la protection
contre la pollution
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.080.30 ISBN 978-2-8322-3693-2
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN 60664-3:2017
– 2 – IEC 60664-3:2016 © IEC 2016
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Design requirements . 9
4.1 Principles . 9
4.2 Application range with regards to the environment . 9
4.3 Requirements for the types of protection . 10
4.4 Dimensioning procedures . 10
5 Tests . 11
5.1 General . 11
5.2 Specimens for testing coatings . 11
5.3 Specimens for testing mouldings and potting . 12
5.4 Preparation of test specimens . 12
5.5 Visual examination . 12
5.6 Scratch-resistance test . 12
5.7 Conditioning of the test specimens . 13
5.7.1 General . 13
5.7.2 Cold conditioning . 13
5.7.3 Dry-heat conditioning . 13
5.7.4 Rapid change of temperature . 14
5.7.5 Damp heat, steady-state with polarizing voltage . 15
5.8 Mechanical and electrical tests after conditioning and electromigration . 15
5.8.1 General test conditions . 15
5.8.2 Adhesion of coating . 15
5.8.3 Insulation resistance between conductors . 16
5.8.4 Voltage test . 16
5.8.5 Partial discharge extinction voltage . 16
5.9 Additional tests . 16
5.9.1 General . 16
5.9.2 Resistance to soldering heat . 17
5.9.3 Flammability . 17
5.9.4 Solvent resistance . 17
Annex A (normative) Test sequences . 18
Annex B (normative) Decisions to be taken by the technical committees . 20
B.1 General . 20
B.2 Decisions required by technical committees . 20
B.3 Optional test conditions. 20
Annex C (normative) Printed wiring board for testing coatings . 21
C.1 General . 21
C.2 Specification of the printed wiring board. 21
C.3 Arrangement of the conductors . 21
C.4 Arrangement of lands . 22
C.5 Connections for the tests . 22
Bibliography . 25
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IEC 60664-3:2016 © IEC 2016 – 3 –
Figure 1 – Scratch-resistance test for protecting layers . 13
Figure C.1 – Configuration of the test specimen . 23
Figure C.2 – Configuration of lands and adjacent conductors . 24
Table 1 – Minimum spacings for type 2 protection . 10
Table 2 – Dry-heat conditioning . 14
Table 3 – Degrees of severities for rapid change of temperature . 14
Table A.1 – Test sequence 1 . 18
Table A.2 – Test sequence 2 additional conditioning with respect to electromigration . 19
Table A.3 – Additional tests . 19
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INSULATION COORDINATION FOR EQUIPMENT
WITHIN LOW-VOLTAGE SYSTEMS –
Part 3: Use of coating, potting or moulding
for protection against pollution
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60664-3 has been prepared by IEC technical committee TC 109:
Insulation co-ordination for low-voltage equipment.
It has the status of a basic safety publication in accordance with IEC Guide 104.
This third edition cancels and replaces the second edition published in 2003 and Amendment
1:2010. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) information added concerning interpolation;
b) provided scratch test is only for type 2 protection;
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IEC 60664-3:2016 © IEC 2016 – 5 –
c) renumbered the scratch test to follow the visual examination test, since it makes more
sense there;
d) separated the tables under what is now called Annex A, to make them clearer.
The text of this standard is based on the following documents:
FDIS Report on voting
109/153/FDIS 109/154/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
In this standard, the following types are used:
– Terms used throughout this standard which have been defined in Clause 3: bold type
A list of all parts in the IEC 60664 series, published under the general title Insulation
coordination for equipment within low-voltage systems, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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INTRODUCTION
This part of IEC 60664 details the conditions in which the reduction of clearance and
creepage distances can apply to rigid assemblies such as printed boards or terminals of
components. Protection against pollution can be achieved by any kind of encapsulation such
as coating, potting or moulding. The protection may be applied to one or both sides of the
assembly. This standard specifies the insulating properties of the protecting material.
Between any two unprotected conductive parts, the clearance and creepage distance
requirements of IEC 60664-1 apply.
This document refers only to permanent protection. It does not cover assemblies after repair.
Technical committees should consider the influence on the protection of overheating
conductors and components, especially under fault conditions, and to decide if any additional
requirements are necessary.
Safe performance of assemblies is dependent upon a precise and controlled manufacturing
process for the application of the protective system. Requirements for quality control, e.g. by
sampling tests, should be considered by technical committees.
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IEC 60664-3:2016 © IEC 2016 – 7 –
INSULATION COORDINATION FOR EQUIPMENT
WITHIN LOW-VOLTAGE SYSTEMS –
Part 3: Use of coating, potting or moulding
for protection against pollution
1 Scope
This part of IEC 60664 applies to assemblies protected against pollution by the use of
coating, potting or moulding, thus allowing a reduction of clearance and creepage distances
as described in IEC 60664-1.
This document describes the requirements and test procedures for two methods of
protection:
– type 1 protection improves the microenvironment of the parts under the protection;
– type 2 protection is considered to be similar to solid insulation.
This document also applies to all kinds of protected printed boards, including the surface of
inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case
of multi-layer printed boards, the distances through an inner layer are covered by the
requirements for solid insulation in IEC 60664-1.
NOTE Examples of substrates are hybrid integrated circuits and thick-film technology.
This document refers only to permanent protection. It does not cover assemblies that are
subjected to mechanical adjustment or repair.
The principles of this standard are applicable to functional, basic, supplementary and
reinforced insulation.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60326-2:1990, Printed boards – Part 2: Test methods
IEC 60454-3-1:1998/AMD1:2001, Pressure-sensitive adhesive tapes for electrical purposes –
Part 3: Specifications for individual materials – Sheet 1: PVC film tapes with pressure –
sensitive adhesive
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IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:
Principles, requirements and tests
IEC 61189-2:2006, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 2: Test methods for materials for
interconnection structures
IEC 61189-3:2007, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 3: Test methods for interconnection
structures (printed boards)
IEC 61249-2 (all parts), Materials for printed boards and other interconnecting structures –
Reinforced base materials, clad and unclad
IEC Guide 104:2010, The preparation of safety publications and the use of basic safety
publications and group safety publications
ISO/IEC Guide 51, Safety aspects – Guidelines for their inclusion in standards
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60664-1 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
base material
insulating material upon which a conductive pattern may be formed
Note 1 to entry: The base material may be rigid or flexible, or both. It may be a dielectric or an insulated metal
sheet.
[SOURCE: IEC 60050-541:1990, 541-02-01]
3.2
printed board
base material cut to size containing all required holes and bearing at least one conductive
pattern.
Printed boards are typically subdivided according to
– their structure (e.g., single- and double-sided, multilayers)
– the nature of the base material (e.g., rigid, flexible)
[SOURCE: IEC 60050-541:1990, 541-01-03]
3.3
conductor (of a printed board) single conductive path in a conductive pattern
[SOURCE: IEC 60050-541:1990, 541-01-20]
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IEC 60664-3:2016 © IEC 2016 – 9 –
3.4
protection
measure which reduces the influence of the environment
3.5
coating
insulating material such as varnish or dry film laid on the surface of the assembly
Note 1 to entry: Coating and base material of a printed board form an insulating system that may have
properties similar to solid insulation
[SOURCE: IEC 60050-212:2010, 212-11-61].
3.6
solid insulation
solid insulating material, or a combination of solid insulating materials, placed between two
conductive parts or between a conductive part and a body part
EXAMPLE In the case of a printed board with a coating, solid insulation consists of the board
itself as well as the coating. In other cases, solid insulation consists of the encapsulating
material.
[SOURCE: IEC 60050-903:2013, 903-04-14]
3.7
spacing
any combination of clearances, creepage distances and insulation distances through
insulation
[SOURCE: IEC 60050-471:2007, 471-01-20]
4 Design requirements
4.1 Principles
The dimensioning of spacings between conductors depends on the type of protection used.
When type 1 protection is used, dimensioning of clearances and creepage distances shall
follow the requirements of IEC 60664-1. If the requirements of this standard are met, pollution
degree 1 applies under the protection.
When type 2 protection is used, spacings between conductive parts shall meet the
requirements and tests for solid insulation of IEC 60664-1 and their dimensions shall not be
less than the minimum clearances specified in IEC 60664-1 for homogeneous field conditions.
4.2 Application range with regards to the environment
The design requirements are applicable in all microenvironments.
Stresses such as temperature, chemical or mechanical stresses, or those listed in 5.3.2.4 of
IEC 60664-1:2007 shall be taken into account when the protective material is selected.
Absorption of humidity by the protective material shall not impair the insulation properties of
the parts being protected.
NOTE Absorption of humidity can be checked by an insulation resistance measurement under humid conditions.
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4.3 Requirements for the types of protection
Protection is achieved in the following ways.
– Type 1 protection improves the microenvironment of the parts under the protection. The
clearance and creepage distance requirements of IEC 60664-1 for pollution degree 1
apply under the protection. Between two conductive parts, it is a requirement that one or
both conductive parts, together with all the spacings between them, are covered by the
protection.
– Type 2 protection is considered to be similar to solid insulation. Under the protection,
the requirements for solid insulation specified in IEC 60664-1 are applicable and the
spacings shall be not less than those specified in Table 1. The requirements for
clearances and creepage distances in IEC 60664-1 do not apply. Between two conductive
parts, it is a requirement that both conductive parts, together with all the spacings
between them, are covered by the protection so that no air gap exists between the
protective material, the conductive parts and the printed board.
Clearance and creepage distance requirements according to IEC 60664-1 apply to all
unprotected parts of the equipment.
4.4 Dimensioning procedures
For type 1 protection, the dimensioning requirements of 5.1 and 5.2 of
...
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