SIST ISO 19694-7:2025
(Main)Stationary source emissions - Determination of greenhouse gas emissions in energy-intensive industries - Part 7: Semiconductor and display industries
Stationary source emissions - Determination of greenhouse gas emissions in energy-intensive industries - Part 7: Semiconductor and display industries
This document provides a methodology for calculating greenhouse gas (GHG) emissions from the semiconductor and display industry. This document includes the manufacture of semiconductor devices, microelectromechanical systems (MEMS), photovoltaic (PV) devices and displays. This document allows to report GHG emissions for various purposes and on different bases, such as a per-plant basis, per-company basis (by country or by region) or an international group basis. This document addresses all of the following direct and indirect sources of GHG:
— direct GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 a)] from sources that are owned or controlled by the company, such as emissions resulting from the following sources:
— process: fluorinated compound (FC) gases and nitrous oxide (N2O) used in etching and wafer cleaning (EWC), remote plasma cleaning (RPC), in situ plasma cleansing (IPC), in situ thermal cleaning (ITC), N2O thin film deposition (TFD), and other N2O using process;
— fuel combustion related to equipment and on-site vehicles, room heating/cooling;
— fuel combustion of fuels for on-site power generation;
— indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 b)] from the generation of imported electricity, heat or steam consumed by the organization.
Other indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 c) to f)], which are the consequence of an organization’s activities, but arise from GHG sources that are owned or controlled by other organizations, are excluded from this document.
Émissions de sources fixes - Détermination des émissions de gaz à effet de serre dans les industries énergo-intensives - Partie 7: Industries des semi-conducteurs et des écrans
Emisije nepremičnih virov - Določanje emisij toplogrednih plinov (TGP) v energetsko intenzivnih industrijah - 7. del: Proizvodnja polprevodnikov in prikazovalnikov
Ta dokument določa metodologijo za izračun emisij toplogrednih plinov (TPG) pri proizvodnji polprevodnikov in prikazovalnikov. Vključuje proizvodnjo polprevodniških naprav, mikroelektromehanskih sistemov (MEMS), fotonapetostnih (PV) naprav in prikazovalnikov. Ta dokument omogoča poročanje o emisijah toplogrednih plinov za različne namene in na različnih ravneh, na primer na ravni obrata, podjetja (po državi ali regiji) ali mednarodne skupine. Ta dokument obravnava vse naslednje neposredne in posredne vire toplogrednih plinov: – neposredne emisije toplogrednih plinov [kot so opredeljene v standardu ISO 14064-1:2018, točka 5.2.4 a)] iz virov, ki so v lasti ali pod nadzorom podjetja, kot so emisije iz naslednjih virov: – obdelava: plini fluorovih spojin (FC) in dušikov oksid (N2O), ki se uporabljajo pri jedkanju in čiščenju rezin (EWC), čiščenju s plazmo na daljavo (RPC), in situ čiščenju s plazmo (IPC), in situ termičnem čiščenju (ITC), nanašanju tankih plasti N2O (TFD) ter drugih postopkih, pri katerih se uporablja N2O; – zgorevanje goriv, povezano z opremo in vozili na mestu uporabe ter z ogrevanjem/hlajenjem prostorov; – zgorevanje goriv za proizvodnjo električne energije na mestu uporabe; – posredne emisije toplogrednih plinov [kot so opredeljene v standardu ISO 14064-1:2018, točka 5.2.4 b)] zaradi proizvodnje uvožene električne energije, toplote ali pare, ki jo porablja organizacija. Druge posredne emisije toplogrednih plinov [kot so opredeljene v standardu ISO 14064-1:2018, točke 5.2.4 c) do f)], ki so posledica dejavnosti organizacije, vendar izhajajo iz virov toplogrednih plinov, ki so v lasti ali pod nadzorom drugih organizacij, niso zajete v tem dokumentu.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2025
Emisije nepremičnih virov - Določanje emisij toplogrednih plinov (TGP) v
energetsko intenzivnih industrijah - 7. del: Proizvodnja polprevodnikov in
prikazovalnikov
Stationary source emissions - Determination of greenhouse gas emissions in energy-
intensive industries - Part 7: Semiconductor and display industries
Émissions de sources fixes - Détermination des émissions de gaz à effet de serre dans
les industries énergo-intensives - Partie 7: Industries des semi-conducteurs et des
écrans
Ta slovenski standard je istoveten z: ISO 19694-7:2024
ICS:
13.020.40 Onesnaževanje, nadzor nad Pollution, pollution control
onesnaževanjem in and conservation
ohranjanje
13.040.40 Emisije nepremičnih virov Stationary source emissions
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
International
Standard
ISO 19694-7
First edition
Stationary source emissions —
2024-02
Determination of greenhouse gas
emissions in energy-intensive
industries —
Part 7:
Semiconductor and display
industries
Émissions de sources fixes — Détermination des émissions de gaz
à effet de serre dans les industries énergo-intensives —
Partie 7: Industries des semi-conducteurs et des écrans
Reference number
© ISO 2024
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Published in Switzerland
ii
Contents Page
Foreword .v
Introduction .vi
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 2
4 Abbreviated terms . 6
5 Determination of GHG emissions principles . 7
5.1 General .7
5.2 Major GHG emissions in semiconductor and display .7
5.3 Determination based on mass balance .7
5.4 Determination based on stack emission measurements .8
6 Inventory boundaries . 8
6.1 General .8
6.2 Organizational boundaries .8
6.3 Reporting boundaries .9
7 Direct GHG emissions and their determination . 9
7.1 General .9
7.2 Direct GHG emissions from combustion and transportation .10
7.3 Direct GHG emissions from process emissions .10
7.3.1 General .10
7.3.2 Tier 1 . 13
7.3.3 Tier 2a .14
7.3.4 Tier 2b . 15
7.3.5 Tier 2c. 15
7.3.6 Tier 3a — Measured process-specific parameters .19
7.3.7 Tier 3b — Stack testing .19
7.3.8 Fluorinated liquids . 22
8 Indirect emissions from imported energy and their determination .23
8.1 General . 23
8.2 GHG emissions from imported electricity . 23
8.3 GHG emissions from external fossil and alternative fuels production and processing.24
9 General requirements for identifying, calculating and reporting of GHG emissions .24
10 Baselines, acquisitions and disinvestments .25
11 Reporting and performance assessment .25
11.1 General . 25
11.2 Corporate environmental reporting . 26
11.3 Reporting periods . 26
11.4 Performance assessment . 26
12 Uncertainty of GHG inventories .27
12.1 General .27
12.2 A ssessment of uncertainty of the mass balance based method . 28
12.2.1 Major sources of uncertainty . 28
12.2.2 Uncertainty of activity data . 28
12.2.3 Aggregated uncertainties of activity data. 29
12.2.4 Application of default values instead of analytical results . 30
12.2.5 Evaluation of the overall uncertainty of a GHG inventory . 30
12.3 A ssessment of the uncertainty for the stack-measurement method . 30
Annex A (informative) Content of the monitoring plan .31
Annex B (informative) Default emission factors .32
iii
Bibliography .40
iv
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out through
ISO technical committees. Each member body interested in a subject for which a technical committee
has been established has the right to be represented on that committee. International organizations,
governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely
with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types
of ISO document should be noted. This document was drafted in accordance with the editorial rules of the
ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). ISO takes no position concerning the evidence, validity or applicability of any claimed patent
rights in respect thereof. As of the date of publication of this document, ISO had not received notice of (a)
patent(s) which may be required to implement this document. However, implementers are cautioned that
this may not represent the latest information, which may be obtained from the patent database available at
www.iso.org/patents. ISO shall not be held responsible for identifying any or all such patent rights.
Any trade name used in this document is information given for the convenience of users and does not
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This document was prepared by Technical Committee ISO/TC 146, Air quality, Subcommittee SC 1, Stationary
source emissions.
A list of all parts in the ISO 19694 series can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.html.
v
Introduction
0.1 General
This document for the semiconductor and display industry is based on 2019 Refinement to the 2006 IPCC
Guideline for National Greenhouse Gas Inventories.
This document, which deals with specific requirements for the semiconductor and display industry, has
been harmonized with ISO 14064-1 and ISO 19694-1, which deal with broader requirements. ISO 19694-1
and this document provide a harmonized method for:
— measuring, testing and quantifying methods for greenhouse gas (GHG) emissions;
— assessing the level of GHG emissions performance of production processes over time, at production sites;
and
— establishing and providing reliable, accurate and quality information for reporting and verification
purposes.
0.2 Overview of semiconductor and display manufacturing process
Semiconductor and display manufacture include processes, such as TFD or plasma EWC of silicon-containing
materials, that result in significant carbon dioxide emissions. These emissions are the results of the FC gases
and nitrous oxide used in the manufacturing process. Other GHG emissions in semiconductor and display
industry include the CO and CH from direct emissions of combustion, transportation, manufacturing
2 4
process or indirect emissions (e.g. room heating, on-site transports, on-site power generation, external
power production and external transports).
FC gases are used in two important steps of electronics manufacturing:
a) plasma EWC of silicon-containing materials, and
b) cleaning of the chamber walls of TFD and diffusion tools after processing substrates.
The semiconductor and display industry use N O as an input gas in TFD processes, and in other manufacturing
processes that use N O, such as diffusion and dry removal of photoresist.
The process emission of FC gases and N O should be estimated using the 2019 Refinement to the 2006 IPCC
Guideline for National Greenhouse Gas Inventories. In this document, references are made to the relevant
parts of 2019 Refinement to the 2006 IPCC Guideline for National Greenhouse Gas Inventories depending on
the element used for appropriate guidance that includes formulae, tables, etc. However, the 2019 Refinement
to the 2006 IPCC Guideline for National Greenhouse Gas Inventories can be corrected if some errors are
detected. Therefore, companies are strongly encouraged to keep referring to Reference [4] and to replace
the Annex B with the latest corrected version of Chapter 6, Volume 3 of the 2019 Refinement to the 2006 IPCC
Guideline for National Greenhouse Gas Inventories when it is made available.
vi
International Standard ISO 19694-7:2024(en)
Stationary source emissions — Determination of greenhouse
gas emissions in energy-intensive industries —
Part 7:
Semiconductor and display industries
1 Scope
This document provides a methodology for calculating greenhouse gas (GHG) emissions from the
semiconductor and display industry. This document includes the manufacture of semiconductor devices,
microelectromechanical systems (MEMS), photovoltaic (PV) devices and displays. This document allows to
report GHG emissions for various purposes and on different bases, such as a per-plant basis, per-company
basis (by country or by region) or an international group basis. This document addresses all of the following
direct and indirect sources of GHG:
— direct GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 a)] from sources that are owned or controlled
by the company, such as emissions resulting from the following sources:
— process: fluorinated compound (FC) gases and nitrous oxide (N O) used in etching and wafer cleaning
(EWC), remote plasma cleaning (RPC), in situ plasma cleansing (IPC), in situ thermal cleaning (ITC),
N O thin film deposition (TFD), and other N O using process;
2 2
— fuel combustion related to equipment and on-site vehicles, room heating/cooling;
— fuel combustion of fuels for on-site power generation;
— indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 b)] from the generation of imported
electricity, heat or steam consumed by the organization.
Other indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 c) to f)], which are the consequence of
an organization’s activities, but arise from GHG sources that are owned or controlled by other organizations,
are excluded from this document.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references,
the latest edition of the referenced document (including any amendments) applies.
ISO/IEC Guide 98-3:2008, Uncertainty of measurement — Part 3: Guide to the expression of uncertainty in
measurement (GUM: 1995)
ISO 19694-1:2021, Stationary source emissions — Determination of greenhouse gas emissions in energy-
intensive industries — Part 1: General aspects
ISO 14064-1:2018, Greenhouse gases — Part 1: Specification with guidance at the organization level for
quantification and reporting of greenhouse gas emissions and removals
Calvo Buendia, E., Tanabe, K., Kranjc, A., Baasansuren, J., Fukuda, M., Ngarize, S., Osako, A., Pyrozhenko, Y.,
Shermanau, P. and Federici, S. 2019 Refinement to the 2006 IPCC Guideline for National Greenhouse Gas
Inventories (2019 Refinement), Volume 3, Chapter 6 Electronics. URL: https:// www .ipcc -nggip .iges .or .jp/
public/ 2019rf/ index .html
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 19694-1 and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
3.1
base year
specific, historical period identified for the purpose of comparing greenhouse gas emissions (3.14) or
greenhouse gas (3.13) removals or other greenhouse gas-related information over time
Note 1 to entry: Base year emissions or removals may be quantified based on a specific period (e.g. a year or part of
year where seasonality is a feature of the organization’s (3.27) activity) or averaged from several periods (e.g. several
years).
[SOURCE: ISO 19694-1:2021, 3.3, modified — Note 1 to entry has been added.]
3.2
carbon dioxide equivalent
CO e
unit for comparing the radiative forcing of a greenhouse gas (3.13) to that of carbon dioxide
Note 1 to entry: The carbon dioxide equivalent is calculated using the mass of a given greenhouse gas multiplied by its
global warming potential (3.15).
[SOURCE: ISO 14064-1:2018, 3.1.13]
3.3
chemical vapour deposition
CVD
process for manufacturing preforms by which vapours and gases react chemically to produce deposits at the
surface of a substrate
3.4
equity share
percentage of economic interest in, or benefit derived from, a facility (3.7)
Note 1 to entry: Under this approach, an organization (3.27) (corporation, group) or a company consolidates its
greenhouse gas emissions (3.14) according to the (pro rata) equity share it holds in each operation, i.e. according to
ownership. As an exception, no emissions are consolidated for so-called fixed asset investments where a company
owns only a small part of the total shares of an operation and exerts neither significant influence nor financial control;
other possible exceptions relate to the economic substance of a relationship.
3.5
etching
removal of surface material
Note 1 to entry: Etching can be applied with liquids agents (wet chemical etching) or with gases in a recipient (dry
etching, plasma etching). The etching agent reacts chemically with the substrate.
[SOURCE: ISO 12679:2011, 3.3]
3.6
etching and wafer cleaning
EWC
removal process of chemical and particle impurities without altering or damaging the wafer surface after
etching (3.5) the surface material
3.7
facility
single installation, set of installations or production processes (stationary or mobile), which can be defined
within a single geographical boundary, organizational unit or production process
[SOURCE: ISO 14064-1:2018, 3.4.1]
3.8
fixed combustion emission
emission from the fixed combustion, including power generation, heat and electricity generation
3.9
fluorinated compounds and N O
FCs and N O
types of fluorinated compounds and liquids used to manufacture electrical products
EXAMPLE CF , C F , C F , c-C F , C F , c-C F , CH F, CH F , CHF , C HF , NF , SF , COF , F , C F O and N O.
4 2 6 3 8 4 8 4 6 5 8 3 2 2 3 2 5 3 6 2 2 4 8 2
3.10
fossil fuel
fuels from fossilized materials listed by the Intergovernmental Panel on Climate Change (IPCC)
EXAMPLE Coal, oil, natural gas and peat.
[SOURCE: ISO 19694-3:2023, 3.18]
3.11
fuel combustion
intentional oxidation of materials within an apparatus that is designed to provide heat or mechanical work
to a process, or to be used away from the apparatus
3.12
global warming potential
GWP
index, based on radiative properties of greenhouse gases (3.13), measuring the radiative forcing following
a pulse emission of a unit mass of a given greenhouse gas in the present-day atmosphere integrated over a
chosen time horizon (e.g. 100 years), relative to that of carbon dioxide (CO )
[SOURCE: ISO 14064-1:2018, 3.1.12, modified — "(e.g. 100 years)" has been added to the definition.]
3.13
greenhouse gas
GHG
gaseous constituent of the atmosphere, both natural and anthropogenic, that absorbs and emits radiation
at specific wavelengths within the spectrum of infrared radiation emitted by the Earth’s surface, the
atmosphere and clouds
Note 1 to entry: For list of greenhouse gases, see latest Intergovernmental Panel on Climate Change (IPCC) Assessment
Report.
Note 2 to entry: Water vapour and ozone are anthropogenic as well as natural greenhouse gases but are not included
as recognized greenhouse gases due to difficulties, in most cases, in isolating the human-induced component of global
warming attributable to their presence in the atmosphere.
[SOURCE: ISO 14064-1:2018, 3.1.1]
3.14
greenhouse gas emission
GHG emission
release of a greenhouse gas (3.13) into the atmosphere
[SOURCE: ISO 14064-1:2018, 3.1.5]
3.15
greenhouse gas emission factor
emission factor
coefficient relating greenhouse gas (3.13) activity data with the greenhouse gas emission (3.14)
[SOURCE: ISO 14064-1:2018, 3.1.7, modified — "GHG" has been removed from the second term and Note 1 to
entry has been deleted.]
3.16
greenhouse gas inventory
GHG inventory
list of greenhouse gas sources (3.17) and greenhouse gas (3.13) sinks, and their quantified greenhouse gas
emissions (3.14) and greenhouse gas removals
[SOURCE: ISO 14064-1:2018, 3.2.6]
3.17
greenhouse gas source
GHG source
process that releases a greenhouse gas (3.16) into the atmosphere
[SOURCE: ISO 14064-1:2018, 3.1.2]
3.18
electricity grid
grid
public electricity network
[SOURCE: ISO 52000-1:2017, 3.4.8]
3.19
indirect greenhouse gas emission
indirect GHG emission
greenhouse gas emission (3.14) that is a consequence of an organization’s (3.27) operations and activities, but
that arise from greenhouse gas sources (3.17) that are not owned or controlled by the organization
Note 1 to entry: These emissions occur generally in the upstream and/or downstream chain.
[SOURCE: ISO 14064-1:2018, 3.1.11]
3.20
in situ plasma cleaning
IPC
technique using chemically reactive oxygen plasma to remove hydrocarbon contaminants
3.21
in situ thermal cleaning
ITC
combined process of pyrolysis and oxidation
3.22
lower heat value
LHV
net calorific value
NCV
absolute value of the specific heat (enthalpy) of combustion, for unit mass of the fuel burned in oxygen at
constant pressure under such conditions that all the water of the reaction products remains as water vapour
(at 0,1 MPa), the other products being as for the gross calorific value, all at the reference temperature
[SOURCE: ISO 1928:2020, 3.1.3, modified — the term “net calorific value at constant volume” has been
replaced with “lower heat value”, the admitted term "net calorific value" has been added, and "(enthalpy)"
has been added to the definition.]
3.23
micro-electromechanical system
MEMS
DEPRECATED: micro-electromechanical device
system composed of one or more integrated microsized components, such as sensors, actuators, transducers,
resonators, oscillators, mechanical components and electric circuits
Note 1 to entry: In the definition, “microsized” is used to mean a size of less than a few millimetres.
Note 2 to entry: Technologies relating MEMS are extremely diverse and include fundamental technologies (such as
design, material, processing, functional element, system control, energy supply, bonding and assembly, electric circuit,
and evaluation), basic sciences (such as micro-science and engineering) as well as thermodynamics on a micro-scale
and microtribology.
Note 3 to entry: The singular and plural forms of the term “MEMS” are identical.
[SOURCE: IEC 62047-1:2016, 2.1.1, modified — the term has been changed to “micro-electromechanical
device” and the previous term “micro-electromechanical system” has been listed as a deprecated term;
Notes 1 and 2 to entry have been revised.]
3.24
monitoring
continuous or periodic assessment of greenhouse gas emissions (3.14) and greenhouse gas (3.13) removals or
other greenhouse gas-related data
[SOURCE: ISO 14064-1:2018, 3.2.12]
3.25
N O other process
semiconductor and display manufacturing process other than N O thin-film deposition (3.34) using N O
2 2
EXAMPLE Diffusion and dry removal of photoresist.
3.26
NO thin film deposition
N O TFD
thin-film deposition using N O as an input gas
3.27
organization
person or group of people that has its own functions with responsibilities, authorities and relationships to
achieve its objectives
Note 1 to entry: The concept of organization includes, but is not limited to, sole-trader, company, corporation, firm,
enterprise, authority, partnership, association, charity or institution, or part or combination thereof, whether
incorporated or not, public or private.
[SOURCE: ISO 14064-1:2018, 3.4.2]
3.28
organizational boundary
grouping of activities or facilities (3.9) in which an organization (3.27) exercises operational or financial
control or has an equity share (3.4)
[SOURCE: ISO 14064-1:2018, 3.4.7]
3.29
photovoltaic device
PV device
device which produces an electric potential difference between two points in a material by the absorption
of photons
3.30
process emission
emission from industrial processes involving chemical transformation other than combustion
[SOURCE: ISO 19694-1:2021, 3.36, modified — "including chemical and mineralogical transformations" has
been changed to "involving chemical transformation".]
3.31
remote plasma cleaning
RPC
plasma processing method in which the plasma and material interaction occurs at a location remote from
the plasma
3.32
reporting boundary
grouping of greenhouse gas emissions (3.14) or greenhouse gas removals reported from within the
organizational boundary (3.28) as well as those significant indirect greenhouse gas emissions (3.19) that are a
consequence of the organization's (3.27) operations and activities
[SOURCE: ISO 14064-1:2018, 3.4.8]
3.33
source stream
specific fuel type, raw material or product that
a) creates emissions of relevant greenhouse gases (3.13) at one or more emission sources as a result of its
consumption or production;
b) contains carbon and is included in the calculation of greenhouse gas emissions (3.14) using a mass
balance methodology
3.34
thin film deposition
TFD
process of producing thin films by physical vapour deposition or chemical vapour deposition (3.3) as well as
other techniques
3.35
transport combustion emission
combustion emission from transportation activities
3.36
uncertainty
parameter associated with the result of quantification which characterizes the dispersion of the values that
can be reasonably attributed to the quantified amount
Note 1 to entry: Uncertainty information typically specifies quantitative estimates of the likely dispersion of values
and a qualitative description of the likely causes of the dispersion.
[SOURCE: ISO 14064-1:2018, 3.2.13]
3.37
verification
process for evaluating a statement of historical data and information to determine if the statement is
materially correct and conforms to criteria
[SOURCE: ISO 14064-1:2018, 3.4.9]
4 Abbreviated terms
For the purposes of this document, the following abbreviated terms apply.
CVD chemical vapour deposition
DRE destruction removal efficiency
EF emission factor
EWC etching and wafer cleaning
FC fluorinated compound
GHG greenhouse gas
GWP global warming potential
IPC in situ plasma cleansing
IPCC intergovernmental panel on climate change
ITC in situ thermal cleaning
KPI key performance indicator
LHV lower heat value
MEMS microelectromechanical systems
NER normalized emission rate
OEM original equipment manufacturer
PI performance indicator
PV photovoltaic
TFD thin film deposition
RPC remote plasma cleaning
WSC World Semiconductor Council
5 Determination of GHG emissions principles
5.1 General
The determination of GHG emissions can in principle be done through a mass balance method or through
stack emission measurement or a combination of these two approaches. The choice of appropriate
methodology should depend on the obtention of accurate results with acceptable measurement uncertainties
at reasonable costs.
5.2 Major GHG emissions in semiconductor and display
GHG emissions in semiconductor and display industry include the family of FCs, N O and CH , which are from
2 4
direct emissions of combustion, transportation and manufacturing processes, or from indirect emissions.
5.3 Determination based on mass balance
The GHG emissions of an installation may be determined based on mass balance. Emissions from source
streams are calculated from input or production data, obtained by means of measurement systems, and
additional parameters from laboratory and analysis [including the reduction of mass of gas i (D ), the use
i
rate of gas i (U ), the emission factor of by-product (B )]. Standard factors may also be used; references to
i k,i
these factors are provided in ISO 19694-1.
5.4 Determination based on stack emission measurements
The GHG emissions of an installation may also be determined by measurement. Emissions from an emission
source are determined based on the measurement of the concentration of the relevant GHG in the flue gas
and the flowrate of the flue gas. Measurement standards to be applied on stack emission measurements
are provided in ISO 19694-1 and 2019 Refinement to the 2006 IPCC Guidelines for National Greenhouse Gas
Inventories.
6 Inventory boundaries
6.1 General
Drawing appropriate boundaries is one of the key tasks in an emissions' inventory process.
6.2 Organizational boundaries
Organizational boundaries define which parts of an organization – for example, wholly owned operations,
joint ventures and subsidiaries – are covered by an inventory, and how the emissions of these entities are
consolidated. The requirements to create organizational boundaries in ISO 19694-1 shall be applied.
In this document, reporting covers the main direct and indirect GHG emissions associated with
semiconductor and display production as required in Clauses 7, 8 and 10. These emissions also include those
related to consumption of fuels, materials and electricity in upstream and downstream operations.
Separate inventories may be established for individual facilities as appropriate, for instance, if they are
geographically separated or run by distinct operators. The impacts of such a division will cancel out when
emissions are consolidated at an organizational or group level.
Table 1 — Reporting boundaries for the semiconductor industry
Type of GHGs
Included within
Emission source
boundaries
CO CH N O HFCs PFCs SF NF
2 4 2 6 3
Room heating/ Fossil fuels used for
○ ○ ○
Fixed
cooling operating the boiler
combustion
Power / heat Fossil fuels used in the emer-
emissions
○ ○ ○
generation gency generator
Transport
Transport and Transport to processing
combustion ○ ○ ○
distribution facilities
emissions
Plasma etching and wafer
EWC ○ ○ ○ ○
Direct
cleaning of silicon materials
emissions
RPC ○ ○ ○ ○ Remote plasma cleaning
IPC ○ ○ ○ ○ In situ plasma cleaning
Process
ITC ○ ○ ○ ○ In situ thermal cleaning
emissions
Cleaning of the chamber from
N O TFD ○
the TFD process
N O other
○ N O process other than TFD
process
Imported
○ ○ ○
Use of purchased electricity
electricity
Indirect emissions production consumed in the
Imported
company’s equipment
○ ○ ○
steam / heat
6.3 Reporting boundaries
Reporting boundaries refer to the types of sources of emissions covered by an inventory and shall follow
ISO 14064-1.
Each semiconductor and display plant shall asses its direct GHG emissions sources and indirect GHG
emission sources. The assessment shall include GHG emissions from all stages of the manufacturing process
undertaken at the plant. Clause 7 provides detailed guidance on the different sources of direct emissions
occurring in semiconductor and display plant. Indirect emissions are addressed in Clause 8.
Companies shall use the reporting boundaries outlined in Tables 1 and 2 for the determination of GHG
emissions for the semiconductor and display plant. Any deviation from the boundaries shall be reported and
explained.
Table 2 — Reporting boundaries for the display industry
Type of GHGs
Included within
Emission source
boundaries
CO CH N O HFCs PFCs SF NF
2 4 2 6 3
Room heating/ Fossil fuels used for operating
○ ○ ○
Fixed
cooling the boiler
combustion
Power / heat Fossil fuels used in the emer-
emissions
○ ○ ○
generation gency generator
Transport
Transport and Transport to processing
combustion ○ ○ ○
distribution facilities
Direct emissions
emissions
Plasma etching of silicon
Etching ○ ○ ○ ○
materials
RPC ○ ○ ○ ○ Remote plasma cleaning
Process
emissions
IPC ○ ○ ○ ○ In situ plasma cleaning
Cleaning of the chamber from
N O TFD ○
the TFD process
Imported
○ ○ ○
Use of purchased electricity
electricity
Indirect emissions production consumed in the
Imported
company’s equipment
○ ○ ○
steam / heat
7 Direct GHG emissions and their determination
7.1 General
Direct GHG emissions are emissions from sources of the respective plant. In the semiconductor and display
manufacture, GHG emissions include the family of FCs including fluorinated liquids, N O and CH which may
2 4
result from, but are not restricted to, the following sources:
— fuel combustion for on-site power generation
— process emission, including:
a) plasma EWC of silicon-containing materials, and
b) cleaning of the chamber walls of TFD and diffusion tools after processing substrates.
The reporting entity shall prepare a full inventory of all direct GHG emissions sources of the plant.
The amount of FCs and N O direct GHG emissions can be determined by the mass balance based method or
by the continuous stack measurement based method.
Generally, companies are encouraged to measure the required parameters at plant level for site-specific
gases. Where plant- or company- specific data are not available, standard or default factors should be used.
Emission factors, formulae and reporting approaches for these sources are described in Clauses 7 and 8.
7.2 Direct GHG emissions from combustion and transportation
Direct GHG emissions from combustion can occur from sources that are owned or controlled by the
organization, such as boilers, furnaces and vehicles. GHG from combustion and transportation include CO ,
CH , and N O. To determine the direct GHG emissions from combustion and transportation, obtain the
4 2
following data:
— mass flow or volume flow (activity data);
— emissions factors;
— calorific values for fuels;
— oxidation or conversion factors.
GHG emissions from the fuel combustion can be calculated based on the mass, net calorific value and
chemical composition of fuels entering the process. It is important to note that the applied net calorific value
always has to match the type of the fuel.
The GHG emissions from combustion and transportation shall be determined using the mass balanced based
method given in Formula (1).
Ef=⋅HF⋅⋅F (1)
cons i Eo
where
E are the total annual GHG emissions of the regarding fuel, in tCO e/year;
f is the amount of fuel consumed, in t/year;
cons
H is the lower heat value (LHV) of fuel, in GJ/t;
i
F is the emission factor of fuel, in tCO e/GJ;
E 2
F is the oxidation factor of fuel (dimensionless); an oxidation factor of 1 means complete oxidation.
o
The GHG emissions from fuel shall be summed to give the total emissions of the fuels for the entire plant.
The reporting entity shall calculate GHG emissions in accordance with ISO 19694-1.
The reporting entity shall follow sampling methods in accordance with ISO 19694-1.
7.3 Direct GHG emissions from process emissions
7.3.1 General
The use of FCs and N O is considered under the process emission. The GHG emissions originating from the
use of FC gas and N O in the semiconductor and display manufacturing process shall be calculated.
FC gases include perfluoromethane (CF ), perfluoroethane (C F ), perfluoropropane (C F ),
4 2 6 3 8
perfluorocyclobutane (c-C F ), 1,3-hexafluorocyclopentene (C F ), octafluorotetrahydrofuran (C F O),
4 8 4 6 4 8
octafluorocyclopentene (c-C F ), fluoromethane (CH F), difluoromethane (CH F ), trifluoromethane (CHF ),
5 8 3 2 2 3
pentafluoroethane (C HF ), nitrogen trifluoride (NF ) and hexafluoride (SF ). This method is also applicable
2 5 3 6
to the determination of COF and F emissions.
2 2
In general, FCs that are GHGs or whose use during the manufacturing of electronic devices can result in
emissions of GHGs should be determined.
In the manufacturing processes, some portions of FC input gas are transformed into FC gas by-products such
as CF , C F , C F , C F , CH F, CH F and CHF . Several of these by-products can also be formed even if no
4 2 6 4 6 3 8 3 2 2 3
carbon-containing FCs, F , NF , SF , and ClF , are fed into the process that include etching carbon containing
2 3 6 3
materials or cleaning chambers used to deposit carbon-containing thin films.
The semiconductor sector includes six process types as follows: EWC, RPC, IPC, ITC, N O TFD and N O other
2 2
process. The display sector is differentiated into four process types: etching, RPC, IPC and N O TFD.
Methods to determine emissions of FC gases, fluorinated liquids, and N O that are used in the semiconductor
and display manufacturing processes are mainly classified into three tiers:
— Tier 1 is applicable only in cases where facility-specific data are not available. Tier 1 gives the aggregated
estimate of GHG and N O emissions based on production figures (surface area of substrate used during
the production of electronic devices).
— Tier 2a is only applicable to the semiconductor industry or industries with processes similar to
semiconductor manufacturing, such as MEMS. Tier 2a uses the default emission factors based on gas
consumption.
— Tier 2b is only applicable to the semiconductor industry and to MEMS manufacturing that uses tools
and processes similar to those used to manufacture semiconductors. Tier 2b uses the default emission
factors that are provided by the wafer size being manufactured.
— Tier 2c is applicable to the all sub-sectors, semiconductor (MEMS), display, and PV. Tier 2c uses default
emission factors that are provided for distinct process types p.
— Tier 3a is applicable to all sub-sectors and uses measured values for parameters. Tier 3a uses emission
factors which are measured for recipes or families of similar recipes.
— Tier 3b is applicable to all sub-sectors. Tier 3b measures the amount of GHGs emitted from a specific
facility through stack systems. Reporting companies estimate their emissions based on fabrication-
specific emission factors.
The steps to determine the direct GHG emissions in the semiconductor and display industry manufacturing
processes are given in Figure 1.
Figure 1 — Flowchart for the determination of the estimation method of GHG emissions from
semiconductor and display manufacturing process
NOTE If there are no national regulations, the following suggestion can be
...
International
Standard
ISO 19694-7
First edition
Stationary source emissions —
2024-02
Determination of greenhouse gas
emissions in energy-intensive
industries —
Part 7:
Semiconductor and display
industries
Émissions de sources fixes — Détermination des émissions de gaz
à effet de serre dans les industries énergo-intensives —
Partie 7: Industries des semi-conducteurs et des écrans
Reference number
© ISO 2024
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on
the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below
or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii
Contents Page
Foreword .v
Introduction .vi
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 2
4 Abbreviated terms . 6
5 Determination of GHG emissions principles . 7
5.1 General .7
5.2 Major GHG emissions in semiconductor and display .7
5.3 Determination based on mass balance .7
5.4 Determination based on stack emission measurements .8
6 Inventory boundaries . 8
6.1 General .8
6.2 Organizational boundaries .8
6.3 Reporting boundaries .9
7 Direct GHG emissions and their determination . 9
7.1 General .9
7.2 Direct GHG emissions from combustion and transportation .10
7.3 Direct GHG emissions from process emissions .10
7.3.1 General .10
7.3.2 Tier 1 . 13
7.3.3 Tier 2a .14
7.3.4 Tier 2b . 15
7.3.5 Tier 2c. 15
7.3.6 Tier 3a — Measured process-specific parameters .19
7.3.7 Tier 3b — Stack testing .19
7.3.8 Fluorinated liquids . 22
8 Indirect emissions from imported energy and their determination .23
8.1 General . 23
8.2 GHG emissions from imported electricity . 23
8.3 GHG emissions from external fossil and alternative fuels production and processing.24
9 General requirements for identifying, calculating and reporting of GHG emissions .24
10 Baselines, acquisitions and disinvestments .25
11 Reporting and performance assessment .25
11.1 General . 25
11.2 Corporate environmental reporting . 26
11.3 Reporting periods . 26
11.4 Performance assessment . 26
12 Uncertainty of GHG inventories .27
12.1 General .27
12.2 A ssessment of uncertainty of the mass balance based method . 28
12.2.1 Major sources of uncertainty . 28
12.2.2 Uncertainty of activity data . 28
12.2.3 Aggregated uncertainties of activity data. 29
12.2.4 Application of default values instead of analytical results . 30
12.2.5 Evaluation of the overall uncertainty of a GHG inventory . 30
12.3 A ssessment of the uncertainty for the stack-measurement method . 30
Annex A (informative) Content of the monitoring plan .31
Annex B (informative) Default emission factors .32
iii
Bibliography .40
iv
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out through
ISO technical committees. Each member body interested in a subject for which a technical committee
has been established has the right to be represented on that committee. International organizations,
governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely
with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types
of ISO document should be noted. This document was drafted in accordance with the editorial rules of the
ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). ISO takes no position concerning the evidence, validity or applicability of any claimed patent
rights in respect thereof. As of the date of publication of this document, ISO had not received notice of (a)
patent(s) which may be required to implement this document. However, implementers are cautioned that
this may not represent the latest information, which may be obtained from the patent database available at
www.iso.org/patents. ISO shall not be held responsible for identifying any or all such patent rights.
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and expressions
related to conformity assessment, as well as information about ISO's adherence to the World Trade
Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www.iso.org/iso/foreword.html.
This document was prepared by Technical Committee ISO/TC 146, Air quality, Subcommittee SC 1, Stationary
source emissions.
A list of all parts in the ISO 19694 series can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.html.
v
Introduction
0.1 General
This document for the semiconductor and display industry is based on 2019 Refinement to the 2006 IPCC
Guideline for National Greenhouse Gas Inventories.
This document, which deals with specific requirements for the semiconductor and display industry, has
been harmonized with ISO 14064-1 and ISO 19694-1, which deal with broader requirements. ISO 19694-1
and this document provide a harmonized method for:
— measuring, testing and quantifying methods for greenhouse gas (GHG) emissions;
— assessing the level of GHG emissions performance of production processes over time, at production sites;
and
— establishing and providing reliable, accurate and quality information for reporting and verification
purposes.
0.2 Overview of semiconductor and display manufacturing process
Semiconductor and display manufacture include processes, such as TFD or plasma EWC of silicon-containing
materials, that result in significant carbon dioxide emissions. These emissions are the results of the FC gases
and nitrous oxide used in the manufacturing process. Other GHG emissions in semiconductor and display
industry include the CO and CH from direct emissions of combustion, transportation, manufacturing
2 4
process or indirect emissions (e.g. room heating, on-site transports, on-site power generation, external
power production and external transports).
FC gases are used in two important steps of electronics manufacturing:
a) plasma EWC of silicon-containing materials, and
b) cleaning of the chamber walls of TFD and diffusion tools after processing substrates.
The semiconductor and display industry use N O as an input gas in TFD processes, and in other manufacturing
processes that use N O, such as diffusion and dry removal of photoresist.
The process emission of FC gases and N O should be estimated using the 2019 Refinement to the 2006 IPCC
Guideline for National Greenhouse Gas Inventories. In this document, references are made to the relevant
parts of 2019 Refinement to the 2006 IPCC Guideline for National Greenhouse Gas Inventories depending on
the element used for appropriate guidance that includes formulae, tables, etc. However, the 2019 Refinement
to the 2006 IPCC Guideline for National Greenhouse Gas Inventories can be corrected if some errors are
detected. Therefore, companies are strongly encouraged to keep referring to Reference [4] and to replace
the Annex B with the latest corrected version of Chapter 6, Volume 3 of the 2019 Refinement to the 2006 IPCC
Guideline for National Greenhouse Gas Inventories when it is made available.
vi
International Standard ISO 19694-7:2024(en)
Stationary source emissions — Determination of greenhouse
gas emissions in energy-intensive industries —
Part 7:
Semiconductor and display industries
1 Scope
This document provides a methodology for calculating greenhouse gas (GHG) emissions from the
semiconductor and display industry. This document includes the manufacture of semiconductor devices,
microelectromechanical systems (MEMS), photovoltaic (PV) devices and displays. This document allows to
report GHG emissions for various purposes and on different bases, such as a per-plant basis, per-company
basis (by country or by region) or an international group basis. This document addresses all of the following
direct and indirect sources of GHG:
— direct GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 a)] from sources that are owned or controlled
by the company, such as emissions resulting from the following sources:
— process: fluorinated compound (FC) gases and nitrous oxide (N O) used in etching and wafer cleaning
(EWC), remote plasma cleaning (RPC), in situ plasma cleansing (IPC), in situ thermal cleaning (ITC),
N O thin film deposition (TFD), and other N O using process;
2 2
— fuel combustion related to equipment and on-site vehicles, room heating/cooling;
— fuel combustion of fuels for on-site power generation;
— indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 b)] from the generation of imported
electricity, heat or steam consumed by the organization.
Other indirect GHG emissions [as defined in ISO 14064-1:2018, 5.2.4 c) to f)], which are the consequence of
an organization’s activities, but arise from GHG sources that are owned or controlled by other organizations,
are excluded from this document.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references,
the latest edition of the referenced document (including any amendments) applies.
ISO/IEC Guide 98-3:2008, Uncertainty of measurement — Part 3: Guide to the expression of uncertainty in
measurement (GUM: 1995)
ISO 19694-1:2021, Stationary source emissions — Determination of greenhouse gas emissions in energy-
intensive industries — Part 1: General aspects
ISO 14064-1:2018, Greenhouse gases — Part 1: Specification with guidance at the organization level for
quantification and reporting of greenhouse gas emissions and removals
Calvo Buendia, E., Tanabe, K., Kranjc, A., Baasansuren, J., Fukuda, M., Ngarize, S., Osako, A., Pyrozhenko, Y.,
Shermanau, P. and Federici, S. 2019 Refinement to the 2006 IPCC Guideline for National Greenhouse Gas
Inventories (2019 Refinement), Volume 3, Chapter 6 Electronics. URL: https:// www .ipcc -nggip .iges .or .jp/
public/ 2019rf/ index .html
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 19694-1 and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
3.1
base year
specific, historical period identified for the purpose of comparing greenhouse gas emissions (3.14) or
greenhouse gas (3.13) removals or other greenhouse gas-related information over time
Note 1 to entry: Base year emissions or removals may be quantified based on a specific period (e.g. a year or part of
year where seasonality is a feature of the organization’s (3.27) activity) or averaged from several periods (e.g. several
years).
[SOURCE: ISO 19694-1:2021, 3.3, modified — Note 1 to entry has been added.]
3.2
carbon dioxide equivalent
CO e
unit for comparing the radiative forcing of a greenhouse gas (3.13) to that of carbon dioxide
Note 1 to entry: The carbon dioxide equivalent is calculated using the mass of a given greenhouse gas multiplied by its
global warming potential (3.15).
[SOURCE: ISO 14064-1:2018, 3.1.13]
3.3
chemical vapour deposition
CVD
process for manufacturing preforms by which vapours and gases react chemically to produce deposits at the
surface of a substrate
3.4
equity share
percentage of economic interest in, or benefit derived from, a facility (3.7)
Note 1 to entry: Under this approach, an organization (3.27) (corporation, group) or a company consolidates its
greenhouse gas emissions (3.14) according to the (pro rata) equity share it holds in each operation, i.e. according to
ownership. As an exception, no emissions are consolidated for so-called fixed asset investments where a company
owns only a small part of the total shares of an operation and exerts neither significant influence nor financial control;
other possible exceptions relate to the economic substance of a relationship.
3.5
etching
removal of surface material
Note 1 to entry: Etching can be applied with liquids agents (wet chemical etching) or with gases in a recipient (dry
etching, plasma etching). The etching agent reacts chemically with the substrate.
[SOURCE: ISO 12679:2011, 3.3]
3.6
etching and wafer cleaning
EWC
removal process of chemical and particle impurities without altering or damaging the wafer surface after
etching (3.5) the surface material
3.7
facility
single installation, set of installations or production processes (stationary or mobile), which can be defined
within a single geographical boundary, organizational unit or production process
[SOURCE: ISO 14064-1:2018, 3.4.1]
3.8
fixed combustion emission
emission from the fixed combustion, including power generation, heat and electricity generation
3.9
fluorinated compounds and N O
FCs and N O
types of fluorinated compounds and liquids used to manufacture electrical products
EXAMPLE CF , C F , C F , c-C F , C F , c-C F , CH F, CH F , CHF , C HF , NF , SF , COF , F , C F O and N O.
4 2 6 3 8 4 8 4 6 5 8 3 2 2 3 2 5 3 6 2 2 4 8 2
3.10
fossil fuel
fuels from fossilized materials listed by the Intergovernmental Panel on Climate Change (IPCC)
EXAMPLE Coal, oil, natural gas and peat.
[SOURCE: ISO 19694-3:2023, 3.18]
3.11
fuel combustion
intentional oxidation of materials within an apparatus that is designed to provide heat or mechanical work
to a process, or to be used away from the apparatus
3.12
global warming potential
GWP
index, based on radiative properties of greenhouse gases (3.13), measuring the radiative forcing following
a pulse emission of a unit mass of a given greenhouse gas in the present-day atmosphere integrated over a
chosen time horizon (e.g. 100 years), relative to that of carbon dioxide (CO )
[SOURCE: ISO 14064-1:2018, 3.1.12, modified — "(e.g. 100 years)" has been added to the definition.]
3.13
greenhouse gas
GHG
gaseous constituent of the atmosphere, both natural and anthropogenic, that absorbs and emits radiation
at specific wavelengths within the spectrum of infrared radiation emitted by the Earth’s surface, the
atmosphere and clouds
Note 1 to entry: For list of greenhouse gases, see latest Intergovernmental Panel on Climate Change (IPCC) Assessment
Report.
Note 2 to entry: Water vapour and ozone are anthropogenic as well as natural greenhouse gases but are not included
as recognized greenhouse gases due to difficulties, in most cases, in isolating the human-induced component of global
warming attributable to their presence in the atmosphere.
[SOURCE: ISO 14064-1:2018, 3.1.1]
3.14
greenhouse gas emission
GHG emission
release of a greenhouse gas (3.13) into the atmosphere
[SOURCE: ISO 14064-1:2018, 3.1.5]
3.15
greenhouse gas emission factor
emission factor
coefficient relating greenhouse gas (3.13) activity data with the greenhouse gas emission (3.14)
[SOURCE: ISO 14064-1:2018, 3.1.7, modified — "GHG" has been removed from the second term and Note 1 to
entry has been deleted.]
3.16
greenhouse gas inventory
GHG inventory
list of greenhouse gas sources (3.17) and greenhouse gas (3.13) sinks, and their quantified greenhouse gas
emissions (3.14) and greenhouse gas removals
[SOURCE: ISO 14064-1:2018, 3.2.6]
3.17
greenhouse gas source
GHG source
process that releases a greenhouse gas (3.16) into the atmosphere
[SOURCE: ISO 14064-1:2018, 3.1.2]
3.18
electricity grid
grid
public electricity network
[SOURCE: ISO 52000-1:2017, 3.4.8]
3.19
indirect greenhouse gas emission
indirect GHG emission
greenhouse gas emission (3.14) that is a consequence of an organization’s (3.27) operations and activities, but
that arise from greenhouse gas sources (3.17) that are not owned or controlled by the organization
Note 1 to entry: These emissions occur generally in the upstream and/or downstream chain.
[SOURCE: ISO 14064-1:2018, 3.1.11]
3.20
in situ plasma cleaning
IPC
technique using chemically reactive oxygen plasma to remove hydrocarbon contaminants
3.21
in situ thermal cleaning
ITC
combined process of pyrolysis and oxidation
3.22
lower heat value
LHV
net calorific value
NCV
absolute value of the specific heat (enthalpy) of combustion, for unit mass of the fuel burned in oxygen at
constant pressure under such conditions that all the water of the reaction products remains as water vapour
(at 0,1 MPa), the other products being as for the gross calorific value, all at the reference temperature
[SOURCE: ISO 1928:2020, 3.1.3, modified — the term “net calorific value at constant volume” has been
replaced with “lower heat value”, the admitted term "net calorific value" has been added, and "(enthalpy)"
has been added to the definition.]
3.23
micro-electromechanical system
MEMS
DEPRECATED: micro-electromechanical device
system composed of one or more integrated microsized components, such as sensors, actuators, transducers,
resonators, oscillators, mechanical components and electric circuits
Note 1 to entry: In the definition, “microsized” is used to mean a size of less than a few millimetres.
Note 2 to entry: Technologies relating MEMS are extremely diverse and include fundamental technologies (such as
design, material, processing, functional element, system control, energy supply, bonding and assembly, electric circuit,
and evaluation), basic sciences (such as micro-science and engineering) as well as thermodynamics on a micro-scale
and microtribology.
Note 3 to entry: The singular and plural forms of the term “MEMS” are identical.
[SOURCE: IEC 62047-1:2016, 2.1.1, modified — the term has been changed to “micro-electromechanical
device” and the previous term “micro-electromechanical system” has been listed as a deprecated term;
Notes 1 and 2 to entry have been revised.]
3.24
monitoring
continuous or periodic assessment of greenhouse gas emissions (3.14) and greenhouse gas (3.13) removals or
other greenhouse gas-related data
[SOURCE: ISO 14064-1:2018, 3.2.12]
3.25
N O other process
semiconductor and display manufacturing process other than N O thin-film deposition (3.34) using N O
2 2
EXAMPLE Diffusion and dry removal of photoresist.
3.26
NO thin film deposition
N O TFD
thin-film deposition using N O as an input gas
3.27
organization
person or group of people that has its own functions with responsibilities, authorities and relationships to
achieve its objectives
Note 1 to entry: The concept of organization includes, but is not limited to, sole-trader, company, corporation, firm,
enterprise, authority, partnership, association, charity or institution, or part or combination thereof, whether
incorporated or not, public or private.
[SOURCE: ISO 14064-1:2018, 3.4.2]
3.28
organizational boundary
grouping of activities or facilities (3.9) in which an organization (3.27) exercises operational or financial
control or has an equity share (3.4)
[SOURCE: ISO 14064-1:2018, 3.4.7]
3.29
photovoltaic device
PV device
device which produces an electric potential difference between two points in a material by the absorption
of photons
3.30
process emission
emission from industrial processes involving chemical transformation other than combustion
[SOURCE: ISO 19694-1:2021, 3.36, modified — "including chemical and mineralogical transformations" has
been changed to "involving chemical transformation".]
3.31
remote plasma cleaning
RPC
plasma processing method in which the plasma and material interaction occurs at a location remote from
the plasma
3.32
reporting boundary
grouping of greenhouse gas emissions (3.14) or greenhouse gas removals reported from within the
organizational boundary (3.28) as well as those significant indirect greenhouse gas emissions (3.19) that are a
consequence of the organization's (3.27) operations and activities
[SOURCE: ISO 14064-1:2018, 3.4.8]
3.33
source stream
specific fuel type, raw material or product that
a) creates emissions of relevant greenhouse gases (3.13) at one or more emission sources as a result of its
consumption or production;
b) contains carbon and is included in the calculation of greenhouse gas emissions (3.14) using a mass
balance methodology
3.34
thin film deposition
TFD
process of producing thin films by physical vapour deposition or chemical vapour deposition (3.3) as well as
other techniques
3.35
transport combustion emission
combustion emission from transportation activities
3.36
uncertainty
parameter associated with the result of quantification which characterizes the dispersion of the values that
can be reasonably attributed to the quantified amount
Note 1 to entry: Uncertainty information typically specifies quantitative estimates of the likely dispersion of values
and a qualitative description of the likely causes of the dispersion.
[SOURCE: ISO 14064-1:2018, 3.2.13]
3.37
verification
process for evaluating a statement of historical data and information to determine if the statement is
materially correct and conforms to criteria
[SOURCE: ISO 14064-1:2018, 3.4.9]
4 Abbreviated terms
For the purposes of this document, the following abbreviated terms apply.
CVD chemical vapour deposition
DRE destruction removal efficiency
EF emission factor
EWC etching and wafer cleaning
FC fluorinated compound
GHG greenhouse gas
GWP global warming potential
IPC in situ plasma cleansing
IPCC intergovernmental panel on climate change
ITC in situ thermal cleaning
KPI key performance indicator
LHV lower heat value
MEMS microelectromechanical systems
NER normalized emission rate
OEM original equipment manufacturer
PI performance indicator
PV photovoltaic
TFD thin film deposition
RPC remote plasma cleaning
WSC World Semiconductor Council
5 Determination of GHG emissions principles
5.1 General
The determination of GHG emissions can in principle be done through a mass balance method or through
stack emission measurement or a combination of these two approaches. The choice of appropriate
methodology should depend on the obtention of accurate results with acceptable measurement uncertainties
at reasonable costs.
5.2 Major GHG emissions in semiconductor and display
GHG emissions in semiconductor and display industry include the family of FCs, N O and CH , which are from
2 4
direct emissions of combustion, transportation and manufacturing processes, or from indirect emissions.
5.3 Determination based on mass balance
The GHG emissions of an installation may be determined based on mass balance. Emissions from source
streams are calculated from input or production data, obtained by means of measurement systems, and
additional parameters from laboratory and analysis [including the reduction of mass of gas i (D ), the use
i
rate of gas i (U ), the emission factor of by-product (B )]. Standard factors may also be used; references to
i k,i
these factors are provided in ISO 19694-1.
5.4 Determination based on stack emission measurements
The GHG emissions of an installation may also be determined by measurement. Emissions from an emission
source are determined based on the measurement of the concentration of the relevant GHG in the flue gas
and the flowrate of the flue gas. Measurement standards to be applied on stack emission measurements
are provided in ISO 19694-1 and 2019 Refinement to the 2006 IPCC Guidelines for National Greenhouse Gas
Inventories.
6 Inventory boundaries
6.1 General
Drawing appropriate boundaries is one of the key tasks in an emissions' inventory process.
6.2 Organizational boundaries
Organizational boundaries define which parts of an organization – for example, wholly owned operations,
joint ventures and subsidiaries – are covered by an inventory, and how the emissions of these entities are
consolidated. The requirements to create organizational boundaries in ISO 19694-1 shall be applied.
In this document, reporting covers the main direct and indirect GHG emissions associated with
semiconductor and display production as required in Clauses 7, 8 and 10. These emissions also include those
related to consumption of fuels, materials and electricity in upstream and downstream operations.
Separate inventories may be established for individual facilities as appropriate, for instance, if they are
geographically separated or run by distinct operators. The impacts of such a division will cancel out when
emissions are consolidated at an organizational or group level.
Table 1 — Reporting boundaries for the semiconductor industry
Type of GHGs
Included within
Emission source
boundaries
CO CH N O HFCs PFCs SF NF
2 4 2 6 3
Room heating/ Fossil fuels used for
○ ○ ○
Fixed
cooling operating the boiler
combustion
Power / heat Fossil fuels used in the emer-
emissions
○ ○ ○
generation gency generator
Transport
Transport and Transport to processing
combustion ○ ○ ○
distribution facilities
emissions
Plasma etching and wafer
EWC ○ ○ ○ ○
Direct
cleaning of silicon materials
emissions
RPC ○ ○ ○ ○ Remote plasma cleaning
IPC ○ ○ ○ ○ In situ plasma cleaning
Process
ITC ○ ○ ○ ○ In situ thermal cleaning
emissions
Cleaning of the chamber from
N O TFD ○
the TFD process
N O other
○ N O process other than TFD
process
Imported
○ ○ ○
Use of purchased electricity
electricity
Indirect emissions production consumed in the
Imported
company’s equipment
○ ○ ○
steam / heat
6.3 Reporting boundaries
Reporting boundaries refer to the types of sources of emissions covered by an inventory and shall follow
ISO 14064-1.
Each semiconductor and display plant shall asses its direct GHG emissions sources and indirect GHG
emission sources. The assessment shall include GHG emissions from all stages of the manufacturing process
undertaken at the plant. Clause 7 provides detailed guidance on the different sources of direct emissions
occurring in semiconductor and display plant. Indirect emissions are addressed in Clause 8.
Companies shall use the reporting boundaries outlined in Tables 1 and 2 for the determination of GHG
emissions for the semiconductor and display plant. Any deviation from the boundaries shall be reported and
explained.
Table 2 — Reporting boundaries for the display industry
Type of GHGs
Included within
Emission source
boundaries
CO CH N O HFCs PFCs SF NF
2 4 2 6 3
Room heating/ Fossil fuels used for operating
○ ○ ○
Fixed
cooling the boiler
combustion
Power / heat Fossil fuels used in the emer-
emissions
○ ○ ○
generation gency generator
Transport
Transport and Transport to processing
combustion ○ ○ ○
distribution facilities
Direct emissions
emissions
Plasma etching of silicon
Etching ○ ○ ○ ○
materials
RPC ○ ○ ○ ○ Remote plasma cleaning
Process
emissions
IPC ○ ○ ○ ○ In situ plasma cleaning
Cleaning of the chamber from
N O TFD ○
the TFD process
Imported
○ ○ ○
Use of purchased electricity
electricity
Indirect emissions production consumed in the
Imported
company’s equipment
○ ○ ○
steam / heat
7 Direct GHG emissions and their determination
7.1 General
Direct GHG emissions are emissions from sources of the respective plant. In the semiconductor and display
manufacture, GHG emissions include the family of FCs including fluorinated liquids, N O and CH which may
2 4
result from, but are not restricted to, the following sources:
— fuel combustion for on-site power generation
— process emission, including:
a) plasma EWC of silicon-containing materials, and
b) cleaning of the chamber walls of TFD and diffusion tools after processing substrates.
The reporting entity shall prepare a full inventory of all direct GHG emissions sources of the plant.
The amount of FCs and N O direct GHG emissions can be determined by the mass balance based method or
by the continuous stack measurement based method.
Generally, companies are encouraged to measure the required parameters at plant level for site-specific
gases. Where plant- or company- specific data are not available, standard or default factors should be used.
Emission factors, formulae and reporting approaches for these sources are described in Clauses 7 and 8.
7.2 Direct GHG emissions from combustion and transportation
Direct GHG emissions from combustion can occur from sources that are owned or controlled by the
organization, such as boilers, furnaces and vehicles. GHG from combustion and transportation include CO ,
CH , and N O. To determine the direct GHG emissions from combustion and transportation, obtain the
4 2
following data:
— mass flow or volume flow (activity data);
— emissions factors;
— calorific values for fuels;
— oxidation or conversion factors.
GHG emissions from the fuel combustion can be calculated based on the mass, net calorific value and
chemical composition of fuels entering the process. It is important to note that the applied net calorific value
always has to match the type of the fuel.
The GHG emissions from combustion and transportation shall be determined using the mass balanced based
method given in Formula (1).
Ef=⋅HF⋅⋅F (1)
cons i Eo
where
E are the total annual GHG emissions of the regarding fuel, in tCO e/year;
f is the amount of fuel consumed, in t/year;
cons
H is the lower heat value (LHV) of fuel, in GJ/t;
i
F is the emission factor of fuel, in tCO e/GJ;
E 2
F is the oxidation factor of fuel (dimensionless); an oxidation factor of 1 means complete oxidation.
o
The GHG emissions from fuel shall be summed to give the total emissions of the fuels for the entire plant.
The reporting entity shall calculate GHG emissions in accordance with ISO 19694-1.
The reporting entity shall follow sampling methods in accordance with ISO 19694-1.
7.3 Direct GHG emissions from process emissions
7.3.1 General
The use of FCs and N O is considered under the process emission. The GHG emissions originating from the
use of FC gas and N O in the semiconductor and display manufacturing process shall be calculated.
FC gases include perfluoromethane (CF ), perfluoroethane (C F ), perfluoropropane (C F ),
4 2 6 3 8
perfluorocyclobutane (c-C F ), 1,3-hexafluorocyclopentene (C F ), octafluorotetrahydrofuran (C F O),
4 8 4 6 4 8
octafluorocyclopentene (c-C F ), fluoromethane (CH F), difluoromethane (CH F ), trifluoromethane (CHF ),
5 8 3 2 2 3
pentafluoroethane (C HF ), nitrogen trifluoride (NF ) and hexafluoride (SF ). This method is also applicable
2 5 3 6
to the determination of COF and F emissions.
2 2
In general, FCs that are GHGs or whose use during the manufacturing of electronic devices can result in
emissions of GHGs should be determined.
In the manufacturing processes, some portions of FC input gas are transformed into FC gas by-products such
as CF , C F , C F , C F , CH F, CH F and CHF . Several of these by-products can also be formed even if no
4 2 6 4 6 3 8 3 2 2 3
carbon-containing FCs, F , NF , SF , and ClF , are fed into the process that include etching carbon containing
2 3 6 3
materials or cleaning chambers used to deposit carbon-containing thin films.
The semiconductor sector includes six process types as follows: EWC, RPC, IPC, ITC, N O TFD and N O other
2 2
process. The display sector is differentiated into four process types: etching, RPC, IPC and N O TFD.
Methods to determine emissions of FC gases, fluorinated liquids, and N O that are used in the semiconductor
and display manufacturing processes are mainly classified into three tiers:
— Tier 1 is applicable only in cases where facility-specific data are not available. Tier 1 gives the aggregated
estimate of GHG and N O emissions based on production figures (surface area of substrate used during
the production of electronic devices).
— Tier 2a is only applicable to the semiconductor industry or industries with processes similar to
semiconductor manufacturing, such as MEMS. Tier 2a uses the default emission factors based on gas
consumption.
— Tier 2b is only applicable to the semiconductor industry and to MEMS manufacturing that uses tools
and processes similar to those used to manufacture semiconductors. Tier 2b uses the default emission
factors that are provided by the wafer size being manufactured.
— Tier 2c is applicable to the all sub-sectors, semiconductor (MEMS), display, and PV. Tier 2c uses default
emission factors that are provided for distinct process types p.
— Tier 3a is applicable to all sub-sectors and uses measured values for parameters. Tier 3a uses emission
factors which are measured for recipes or families of similar recipes.
— Tier 3b is applicable to all sub-sectors. Tier 3b measures the amount of GHGs emitted from a specific
facility through stack systems. Reporting companies estimate their emissions based on fabrication-
specific emission factors.
The steps to determine the direct GHG emissions in the semiconductor and display industry manufacturing
processes are given in Figure 1.
Figure 1 — Flowchart for the determination of the estimation method of GHG emissions from
semiconductor and display manufacturing process
NOTE If there are no national regulations, the following suggestion can be used to define key GHG emission
sources: key GHG emission sources are emission sources prioritized within the total GHG emission sources of the
individual company’s emission from Table 1 and Table 2 because their process emission estimates exceed 5 % of the
total process emission.
The GHG emissions determination method is exclusively developed for specific FC handling plants using the
emission factors. The development of individual facilities emission factors for specific process to estimate
emissions is encouraged. When it is not possible to apportion gas consumption for a site-specific level, then
the emission factors from IPCC or national factors based on consumption of individual gases may be used
as the default emission factors. However, the precision of the emissions' estimate generally improves from a
lower tier to a higher tier, due to more site-specific factors.
Emission factors, formulae and reporting approaches for these sources are described in the following
subclauses of 7.3.
Generally, companies are encouraged to measure the required parameters at the plant level, as it is expected
to provide a more accurate emissions estimate. International default factors can be used when the data for
the facilities specific emission factors are not provided. Other default factors (e.g. national) are preferred
to th
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