SIST EN 60191-4:2002

Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

Mechanische Normung von Halbleiterbauelementen -- Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente

Normalisation mécanique des dispositifs à semiconducteurs -- Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteurs

Donne des recommandations pour la désignation des boîtiers et pour la classification en formes des boîtiers pour les dispositifs à semiconducteurs.

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package (IEC 60191-4:1999)

General Information

• Status: Published
• Publication Date: 31-Aug-2002
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Sep-2002
• Due Date: 01-Sep-2002
• Completion Date: 01-Sep-2002
• Ref Project: EN 60191-4:1999 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Relations

• Amended By: SIST EN 60191-4:2002/A1:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 21-Sep-2010
• Amended By: SIST EN 60191-4:2002/A2:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 21-Sep-2010
• Amended By: SIST EN 60191-4:2002/A1:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 28-Jan-2023
• Amended By: SIST EN 60191-4:2002/A2:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 28-Jan-2023
• Revised: SIST EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 06-May-2014
• Amended By: SIST EN 60191-4:2002/A1:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 07-Jun-2022
• Amended By: SIST EN 60191-4:2002/A2:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 07-Jun-2011
• Replaced By: SIST EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 28-Jan-2023

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package (IEC 60191-4:1999)Mechanische Normung von Halbleiterbauelementen -- Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für HalbleiterbauelementeNormalisation mécanique des dispositifs à semiconducteurs -- Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteursMechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages31.240Mehanske konstrukcije za elektronsko
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