SIST EN IEC 61191-1:2020
(Main)Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.
Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an gelötete elektrische und elektronische Baugruppen unter Verwendung der Oberflächenmontage und verwandter Montagetechniken
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées
NEW!IEC 61191-1:2018 est disponible sous forme de IEC 61191-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 61191-1:2018 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d’interconnexions et d’ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu’à des techniques d’assemblage associées. La présente partie de l’IEC 61191 comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- les exigences ont été mises à jour pour être conformes aux critères d’acceptation de l’IPC‑A-610F;
- le terme "dessin d’assemblage" a été remplacé partout par "document d’assemblage";
- les références aux normes IEC ont été corrigées;
- l’Article 9 a été entièrement réécrit;
- l’Annexe B a été retirée car des procédures d’assemblages de cartes à circuits existent déjà.
Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije
Ta del standarda IEC 61191 določa zahteve za materiale, metode in kriterije za preverjanje za izdelavo kakovostnih spajkanih medsebojnih povezav in sestavov, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije. Ta del standarda IEC 61191 vsebuje tudi priporočila za dobre postopke izdelave.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2020
Nadomešča:
SIST EN 61191-1:2014
Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane
električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in
sorodne tehnologije
Printed board assemblies - Part 1: Generic specification - Requirements for soldered
electrical and electronic assemblies using surface mount and related assembly
technologies
Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an
gelötete elektrische und elektronische Baugruppen unter Verwendung der
Oberflächenmontage und verwandter Montagetechniken
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives
aux ensembles électriques et électroniques brasés utilisant les techniques de montage
en surface et associées
Ta slovenski standard je istoveten z: EN IEC 61191-1:2018
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61191-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2018
ICS 31.190; 31.240 Supersedes EN 61191-1:2013
English Version
Printed board assemblies - Part 1: Generic specification -
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
(IEC 61191-1:2018)
Ensembles de cartes imprimées - Partie 1: Spécification Elektronikaufbauten auf Leiterplatten - Teil 1:
générique - Exigences relatives aux ensembles électriques Fachgrundspezifikation - Anforderungen an gelötete
et électroniques brasés utilisant les techniques de montage elektrische und elektronische Baugruppen unter
en surface et associées Verwendung der Oberflächenmontage und verwandter
(IEC 61191-1:2018) Montagetechniken
(IEC 61191-1:2018)
This European Standard was approved by CENELEC on 2018-10-19. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61191-1:2018 E
European foreword
The text of document 91/1481/CDV, future edition 3 of IEC 61191-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61191-1:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-07-19
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-10-19
document have to be withdrawn
This document supersedes EN 61191-1:2013.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61191-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4
IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6
IEC 61188-7 NOTE Harmonized as EN 61188-7
IEC 61189-2 NOTE Harmonized as EN 61189-2
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61193-1 NOTE Harmonized as EN 61193-1
IEC 61193-3 NOTE Harmonized as EN 61193-3
IEC 62326-1 NOTE Harmonized as EN 62326-1
IEC 62326-4 NOTE Harmonized as EN 62326-4
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test T: EN 60068-2-20 -
Test methods for solderability and resistance to
soldering heat of devices with leads
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - Test EN 60068-2-58 -
Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat
of surface mounting devices (SMD)
IEC 60194 - Printed board design, manufacture and assembly - -
- Terms and definitions
IEC 60721-3-1 - Printed board design, manufacture and assembly EN IEC 60721-3-1 -
- Terms and definitions
IEC 61189-1 - Test methods for electrical materials, EN 61189-1 -
interconnection structures and assemblies - Part
1: General test methods and methodology
IEC 61189-3 - Test methods for electrical materials, printed EN 61189-3 -
boards and other interconnection structures and
assemblies - Part 3: Test methods for
interconnection structures (printed boards)
IEC 61190-1-1 - Attachment materials for electronic assembly - EN 61190-1-1 -
Part 1-1: Requirements for soldering fluxes for
high-quality interconnections in electronics
assembly
IEC 61190-1-3 - Attachment materials for electronic assembly - EN IEC 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solder for electronic soldering applications
IEC 61191-2 - Printed board assemblies - Part 2: Sectional EN 61191-2 -
specification - Requirements for surface mount
soldered assemblies
IEC 61191-3 - Printed board assemblies - Part 3: Sectional EN 61191-3 -
specification - Requirements for through-hole
mount soldered assemblies
IEC 61191-4 - Printed board assemblies - Part 4: Sectional EN 61191-4 -
specification - Requirements for terminal
soldered assemblies
IEC 61249-8-8 - Materials for interconnection structures - Part 8: EN 61249-8-8 -
Sectional specification set for non-conductive
films and coatings - Section 8: Temporary
polymer coatings
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic EN 61340-5-1 -
devices from electrostatic phenomena - General
requirements
IEC/TR 61340-5-2 - Electrostatics - Part 5-2: Protection of electronic CLC/TR 61340-5-2 -
devices from electrostatic phenomena - User
guide
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of surface
mounting devices (SMD) - Application guide
ISO 9001 2008 Quality management systems - Requirements - -
IPC-A-610 - Acceptability of Electronics Assemblies - -
IEC 61191-1 ®
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190; 31.240 ISBN 978-2-8322-5953-5
– 2 – IEC 61191-1:2018 © IEC 2018
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references. 8
3 Terms and definitions . 9
4 General requirements . 10
4.1 Order of precedence . 10
4.1.1 General remark . 10
4.1.2 Conflict . 10
4.1.3 Conformance documentation . 10
4.2 Interpretation of requirements . 11
4.3 Classification . 11
4.4 Defects and process indicators . 11
4.5 Process control requirements . 12
4.6 Requirements flowdown . 12
4.7 Physical designs . 12
4.7.1 New designs . 12
4.7.2 Existing designs . 12
4.8 Visual aids . 12
4.9 Proficiency of personnel . 13
4.9.1 Design proficiency . 13
4.9.2 Manufacturing proficiency. 13
4.10 Electrostatic discharge (ESD) . 13
4.11 Facilities . 13
4.11.1 General . 13
4.11.2 Environmental controls . 13
4.11.3 Temperature and humidity . 13
4.11.4 Lighting . 14
4.11.5 Field conditions . 14
4.11.6 Clean rooms . 14
4.12 Assembly tools and equipment . 14
4.12.1 General . 14
4.12.2 Process control . 14
5 Requirements of materials . 14
5.1 Overview. 14
5.2 Solder . 14
5.3 Flux . 14
5.4 Solder paste . 15
5.5 Preform solder . 15
5.6 Adhesives . 15
5.7 Cleaning agents . 15
5.7.1 General . 15
5.7.2 Cleaning agents selection . 15
5.8 Polymeric coatings . 16
5.8.1 Solder resists and localized maskants . 16
5.8.2 Conformal coating and encapsulants . 16
5.8.3 Spacers (permanent and temporary) . 16
IEC 61191-1:2018 © IEC 2018 – 3 –
5.9 Chemical strippers . 16
5.10 Cleaning Agents . 16
5.11 Heat shrinkable soldering devices . 16
6 Components and printed board requirements . 16
6.1 General . 16
6.2 Solderability . 17
6.2.1 Parts solderability . 17
6.2.2 Reconditioning . 17
6.2.3 Solderability testing of ceramic boards . 17
6.3 Solderability maintenance . 17
6.3.1 General . 17
6.3.2 Preconditioning . 17
6.3.3 Gold embrittlement of solder joints . 17
6.3.4 Tinning of non-solderable parts . 18
6.4 Solder purity maintenance . 18
6.5 Lead preparation . 19
6.5.1 General . 19
6.5.2 Lead forming . 19
6.5.3 Lead-forming limits . 19
7 Assembly process requirements . 20
7.1 Overview. 20
7.2 Cleanliness . 20
7.3 Part markings and reference designations . 20
7.4 Solder connection contours . 20
7.5 Moisture traps . 20
7.6 Thermal dissipation . 20
8 Assembly soldering requirements . 20
8.1 General . 20
8.1.1 Soldering process . 20
8.1.2 Machine maintenance . 21
8.1.3 Handling of parts . 21
8.1.4 Preheating . 21
8.1.5 Carriers . 21
8.1.6 Hold down of surface mount leads . 21
8.1.7 Heat application . 21
8.1.8 Cooling . 21
8.2 Reflow soldering . 21
8.2.1 Requirements . 21
8.2.2 Process development for reflow soldering . 22
8.2.3 Flux application . 22
8.2.4 Solder application . 22
8.3 Manual/hand soldering . 23
8.3.1 Non-reflow manual soldering . 23
8.3.2 Reflow manual soldering . 23
9 Cleanliness and residue requirements . 24
9.1 General . 24
9.2 Qualified cleaning/manufacturing process . 24
9.2.1 General . 24
– 4 – IEC 61191-1:2018 © IEC 2018
9.2.2 Cleaning designator . 25
9.2.3 Upper specification limit . 25
9.3 Visual requirements . 25
9.4 Correlation of ionic testers . 26
9.5 Non-ionic residues . 26
9.6 SIR testing . 26
10 Assembly requirements . 26
10.1 General . 26
10.2 Acceptance requirements . 26
10.2.1 Process control . 26
10.2.2 Corrective action limits . 27
10.2.3 Control limit determination . 27
10.3 General assembly requirements . 27
10.3.1 Assembly integrity . 27
10.3.2 Assembly damage . 27
10.3.3 Markings . 28
10.3.4 Flatness (bow and twist) . 28
10.3.5 Solder connection . 28
10.3.6 Interfacial connections . 30
11 Coating and encapsulation . 30
11.1 Conformal coating . 30
11.1.1 Coating instructions . 30
11.1.2 Application . 30
11.1.3 Performance requirements . 31
11.1.4 Rework of conformal coating . 32
11.1.5 Conformal coating inspection . 32
11.2 Encapsulation . 32
11.2.1 Encapsulation instructions . 32
11.2.2 Application . 32
11.2.3 Performance requirements . 33
11.2.4 Rework of encapsulant material . 33
11.2.5 Encapsulant inspection . 33
12 Rework and repair . 33
12.1 Rework of unsatisfactorily soldered electrical and electronic assemblies . 33
12.2 Repair . 34
12.3 Post rework/repair cleaning . 34
13 Product quality assurance . 35
13.1 System requirements . 35
13.2 Inspection methodology . 35
13.2.1 Verification inspection . 35
13.2.2 Visual inspection . 35
13.2.3 Sampling inspection . 36
13.3 Process control . 36
13.3.1 System details . 36
13.3.2 Defect reduction . 36
13.3.3 Variance reduction . 37
14 Other requirements . 37
14.1 Health and safety . 37
IEC 61191-1:2018 © IEC 2018 – 5 –
14.2 Special manufacturing requirements . 37
14.2.1 Manufacture of devices incorporating magnetic windings . 37
14.2.2 High-frequency applications . 37
14.2.3 High-voltage or high-power applications . 37
14.3 Guidance on requirement flowdown . 37
15 Ordering data . 37
Annex A (normative) Requirements for soldering tools and equipment . 39
A.1 Requirements for tools and equipment . 39
A.2 Abrasives . 39
A.3 Benchtop and hand-soldering systems . 39
A.4 Soldering iron holders . 40
A.5 Wiping pads . 40
A.6 Soldering guns . 40
A.7 Solder pots . 40
A.8 Process control . 40
Annex B (normative) Quality assessment . 41
B.1 Process control (PC) . 41
B.2 Reduction of quality conformance testing . 41
B.3 Audit plan . 42
Bibliography . 43
Figure 1 – Solder contact angle . 29
Figure 2 – Solder wetting of plated through-holes without leads . 30
Figure 3 – Coating conditions . 31
Table 1 – Solder contamination limits; maximum contaminant limit (percentage by
weight) . 19
Table 2 – Designation of surfaces to be cleaned . 25
Table 3 – Residue testing for process control . 25
Table 4 – Maximum acceptable rosin flux residues . 26
Table 5 – Electrical and electronic assembly defects . 34
Table 6 – Magnification requirements . 35
– 6 – IEC 61191-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 1: Generic specification –
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61191-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This third edition cancels and replaces the second edition published in 2013. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the requirements have been updated to be compliant with the acceptance criteria in
IPC-A-610F;
b) the term "assembly drawing" has been changed to "assembly documentation" throughout;
c) references to IEC standards have been corrected;
d) Clause 9 was completely rewritten;
IEC 61191-1:2018 © IEC 2018 – 7 –
e) Annex B was removed because there are already procedures for circuit board assemblies.
The text of this International Standard is based on the following documents:
CDV Report on voting
91/1481/CDV 91/1510/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 61191 series, published under the general title Printed board
assemblies, can be found in the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 8 – IEC 61191-1:2018 © IEC 2018
PRINTED BOARD ASSEMBLIES –
Part 1: Generic specification –
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
1 Scope
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria
for producing quality soldered interconnections and assemblies using surface mount and
related assembly technologies. This part of IEC 61191 also includes recommendations for
good manufacturing processes.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 60721-3-1, Classification of environmental conditions – Part 3: Classification of groups of
environmental parameters and their severities – Storage
IEC 61189-1, Test methods for electrical materials, interconnection structures and assemblies
– Part 1: General test methods and methodology
IEC 61189-3, Test methods for electrical materials, printed boards and other interconnection
structures and assemblies – Part 3: Test methods for interconnection structures (printed
boards)
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements for
surface mount soldered assemblies
IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for
through-hole mount soldered assemblies
IEC 61191-1:2018 © IEC 2018 – 9 –
IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for
terminal soldered assemblies
IEC 61249-8-8, Materials for interconnection structures – Part 8: Sectional specification set
for non-conductive films and coatings – Section 8: Temporary polymer coatings
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions
of surface mounting devices (SMD) – Application guide
ISO 9001:2008, Quality management systems – Requirements
IPC-A-610, Acceptability of Electronic Assemblies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
bow
deviation from flatness of a board characterized by a roughly cylindrical or spherical curvature
so that, if the product is rectangular, its four corners are in the same plane
3.2
manufacturer
assembler
individual or company responsible for the procurement of materials and components, as well
as all assembly process and verification operations necessary to ensure full compliance of
assemblies with this document
3.3
objective evidence
documentation agreed to between the user and the manufacturer
Note 1 to entry: The documentation can be in the form of a hard copy, computer data, computer algorithms, video
or other media.
3.4
process indicator
detectable anomaly, other than a defect, that is reflective of material, equipment, personnel,
process and/or workmanship variation
– 10 – IEC 61191-1:2018 © IEC 2018
3.5
proficiency
capability to perform tasks in accordance with the requirements and verification procedures
detailed in this document
3.6
shadowing
phenomenon where parts create a shadow of leads, lands, or other parts, which obstruct
heating at reflow soldering or spreading solder at flow soldering
3.7
supplier
individual or company responsible for assuring, to the manufacturer (assembler), full
compliance of components and base materials with the requirements and verification
procedures of this document
Note 1 to entry: Components include electronic, electromechanical, mechanical components, printed boards, etc.
Note 2 to entry: Base materials include solder, flux, cleaning agents, etc.
3.8
twist
deviation of a rectangular sheet, panel or printed board that occurs parallel to a diagonal
across its surface, so that one of the corners of the sheet is not in the plane that contains the
other three corners
3.9
user
procuring authority
individual, company or agency responsible for the procurement of electrical/electronic
hardware, and having the authority to define the class of equipment and any variation or
restrictions to the requirements of this document
EXAMPLE The originator/custodian of the contract detailing these requirements.
4 General requirements
4.1 Order of precedence
4.1.1 General remark
In the event of a conflict between the text of this standard and the applicable standard cited
herein, the text of this document shall take precedence. However, nothing in this document
supersedes applicable laws and regulations.
4.1.2 Conflict
In the event of conflict between the requirements of this document and the applicable
assembly documentation, the applicable user approved assembly documentation shall govern.
In the event of conflict between the requirements of this document and assembly
documentation that has not been approved, the differences shall be referred to the designated
user activity for approval. Upon such approval, the provisions shall be documented (by official
revision notice or equivalent) on the assembly documentation, which shall then govern.
4.1.3 Conformance documentation
Where this document requires documentary evidence to support conformance claims, each
record shall be retained and be available for inspection for a minimum of two years from the
date of the recorded occurrence (see ISO 9001).
IEC 61191-1:2018 © IEC 2018 – 11 –
4.2 Interpretation of requirements
The introduction of product classification according to the levels and their end use (see 4.3)
permits the user to differentiate the performance requirements. When the user elects to
specify compliance with the mandatory requirements of this document, the following
conditions apply:
• unless otherwise specified by the user, the word "shall" signifies that the requirements are
mandatory,
• deviations from any "shall" requirement requires written acceptance by the user, for
example via assembly documentation, specification or contract provision. The word
“should” is used to indicate a recommendation or guidance statement. The word “may”
indicates an optional situation. Both “should” and “may” express non-mandatory situations.
“Will” is used to express a declaration of purpose.
4.3 Classification
This document recognizes that electrical and electronic assemblies are subject to
classifications by intended end-item use. Three general end-product levels have been
established to reflect differences in producibility, functional performance requirements, and
verification (inspection/test) frequency.
It should be recognized tha
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