SIST EN IEC 60749-37:2023

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022)

This part of IEC 60749 provides a test method that is intended to evaluate and compare drop
performance of surface mount electronic components for handheld electronic product
applications in an accelerated test environment, where excessive flexure of a circuit board
causes product failure. The purpose is to standardize the test board and test methodology to
provide a reproducible assessment of the drop test performance of surface-mounted
components while producing the same failure modes normally observed during product level
test.
This document aims at prescribing a standardized test method and reporting procedure. This is
not a component qualification test and is not meant to replace any system level drop test that
is sometimes used to qualify a specific handheld electronic product. The standard is not meant
to cover the drop test required to simulate shipping and handling-related shock of electronic
components or PCB assemblies. These requirements are already addressed in test methods
such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded
surface mounted packages.
This test method uses an accelerometer to measure the mechanical shock duration and
magnitude applied which is proportional to the stress on a given component mounted on a
standard board. The test method described in IEC 60749-40 uses strain gauge to measure the
strain and strain rate of a board in the vicinity of a component. The customer specification states
which test method is to be used.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes (IEC 60749-37:2022)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accéléromètre (IEC 60749-37:2022)

IEC 60749-37:2022 est disponible sous forme de IEC 60749-37:2022 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L’IEC 60749-37:2022 fournit une méthode d’essai destinée à évaluer et comparer la performance de chute des composants électroniques à montage en surface dans des applications de produits électroniques portatifs dans un environnement d’essai accéléré, où une flexion excessive d’une carte de circuit imprimé provoque une défaillance de produit. Le but est de normaliser la carte d'essai et la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des composants à montage en surface, en reproduisant les mêmes modes de défaillances que ceux observés normalement au cours d'un essai au niveau du produit. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- correction d’une erreur technique précédente concernant les conditions d’essai;
- mises à jour afin de refléter les progrès technologiques.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del: Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC 60749-37:2022)

Ta del standarda IEC 60749 podaja preskusno metodo, ki je namenjena ocenjevanju in primerjavi učinka padca površinsko nameščenih elektronskih komponent za uporabo v ročnih elektronskih izdelkih v pospešenem preskusnem okolju, v katerem upogibanje plošče s tiskanim vezjem povzroči okvaro izdelka. Namen je standardizirati preskusno ploščo in preskusno metodologijo, da se zagotovi ponovljiva ocena uspešnosti preskusa padca površinsko nameščenih komponent, ter obenem ustvariti enake vrste okvar, kot so običajno opažene med preskusom na ravni izdelka.
Namen tega dokumenta je predpisati standardizirano preskusno metodo in postopek poročanja. Ta dokument ni preskus ustreznosti komponent in naj ne bi nadomeščal katerega koli preskusa na ravni sistema, ki se včasih uporablja za preverjanje ustreznosti določenega ročnega električnega izdelka. Standard naj ne bi zajemal preskusa padca, ki je potreben za simulacijo udarcev elektronskih komponent ali sestavov tiskanih vezij, povezanih z odpremo in rokovanjem. Te zahteve so že obravnavane v preskusnih metodah, kot je standard IEC 60749-10. Metoda se uporablja tako za površinsko nameščene komponente z okrovi z matričnimi priključki v ravnini kot površinsko nameščene komponente s svinčenim obodom.
Ta preskusna metoda uporablja pospeševalnik za merjenje trajanja mehanskega udarca in uporabljene stopnje, ki je sorazmerna z obremenitvijo dane komponente, nameščene na standardno ploščo. Preskusna metoda, opisana v standardu IEC 60749-40 uporablja merilnik deformacije za merjenje deformacije stopnje deformacije plošče v bližini komponente. Specifikacija stranke določa, katera preskusna metoda mora biti uporabljena.

General Information

• Status: Published
• Publication Date: 04-Dec-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 29-Nov-2022
• Due Date: 03-Feb-2023
• Completion Date: 05-Dec-2022
• Ref Project: EN IEC 60749-37:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Relations

• Revised: SIST EN 60749-37:2008 - Semiconductor devices - Mechanical and climatic test methods -- Part 37: Board level drop test method using an accelerometer
• Effective Date: 15-Sep-2020
• Replaces: SIST EN 60749-37:2008 - Semiconductor devices - Mechanical and climatic test methods -- Part 37: Board level drop test method using an accelerometer
• Effective Date: 22-Nov-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 60749-37:2023
01-januar-2023
Nadomešča:
SIST EN 60749-37:2008
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del:
Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC
60749-37:2022)
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level
drop test method using an accelerometer (IEC 60749-37:2022)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37:
Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-
Messgerätes (IEC 60749-37:2022)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accéléromètre
(IEC 60749-37:2022)
Ta slovenski standard je istoveten z: EN IEC 60749-37:2022
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-37:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 60749-37:2023

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SIST EN IEC 60749-37:2023


EUROPEAN STANDARD EN IEC 60749-37

NORME EUROPÉENNE

EUROPÄISCHE NORM November 2022
ICS 31.080.01 Supersedes EN 60749-37:2008
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 37: Board level drop test method using an accelerometer
(IEC 60749-37:2022)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 37: Méthode d'essai de Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte
chute au niveau de la carte avec utilisation d'un unter Verwendung eines Beschleunigungs-Messgerätes
accéléromètre (IEC 60749-37:2022)
(IEC 60749-37:2022)
This European Standard was approved by CENELEC on 2022-11-16. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 60749-37:2022 E

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SIST EN IEC 60749-37:2023
EN IEC 60749-37:2022 (E)
European foreword
The text of document 47/2651/CDV, future edition 2 of IEC 60749-37, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-37:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-08-16
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-11-16
document have to be withdrawn
This document supersedes EN 60749-37:2008 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-37:2022 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60749-40 NOTE Harmonized as EN 60749-40
2

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SIST EN IEC 60749-37:2023
EN IEC 60749-37:2022 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-10 2022 Semiconductor devices - Mechanical and EN IEC 60749-10 2022
climatic test methods - Part 10: Mechanical
shock - device and subassembly
IEC 60749-20 - Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 60749-20-1 - Semiconductor devices - Mechanical and EN 60749-20-1 -
climatic test methods - Part 20-1: Handling,
packing, labelling and shipping of surface-
mount devices sensitive to the combined
effect of moisture and soldering heat

3

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SIST EN IEC 60749-37:2023




IEC 60749-37

®


Edition 2.0 2022-10




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Semiconductor devices – Mechanical and climatic test methods –

Part 37: Board level drop test method using an accelerometer




Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un

accéléromètre















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-5837-8




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 60749-37:2023
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CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and components . 7
4.1 Test apparatus . 7
4.2 Test components . 8
4.3 Test board . 8
4.4 Test board assembly . 8
4.5 Number of components and sample size . 9
5 Test procedure . 9
5.1 Test equipment and parameters . 9
5.2 Pre-test characterization . 11
5.3 Drop testing . 12
6 Failure criteria and failure analysis . 13
7 Summary . 14
Annex A (informative)  Preferred board construction, material, design and layout . 15
A.1 Preferred board construction, material and design . 15
A.2 Preferred test board size, layout, and component locations . 17
Bibliography . 20

Figure 1 – Drop test apparatus detail . 10
Figure 2 – Calculation of velocity change . 11
Figure 3 – Typical shock test half-sine pulse graphic and formulae . 12
Figure A.1 – Board footprint and BGA layout . 18
Figure A.2 – Test vehicle with 4 component placement (top side – left) and
1 component at center location (bottom side – right). . 19

Table 1 – Quantity of test boards and components required for testing . 9
Table A.1 – Test board stack-up and material . 15
Table A.2 – Mechanical property requirements for dielectric materials . 16
Table A.3 – Recommended test board pad sizes and solder mask openings . 17

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SIST EN IEC 60749-37:2023
IEC 60749-37:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 37: Board level drop test method using an accelerometer

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60749-37 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This second edition, based on JEDEC document JESD22-B111A, cancels and replaces the first
edition published in 2008. lt is used with permission of the copyright holder, JEDEC Solid State
Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) correction of a previous technical error concerning test conditions;
b) updates to reflect improvements in technology.

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SIST EN IEC 60749-37:2023
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The text of this International Standard is based on the following documents:
Draft Report on voting
47/2651/CDV 47/2719/RVC

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found in the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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SIST EN IEC 60749-37:2023
IEC 60749-37:2022 © IEC 2022 – 5 –
INTRODUCTION
Handheld electronic products fit into the consumer and portable market segments. Included in
handheld electronic products are cameras, calculators, cell phones, cordless phones, pagers,
palm size PCs, personal computer memory card international association (PCMCIA) cards,
smart cards, personal digital assistants (PDAs) and other electronic products that can be
conveniently stored in a pocket and used while held in user’s hand.
These handheld electronic products are more prone to being dropped during their useful service
life because of their size and weight. This dropping event can not only cause mechanical failures
in the housing of the device but also create electrical failures in the printed circuit board (PCB)
assemblies mounted inside the housing due to transfer of energy through PCB supports. The
electrical failures sometimes result from various failure modes such as cracking of the circuit
board, track cracking on the board, cracking of solder interconnections between the
components and the board, and component cracks. The primary driver of these failures is
excessive flexing of the circuit board due to input acceleration to the board created from
dropping the handheld electronic product. This flexing of the board causes relative motion
between the board and the components mounted on it, resulting in component, interconnect or
board failures. The failure is a function of the combination of the board design, construction,
material, thickness and surface finish; interconnect material and standoff height and component
size.
Correlation between test and field conditions is not yet fully established. Consequently, the test
procedure is presently more appropriate for relative component performance than for use as a
pass/fail criterion. Rather, results can be used to augment existing data or establish a baseline
for potential investigative efforts in package/board technologies.
The comparability between different test sites, data acquisition methods, and board
manufacturers has not been fully demonstrated by existing data. As a result, if the data are to
be used for direct comparison of component performance, matching studies will first be
performed to prove that the data are in fact comparable across different test sites and test
conditions.
This method is not intended to substitute for full characterization testing, which could
incorporate substantially larger sample sizes and increased number of drops. Due to limited
sample size and number of drops specified here, it is possible that enough failure data are not
generated in every case to perform full statistical analysis.

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SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 37: Board level drop test method using an accelerometer



1 Scope
This part of IEC 60749 provides a test method that is intended to evaluate and compare drop
performance of surface mount electronic components for handheld electronic product
applications in an accelerated test environment, where excessive flexure of a circuit board
causes product failure. The purpose is to standardize the test board and test methodology to
provide a reproducible assessment of the drop test performance of surface-mounted
components while producing the same failure modes normally observed during product level
test.
This document aims at prescribing a standardized test method and reporting procedure. This is
not a component qualification test and is not meant to replace any system level drop test that
is sometimes used to qualify a specific handheld electronic product. The standard is not meant
to cover the drop test required to simulate shipping and handling-related shock of electronic
components or PCB assemblies. These requirements are already addressed in test methods
such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded
surface mounted packages.
This test method uses an accelerometer to measure the mechanical shock duration and
magnitude applied which is proportional to the stress on a given component mounted on a
standard board. The test method described in IEC 60749-40 uses strain gauge to measure the
strain and strain rate of a board in the vicinity of a component. The customer specification states
which test method is to be used.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60749-10:2022, Semiconductor devices – Mechanical and climatic test methods – Part 10:
Mechanical shock – Device and subassembly
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20-1, Semiconductor devices – Mechanical and climatic test methods – Part 20-1:
Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined
effect of moisture and soldering heat
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:

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SIST EN IEC 60749-37:2023
IEC 60749-37:2022 © IEC 2022 – 7 –
IEC Electropedia: available at https://www.electropedia.org/
ISO Online browsing platform: available at https://www.iso.org/obp
3.1
component
packaged semiconductor device
3.2
single-sided assembly
printed circuit board assembly with components mounted on only one side of the board
3.3
double-sided assembly
printed circuit board assembly with components mounted on top and bottom sides of the board
3.4
handheld electronic product
product that can conveniently be stored in a pocket (of sufficient size) and used when held in
user’s hand
Note 1 to entry: Handheld electronic products include cameras, calculators, cell phones, pagers, palm-size PCs
(formerly called ‘pocket organizers’), personal computer memory card international association (PCMCIA) cards,
smart cards, mobile phones, personal digital assistants (PDAs) and other communication devices.
3.5
peak acceleration
maximum acceleration during the dynamic motion of the test apparatus
3.6
pulse duration
acceleration interval
time interval between the instant when the acceleration first reaches 10 % of its specified peak
level and the instant when the acceleration first returns to 10 % of the specified peak level after
having reached that peak level
3.7
table drop height
free-fall drop height of the drop table needed to attain the prescribed peak acceleration and
pulse duration
3.8
event
electrical discontinuity of resistance greater than 1 000 Ω lasting for 1 μs or longer
3.9
event detector
continuity test instrument capable of detecting electrical discontinuity of resistance greater than
1 000 Ω lasting for 1 μs or longer
4 Test apparatus and components
4.1 Test apparatus
The shock-testing apparatus shall be capable of providing shock pulses up to a peak
−2
acceleration of 2 900 m·s with a pulse duration between 0,3 ms and 8,0 ms to the body of the
−1 −1
device and a velocity change of 1 250 mm·s to 5 430 mm·s . For free-state testing, a velocity
−1 −1
change of 1 250 mm·s to 5 430 mm·s and a pulse duration between 0,3 ms and 2,0 ms is
sufficient. Conversely, for mounted-state testing, apparatus capable of a velocity change of

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−1 −1
1 000 mm·s to 5 430 mm·s and a pulse duration between 5,0 ms and 8,0 ms to the body of
the component is sufficient.
The acceleration pulse shall be a half-sine waveform with an allowable deviation from specified
peak acceleration not greater than ±10 %. The test velocity change shall be ±10 %of the
specified level. The pulse duration shall be measured between the points at 10 % of the peak
acceleration during rise time and 10 % of the peak acceleration during decay time. Absolute
tolerances of the pulse duration shall be ±15 % of the specified duration. The test equipment
transducer shall have a natural frequency greater than 5 times the frequency of the shock pulse
being established, and measured through a low-pass filter having a bandwidth greater than 5
times the frequency of the shock pulse being established. Filtering shall not be used in lieu of
good measurement setup and procedure practices.
Appropriate equipment calibration shall be carried out prior to any testing.
4.2 Test components
This document covers all area arrays and perimeter-leaded surface-mountable packaged
semiconductor devices such as ball grid arrays (BGA), land grid arrays (LGA), chip scale
packages (CSP), thin small outline packages (TSOP) and quad flat no-lead packages (QFN)
typically used in handheld electronic product. The maximum size of the component body
covered in this document is 15 mm x 15 mm in general. A larger body size may be used for a
special board layout as described in detail in 4.3. All components used for this testing shall be
daisy-chained. The daisy chain is made at the die level or by providing daisy chain links at the
lead-frame or substrate level. In case of non-daisy chain die, a mechanical dummy die shall be
used inside the package to simulate the actual structure of the package. The die size and
thickness shall be similar to the functional die size to be used in application. The component
materials, dimensions and assembly processes shall be representative of typical production
device.
4.3 Test board
Since the drop test performance is a function of the test board used for evaluation, this
document describes a preferred test board construction, dimensions, and material that is
representative of those used in handheld electronic products. If another board
construction/material better represents a specific application, the test board construction,
dimensions and material shall be documented. The test data generated using such a board
shall be correlated at least once by generating the same data on the same component using
the preferred board defined in this document (see Annex A for recommendations).
4.4 Test board assembly
Prior to board assembly, all devices shall be inspected for missing balls or bent leads. Board
thickness, warpage and pad sizes shall also be measured using a sampling plan. A visual
inspection shall be performed on all boards for solder mask registration, contamination and
daisy chain connection. It is recommended that boards be inspected and accepted in
accordance with a relevant national or international standard. One board shall also be used to
measure the mechanical properties (modulus and glass transition temperature, T ) of the board
g
at the component location using dynamic mechanical analysis (DMA) and thermomechanical
analysis (TMA) methods. It is highly recommended that the coefficient of thermal expansion
(CTE) of the board be also measured in X, Y and Z direction. The mechanical property
measurements are not required for every board lot, unless the fabrication process, material or
vendor is changed from lot to lot.
The components shall be baked according to IEC 60749-20 and IEC 60749-20-1 prior to board
assembly. The test boards shall be assembled using best known methods of printed circuit
assembly process, representative of production methods. At least one board shall be used to
adjust the board mounting process such as paste printing, placement and reflow profile. All
assemblies shall be single-sided only, unless the component is anticipated for use in mirror-

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SIST EN IEC 60749-37:2023
IEC 60749-37:2022 © IEC 2022 – 9 –
sided board assemblies. In that case, the components shall be mounted on each side of the
board.
A 100 % X-ray inspection is recommended on assembled units to check for voids, short-circuits
and other abnormalities. Electrical continuity test shall also be performed on all mounted units
to detect any open-circuits or short-circuits.
4.5 Number of components and sample size
The board design recommended in Annex A allows 4 locations for component mounting and is
recommended that all 4 components are mounted. Since the board is designed with full
symmetry, all 4 compone
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