SIST EN 16602-60-13:2023

Space product assurance - Commercial electrical, electronic and electromechanical (EEE) components

This standard defines the requirements for selection, control, procurement and
usage of EEE commercial components for space projects.
This standard is applicable to commercial parts from the following families:
• Ceramic capacitors chips
• Solid electrolyte tantalum capacitors chips
• Discrete parts (transistors, diodes, optocouplers)
• Fuses
• Magnetic parts
• Microcircuits
• Resistors chips
• Thermistors
In addition for families of EEE components not addressed by the present ECSS
standard, it can be used as guideline on case by case basis.
The requirements of this document are applicable to all parties involved at all
levels in the integration of EEE commercial components into space segment
hardware and launchers.
This standard may be tailored for the specific characteristics and constrains of a
space project in conformance with ECSS-S-ST-00

Raumfahrtproduktsicherung - Kommerzielle Elektrische, elektronische und elektromechanische (EEE) Bauteile

The purpose of this NWIP is to update EN 16602-60-13(2015), equivalent to ECSS-Q-ST-60-13C “Space product assurance - Commercial electrical, electronic and electromechanical (EEE) components”.
The objectives of this activity are:
1. To disposition all CRs and propose their implementation.
2. Pre-tailoring:
a.   The C version of the ECSS-Q-ST-60-13 standard already provides three classes of EEE COTS components, in line with the ECSS-Q-ST-60C Rev.2,  but the need for modification to the current type of Pre-Tailoring shall be discussed by the WG and the result reported to the TA for instructions.
b   In case the WG believe there will be a need for modification to the current Pre-Tailoring, they will present their request to the TA and specific instructions will be provided.
3. To improve the general usability of the standard by defining requirement rationale where necessary, as specified in Annex B of the present document. The way this information will be published is still to be defined by the TA. The result shall be recorded in a separate document until further instruction by TA.
Justification:
Change Requests have been issued and reviewed by the discipline TAAR. The TA, based on the TAAR assessment, concluded that some of them are important enough and urgent and, as a consequence, required an update of the document.
All CRs recorded on this document shall then be reviewed and implemented by the Policy & Standards Working Group (PSWG) of ESCC that can be supported, if needed, by additional COTS experts that can be properly proposed by the PSWG and approved by the TA and the activities listed in clause 1 shall be carried out.
As identified by the Task Force on New Space Activities, the use of COTS in the current evolving equipment technology is becoming massive and the possibility to use EEE components coming from different business types (Automotive, Aeronautic, Railway, etc.) shall be taken into account .
In addition to the small technical and editorial modifications of Q-ST-60-13C requirements  which have been proposed by the attached CRs, the additional following main technical topics have been identified as needed to be implemented:
-   Enlargement of ECSS-Q-ST-60-13C Rev.1 to passive parts: enlarging the scope of the ECSS-Q-ST-60-13 current issue, by adding requirements about passive parts procurement (the scope of the current issue is limited to active parts).  
-   Automotive standard recognition: This new work item proposal aimed at defining the way to recognize automotive standards (AEC-Q) in EEE parts procurement process.
-   Screening and re-tinning requirements modification: This new work item proposal aimed at reducing screening and re-tinning requirements in certain cases.

Assurance produit des projets spatiaux - Composants électriques, électroniques et électromécaniques (EEE) commerciaux

Zagotavljanje varnih proizvodov v vesoljski tehniki - Električne, elektronske in elektromehanske komercialne komponente (EEE)

Ta standard določa zahteve za izbiro, nadzor, nabavo in uporabo komercialnih električnih, elektronskih in elektromehanskih komponent (EEE) za vesoljske projekte.
Ta standard se uporablja za komercialne dele iz naslednjih skupin:
• čipi keramičnega kondenzatorja,
• čipi tantalskega kondenzatorja s trdnim elektrolitom,
• diskretni deli (tranzistorji, diode, optični sklopniki),
• varovalke,
• magnetni deli,
• mikrovezja,
• uporni čipi,
• termistorji.
Poleg tega se lahko za družine električnih, elektronskih in elektromehanskih komponent (EEE), ki jih ta standard ECSS ne obravnava, uporablja kot smernica za vsak primer posebej.
Zahteve tega dokumenta veljajo za vse vpletene strani na vseh ravneh integracije komercialnih električnih, elektronskih in elektromehanskih komponent v vesoljski strojni opremi in lansirnikih.
Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.

General Information

• Status: Published
• Public Enquiry End Date: 30-Nov-2021
• Publication Date: 17-Aug-2023
• ICS: 49.140 - Space systems and operations
• Technical Committee: I13 - Imaginarni 13
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 06-Jul-2023
• Due Date: 10-Sep-2023
• Completion Date: 18-Aug-2023
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: EN 16602-60-13:2023 - Space product assurance - Commercial electrical, electronic and electromechanical (EEE) components

Relations

• Revised: SIST EN 16602-60-13:2015 - Space product assurance - Requirements for the use of COTS components
• Effective Date: 19-Jan-2023

Overview

SIST EN 16602-60-13:2023 - "Space product assurance - Commercial electrical, electronic and electromechanical (EEE) components" - defines requirements for the selection, control, procurement and use of commercial (COTS) EEE components in space projects. Originating from ECSS-Q-ST-60C and aligned with ECSS system rules, the standard applies to space segment hardware and launchers and may be tailored per ECSS‑S‑ST‑00. It covers specific component families (ceramic and tantalum chip capacitors, discrete semiconductors, fuses, magnetics, microcircuits, resistor chips, thermistors) and provides guidance for other commercial EEE families on a case‑by‑case basis.

Key topics and technical requirements

• Component classification: Defines three assurance classes (Class 1, 2, 3) with different requirements and trade‑offs between risk, assurance and cost.
• Selection & approval: Processes for component selection, evaluation and formal approval to meet mission requirements and justify use of commercial parts.
• Procurement controls: Requirements for procurement specifications, supplier assessment, traceability information (trace codes) and declared component lists.
• Quality & testing: Guidance on evaluation, screening and lot acceptance tests (LAT); procurement test tables are provided for each component family.
• Risk areas: Specific attention to finish-related risks (e.g., pure tin lead finish) and mitigation through risk analysis.
• Documentation & management: Templates and normative annexes such as Component Control Plan (CCP), Declared Components List (DCL), Parts Approval Document and Justification Documents to support traceability and configuration control.
• Tailoring & applicability: Explicitly designed to be used with ECSS-Q-ST-60; tailoring rules and an ECSS Applicability Requirement Matrix (EARM) approach are supported for integration into project requirement tools.

Practical applications - who uses it

• Space system integrators and prime contractors: to establish EEE parts policies, component control plans and procurement clauses.
• Project managers and systems engineers: to define acceptable component classes, mission-driven trade-offs and tailoring.
• Procurement and quality assurance teams: for supplier evaluation, incoming inspection strategy, lot acceptance and traceability.
• Electronic designers: to select approved commercial parts and apply mitigation measures when COTS parts are required.
• Sub‑contractors and component suppliers: to comply with project-specific EEE requirements and provide required documentation.

Related standards (applicable)

This standard is used alongside ECSS-Q-ST-60 and ECSS‑S‑ST‑00 and references documents such as ESCC specifications, JESD and J‑STD test guides, MIL‑STD test methods and automotive AEC‑Q documents for harmonized handling of test, quality and contamination topics.

Keywords: SIST EN 16602-60-13:2023, space product assurance, EEE components, commercial parts, component selection, procurement, lot acceptance tests, ECSS.

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2023
Zagotavljanje varnih proizvodov v vesoljski tehniki - Električne, elektronske in
elektromehanske komercialne komponente (EEE)
Space product assurance - Commercial electrical, electronic and electromechanical
(EEE) components
Raumfahrtproduktsicherung - Kommerzielle Elektrische, elektronische und
elektromechanische (EEE) Bauteile
Assurance produit des projets spatiaux - Composants électriques, électroniques et
électromécaniques (EEE) commerciaux
Ta slovenski standard je istoveten z: EN 16602-60-13:2023
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 16602-60-13

NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2023
ICS 49.140
Supersedes EN 16602-60-13:2015
English version
Space product assurance - Commercial electrical,
electronic and electromechanical (EEE) components
Assurance produit des projets spatiaux - Composants Raumfahrtproduktsicherung - Kommerzielle
électriques, électroniques et électromécaniques (EEE) Elektrische, elektronische und elektromechanische
commerciaux (EEE) Bauteile
This European Standard was approved by CEN on 30 January 2023.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Türkiye and United Kingdom.

CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2023 CEN/CENELEC All rights of exploitation in any form and by any means
Ref. No. EN 16602-60-13:2023 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 5
Introduction . 6
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 11
3.1 Terms from other standards .11
3.2 Terms specific to the present standard .11
3.3 Abbreviated terms. 12
3.4 Conventions.13
3.5 Nomenclature .14
3.6 Convention for the Applicability Matrix . 15
4 Requirements for class 1 components . 16
5 Requirements for class 2 components . 28
6 Requirements for class 3 components . 39
7 Quality levels . 50
8 Evaluation, screening and LAT tests . 51
9 Pure tin lead finish – risk analysis . 93
Annex A (normative) Component control plan (CCP) - DRD . 94
Annex B (normative) Declared components list (DCL) - DRD . 95
Annex C (normative) Internal Supplier’s specification - DRD . 96
Annex D (normative) Parts approval document - DRD . 97
Annex E (informative) EEE documents delivery per review . 98
Annex F (normative) Justification document - DRD . 99
Annex G <> . 102
Annex H (informative) Flow chart for construction analysis . 103
Bibliography . 106

Figures
Figure 4-1: <> . 20
Figure 4-2: <> . 23
Figure 5-1: <> . 32
Figure 5-2: <> . 35
Figure 6-1: <> . 45
Figure 8-1: <> .51
Figure 8-2: <> .51
Figure 8-3: <> .51
Figure 8-4: <> .51
Figure 8-5: <> .51
Figure 8-6: <> .51

Tables
Table 4–1: <> . 20
Table 4–2: <> . 23
Table 4–3: <> . 23
Table 4-4: Documentation for Class 1 components . 27
Table 5–1: <> . 32
Table 5–2: <> . 34
Table 5–3: <> . 35
Table 5–4: Documentation for Class 2 components . 38
Table 6–1: <> .42
Table 6–2: <> .44
Table 6–3: <> . 45
Table 6–4: Documentation for Class 3 components . 48
Table 8–1: Procurement test table for ceramic capacitors chips . 54
Table 8–2: Procurement test table for solid electrolyte tantalum capacitors chips . 56
Table 8–3: Procurement test table for discrete parts (diodes, transistors, optocouplers)
..................................................................................................................58
Table 8–4: Procurement test table for fuses .60
Table 8–5: Procurement test table for magnetics.63
Table 8–6: Procurement test table for microcircuits . 66
Table 8–7: Procurement test table for resistor chips . 68
Table 8–8: Procurement test table for Thermistors . 71
Table 8–9: Legacy test files - Evaluation tests for Class 1 components - Active parts . 74
Table 8–10: Legacy test files - Screening tests for Class 1 components - Active parts 77
Table 8–11: Legacy test files - Lot acceptance tests for Class 1 components - Active
parts .79
Table 8–12: Legacy test files - Evaluation tests - Class 2 components - Active parts . 82
Table 8–13: Legacy test files - Screening tests - Class 2 components - Active parts . 85
Table 8–14: Legacy test files - Lot acceptance tests - Class 2 components – Active parts
..................................................................................................................87
Table 8–15: Legacy test files - LAT tests - Class 3 components - Active parts . 90
: <> . 103
: Construction analysis sequence . 104

European Foreword
This document (EN 16602-60-13:2023) has been prepared by Technical
Committee CEN-CENELEC/TC 5 “Space”, the secretariat of which is held by
DIN.
This standard (EN 16602-60-13:2023) originates from ECSS-Q-ST-60-13C Rev.1.
This document will supersede EN 16602-60-13:2015.
The main changes with respect to EN 16602-60-13:2015 are listed below:
• Implementation of Change Requests
• Definition of “traceability information (trace code)” updated”
• Alignment with updated version of ECSS-Q-ST-60
This document has been prepared under a standardization request given to CEN
by the European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
Introduction
This standard is based on and complementary to ECSS-Q-ST-60C. It defines the
applicability and tailoring of the requirements of ECSS-Q-ST-60C for COTS EEE.
This standard can only be used in conjunction with ECSS-Q-ST-60C in its current
revision. This standard applies only to commercial components - as defined in its
scope - which meet defined technical parameters that are on the system
application level demonstrated to be unachievable with existing space
components or only achievable with qualitative and quantitative penalties. The
standard requires that qualitative and quantitative penalties are specified, as
applicable, as a minimum in terms of quantifiable parameters such as: functional
capability, parts count, power dissipation, frequency of operation, data/signal
processing efficiency, interconnect complexity, mass, volume, …
For traceability to ECSS-Q-ST-60, the modifications or additions are marked in
blue. Text in black colour is unmodified text.
For easy tailoring and implementation of the requirements into a Requirement
Management Tool, and for direct traceability to ECSS-Q-ST-60, requirements in
this standards have been written in the way of a ECSS Applicability Requirement
Matrix (EARM), as defined in Annex A of ECSS-S-ST-00 “ECSS system –
Description, implementation and general requirements”.

In line with ECSS-Q-ST-60, this standard differentiates between three classes of
components through three different sets of standardization requirements
(clauses) to be met.
The three classes provide for three levels of trade-off between assurance and risk.
The highest assurance and lowest risk is provided by class 1 and the lowest
assurance and highest risk by class 3. Procurement costs are typically highest for
class 1 and lowest for class 3. Mitigation and other engineering measures can
decrease the total cost of ownership differences between the three classes. The
project objectives, definition and constraints determine which class or classes of
components are appropriate to be utilised within the system and subsystems.
Class 1 components are described in Clause 4
Class 2 components are described in Clause 5
Class 3 components are described in Clause 6

The objective of the EEE component selection, control, procurement and use
requirements is to ensure that EEE components used in a space project enables
the project to meet its mission requirements.
Important elements of EEE component requirements include:
component programme management,
component selection, evaluation and approval,
procurement,
handling and storage,
component quality assurance,
specific components, and
documentation.
The main tools which can be used to reach the objective are:
concurrent engineering,
standardization of component types,
characterization of components,
assessment of component manufacturers including declared competencies
and processes,
testing, screening, lot acceptance and periodic testing,
procurement specifications,
control and inspection,
control of nonconforming materials,
assessment and use of existing component data,
application of specific control to mitigate risk for components with limited
data or confidence, and
information management.
The basic approach is as follows:
• The customer of a given space project defines the EEE component
requirements within the boundaries of this standard. They appear in the
appropriate clauses of the project requirements as defined in ECSS-M-ST-10.
• The supplier defines a component control plan to implement those
requirements into a system which enables, for instance, to control the
selection, approval, procurement, handling in a schedule compatible with his
requirements, and in a cost-efficient way.
• The supplier ensures that the applicable parts requirements are passed down
to lower level suppliers and ensure that they are compliant to these parts
requirements.
Scope
This standard defines the requirements for selection, control, procurement and
usage of EEE commercial components for space projects.
This standard is applicable to commercial parts from the following families:
• Ceramic capacitors chips
• Solid electrolyte tantalum capacitors chips
• Discrete parts (transistors, diodes, optocouplers)
• Fuses
• Magnetic parts
• Microcircuits
• Resistors chips
• Thermistors
In addition for families of EEE components not addressed by the present ECSS
standard, it can be used as guideline on case by case basis.

The requirements of this document are applicable to all parties involved at all
levels in the integration of EEE commercial components into space segment
hardware and launchers.
This standard may be tailored for the specific characteristics and constrains of a
space project in conformance with ECSS-S-ST-00.
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01
ECSS system - Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance - Electrical, electronic and
electromechanical (EEE) components
EN 16602-60-14 ECSS-Q-ST-60-14 Space product assurance - Relifing procedure - EEE
components
EN 16602-60-15 ECSS-Q-ST-60-15 Space product assurance – Radiation hardness
assurance – EEE components
ESCC 20600 Preservation packaging and despatch of SCC
components
ESCC 21004 Guidelines for incoming inspection of EEE
components (ESCC Basic Specification No. 21004)
ESCC 21300 Terms, definitions, abbreviations, symbols and units
ESCC 22500 Guidelines for displacement damage irradiation
testing
ESCC 24900 Minimum requirements for controlling
environmental contamination of components
ESCC 25100 Single Event Effects Test Method and Guidelines
ESCC 25500 Methodology for the detection of pure tin in the
external surface finish of case and leads of EEE
components
GEIA-STD-005-2 Standard for Mitigating the Effects of Tin Whiskers in
Aerospace and High Performance Electronic Systems.
JESD22-A101 Steady state temperature humidity bias life test
JESD22-A110 Highly accelerated temperature and humidity stress
test
JESD22-A113 Preconditioning of plastic surface mount devices prior
to reliability testing
EN reference Reference in text Title
JESD22-A121 Test Method for Measuring Whisker Growth on Tin
and Tin Alloy Surface Finishes
JESD22-B106 Resistance to soldering temperature for through hole
mounted devices
JESD-201 Environmental Acceptance Requirements for Tin
Whisker Susceptibility of Tin and Tin Alloy Surface
Finishes
J-STD-020 Moisture/Reflow sensitivity classification for
nonhermetic solid state surface mount devices
J-STD-033 Handling, packing, shipping and use of moisture/
reflow sensitive surface mount devices
MIL-STD-750 Test methods for semiconductor devices
MIL-STD-883 Test method standard microcircuits
AEC-Q100 Failure mechanism based stress test qualification for
integrated circuits
AEC_Q101 Stress test qualification for automotive grade discrete
semiconductors
AEC-Q200 Stress test qualification for passive components

Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this standard, the terms and definitions from ECSS-S-
ST-00-01 apply.
For the purpose of this standard, the following terms and definitions from
ECSS-Q-ST-60 apply:
1. agent
2. characterization
3. commercial component
4. concurrent engineering
5. franchised distributor
6. parts engineer
7. parts procurer
8. qualified parts
9. screening
10. space qualified parts
3.2 Terms specific to the present standard
3.2.1 traceability information (trace code)
unique identifier used by manufacturers to label and trace a quantity of
components with at least a common assembly history
NOTE 1 The notion of “lot of EEE parts” used for lot acceptance
tests, except for radiation, is defined by the same trace
code.
NOTE 2 The notion of "lot of EEE parts" used for the radiation is
defined by the same diffusion lot.
NOTE 3 Several trace codes can be part of a same delivery from the
manufacturer or the distributor.
NOTE 4 It is possible to have several diffusion lots and wafer fabs
(as per ESCC 21300) in the same trace code.
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
Abbreviation Meaning
AOQ average outgoing quality
ASIC application specific integrated circuit
BGA ball grid array
CA construction analysis
CCD charge coupled device
CCP component control plan
CN change notice
CoC certificate of conformance
CDR critical design review
CR change request
DCL declared components list
DPA destructive physical analysis
DRD document requirement definition
DSM deep Sub-Micron
Ea activation energy
ECSS European Coordination for Space
Standardization
EEE electrical, electronic, electromechanical
EFR early failure rate
ESCC European space components coordination
GSE ground support equipment
HAST highly accelerated stress test
HTOL high temperature operating life
HTRB high temperature reverse bias
JD justification document
LAT lot acceptance test
LED light emitting diode
LVT lot validation testing
MMIC microwave monolithic integrated circuit
PAD parts approval document
PCB parts control board
PCN process change notice
PDA percent defective allowable
PED plastic encapsulated device
PIND particle impact noise detection
QBSD full quadrant back scatter electron detector
Abbreviation Meaning
QCI quality conformance inspection
RFD request for deviation
RH relative humidity
RoHs restriction of the use of certain hazardous
substances
RVT radiation verification testing
SCSB Space Components Steering Board
SAM scanning accoustic microscopy
SEM scanning electron microscope
SMD surface mount device
TCI technology conformance inspection
Tg Glass Transition Temperature
THB temperature humidity bias
Tj junction temperature
T/C thermal cycling
TM Test Method
3.4 Conventions
The term “EEE component“ is synonymous with the terms "EEE Part",
"Component" or just "Part".
The term “for approval” means that a decision of the approval authority is
necessary for continuing the process.
The term “for review” means that raised reviewers comments are
considered and dispositioned.
The term “for information” means that no comments are expected about
the delivered item.
For the purpose of clear understanding of this document, hereunder is a
listing of component categories which are covered by the term EEE
component, encapsulated or non-encapsulated, irrespective of the quality
level:
1. Capacitors
2. Connectors
3. Crystals
4. Discrete semiconductors (including diodes, transistors)
5. Filters
6. Fuses
7. Magnetic components (e.g. inductors, transformers, including in-
house products)
8. Monolithic Microcircuits (including MMICs)
9. Hybrid circuits
10. Relays
11. Resistors, heaters
12. Surface acoustic wave devices
13. Switches (including mechanical, thermal)
14. Thermistors
15. Wires and Cables
16. Optoelectronic Devices (including opto-couplers, LED, CCDs,
displays, sensors)
17. Passive Microwave Devices (including, for instance, mixers,
couplers, isolators and switches)
NOTE Microwave switches consisting of multiple EEE components are
considered as equipment. The requirements of this standard are
applicable to the EEE parts they incorporate and to microwave
switches having a simple design (single EEE part).
3.5 Nomenclature
The following nomenclature applies throughout this document:
The word “shall” is used in this Standard to express requirements. All the
requirements are expressed with the word “shall”.
The word “should” is used in this Standard to express recommendations.
All the recommendations are expressed with the word “should”.
NOTE It is expected that, during tailoring, recommendations in this
document are either converted into requirements or tailored out.
The words “may” and “need not” are used in this Standard to express
positive and negative permissions, respectively. All the positive
permissions are expressed with the word “may”. All the negative
permissions are expressed with the words “need not”.
The word “can” is used in this Standard to express capabilities or
possibilities, and therefore, if not accompanied by one of the previous
words, it implies descriptive text.
NOTE In ECSS “may” and “can” have completely different meanings:
“may” is normative (permission), and “can” is descriptive.
The present and past tenses are used in this Standard to express statements
of fact, and therefore they imply descriptive text.
3.6 Convention for the Applicability Matrix
The following terminology applies for the column “Applicability” of the
applicability matrix:
Applicability Explanation
Applicable Requirement of ECSS-Q-ST-60 applies
Not applicable Requirement from ECSS-Q-ST-60 does not apply
Modified Requirement of ECSS-Q-ST-60 applies with modified text
New Requirement added in ECSS-Q-ST-60-13 and not present in ECSS-
Q-ST-60
Deleted Requirement is deleted in the applicable version of ECSS-Q-ST-60
or ECSS-Q-ST-60-13
NOTE: In case of the deletion of a requirement that existed only
in ECSS-Q-ST-60-13 the former text is replaced by the
word <>
Requirements for class 1 components
Identifier Requirement Applicability
4.1 Component programme management
4.1.1 General
4.1.1a Deleted
4.1.2 Components control programme
4.1.2.1 Organization
4.1.2.1a Applicable
4.1.2.1b Deleted
4.1.2.2 Component control plan
4.1.2.2a Applicable
4.1.2.2b Applicable
4.1.2.2c Applicable
4.1.3 Parts control board
4.1.3a Applicable
4.1.3b Applicable
4.1.3c Applicable
4.1.3d Applicable
4.1.4 Declared component list
4.1.4a Applicable
4.1.4b Applicable
4.1.4c Applicable
4.1.4d  Applicable
4.1.4e Applicable
4.1.4f Applicable
4.1.4g Applicable
4.1.4h Applicable
4.1.4i Applicable
4.1.5 Electrical and mechanical GSE
4.1.5a Applicable
4.1.5b Applicable
4.1.6 EQM components
4.1.6a Applicable
4.1.6b Applicable
4.2 Component selection, evaluation and approval
4.2.1 General
4.2.1a Applicable
4.2.1b  Applicable
4.2.2 Manufacturer and component selection
4.2.2.1 General rules
4.2.2.1a Applicable
4.2.2.1b Applicable
4.2.2.1c <> Deleted
4.2.2.1d <> Deleted
4.2.2.1e <> Deleted
4.2.2.1f <> Deleted
4.2.2.1g For the assessment of commercial components, the supplier shall New
collect the available data on the manufacturer and the component in
the JD specified in the requirement 4.2.4d.
NOTE It is important to check the exhaustiveness
of the manufacturer documentation & data
sheet with respect to e.g. the following
items:
• component marking,
• mechanical description,
• electrical and thermal description.
4.2.2.1h <> Deleted
4.2.2.2 Parts and material restriction
4.2.2.2a Applicable
4.2.2.2b Applicable
4.2.2.2c Applicable
4.2.2.2d Applicable
4.2.2.2e Applicable
4.2.2.2f Applicable
4.2.2.2g Applicable
4.2.2.2h Applicable
4.2.2.2i Applicable
4.2.2.2.j Applicable
4.2.2.2k Applicable
4.2.2.2l Applicable
4.2.2.3 Preferred sources
4.2.2.3a Not applicable
4.2.2.3b Not applicable
4.2.2.3c Applicable
4.2.2.3d Not applicable
4.2.2.3e Applicable
4.2.2.3f Applicable
4.2.2.3g Applicable
4.2.2.4 Radiation hardness
4.2.2.4a Applicable
4.2.2.4b Applicable
4.2.2.4c Applicable
4.2.2.4d Applicable
4.2.2.4e Applicable
4.2.2.4f Applicable
4.2.2.4g Applicable
4.2.2.4h Applicable
4.2.2.4i Applicable
4.2.2.5 Derating
4.2.2.5a Applicable
4.2.2.5b Deleted
4.2.2.6 Temperature range
4.2.2.6a Commercial parts shall be selected in the highest available New
temperature range.
4.2.2.6b A minimum 10 °C margin shall be used between the maximum New
manufacturer temperature range and the application temperature
range (including worst cases).
4.2.2.6c <> Deleted
4.2.2.6d Operating temperature range of all commercial parts shall be greater New
or equal to (-40 / 85) °C.
4.2.2.6e Temperature range of commercial ceramic capacitors shall be New
greater or equal to (-40 / 125) °C
4.2.3 Component evaluation
4.2.3.1 General
4.2.3.1a Applicable
4.2.3.1b Deleted
4.2.3.1c Applicable
4.2.3.1d Applicable
4.2.3.1e Applicable
4.2.3.1f Applicable
4.2.3.1g Applicable
4.2.3.1h Applicable
4.2.3.1i The supplier shall review the evaluation results to determine their Modified
impact on the content of the screening and lot acceptance tests.
4.2.3.1j Applicable
4.2.3.1k The supplier shall prepare a preliminary internal supplier’s New
specification for electrical testing during evaluation tests.
NOTE This specification can be part of the
Justification document.
4.2.3.1l The supplier specification specified in 4.2.3.1k shall as minimum New
include tested parameters, test conditions, acceptance criteria, drift
limits.
4.2.3.1m The supplier shall update the internal supplier’s specification used New
for screening and lot acceptance in accordance with the results of
evaluation testing.
4.2.3.1n The preliminary and the final internal supplier’s specification as New
specified in Annex C shall be submitted to the customer for
approval.
4.2.3.2 Component manufacturer assessment
4.2.3.2.1 Not applicable
See 4.2.2.1.g
4.2.3.2.2a Not applicable
See 4.2.2.1.g
4.2.3.2.2b Not applicable
See 4.2.2.1.g
4.2.3.3. Construction analysis
4.2.3.3a Applicable
4.2.3.3b The Construction analysis shall be documented by a procedure to be Modified
submitted on request to the customer for information.
NOTE Annex H provides guidelines for
microcircuits, diodes, transistors and
optocouplers.
4.2.3.3c Applicable
4.2.3.4 Evaluation testing
4.2.3.4a Applicable
4.2.3.4b Applicable
4.2.3.4c Evaluation tests shall be performed as specified in: New
1. Table 8–1 for ceramic capacitors chips
2. Table 8–2 for solid electrolyte tantalum capacitors chips
3. Table 8–3 for discrete parts (diodes, transistors,
optocouplers)
4 Table 8–4 for fuses
5. Table 8–5 for magnetic parts
6. Table 8–6 for microcircuits
7. Table 8–7 for resistors
8. Table 8–8 for thermistors
4.2.3.4d Omission of any of the elements of tests specified in Table 8–1, Table New
8–2, Table 8–3, Table 8–4, Table 8–5, Table 8–6, Table 8–7 and Table
8–8, or the introduction of alternative activities, shall be justified in
the JD.
4.2.3.4e <> Deleted
Figure 4-1: <>
Table 4–1: <>
4.2.4 Parts approval
4.2.4a Applicable
4.2.4b Deleted
4.2.4c Applicable
4.2.4d The approval process by the customer depends on the part Modified
qualification status and shall be organized as follows:
1. Not applicable
2. Not applicable
3. Applicable
4. <> Deleted
4.2.4e In case the evaluation results are changing the testing conditions Modified
documented in the JD, a new revision of JD shall be submitted to the
customer for approval.
4.2.4f Applicable
4.3 Component procurement
4.3.1 General
4.3.1a Applicable
4.3.1b Not applicable
4.3.1c Not applicable
4.3.1d Applicable
4.3.1e Applicable
4.3.1f Applicable
4.3.1g Applicable
4.3.1h Applicable
4.3.1i Each procured EEE part shall be traceable to a manufacturer New
assigned trace code.
NOTE 1 The procurement of a single trace code per
delivery lot should be preferred and
encouraged.
NOTE 2 Some passive components can be traceable
with datecode only.
4.3.1j Each trace code shall be maintained as is through the entire supply New
chain including distributor.
NOTE As far as possible, commercial parts
should be ordered in the manufacturer’s
standard packing quantities or multiples
thereof to avoid distributor re-packing
and handling and to preserve the
traceability information usually included
on the original manufacturer packaging.
4.3.1k The supplier shall ensure that the elements of the JD in accordance with New
Annex F, including any action plan, are applicable to flight parts.
4.3.2 Procurement specification
4.3.2a The supplier shall procure EEE components according to controlled Modified
specifications.
NOTE It can be procurer’s in-house specification, a
manufacturer’s drawing or a datasheet as a
minimum.
4.3.2b Not applicable
4.3.2c Not applicable
4.3.2d Not applicable
4.3.2e Applicable
4.3.2f Applicable
4.3.2g Applicable
4.3.2h If additional requirements to the manufacturer are identified by the New
supplier, they shall be specified in the procurement specification, in
conformance with DRD from Annex C.
4.3.3. Screening requirements
4.3.3a Applicable
4.3.3b Applicable
4.3.3c Applicable
4.3.3d For commercial parts, screening tests shall be performed in Modified
accordance with:
1. Table 8–1 for ceramic capacitors chips,
2. Table 8–2 for solid electrolyte tantalum capacitors chips
3. Table 8–3 for discrete parts (diodes, transistors, optocouplers)
4. Table 8–4 for fuses
5. Table 8–5 for magnetic parts
6. Table 8–6 for microcircuits
7. Table 8–7 for resistors
8. Table 8–8 for thermistors
4.3.3e Deleted
4.3.3f Applicable
4.3.3g Deleted
4.3.3h Applicable
Table 4–2: <>

4.3.4 Initial customer source inspection (precap)
4.3.4a Not applicable
4.3.4b Not applicable
4.3.4c Not applicable
4.3.5 Lot acceptance
4.3.5a The supplier shall ensure that any lot/date code of EEE parts is Modified
submitted to a lot acceptance procedure, in line with applied
normative systems, according to the following rules:
1. Not applicable
2. Not applicable
3.  Applicable
4.3.5b Not applicable
4.3.5c Lot acceptance tests shall be performed as specified in: New
1. Table 8–1 for ceramic capacitors chips
2. Table 8–2 for solid electrolyte tantalum capacitors chips
3. Table 8–3 for discrete parts (diodes, transistors, optocouplers)
4. Table 8–4 for fuses
5. Table 8–5 for magnetic parts
6. Table 8–6 for microcircuits
7. Table 8–7 for resistors
8. Table 8–8 for thermistors
Figure 4-2: <>
Table 4–3: <>

4.3.6 Final customer source inspection (buy-off)
4.3.6a Not applicable
4.3.6b Not applicable
4.3.6c For commercial parts, the buy off shall be replaced by an incoming Modified
inspection at the procurement entity’s facility reported in the JD in
accordance with clause 4.3.7.
4.3.6d Not applicable
4.3.7 Incoming inspection
4.3.7a Applicable
4.3.7b Applicable
4.3.7c Applicable
4.3.7d Not applicable
4.3.7e Applicable
4.3.8 Radiation verification testing
4.3.8a Applicable
4.3.8b Applicable
4.3.8c Not applicable
4.3.8d Applicable
4.3.8e Applicable
4.3.8f Parts submitted to total dose test shall be first screened as specified in New
the clause 4.3.3 to be fully representative of flight parts.
4.3.9 Destructive physical analysis
4.3.9a The DPA shall be performed according to the procurement Tables Modified
Table 8–1, Table 8–2, Table 8–3, Table 8–4, Table 8–5, Table 8–6, Table
8–7, Table 8–8 of Clause 8.
4.3.9b Not applicable
4.3.9c Not applicable
4.3.9d Not applicable
4.3.9e The DPA process shall be documented by a procedure to be submitted, Modified
on request, to the customer for information.
NOTE For guidance refer to the basic specification
ESSC 20600 and for active parts ECSS-Q-ST-
60-13 Annex H.
4.3.9f Applicable
4.3.9g Deleted
4.3.9h Not applicable
4.3.9i Applicable
4.3.9j Applicable
4.3.9k <> Deleted
4.3.10 Relifing
4.3.10a Applicable
4.3.10b Applicable
4.3.10c <> Deleted
4.3.10d <> Deleted
4.3.11 Manufacturer’s data documentation deliveries
4.3.11a The manufacturer’s or the franchised distributor’s CoC shall be Modified
delivered to the parts procurer.
4.3.11b Any other data, defined in the procurement documents, shall be Modified
delivered to the parts’ procurer in line with the purchase order.
4.3.11c Applicable
4.4 Handling and storage
4.4a The supplier shall establish and implement procedures for handling Applicable
and storage of components in order to prevent possible degradation.
NOTE For guidance, refer to the basic specification
ESCC 20600.
4.4b Applicable
4.4c Applicable
4.4d Applicable
4.4e Plastic encapsulated devices shall be stored in one of the following New
conditions:
1. Dry Nitrogen
2. Dry and ionised air, with RH in a range of 15% to 20%
3. Dry packs as specified in J-STD-033 for dry pack inspection
and control
4.5 Components quality assurance
4.5.1 General
4.5.1a Applicable
4.5.2 Nonconformances or failures
4.5.2a Applicable
4.5.2b Applicable
4.5.2c Applicable
4.5.2d Applicable
4.5.3 Alerts
4.5.3a Applicable
4.5.3b Applicable
4.5.3c Applicable
4.5.4 Traceability
4.5.4a Deleted
4.5.4b Applicable
4.5.4c Applicable
4.5.4d The traceability of EEE parts during installation in equipment, shall Modified
be ensured by the supplier through maintaining the traceability to the
manufacturer’s trace code number of the EEE parts actually mounted.
4.5.4e If the as built DCL has not yet been delivered, the supplier shall be Modified
able to provide this information (part type actually installed with its
relevant trace code number) within one week.
4.5.5 Lot homogeneity for sampling test
4.5.5a If tests are performed by sampling, the sampled parts shall be selected Modified
so that they are representative of the trace code distribution.
4.5.5b Applicable
4.6 Specific components
4.6.1 General
4.6.1a <> Deleted
4.6.2 ASICs
4.6.2a Applicable
4.6.3 Hybrids
4.6.3a Not applicable
4.6.3b Not applicable
4.6.3c Not applicable
4.6.4 One time programmable devices
4.6.4a Applicable
4.6.4b The JD shall allow traceability to the information related to the Modified
procurement of blank parts, the programming process and the
acceptance of the programmed parts.
NOTE The programming process and the
acceptance of the programmed parts may be
part of PCB, for customer approval, if not
indicated in the JD.
4.6.4c <> Deleted
4.6.4d Applicable
4.6.4e Applicable
4.6.4f Applicable
4.6.4g Applicable
4.6.4h Applicable
4.6.5 Microwave monolithic integrated circuits
4.6.5a Not applicable
4.6.6 Connectors
4.6.6a Not applicable
4.7 Documentation
4.7a Any result from inspection or control shall be documented (including Modified
lot acceptance, incoming, relifing and complementary tests).

Table 4-4: Documentation for Class 1 components
Document Clause Customer Comments
New : Procedure for
4.2.2.2j. Approval For retinning operation
hot solder dip process
Applicable to the
New : Internal
preliminary and final
supplier’s 4.2.3.1k. Approval
internal supplier’s
specification
specification
PAD : not applicable 4.2.4 - -
New : Justification
4.2.4 Approval -
Document
Procedure for
customer precap : not 4.3.4 - -
applicable
New : Procedure for Information (on
4.2.3.3 -
construction analysis request)
Information
New : Evaluation and
4.2.4d. -
LAT report
(on request)
Requirements for class 2 components
5.1 Components programme management
5.1.1. General
5.1.1a Deleted
5.1.2 Components control programme
5.1.2.1 Organization
5.1.2.1a Applicable
5.1.2.2 Component control plan
5.1.2.2a Applicable
5.1.2.2b Applicable
5.1.3 Parts control board
5.1.3a Applicable
5.1.3b Applicable
5.1.3c Applicable
5.1.3d Applicable
5.1.4. Declared component list
5.1.4a Applicable
5.1.4b Applicable
5.1.4c Applicable
5.1.4d Applicable
5.1.4e Applicable
5.1.4f Applicable
5.1.4g Applicable
5.1.4h Applicable
5.1.4i Applicable
5.1.5. Electrical and mechanical GSE
5.1.5a Applicable
5.1.5b Applicable
5.1.6 EQM components
5.1.6a Applicable
5.1.6b Applicable
5.2 Component selection, evaluation and approval
5.2.1 General
5.2.1a  Applicable
5.2.1b Applicable
5.2.2. Manufacturer and component selection
5.2.2.1 General rules
5.2.2.1a Applicable
5.2.2.1b Applicable
5.2.2.1c <> Deleted
5.2.2.1d <> Deleted
5.2.2.1e For the assessment of commercial components, the supplier shall New
collect the available data on the manufacturer and the component in
the JD. Specified in the requirement 5.2.4.d.
NOTE It is important to check the exhaustiveness of
the manufacturer documentation & data
sheet with respect to the following items:
• component marking,
• mechanical description,
• electrical and thermal description
5.2.2.1f <> Deleted
5.2.2.2. Parts and material restriction
5.2.2.2a Applicable
5.2.2.2b Applicable
5.2.2.2c Applicable
5.2.2.2d Applicable
5.2.2.2e Applicable
5.2.2.2f Applicable
5.2.2.2g Applicable
5.2.2.2h Applicable
5.2.2.2i Applicable
5.2.2.2.j Applicable
5.2.2.2k Applicable
5.2.2.2l Applicable
5.2.2.3 Radiation hardness
5.2.2.3a Applicable
5.2.2.3b Applicable
5.2.2.3c Applicable
5.2.2.3d Applicable
5.2.2.3e Applicable
5.2.2.3f Applicable
5.2.2.3g Applicable
5.2.2.3h Applicable
5.2.2.3i Applicable
5.2.2.4 Derating
5.2.2.4a Applicable
5.2.2.4b Deleted
5.2.2.5 Preferred sources
5.2.2.5a Applicable
5.2.2.5b Applicable
5.2.2.6 Temperature range
5.2.2.6a Commercial parts shall be selected in the highest available New
temperature range.
5.2.2.6b A minimum 10°C margin shall be used between the maximum New
manufacturer temperature range and the application temperature
range (including worst cases).
5.2.2.6c <> Deleted
5.2.2.6d Operating temperature range of all commercial parts shall be greater New
or equal to (-40 / 85) °C.
5.2.2.6e Temperature range of comm
...