SIST EN 61967-2:2006
(Main)Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz -- Teil 2: Messung der abgestrahlten Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie 2: Mesure des émissions rayonnées - Méthode de cellule TEM et cellule TEM à large bande
La présente procédure de mesure définit une méthode de mesure du rayonnement électromagnétique provenant d'un circuit intégré (CI). Le CI évalué est monté sur une carte de circuit imprimé (PCB) d'essai de CI qui est fixée sur un accès d'accouplement (désigné comme accès à la paroi) découpé au sommet ou au fond d'une cellule électromagnétique transverse (TEM, transverse electromagnetic) ou d'une cellule TEM en gigahertz (GTEM) à large bande. La carte d'essai n'est pas à l'intérieur de la cellule, comme dans l'usage conventionnel, mais devient une partie de la paroi de la cellule. Cette méthode est applicable à toute cellule TEM ou GTEM modifiée pour incorporer l'accès à la paroi; cependant, la tension RF mesurée sera affectée par de nombreux facteurs. Le facteur principal affectant la tension RF mesurée est l'espacement entre le diaphragme et la carte d'essai du CI (paroi de la cellule). Cette procédure a été élaborée à l'aide d'une cellule TEM de 1 GHz avec un espacement entre le diaphragme et le sol de 45 mm et d'une cellule GTEM avec un espacement moyen entre le diaphragme et le sol de 45 mm au-dessus de la zone de l'accès. D'autres cellules peuvent ne pas produire de sortie spectrale identique, mais peuvent être utilisées pour des mesures comparatives, soumises à leurs limites en fréquence et en sensibilité. Un facteur de conversion peut permettre des comparaisons entre les données mesurées sur les cellules TEM ou GTEM avec un espacement différent entre le diaphragme et le sol. La carte d'essai du CI contrôle la géométrie et l'orientation du CI en fonctionnement par rapport à la cellule et élimine tous les conducteurs de connexion à l'intérieur de la cellule (ceux-ci se situent sur la face arrière de la carte, qui est à l'extérieur de la cellule). Pour la cellule TEM, l'un des accès de 50 est terminé par une charge de 50 . L'autre accès de 50 pour une cellule TEM, ou le seul accès de 50 pour une cellule GTEM, est connecté à l'entrée d'un analyseur de sp
Integrirana vezja – Meritve elektromagnetnega oddajanja v območju od 150 kHz do 1 GHz – 2. del: Meritve sevanih oddajanj – Metoda s celico TEM in s širokopasovno celico TEM (IEC 61967-2:2005)
General Information
Overview
EN 61967-2:2005 (CLC adoption) specifies a standardized method for measuring radiated electromagnetic emissions from integrated circuits (ICs) in the 150 kHz to 1 GHz band using a TEM cell or a wideband (GTEM) cell. Unlike conventional use where the DUT is placed inside the cell, the IC is mounted on a dedicated IC test PCB that is clamped into a wall port cut in the cell wall; the test board becomes part of the cell wall. The procedure emphasizes repeatable, comparative measurement of RF voltages impressed onto the cell septum and identifies key influences (notably the septum-to-test-board spacing).
Key topics and technical requirements
- Frequency range: 150 kHz to 1 GHz (radiated emissions measurement).
- Test configuration: IC mounted on an IC test PCB; PCB clamped to a wall port in a TEM or GTEM cell so the board becomes part of the cell wall.
- Critical geometry: Septum-to-IC test board (cell wall) spacing is the primary factor affecting measured RF voltage; the method was developed with septum-to-floor spacing ≈ 45 mm for both TEM and GTEM over the port area.
- Measurement chain: 50 Ω terminations, one port terminated with a 50 Ω load (TEM), remaining port(s) connected to a spectrum analyser or receiver; preamplifier and system gain considerations are included.
- Required checks and steps: ambient measurement, DUT operational check, DUT emissions measurement; calibration and setup verification (annexes provide example sheets).
- Data handling: Procedures for system gain, dipole moment calculation (informative annex), and presentation/specification of emissions data are included to support comparative reporting.
- Limitations and comparability: Other TEM/GTEM cells may be used, but spectral output can differ; a conversion factor may allow comparisons between cells with different septum-to-floor spacings, subject to frequency and sensitivity limitations.
Practical applications and users
This standard is intended for:
- EMC test laboratories performing radiated emissions characterization and pre-compliance testing of ICs.
- Semiconductor manufacturers and IC design teams assessing on-chip emissions during development.
- Test engineers and compliance officers who need repeatable, comparative radiated emission data for component-level EMC assessment.
- Use cases include component characterization, troubleshooting emission sources, and comparative assessments across different cell setups.
Related standards
- EN/IEC 61967-1: General conditions and definitions (required companion document)
- Referenced EMC documents cited in the standard: IEC 61000-4-3, IEC 61000-4-20, and the CISPR 16 series (measurement instrumentation and methods)
Keywords: integrated circuits, electromagnetic emissions, radiated emissions measurement, TEM cell, GTEM, IC test PCB, EMC testing, spectrum analyser, septum spacing.
Frequently Asked Questions
SIST EN 61967-2:2006 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method". This standard covers: This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.
This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.
SIST EN 61967-2:2006 is classified under the following ICS (International Classification for Standards) categories: 31.200 - Integrated circuits. Microelectronics. The ICS classification helps identify the subject area and facilitates finding related standards.
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Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2006
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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz --
Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im
Frequenzbereich von 150 kHz bis 1 GHz -- Teil 2: Messung der abgestrahlten
Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie
2: Mesure des émissions rayonnées - Méthode de cellule TEM et cellule TEM à large
bande
Ta slovenski standard je istoveten z: EN 61967-2:2005
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 61967-2
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2005
ICS 31.080.99
English version
Integrated circuits -
Measurement of electromagnetic emissions, 150 kHz to 1 GHz
Part 2: Measurement of radiated emissions -
TEM cell and wideband TEM cell method
(IEC 61967-2:2005)
Circuits intégrés - Integrierte Schaltungen -
Mesure des émissions Messung von elektromagnetischen
électromagnétiques, 150 kHz à 1 GHz Aussendungen im Frequenzbereich
Partie 2: Mesure des émissions von 150 kHz bis 1 GHz
rayonnées - Teil 2: Messung der abgestrahlten
Méthode de cellule TEM et Aussendungen -
cellule TEM à large bande TEM-Zellen- und Breitband-TEM-
(CEI 61967-2:2005) Zellenverfahren
(IEC 61967-2:2005)
This European Standard was approved by CENELEC on 2005-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61967-2:2005 E
Foreword
The text of document 47A/722/FDIS, future edition 1 of IEC 61967-2, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 61967-2 on 2005-09-01.
This part of EN 61967 is to be read in conjunction with EN 61967-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61967-2:2005 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modified).
IEC 61000-4-20 NOTE Harmonized as EN 61000-4-20:2003 (not modified).
CISPR 16-1-1 NOTE Harmonized as EN 55016-1-1:2004 (not modified).
CISPR 16-1-2 NOTE Harmonized as EN 55016-1-2:2004 (not modified).
CISPR 16-1-4 NOTE Harmonized as EN 55016-1-4:2004 (not modified).
CISPR 16-1-5 NOTE Harmonized as EN 55016-1-5:2004 (not modified).
CISPR 16-2-1 NOTE Harmonized as EN 55016-2-1:2004 (not modified).
CISPR 16-2-2 NOTE Harmonized as EN 55016-2-2:2004 (not modified).
CISPR 16-2-3 NOTE Harmonized as EN 55016-2-3:2004 (not modified).
CISPR 16-2-4 NOTE Harmonized as EN 55016-2-4:2004 (not modified).
__________
- 3 - EN 61967-2:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050-131 2002 International Electrotechnical Vocabulary- -
Part 131: Circuit theory
IEC 60050-161 1990 Chapter 161: Electromagnetic - -
compatibility
1) 2)
IEC 61967-1 - Integrated circuits - Measurement of EN 61967-1 2002
electromagnetic emissions, 150 kHz to
1 GHz
Part 1: General conditions and definitions
1)
Undated reference.
2)
Valid edition at date of issue.
NORME CEI
INTERNATIONALE
IEC
61967-2
INTERNATIONAL
Première édition
STANDARD
First edition
2005-09
Circuits intégrés –
Mesure des émissions électromagnétiques,
150 kHz à 1 GHz –
Partie 2:
Mesure des émissions rayonnées –
Méthode de cellule TEM et cellule
TEM à large bande
Integrated circuits –
Measurement of electromagnetic emissions,
150 kHz to 1 GHz –
Part 2:
Measurement of radiated emissions –
TEM cell and wideband TEM cell method
IEC 2005 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
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International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
61967-2 IEC:2005 – 3 –
CONTENTS
FOREWORD.7
1 Scope.11
2 Normative references .11
3 Terms and definitions .13
4 General .13
5 Test conditions .13
5.1 General .13
5.2 Supply voltage.13
5.3 Frequency range .13
6 Test equipment.13
6.1 General .13
6.2 Shielding .13
6.3 RF measuring instrument .13
6.4 Preamplifier.15
6.5 TEM cell.15
6.6 Wideband TEM/GTEM cell.15
6.7 50-Ohm termination.15
6.8 System gain .15
7 Test set-up .15
7.1 General .15
7.2 Test configuration.15
7.3 Test PCB.17
8 Test procedure .23
8.1 General .23
8.2 Ambient measurement.23
8.3 DUT operational check .23
8.4 DUT emissions measurement .23
9 Test report.25
9.1 General .25
9.2 Measurement conditions.25
10 IC emissions reference levels.25
Annex A (informative) Example calibration & set-up verification sheet .27
Annex B (informative) TEM cell and wideband TEM cell descriptions .29
B.1 TEM cell .29
B.2 Wideband GTEM cell.29
Annex C (informative) Calculation of dipole moment from measured data .31
C.1 General .31
C.2 Dipole moment calculation.31
61967-2 IEC:2005 – 5 –
Annex D (informative) Specification of emissions data .35
D.1 General.35
D.2 Specification of emission levels .35
D.3 Presentation of results.35
D.4 Examples.35
Bibliography.41
Figure 1 – TEM cell test set-up .17
Figure 2 – GTEM cell test set-up.17
Figure 3 – IC Test printed circuit board .21
Figure D.1 – Emission characterization levels .37
Figure D.2 – Maximum Emission Level G8f.39
Table 1 − Pin loading recommendations.19
61967-2 IEC:2005 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 2: Measurement of radiated emissions –
TEM cell and wideband TEM cell method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-2 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/722/FDIS 47A/729/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
61967-2 IEC:2005 – 9 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This part of IEC 61967 is to be read in conjunction with IEC 61967-1.
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell method
Part 3: Measurement of radiated emissions – Surface scan method
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
Part 5: Measurement of conducted emissions – Workbench Faraday Cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
61967-2 IEC:2005 – 11 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz to 1 GHz –
Part 2: Measurement of radiated emissions –
TEM cell and wideband TEM cell method
1 Scope
This test procedure defines a method for measuring the electromagnetic radiation from an
integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board
(PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a
transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is
not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This
method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however,
the measured radio frequency (RF) voltage will be affected by many factors. The primary
factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing.
This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of
45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area.
Other cells may not produce identical spectral output but may be used for comparative
measurements, subject to their frequency and sensitivity limitations. A conversion factor may
allow comparisons between data measured on TEM or GTEM cells with different septum to
floor spacing.
The IC test board controls the geometry and orientation of the operating IC relative to the cell
and eliminates any connecting leads within the cell (these are on the backside of the board,
which is outside the cell). For the TEM cell, one of the 50 Ω ports is terminated with a 50 Ω
load. The other 50 Ω port for a TEM cell, or the single 50 Ω port for a GTEM cell, is connected
to the input of a spectrum analyser or receiver that measures the RF emissions emanating
from the integrated circuit and impressed onto the septum of the cell.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050-131:2002, International Electrotechnical Vocabulary (IEV) – Part 131: Circuit
theory
IEC 60050-161:1990, International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
61967-2 IEC:2005 – 13 –
3 Terms and definitions
For the purposes of this document, the definitions in IEC 61967-1, IEC 60050-131 and
IEC 60050-161 apply.
4 General
The RF voltage appearing at the input to the spectrum analyser is related to the
electromagnetic radiation potential of the IC and of the electronic module of which it would be
a part. The intent is to provide a quantitative measure of the RF emissions from ICs for
comparison or other purposes.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 61967-1. In addition, the
following test conditions shall apply.
5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
5.3 Frequency range
The effective frequency range of this radiated emissions procedure is affected by the test cell
used. For a 1 GHz TEM cell, the range is 150 kHz to 1 GHz. For a wideband TEM cell (GTEM),
the range is 150 kHz to 1 GHz, or as limited by the GTEM and test PCB characteristics.
6 Test equipment
6.1 General
The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the
following test equipment requirements shall apply.
6.2 Shielding
Double shielded or semi-rigid coaxial cable may be required depending on the local ambient
conditions. For extreme ambient environments, operation in a shielded room may be required.
6.3 RF measuring instrument
A spectrum analyser or EMI receiver shall be used. The spectrum analyser or receiver
resolution bandwidth shall be 9 kHz or 10 kHz and the video bandwidth shall not be less than
three times the resolution bandwidth. Measurements shall be made with a peak detector and
presented in units of dBµV [for 50 Ω system: (dBm readings) + 107 = dBµV]. For spectrum
analysers, the frequency band of interest shall be swept in calibrated or coupled mode (auto
sweep).
61967-2 IEC:2005 – 15 –
6.4 Preamplifier
Typically, a 20 dB to 30 dB gain, low noise preamplifier is required to meet the ambient
requirements in 8.2. If used, the preamplifier shall be connected directly to the measurement
port of the TEM cell using the appropriate 50 Ω coaxial adapter; no cable
...
제목: SIST EN 61967-2:2006 - 통합 회로 - 전자기 방사 측정, 150 kHz에서 1 GHz까지 - 제 2부: 방사된 방사 - TEM 셀 및 와이드 밴드 TEM 셀 방법 내용: 이 시험 절차는 통합 회로(IC)에서 전자기 방사를 측정하기 위한 방법을 정의합니다. 평가 대상인 IC는 IC 테스트 프린트 회로 기판(PCB)에 장착되고, 이 PCB는 전자기 파장에 대한 관련 포트(벽 포트라 불림)가 TEM 셀 또는 와이드 밴드 기가헤르츠 TEM(GTEM) 셀의 상단 또는 하단에 잘린 부분에 클램프됩니다. 테스트 기판은 전통적인 사용법과는 달리 셀 내부에 있지 않고 셀 벽의 일부가 됩니다. 이 방법은 벽 포트를 포함한 어떤 TEM 또는 GTEM 셀에도 적용될 수 있지만, 측정된 라디오 주파수(RF) 전압은 여러 요소에 의해 영향을 받을 수 있습니다. 측정된 RF 전압에 가장 큰 영향을 미치는 요소는 셉툼과 IC 테스트 기판(셀 벽) 간의 간격입니다. 이 절차는 셉툼과 바닥 간의 간격이 45mm인 1 GHz TEM 셀과 포트 영역에서의 평균 셉툼과 바닥 간의 간격이 45mm인 GTEM 셀을 사용하여 개발되었습니다. 다른 셀은 동일한 스펙트럼 출력을 내지 않을 수 있지만, 자주 사용되는 빈도와 감도 제한 내에서 비교적 측정에 사용될 수 있습니다. 변환 계수를 사용하면 다른 셉툼과 바닥 간 간격을 가진 TEM 또는 GTEM 셀에서 측정된 데이터를 비교할 수 있습니다. IC 테스트 기판은 셀 내에서 IC의 기하학적 배치와 방향성을 제어하고, 셀 내부의 연결된 리드를 제거합니다(이는 셀 외부에 있는 보드의 뒷면에 위치합니다). TEM 셀의 50 Ω 포트 중 하나는 50 Ω 부하로 종료됩니다. TEM 셀의 다른 50 Ω 포트 또는 GTEM 셀의 단일 50 Ω 포트는 통합 회로에서 방출되고 셀의 셉툼에 영향을 주는 RF 방사를 측정하는 스펙트럼 분석기 또는 수신기의 입력에 연결됩니다.
記事のタイトル：SIST EN 61967-2:2006 - インテグレートド・サーキット - 電磁放射の測定、150kHzから1GHzまで -- 第2部：放射電磁放射の測定 - TEMセルと広帯域TEMセル法 記事の内容：このテスト手順は、インテグレートド・サーキット（IC）からの電磁放射を測定する方法を定義しています。評価対象であるICは、ICテスト基板（PCB）に取り付けられ、トランスバース電磁（TEM）セルまたは広帯域ギガヘルツTEM（GTEM）セルの上部または下部に切り欠かれた一致ポート（壁ポートとも呼ばれます）にクランプされます。テスト基板は、従来の使用法とは異なり、セル内ではなくセルの壁の一部となります。この方法は、壁ポートを備えた任意のTEMまたはGTEMセルに適用できますが、測定されるRF電圧は多くの要因によって影響を受けます。測定されるRF電圧に最も影響を及ぼす要因は、セプタムとICテスト基板（セルの壁）の間の間隔です。この手順は、セプタムから床までの間隔が45mmの1GHz TEMセルおよびポートエリアでの平均セプタムから床までの間隔が45mmのGTEMセルを使用して開発されました。他のセルは同一のスペクトル出力を生じないかもしれませんが、周波数と感度の制限内で比較的測定に使用することができます。変換係数を使用すると、セプタムと床の間隔が異なるTEMまたはGTEMセルで測定されたデータを比較することができます。ICテスト基板は、セル内のICのジオメトリと方向性を制御し、セル内の接続リードを排除します（これらはセルの外側のボードの裏側にあります）。TEMセルの50Ωポートの一方は50Ω負荷で終端します。TEMセルの他の50ΩポートまたはGTEMセルの単一の50Ωポートは、ICからのRF放射を測定し、セルのセプタムに印加されたRFを測定するために、スペクトラムアナライザまたはレシーバの入力に接続されます。
The article discusses SIST EN 61967-2:2006, which is a test procedure for measuring the electromagnetic radiation from an integrated circuit (IC). The IC is mounted on a test PCB that is clamped to a wall port in a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. This method can be used with any TEM or GTEM cell that has a wall port, but the measured RF voltage may be affected by factors such as the spacing between the septum and the IC test board. The IC test board controls the positioning of the IC within the cell and eliminates any connecting leads inside the cell. The RF emissions from the IC are measured using a spectrum analyzer or receiver connected to one of the ports of the TEM or GTEM cell.
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