SIST EN IEC 60115-2:2026

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT) (IEC 60115-2:2023)

This part of IEC 60115 is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.  
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions)
and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating.
These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole
technique.  
The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the
appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements
for this type of resistor.

Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 2: Rahmenspezifikation: Niedrigbelastbare Schichtwiderstände mit Drahtanschlüssen für Durchsteckmontage auf Leiterplatten (THT) (IEC 60115-2:2023)

Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification intermédiaire: Résistances à couches et à faible dissipation équipées de broches pour assemblage par trous traversants sur circuits imprimés (THT) (IEC 60115-2:2023)

L’IEC 60115-2:2023 s’applique aux résistances fixes à couche, à faible dissipation, équipées de broches de sortie, utilisées dans les équipements électroniques, et qui sont généralement assemblées sur les cartes de circuit imprimé au moyen de la technologie à trous traversants (THT).
Ces résistances sont généralement décrites selon des types (différentes formes géométriques), des modèles (différentes dimensions) et des technologies de produit. L’élément résistif de ces résistances est généralement protégé par un revêtement de vernis enrobant. Ces résistances comportent des fils de sortie et sont principalement destinées à être montées sur une carte de circuits avec la technique des trous traversants.
Le présent document a pour objet d’énoncer les caractéristiques assignées et les caractéristiques préférentielles, de choisir dans l’IEC 60115-1 les procédures d’assurance de la qualité et les méthodes d’essai et de mesure appropriées, et de fixer les exigences de performances générales pour ce type de résistance.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) adoption des définitions des technologies de produit et des niveaux de classification de produit de la spécification générique, IEC 60115-1:2020;
b) examen des dimensions préférentielles du Tableau 1, et suppression de l’ancien modèle RA_0922;
c) amendement en 4.2 d’une base pour la spécification facultative de l’excentricité des broches, pour les résistances à broches axiales;
d) intégration en 5.3.8, en tant que méthode d’essai par défaut, de l’"essai de surcharge haute tension à impulsions périodiques" donné dans l’IEC 60115‑1:2020, 8.3, entraînant le remplacement de l’ancien "essai de surcharge à impulsions périodiques" donné dans l’IEC 60115‑1:2020, 8.4;
e) intégration en 5.3.19 et 5.3.20 de la révision de l’essai de brasabilité de l’IEC 60115‑1:2020, 11.1;
f) intégration en 5.3.22 de l’essai de résistance au solvant combiné de l’IEC 60115‑1:2020, 11.3;
g) intégration en 5.4.1, en tant qu’essai facultatif, de "l’essai d’endurance à la température ambiante" donné dans l’IEC 60115‑1:2020, 7.2 (figurant anciennement dans l’IEC 60115‑2:2014, Annexe C);
h) ajout de la forme d’ondes des impulsions 1,2/50 comme variante facultative en 5.4.2 à "l’essai de surcharge haute tension à une seule impulsion" donné dans l’IEC 60115‑1:2020, 8.2, appliqué avec la forme d’ondes des impulsions 10/700 spécifiée en 5.3.7;
i) intégration en tant qu’essais facultatifs des essais climatiques relatifs au "fonctionnement à basse température" de l’IEC 60115-1:2020, 10.2, et à "chaleur humide, essai continu, accéléré" de l’IEC 60115-1:2020, 10.5, respectivement en 5.4.4 et 5.4.5;
j) ajout de nouvelles recommandations en 6.2 sur la présentation des exigences de stabilité, ainsi que leurs écarts absolus et relatifs admis;
k) ajout de critères d’acceptation pour l’examen visuel en 6.5 et à l’Annexe B;
l) ajout d’un examen visuel pour l’emballage principal et l’emballage de proximité en 6.5.2 et en 7.2;
m) ajout de l’évaluation périodique des revêtements des sorties comme nouveau sujet de l’évaluation de la qualité en 9.8;
n) application de la numérotation corrigée des articles sur les essais de l’IEC 60115-1:2020;
o) ajout d’une nouvelle Annexe C pour synthétiser les exigences relatives à la qualité d’exécution pour l’assemblage de résistance à broches à couche, par exemple celles données dans l’ancienne série de normes IEC 61192

Stalni upori za elektronsko opremo - 2. del: Področna specifikacija: Tankoplastni upori nizke moči z izvodi za montažo skozi prehodne luknje tiskanih vezij (IEC 60115-2:2023)

Ta del standarda IEC 60115 se uporablja za fiksne nizkoenergijske filmske upore s priključnimi vodniki za uporabo v elektronski opremi, ki so običajno sestavljeni v tehnologiji preboja (THT) na tiskanih vezjih.  
Ti upori so običajno opisani glede na tipe (različne geometrijske oblike) in stile (različne dimenzije) ter tehnologijo izdelka. Uporovni element teh uporov je običajno zaščiten s slojem konformnega laka.  
Ti upori imajo žične priključke in so primarno namenjeni za montažo na tiskano vezje v tehniki preboja.  
Namen tega standarda je predpisati priporočene nazivne vrednosti in značilnosti ter izbrati iz IEC 60115-1 ustrezne postopke ocenjevanja kakovosti, teste in merilne metode ter podati splošne zahteve glede zmogljivosti za to vrsto upora.

General Information

• Status: Published
• Public Enquiry End Date: 26-Dec-2024
• Publication Date: 29-Apr-2026
• ICS: 31.040.10 - Fixed resistors
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 15-Apr-2026
• Due Date: 20-Jun-2026
• Completion Date: 30-Apr-2026
• Ref Project: EN IEC 60115-2:2026 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

Relations

• Replaces: SIST EN 60115-2:2015 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification : Fixed low-power non-wirewound resistors
• Effective Date: 01-Jun-2026
• Refers: SIST EN 60063:2015 - Fixed capacitors for use in electronic equipment - Preferred number series for resistors and capacitors
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60286-1:2018 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 60286-1:2017)
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60294:2013 - Measurement of the dimensions of a cylindrical component with axial terminations
• Effective Date: 03-Feb-2026
• Refers: SIST EN IEC 60068-2-20:2021 - Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60068-1:2014 - Environmental testing - Part 1: General and guidance
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60062:2016 - Marking codes for resistors and capacitors (IEC 60062:2016)
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60115-1:2023 - Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2020 (MOD)
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60301:2012 - Preferred diameters of wire terminations of capacitors and resistors
• Effective Date: 03-Feb-2026
• Refers: SIST EN 60068-2-6:2008 - Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
• Effective Date: 03-Feb-2026
• Refers: SIST EN 61193-2:2008 - Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages
• Effective Date: 03-Feb-2026
• Referred By: SIST EN IEC 60115-2-10:2026 - Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G (IEC 60115-2-10:2023)
• Effective Date: 03-Feb-2026
• Referred By: SIST EN IEC 60115-4:2026 - Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis (IEC 60115-4:2022)
• Effective Date: 03-Feb-2026
• Amended By: SIST EN IEC 60115-2:2026/A11:2026 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)
• Effective Date: 01-Jun-2026

Overview

SIST EN IEC 60115-2:2026 is an international standard published by CLC, aligning with IEC 60115-2:2023. This document specifies requirements for fixed low-power film resistors with leads, intended for through-hole technology (THT) mounting on printed circuit boards (PCBs) in electronic equipment. These resistors use a resistive film element protected by a conformal lacquer coating and feature wire terminations for efficient PCB assembly.

The objective of this sectional specification is to define preferred ratings, characteristics, and performance requirements, as well as to reference relevant quality assessment procedures, tests, and measuring methods for these resistor types.

Key Topics

• Scope and Applicability
  SIST EN IEC 60115-2:2026 covers fixed low-power film resistors with termination leads. It addresses various geometric shapes and dimensions, and encompasses different product technologies commonly used in electronic equipment.

• Preferred Styles and Dimensions
  The standard provides preferred resistor styles and standardizes key dimensions such as body size, lead spacing, and allowable lead eccentricity. It updates legacy styles and incorporates improved guidance on dimensional tolerancing.

• Climatic and Electrical Ratings
  The document prescribes preferred climatic categories and electrical characteristics including resistance values, tolerances, rated power dissipation, maximum element voltage, and insulation specifications.

• Testing and Quality Assessment
  It details required and optional quality tests, including:

  • Endurance and overload tests
  • Solderability (supporting lead-free and SnPb solders)
  • Robustness of terminations
  • Climatic sequence and accelerated damp heat tests
  • Visual examination and mechanical measurement standards

• Performance and Marking Requirements
  General performance requirements ensure consistency across manufacturers. The standard specifies marking methods for both components and packaging, facilitating traceability and compliance.

• Packaging, Handling, and Ordering Information
  Guidelines for packaging and storage help preserve quality during handling and transport. Ordering information requirements support clear supplier-customer communication.

Applications

Resistors covered by SIST EN IEC 60115-2:2026 are widely used in:

• Consumer Electronics: Radios, TVs, audio equipment, and home appliances
• Industrial Equipment: Control panels, automation devices, sensors, and measurement systems
• Telecommunications: Switches, routers, communication modules, and signal processing gear
• Automotive Electronics: Instrument clusters, control modules, and lighting boards
• General Electronic Circuit Boards: Any devices requiring precise and stable resistance elements

Through-hole film resistors remain vital where mechanical robustness, ease of inspection, and reliable manual or automated insertion are required. The standard supports manufacturers, designers, and OEMs in qualifying components for durable, high-quality THT assemblies.

Related Standards

The following standards are closely linked to SIST EN IEC 60115-2:2026, either for general requirements or for specialized testing and quality procedures:

• EN IEC 60115-1 – Generic specification for fixed resistors
• EN IEC 60068 series – Environmental testing methods
• EN IEC 60286-2 – Packaging of components for automatic handling
• EN IEC 60717 – SMD land pattern guidelines
• EN IEC 61191-1 / 61191-3 – Requirements for PCB assembly
• EN 60195 / EN IEC 60440 – Additional resistor testing standards

By following SIST EN IEC 60115-2:2026, organizations ensure conformity, reliability, and interoperability of low-power film resistors for through-hole electronic assembly, promoting product quality and compliance in global markets.

Standards Content (Sample)

SLOVENSKI STANDARD
01-junij-2026
Nadomešča:
SIST EN 60115-2:2015
Stalni upori za elektronsko opremo - 2. del: Področna specifikacija: Tankoplastni
upori nizke moči z izvodi za montažo skozi prehodne luknje tiskanih vezij (IEC
60115-2:2023)
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-
power film resistors with leads for through-hole assembly on circuit boards (THT) (IEC
60115-2:2023)
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 2:
Rahmenspezifikation: Niedrigbelastbare Schichtwiderstände mit Drahtanschlüssen für
Durchsteckmontage auf Leiterplatten (THT) (IEC 60115-2:2023)
Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification
intermédiaire: Résistances à couches et à faible dissipation équipées de broches pour
assemblage par trous traversants sur circuits imprimés (THT) (IEC 60115-2:2023)
Ta slovenski standard je istoveten z: EN IEC 60115-2:2026
ICS:
31.040.10 Fiksni upor Fixed resistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60115-2

NORME EUROPÉENNE
EUROPÄISCHE NORM April 2026
ICS 31.040.10 Supersedes EN 60115-2:2015
English Version
Fixed resistors for use in electronic equipment - Part 2: Sectional
specification: Low-power film resistors with leads for through-
hole assembly on circuit boards (THT)
(IEC 60115-2:2023)
Résistances fixes utilisées dans les équipements Festwiderstände zur Verwendung in Geräten der Elektronik
électroniques - Partie 2: Spécification intermédiaire: - Teil 2: Rahmenspezifikation: Niedrigbelastbare
Résistances à broches à couche, à faible dissipation, pour Schichtwiderstände mit Drahtanschlüssen für
assemblage par trous traversants sur cartes de circuit Durchsteckmontage auf Leiterplatten (THT)
imprimé (carte THT) (IEC 60115-2:2023)
(IEC 60115-2:2023)
This European Standard was approved by CENELEC on 2026-02-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60115-2:2026 E

European foreword
This document (EN IEC 60115-2:2026) consists of the text of document IEC 60115-2:2023, prepared
by IEC/TC 40 " Capacitors and resistors for electronic equipment".
The following dates are fixed:
• latest date by which this document has to be (dop) 2027-04-30
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) 2029-04-30
conflicting with this document have to be withdrawn
This document supersedes EN 60115-2:2015 and all of its amendments and corrigenda (if any).
This document is read in conjunction with EN IEC 60115-2:2026/A11:2026.
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure of the generic specification EN 60115-1:2023, where
the tests of prior Clause 4 are given in Clauses 6 to 12 now;
b) the definitions of product technologies and product classification levels of the generic specification,
EN 60115-1:2023, have been adopted;
c) the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA-0922 has
been removed;
d) a basis for the optional specification of the lead eccentricity of axial leaded resistors has been
amended in 4.2;
e) the ‘periodic-pulse high-voltage overload test’ of EN 60115-1:2023, 8.3 has been adopted as default
test method in 5.3.8, thereby replacing the legacy test ‘periodic-pulse overload test’ of EN 60115-
1:2023, 8.4;
f) the revised solderability test of EN 60115-1:2023, 11.1 has been adopted in 5.3.19 and 5.3.20;
g) the combined solvent resistance test of EN 60115-1:2023, 11.3 has been adopted in in 5.3.22;
h) the ‘endurance at room temperature test’ of EN 60115-1:2023, 7.2 (prior Annex C of
EN 60115-2:2015) has been adopted as an optional test in 5.4.1;
i) the ‘single-pulse high-voltage overload test’ of EN 60115-1:2023, 8.2, applied with the pulse shape
10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50
in 5.4.2;
j) climatic tests for ‘operation at low temperature’ of EN 60115-1:2023, 10.2, and for ‘damp heat,
steady state, accelerated’ of EN 60115-1:2023, 10.5, have been adopted as optional tests in 5.4.4.
and 5.4.5, respectively;
k) new guidance is provided in 6.2 on the presentation of stability requirements with their permissible
absolute and relative deviations;
l) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
m) visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2
n) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
o) a new Annex C has been added to summarize workmanship requirements for the assembly of
leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
p) the informative Annex F (prior Annex B) on radial formed styles has been amended with details on
a formed Z-bend style for surface-mount assembly.
Preceding documents on the subject covered by this specification have been:
— EN 60115-2:2015
— EN 140100:2008-02, EN 140100:1996-11 + EN 140100:1996-11/A1:2001-08
— CECC 40 100:1980-00, 1973-00
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60115-2:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60027-1 NOTE Approved as EN 60027-1
IEC 60068-2-1 NOTE Approved as EN IEC 60068-2-1
IEC 60068-2-2 NOTE Approved as EN IEC 60068-2-2
IEC 60068-2-13 NOTE Approved as EN IEC 60068-2-13
IEC 60068-2-14 NOTE Approved as EN IEC 60068-2-14
IEC 60068-2-21 NOTE Approved as EN IEC 60068-2-21
IEC 60068-2-30 NOTE Approved as EN IEC 60068-2-30
IEC 60068-2-45 NOTE Approved as EN 60068-2-45
IEC 60068-2-78 NOTE Approved as EN IEC 60068-2-78
IEC 60195 NOTE Approved as EN 60195
IEC 60286-2 NOTE Approved as EN IEC 60286-2
IEC 60440 NOTE Approved as EN 60440
IEC 60695-11-5 NOTE Approved as EN 60695-11-5
IEC 60717 NOTE Approved as EN 60717
IEC 61191-1 NOTE Approved as EN IEC 61191-1
IEC 61191-3 NOTE Approved as EN 61191-3
IEC 61760-1 NOTE Approved as EN IEC 61760-1
IEC 80000 series NOTE Approved as EN IEC 80000 series
ISO 80000 series NOTE Approved as EN ISO 80000 series

IEC 60115-2 ®
Edition 4.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –

Part 2: Sectional specification: Low-power film resistors with leads for through-

hole assembly on circuit boards (THT)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6467-6

– 2 – IEC 60115-2:2023 © IEC 2023
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
3.1 Terms . 10
3.2 Product technologies . 11
3.3 Product classification . 11
4 Preferred characteristics . 11
4.1 General . 11
4.2 Style and dimensions . 11
4.2.1 Preferred styles and outline dimensions. 11
4.2.2 Length of excessive coating or welding bead . 13
4.2.3 Lead wire spacing . 13
4.2.4 Lead eccentricity . 14
4.3 Preferred climatic categories . 15
4.4 Resistance . 16
4.5 Tolerances on resistance . 16
4.6 Rated dissipation P . 16
4.7 Limiting element voltage U . 16
max
4.8 Insulation voltage U . 17
ins
4.9 Insulation resistance R . 17
ins
5 Tests and test severities . 17
5.1 General provisions for tests applied by this specification . 17
5.2 Preparation of specimens . 18
5.2.1 Drying . 18
5.2.2 Mounting of components on test boards . 18
5.2.3 Mounting of components on a test rack . 21
5.3 Details of applied tests . 23
5.3.1 Resistance . 23
5.3.2 Temperature coefficient of resistance . 23
5.3.3 Temperature rise . 23
5.3.4 Endurance at the rated temperature 70 °C . 23
5.3.5 Endurance at a maximum temperature: UCT . 24
5.3.6 Short-term overload . 24
5.3.7 Single-pulse high-voltage overload test . 25
5.3.8 Periodic-pulse high-voltage overload test . 26
5.3.9 Electrostatic discharge (ESD) test . 27
5.3.10 Visual examination . 27
5.3.11 Gauging of dimensions . 28
5.3.12 Detail dimensions . 28
5.3.13 Robustness of terminations . 28
5.3.14 Vibration . 29
5.3.15 Rapid change of temperature . 29
5.3.16 Rapid change of temperature, ≥ 100 cycles . 29
5.3.17 Climatic sequence . 29
5.3.18 Damp heat, steady state . 30

IEC 60115-2:2023 © IEC 2023 – 3 –
5.3.19 Solderability, with lead-free solder . 30
5.3.20 Solderability, with SnPb solder . 31
5.3.21 Resistance to soldering heat . 32
5.3.22 Solvent resistance . 32
5.3.23 Insulation resistance . 32
5.3.24 Voltage proof . 32
5.3.25 Flammability . 33
5.4 Optional and/or additional tests . 33
5.4.1 Endurance at room temperature . 33
5.4.2 Single-pulse high-voltage overload test . 34
5.4.3 Periodic-pulse overload test . 34
5.4.4 Operation at low temperature. 35
5.4.5 Damp heat, steady state, accelerated . 35
6 Performance requirements. 36
6.1 General . 36
6.2 Limits for change of resistance at tests . 36
6.3 Temperature coefficient of resistance . 39
6.4 Temperature rise . 39
6.5 Visual examination . 40
6.5.1 General visual criteria . 40
6.5.2 Visual criteria after tests . 40
6.5.3 Visual criteria for the packaging . 40
6.6 Solderability . 40
6.7 Insulation resistance . 41
6.8 Flammability . 41
7 Marking, packaging and ordering information . 41
7.1 Marking of the component . 41
7.2 Packaging . 41
7.3 Marking of the packaging . 41
7.4 Ordering information . 42
8 Detail specifications . 42
8.1 General . 42
8.2 Information to be specified in a detail specification . 42
8.2.1 Outline drawing or illustration . 42
8.2.2 Style and dimensions . 42
8.2.3 Climatic category . 43
8.2.4 Resistance range . 43
8.2.5 Tolerances on resistance . 43
8.2.6 Rated dissipation P . 43
8.2.7 Limiting element voltage U . 43
max
8.2.8 Insulation voltage U . 43
ins
8.2.9 Insulation resistance R . 43
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 44
8.2.14 Ordering information . 44
8.2.15 Mounting . 44

– 4 – IEC 60115-2:2023 © IEC 2023
8.2.16 Storage. 44
8.2.17 Transportation . 44
8.2.18 Additional information . 44
8.2.19 Quality assessment procedures . 44
8.2.20 0 Ω resistors . 44
9 Quality assessment procedures . 45
9.1 General . 45
9.2 Definitions. 45
9.2.1 Primary stage of manufacture . 45
9.2.2 Structurally similar components . 45
9.2.3 Assessment level EZ . 45
9.3 Formation of inspection lots . 45
9.4 Approved component (IECQ AC) procedures . 46
9.5 Qualification approval (QA) procedures . 46
9.5.1 General . 46
9.5.2 Qualification approval . 47
9.5.3 Quality conformance inspection . 47
9.6 Capability certification (IECQ AC-C) procedures . 47
9.7 Technology certification (IECQ-AC-TC) procedures . 47
9.8 Periodical evaluation of termination plating . 47
9.9 Delayed delivery . 47
9.10 Certified test records. 48
9.11 Certificate of conformity (CoC) . 48
Annex A (normative) Symbols and abbreviated terms . 58
A.1 Symbols . 58
A.2 Abbreviated terms . 61
Annex B (normative) Visual examination acceptance criteria . 63
B.1 General . 63
B.2 Criteria for general visual inspection of specimens . 63
B.3 Criteria for visual inspection of specimens after tests . 63
Annex C (normative) Workmanship requirements for the assembly of leaded film
resistors . 64
C.1 General . 64
C.2 Lead forming . 64
C.2.1 General . 64
C.2.2 Means for support of mounting height . 65
C.3 Mounting . 66
C.3.1 General . 66
C.3.2 Lateral mounting . 67
C.3.3 Upright mounting . 68
C.4 Lead trimming . 69
Annex D (normative) Zero Ohm resistors (jumpers). 71
D.1 General . 71
D.2 Preferred characteristics . 71
D.3 Tests and test severities . 71
D.4 Performance requirements . 72
D.5 Marking, packaging and ordering information . 72
D.6 Detail specification . 73

IEC 60115-2:2023 © IEC 2023 – 5 –
D.7 Quality assessment procedures . 73
Annex E (informative) Guide on the application of optional and additional tests . 74
E.1 General . 74
E.2 Endurance at room temperature . 74
E.3 Single-pulse high-voltage overload test . 75
E.4 Periodic- pulse overload test . 76
E.5 Operation at low temperature . 76
E.6 Damp heat, steady state, accelerated . 77
Annex F (informative) Radial formed types. 79
F.1 General . 79
F.1.1 Applicability of this annex . 79
F.1.2 Denomination of radial formed types . 79
F.1.3 Coated lead wires . 81
F.1.4 Means for support of mounting height . 81
F.1.5 Means for retention . 82
F.2 Radial formed types for through-hole assembly . 82
F.2.1 Radial formed type with lateral body position . 82
F.2.2 Radial formed type with upright body position . 84
F.3 Radial formed types for surface-mount assembly . 87
F.4 Packaging . 88
F.4.1 Packaging of resistors formed for through-hole assembly . 88
F.4.2 Packaging of resistors formed for surface-mount assembly . 89
F.5 Quality assessment . 89
F.5.1 General . 89
F.5.2 Quality assessment of formed resistors . 89
F.5.3 Forming of finished resistors of assessed quality . 90
F.5.4 Special inspection requirements . 90
Annex X (informative) Cross-references for the prior revision of this specification . 91
Bibliography . 94

Figure 1 – Illustration of a typical axial leaded resistor . 10
Figure 2 – Illustrations of typical radial leaded resistors . 10
Figure 3 – Shape and dimension of axial leaded resistors . 12
Figure 4 – Alternative methods for specification of the length of excessive protective
coating on axial leaded resistors . 13
Figure 5 – Lead-wire spacing of axial leaded resistors with bent leads . 14
Figure 6 – Specification of the lead eccentricity of axial leaded resistors . 15
Figure 7 – Derating curve . 16
Figure 8 – Basic layout for mechanical, environmental and electrical tests . 19
Figure 9 – Assembly of specimens to the test board . 20
Figure 10 – Mounting of axial leaded specimens on a rack, top view . 22
Figure 11 – Examples of specimen lead fixation devices . 23
Figure C.1 – Lead forming dimensions . 64
Figure C.2 – Examples of mounting height support . 66
Figure C.3 – Clearance between coating and solder . 67
Figure C.4 – Lateral mounting . 67

– 6 – IEC 60115-2:2023 © IEC 2023
Figure C.5 – Upright mounting . 68
Figure C.6 – Lead protrusion . 69
Figure C.7 – Lead end distortion . 70
Figure F.1 – Production flow and different scopes of quality assurance . 80
Figure F.2 – Shape and dimensions of radial formed resistor for lateral body position . 82
Figure F.3 – Shape and dimensions of radial formed resistor for lateral body position
with kinked lead wires . 83
Figure F.4 – Shape and dimensions of radial formed resistor for upright body position. 84
Figure F.5 – Shape and dimensions of radial formed resistor for upright body position

and wide spacing . 85
Figure F.6 – Shape and dimensions of radial formed resistor for upright body position
and wide spacing, with kinked lead wire . 85
Figure F.7 – Shape and dimensions of radial formed resistor for surface-mount
assembly (Z-bend) . 87
Figure F.8 – Land pattern dimensions for surface-mount assembly . 88

Table 1 – Preferred styles of axial leaded resistors . 12
Table 2 – Test board dimensions . 20
Table 3 – Preferred aggravated overload conditions . 27
Table 4 – Limits for the change of resistance at tests . 38
Table 5 – Permitted change of resistance due to the variation of temperature . 39
Table 6 – Test schedule for the qualification approval . 48
Table 7 – Test schedule for the quality conformance inspections . 53
Table C.1 – Lead bend radius . 65
Table C.2 – Recommended circuit board bore diameters . 66
Table C.3 – Clearance of lateral mounted resistors . 68
Table E.1 – Implementation of the test endurance at room temperature . 74
Table E.2 – Implementation of the single-pulse high-voltage overload test . 75
Table E.3 – Implementation of the periodic-pulse overload test . 76
Table E.4 – Implementation of the operation at low temperature test . 77
Table E.5 – Implementation of the test damp heat, steady state, accelerated . 78
Table F.1 – Feasible lead-wire spacing of radial formed resistor for lateral body
position . 84
Table F.2 – Feasible lead-wire spacing of radial formed resistor for upright body
position . 87
Table X.1 – Cross reference for references to clauses . 91
Table X.2 – Cross reference for references to figures . 93
Table X.3 – Cross reference for references to table . 93

IEC 60115-2:2023 © IEC 2023 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 2: Sectional specification: Low-power film resistors with leads
for through-hole assembly on circuit boards (THT)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60115-2 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This fourth edition cancels and replaces the third edition published in 2014. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the definitions of product technologies and product classification levels of the generic
specification, IEC 60115‑1:2020, have been adopted;
b) the preferred dimensions given in Table 1 have been reviewed, and the legacy style
RA_0922 has been removed;
c) a basis for the optional specification of the lead eccentricity of axial leaded resistors has
been amended in 4.2;
– 8 – IEC 60115-2:2023 © IEC 2023
d) the 'period-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been adopted as
default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test'
of IEC 60115‑1:2020, 8.4;
e) the revised solderability test of IEC 60115‑1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20;
f) the combined solvent resistance test of IEC 60115‑1:2020, 11.3 has been adopted in 5.3.22;
g) the 'endurance at room temperature test' of IEC 60115‑1:2020, 7.2 (prior IEC 60115 2:2014,
Annex C) has been adopted as an optional test in 5.4.1;
h) the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse
shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse
shape 1,2/50 in 5.4.2;
i) climatic tests for 'operation at low temperature' of IEC 60115‑1:2020, 10.2, and for 'damp
heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional
tests in 5.4.4 and 5.4.5, respectively;
j) new guidance is provided in 6.2 on the presentation of stability requirements with their
permissible absolute and relative deviations;
k) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
l) visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2;
m) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
n) the revised test clause numbering of IEC 60115‑1:2020 has been applied;
o) a new Annex C has been added to summarize workmanship requirements for the assembly
of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
p) the informative Annex F (prior Annex B) on radial formed styles has been amended with
details on a formed Z-bend style for surface-mount assembly.
The text of this International Standard is based on the following documents:
Draft Report on voting
40/2943/CDV 40/3001/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
A list of all parts in the IEC 60115 series, published under the general title Fixed resistors for
use in electronic equipment, can be found on the IEC website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IEC 60115-2:2023 © IEC 2023 – 9 –
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 2: Sectional specification: Low-power film resistors with leads
for through-hole assembly on circuit boards (THT)

1 Scope
This part of IEC 60115 is applicable to fixed low-power film resistors with termination leads for
use in electronic equipment, which are typically assembled in through-hole technology (THT)
on circuit boards.
These resistors are typically described according to types (different geometric shapes) and
styles (different dimensions) and product technology. The resistive element of these resistors
is typically protected by a conformal lacquer coating. These resistors have wire terminations
and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this document is to state preferred ratings and characteristics and to select from
IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and
to give general performance requirements for this type of resistor.
2 Normative
...