SIST EN 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator

This part of IEC 61189 outlines a way to determine the relative permittivity ( ε
r) and loss
tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad
laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric
resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-721: Prüfverfahren für Materialien für Verbindungsstrukturen - Messung der relativen Permittivität und des Verlustfaktors von kupferkaschiertem Laminat im Mikrowellen-Frequenzbereich unter Verwendung eines Split Post dielektrischen Resonators

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique en anneaux fendus

L'IEC 61189-2-721:2015 présente un moyen de déterminer la permittivité relative et la tangente de perte, également appelées constante diélectrique et facteur de dissipation des stratifiés recouverts de cuivre en hyperfréquences (de 1,1 GHz à 20 GHz) à l'aide d'un résonateur diélectrique en anneaux fendus (SPDR). l'IEC 61189-2-721:2015 s'applique aux stratifiés recouverts de cuivre et aux matériaux de base diélectriques.

Preskusne metode za električne materiale, tiskane plošče ter druge povezovalne strukture in sestave - 2-721. del: Preskusne metode za materiale, namenjene uporabi v povezovalnih strukturah - Merjenje relativne permitivnosti in izgubnega tangensa pobakrenega laminata pri mikrovalovni frekvenci z uporabo resonatorja z ločenima dielektrikoma

Ta del standarda IEC 61189 opisuje način za določanje relativne permitivnosti (εr) in izgubnega tangensa (tanδ) (imenovana tudi dielektrična konstanta (Dk) in faktor disipacije (Df)) pobakrenega laminata pri mikrovalovni frekvenci (od 1,1 GHz do 20 GHz) z uporabo resonatorja z ločenima dielektrikoma. Ta del standarda IEC 61189 se uporablja za pobakrene laminate in dieletrične materiale.

General Information

• Status: Published
• Publication Date: 13-Aug-2015
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 27-Jul-2015
• Due Date: 01-Oct-2015
• Completion Date: 14-Aug-2015
• Ref Project: EN 61189-2-721:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-2-721:2015
01-september-2015
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQHSORãþHWHUGUXJHSRYH]RYDOQH
VWUXNWXUHLQVHVWDYHGHO3UHVNXVQHPHWRGH]DPDWHULDOHQDPHQMHQH
XSRUDELYSRYH]RYDOQLKVWUXNWXUDK0HUMHQMHUHODWLYQHSHUPLWLYQRVWLLQL]JXEQHJD
WDQJHQVDSREDNUHQHJDODPLQDWDSULPLNURYDORYQLIUHNYHQFL]XSRUDERUHVRQDWRUMD
]ORþHQLPDGLHOHNWULNRPD
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 2-721: Test methods for materials for interconnection structures -
Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at
Microwave Frequency Using Split Post Dielectric Resonator
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 2-721: Prüfverfahren für Materialien für Verbindungsstrukturen -
Messung der relativen Permittivität und des Verlustfaktors von kupferkaschiertem
Laminat im Mikrowellen-Frequenzbereich unter Verwendung eines Split Post
dielektrischen Resonators
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-2-721:2015
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux
pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de
perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur
diélectrique en anneaux fendus
Ta slovenski standard je istoveten z: EN 61189-2-721:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-2-721:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-2-721:2015

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SIST EN 61189-2-721:2015


EUROPEAN STANDARD EN 61189-2-721

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2015
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-721: Test
methods for materials for interconnection structures -
Measurement of relative permittivity and loss tangent for copper
clad laminate at microwave frequency using split post dielectric
resonator
(IEC 61189-2-721:2015)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-721: Méthodes d'essai des matériaux 721: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
pour structures d'interconnexion - Mesure de la permittivité - Messung der relativen Permittivität und des Verlustfaktors
relative et de la tangente de perte pour les stratifiés von kupferkaschiertem Laminat im Mikrowellen-
recouverts de cuivre en hyperfréquences à l'aide d'un Frequenzbereich unter Verwendung eines Split Post
résonateur diélectrique en anneaux fendus dielektrischen Resonators
(IEC 61189-2-721:2015) (IEC 61189-2-721:2015)
This European Standard was approved by CENELEC on 2015-06-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61189-2-721:2015 E

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SIST EN 61189-2-721:2015
EN 61189-2-721:2015
European foreword
The text of document 91/1246/FDIS, future edition 1 of IEC 61189-2-721, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-2-721:2015.

The following dates are fixed:
(dop) 2016-03-03
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-06-03
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61189-2-721:2015 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN 61189-2-721:2015




IEC 61189-2-721

®


Edition 1.0 2015-04




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 2-721: Test methods for materials for interconnection structures –


Measurement of relative permittivity and loss tangent for copper clad laminate

at microwave frequency using split post dielectric resonator




Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion –

Mesure de la permittivité relative et de la tangente de perte pour les stratifiés

recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique

en anneaux fendus







INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-2648-3



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61189-2-721:2015
– 2 – IEC 61189-2-721:2015 © IEC 2015
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Test specimens . 6
2.1 Specimen size . 6
2.2 Preparation . 7
2.3 Marking . 7
2.4 Thickness . 7
3 Equipment/apparatus . 7
3.1 General . 7
3.2 Vector network analyzer (VNA) . 8
3.3 SPDR test fixture . 8
3.3.1 General . 8
3.3.2 Parameters . 8
3.3.3 Frequency . 8
3.4 Verify unit . 9
3.5 Micrometer . 9
3.6 Circulating oven . 9
3.7 Test chamber . 9
4 Procedure . 9
4.1 Preconditioning . 9
4.2 Testing of relative permittivity and loss tangent at room temperature . 9
4.2.1 Test conditions . 9
4.2.2 Preparation . 9
4.2.3 Fixture . 10
4.2.4 Connection to VNA . 10
4.2.5 VNA parameter . 10
4.2.6 Frequency and Q-factor without specimen . 10
4.2.7 Micrometer . 10
4.2.8 Setting the specimen . 10
4.2.9 Frequency and Q-factor with specimen . 10
4.2.10 Comparison . 10
4.2.11 Calculation . 11
4.2.12 Change the specimen . 12
4.2.13 Change in test frequency . 12
4.3 Testing of relative permittivity and loss tangent at variable temperatures . 12
4.3.1 Test conditions . 12
4.3.2 Preparation . 12
4.3.3 Fixture . 12
4.3.4 Connection to VNA . 12
4.3.5 VNA parameter . 12
4.3.6 Temperature in the chamber . 12
4.3.7 Frequency and Q-factor without specimen . 12
4.3.8 Micrometer . 12
4.3.9 Setting of the specimen . 13
4.3.10 Frequency and Q-factor with specimen . 13
4.3.11 Calculation . 13

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SIST EN 61189-2-721:2015
IEC 61189-2-721:2015 © IEC 2015 – 3 –
4.3.12 Options . 13
4.3.13 Thermal coefficient . 13
4.3.14 Change in test frequency . 14
5 Report . 14
5.1 At room temperature . 14
5.2 At variable temperature . 14
6 Additional information . 14
6.1 Accuracy . 14
6.2 Maintenance . 14
6.3 Matters to be attended . 15
6.4 Additional information concerning fixtures and results . 15
6.5 Additional information on K (ε ,h) and p . 15
ε r es
Annex A (informative) Example of test fixture and test result . 16
A.1 Example of test fixture . 16
A.2 Example of test result . 16
Annex B (informative) Additional information on K (ε ,h) and p . 19
ε r es
Bibliography . 22

Figure 1 – Scheme of SPDR test fixture . 6
Figure 2 – Component diagram of test system . 8
Figure 3 – Scheme of the change of resonance frequency with or without the
specimen . 10
Figure A.1 – Test fixture . 16
Figure A.2 – Relative permittivity versus frequency (laminate of Dk 3,8 and thickness
0,51 mm) . 17
Figure A.3 – Loss tangent versus frequency (laminate of Dk 3,8 and thickness
0,51 mm) . 17
Figure A.4 – Curve of relative permittivity and loss tangent at variable temperatures
(laminate of Dk 3,8 and thickness 0,51 mm) . 18
Figure B.1 – K (ε ,h) versus relative permittivity at different sample thicknesses . 19
ε r
Figure B.2 – Distribution of the electric field of the split dielectric resonator (side view
of the dielectric resonators) . 20
Figure B.3 – Distribution of the electric field of the split dielectric resonator (top view
between the dielectric resonators) . 21
Figure B.4 – p versus relative permittivity at different sample thicknesses . 21
es

Table 1 – Specimen dimensions . 7
Table 2 – SPDR test fixture’s parameter . 9
Table B.1 – Results of measurements of different materials using a 10 GHz SPDR. 20

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SIST EN 61189-2-721:2015
– 4 – IEC 61189-2-721:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-721: Test methods for materials for interconnection structures –
Measurement of relative permittivity and loss tangent for copper clad
laminate at microwave frequency using split post dielectric resonator

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-2-721 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1246/FDIS 91/1258/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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SIST EN 61189-2-721:2015
IEC 61189-2-721:2015 © IEC 2015 – 5 –
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 61189-2-721:2015
– 6 – IEC 61189-2-721:2015 © IEC 2015
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-721: Test methods for materials for interconnection structures –
Measurement of relative permittivity and loss tangent for copper clad
laminate at microwave frequency using split post dielectric resonator



1 Scope
This part of IEC 61189 outlines a way to determine the relative permittivity (ε ) and loss
r
δ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad
tangent (tan
laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric
resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.
2 Test specimens
2.1 Specimen size
The size of the specimen shall be larger than the internal diameter D of the metal enclosures,
and the maximum thickness of the specimen shall be smaller than the distance h between
g
the metal enclosures of the fixture. (See Figure 1.)
Z
Support
D
Dielectric resonators
Coupling loop
Sample
d
r
Metal enclosure
IEC

Key
h distance between the metal enclosures of the fixture;
g
D internal diameter of the metal enclosures;
L internal height of the metal enclosures;
d diameter of the dielectric resonator;
r
h thickness of the dielectric resonator.
r
Figure 1 – Scheme of SPDR test fixture
h
g
h
r
L

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SIST EN 61189-2-721:2015
IEC 61189-2-721:2015 © IEC 2015 – 7 –
Three specimens for the test at room temperature and one specimen for the test at variable
temperatures are required for each SPDR test fixture for this test. Table 1 shows the
supported specimen dimensions.
Table 1 – Specimen dimensions
SPDR test fixture’s nominal
Supported specimen sizes Maximum thickness of specimens
frequency
GHz mm mm
1,1 150 × 150 6,0
3 3,0
80 × 80
5 to 6 2,0
80 × 80
9 to 10 80 × 80 0,9
13 to 16 50 × 35 0,6
18 to 20 0,5
15 × 15

If applicable, a specimen size different from those given in Table 1 can be used. For example,
specimen size “130 mm × 130 mm” can be used for 1,1 GHz.
2.2 Preparation
Copper clad laminates shall have all copper cladding removed by etching, and shall be
thoroughly cleaned.
2.3 Marking
Mark each specimen in the upper left corner with an engraving pencil or other suitable method.
2.4 Thickness
Within the limits of the test fixture, the thicker the specimen is, the less error occurs in the
measurements. Thin specimen can be stacked up to a minimum of 0,4 mm to improve
measurement accuracy.
NOTE Air gaps between the sample and fixture do not affect the measurement.
3 Equipment/apparatus
3.1 General
The component diagram of the test system is shown in Figure 2.

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SIST EN 61189-2-721:2015
– 8 – IEC 61189-2-721:2015 © IEC 2015
Room temperature test
Variable temperature test
VNA
VNA








Environmental test chamber
SPDR test fixture







Sample



SPDR test fixture
Sample

IEC
Figure 2 – Component diagram of test system
3.2 Vector network analyzer (VNA)
The following values are required:
a) The frequency range of VNA shall be 500 MHz to 20 GHz.
b) The dynamic range of VNA shall be more than 60 dB.
3.3 SPDR test fixture
3.3.1 General
Figure 1 shows the scheme of SPDR test fixture.
3.3.2 Parameters
Table 2 shows the typical relationship between the SPDR test fixture’s nominal frequency and
h and D.
g
3.3.3 Frequency
For different test frequencies, use a corresponding SPDR test fixture of nominal frequency.

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SIST EN 61189-2-721:2015
IEC 61189-2-721:2015 © IEC 2015 – 9 –
Table 2 – SPDR test fixture’s parameter
SPDR test fixture’s nominal frequency D h
g
GHz mm mm
1,1 120 6,0
3 50 3,0
5 to 6 30 2,0
9 to 10 22 0,9
13 to 16 15 0,6
18 to 20 10 0,5

3.4 Verify unit
The verify unit includes the following:
a) Standard reference sample, for example, single-crystal quartz or equivalent sample.
b) A calibration assembly of VNA.
3.5 Micrometer
Micrometer with 0,001 mm resolution (or better).
3.6 Circulating oven
+5
Circulating oven with stabilized temperature at 105 °C.
−2
3.7 Test chamber
For the environmental test chamber for variable temperature testing the following
requirements apply:
a) Temperature ranges: –125 °C to +110 °C, other temperature range is as agreed between
user and supplier.
b) Temperature accuracy-set point to actual: ±1 °C.
4 Procedure
4.1 Preconditioning
All specimens shall be conditioned at (23 ± 2) °C and (50 ± 5) % RH for at least 24 h prior to
testing. However, if a specimen has recently been etched or exposed to excessive moisture, it
+5
should be dried in an air-circulating oven for 2 h at 105 °C and then conditioned at the
−2
condition as mentioned above.
4.2 Testing of relative permittivity and loss tangent at room temperature
4.2.1 Test conditions
The ambient test temperature should be (23 ± 2) °C. The variation should not exceed 1 °C
during the test.
4.2.2 Preparation
Allow at least 30 min for the VNA to warm up and stabilize.

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SIST EN 61189-2-721:2015
– 10 – IEC 61189-2-721:2015 © IEC 2015
4.2.3 Fixture
Select an SPDR test fixture in accordance with the test frequency. The specimen size and
thickness shall comply with the requirements specified in Table 1. For example, if the test
frequency is 10 GHz, a SPDR test fixture with 10 GHz nominal frequency should be selected.
The supported specimen size is 80 mm × 80 mm and the maximum thickness of specimens is
no more than 0,9 mm.
4.2.4 Connection to VNA
Connect the SPDR test fixture to the VNA. The test fixture shall be kept horizontal.
4.2.5 VNA parameter
Set the VNA parameters according to the manufacturer's instructions and the nominal
frequency of the SPDR fixture.
4.2.6 Frequency and Q-factor without specimen
Measure the resonance frequency (f ) and Q-factor (Q ) values of the empty resonator.
0 0
4.2.7 Micrometer
Utilize a micrometer to measure the thickness of the specimen and record as h.
4.2.8 Setting the specimen
Insert the specimen into the test fixture. The side with marking is face up and the edge of this
side has to be aligned with the fixture edge.
4.2.9 Frequency and Q-factor with specimen
Measure the resonance frequency (f ) and Q-factor (Q ) of the resonator containing the
s s
specimen.
4.2.10 Comparison
The scheme of the change of resonance frequency with or without the specimen is shown in
Figure 3.
Empty resonator
Resonator containing
the specimen
f f
S 0
Resonance frequency
IEC

Figure 3 – Scheme of the
...