Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an gelötete elektrische und elektronische Baugruppen unter Verwendung der Oberflächenmontage und verwandter Montagetechniken

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées

NEW!IEC 61191-1:2018 est disponible sous forme de IEC 61191-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 61191-1:2018 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d’interconnexions et d’ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu’à des techniques d’assemblage associées. La présente partie de l’IEC 61191 comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - les exigences ont été mises à jour pour être conformes aux critères d’acceptation de l’IPC‑A-610F; - le terme "dessin d’assemblage" a été remplacé partout par "document d’assemblage"; - les références aux normes IEC ont été corrigées; - l’Article 9 a été entièrement réécrit; - l’Annexe B a été retirée car des procédures d’assemblages de cartes à circuits existent déjà.

Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije

Ta del standarda IEC 61191 določa zahteve za materiale, metode in kriterije za preverjanje za izdelavo kakovostnih spajkanih medsebojnih povezav in sestavov, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije. Ta del standarda IEC 61191 vsebuje tudi priporočila za dobre postopke izdelave.

General Information

Status
Published
Publication Date
12-Jan-2020
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
12-Dec-2019
Due Date
16-Feb-2020
Completion Date
13-Jan-2020

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SLOVENSKI STANDARD
SIST EN IEC 61191-1:2020
01-februar-2020
Nadomešča:
SIST EN 61191-1:2014

Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane

električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in

sorodne tehnologije

Printed board assemblies - Part 1: Generic specification - Requirements for soldered

electrical and electronic assemblies using surface mount and related assembly
technologies

Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an

gelötete elektrische und elektronische Baugruppen unter Verwendung der
Oberflächenmontage und verwandter Montagetechniken

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives

aux ensembles électriques et électroniques brasés utilisant les techniques de montage

en surface et associées
Ta slovenski standard je istoveten z: EN IEC 61191-1:2018
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61191-1:2020 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 61191-1:2020
---------------------- Page: 2 ----------------------
SIST EN IEC 61191-1:2020
EUROPEAN STANDARD EN IEC 61191-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2018
ICS 31.190; 31.240 Supersedes EN 61191-1:2013
English Version
Printed board assemblies - Part 1: Generic specification -
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
(IEC 61191-1:2018)

Ensembles de cartes imprimées - Partie 1: Spécification Elektronikaufbauten auf Leiterplatten - Teil 1:

générique - Exigences relatives aux ensembles électriques Fachgrundspezifikation - Anforderungen an gelötete

et électroniques brasés utilisant les techniques de montage elektrische und elektronische Baugruppen unter

en surface et associées Verwendung der Oberflächenmontage und verwandter
(IEC 61191-1:2018) Montagetechniken
(IEC 61191-1:2018)

This European Standard was approved by CENELEC on 2018-10-19. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 61191-1:2018 E
---------------------- Page: 3 ----------------------
SIST EN IEC 61191-1:2020
EN IEC 61191-1:2018 (E)
European foreword

The text of document 91/1481/CDV, future edition 3 of IEC 61191-1, prepared by IEC/TC 91

"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 61191-1:2018.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2019-07-19

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2021-10-19

document have to be withdrawn
This document supersedes EN 61191-1:2013.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 61191-1:2018 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4
IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6
IEC 61188-7 NOTE Harmonized as EN 61188-7
IEC 61189-2 NOTE Harmonized as EN 61189-2
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61193-1 NOTE Harmonized as EN 61193-1
IEC 61193-3 NOTE Harmonized as EN 61193-3
IEC 62326-1 NOTE Harmonized as EN 62326-1
IEC 62326-4 NOTE Harmonized as EN 62326-4
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SIST EN IEC 61191-1:2020
EN IEC 61191-1:2018 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test T: EN 60068-2-20 -

Test methods for solderability and resistance to
soldering heat of devices with leads

IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - Test EN 60068-2-58 -

Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat
of surface mounting devices (SMD)
IEC 60194 - Printed board design, manufacture and assembly - -
- Terms and definitions

IEC 60721-3-1 - Printed board design, manufacture and assembly EN IEC 60721-3-1 -

- Terms and definitions
IEC 61189-1 - Test methods for electrical materials, EN 61189-1 -
interconnection structures and assemblies - Part
1: General test methods and methodology
IEC 61189-3 - Test methods for electrical materials, printed EN 61189-3 -
boards and other interconnection structures and
assemblies - Part 3: Test methods for
interconnection structures (printed boards)
IEC 61190-1-1 - Attachment materials for electronic assembly - EN 61190-1-1 -
Part 1-1: Requirements for soldering fluxes for
high-quality interconnections in electronics
assembly

IEC 61190-1-3 - Attachment materials for electronic assembly - EN IEC 61190-1-3 -

Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solder for electronic soldering applications
IEC 61191-2 - Printed board assemblies - Part 2: Sectional EN 61191-2 -
specification - Requirements for surface mount
soldered assemblies
---------------------- Page: 5 ----------------------
SIST EN IEC 61191-1:2020
EN IEC 61191-1:2018 (E)
IEC 61191-3 - Printed board assemblies - Part 3: Sectional EN 61191-3 -
specification - Requirements for through-hole
mount soldered assemblies
IEC 61191-4 - Printed board assemblies - Part 4: Sectional EN 61191-4 -
specification - Requirements for terminal
soldered assemblies

IEC 61249-8-8 - Materials for interconnection structures - Part 8: EN 61249-8-8 -

Sectional specification set for non-conductive
films and coatings - Section 8: Temporary
polymer coatings

IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic EN 61340-5-1 -

devices from electrostatic phenomena - General
requirements

IEC/TR 61340-5-2 - Electrostatics - Part 5-2: Protection of electronic CLC/TR 61340-5-2 -

devices from electrostatic phenomena - User
guide
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of surface
mounting devices (SMD) - Application guide
ISO 9001 2008 Quality management systems - Requirements - -
IPC-A-610 - Acceptability of Electronics Assemblies - -
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SIST EN IEC 61191-1:2020
IEC 61191-1
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190; 31.240 ISBN 978-2-8322-5953-5

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 61191-1:2020
– 2 – IEC 61191-1:2018 © IEC 2018
CONTENTS

FOREWORD ......................................................................................................................... 6

1 Scope ............................................................................................................................ 8

2 Normative references..................................................................................................... 8

3 Terms and definitions .................................................................................................... 9

4 General requirements .................................................................................................. 10

4.1 Order of precedence ........................................................................................... 10

4.1.1 General remark ............................................................................................ 10

4.1.2 Conflict ........................................................................................................ 10

4.1.3 Conformance documentation ........................................................................ 10

4.2 Interpretation of requirements .............................................................................. 11

4.3 Classification ...................................................................................................... 11

4.4 Defects and process indicators ............................................................................ 11

4.5 Process control requirements .............................................................................. 12

4.6 Requirements flowdown ...................................................................................... 12

4.7 Physical designs ................................................................................................. 12

4.7.1 New designs ................................................................................................ 12

4.7.2 Existing designs ........................................................................................... 12

4.8 Visual aids .......................................................................................................... 12

4.9 Proficiency of personnel ...................................................................................... 13

4.9.1 Design proficiency ........................................................................................ 13

4.9.2 Manufacturing proficiency............................................................................. 13

4.10 Electrostatic discharge (ESD) .............................................................................. 13

4.11 Facilities ............................................................................................................. 13

4.11.1 General ....................................................................................................... 13

4.11.2 Environmental controls ................................................................................. 13

4.11.3 Temperature and humidity ............................................................................ 13

4.11.4 Lighting ....................................................................................................... 14

4.11.5 Field conditions ............................................................................................ 14

4.11.6 Clean rooms ................................................................................................ 14

4.12 Assembly tools and equipment ............................................................................ 14

4.12.1 General ....................................................................................................... 14

4.12.2 Process control ............................................................................................ 14

5 Requirements of materials ........................................................................................... 14

5.1 Overview............................................................................................................. 14

5.2 Solder ................................................................................................................. 14

5.3 Flux .................................................................................................................... 14

5.4 Solder paste ....................................................................................................... 15

5.5 Preform solder .................................................................................................... 15

5.6 Adhesives ........................................................................................................... 15

5.7 Cleaning agents .................................................................................................. 15

5.7.1 General ....................................................................................................... 15

5.7.2 Cleaning agents selection ............................................................................ 15

5.8 Polymeric coatings .............................................................................................. 16

5.8.1 Solder resists and localized maskants .......................................................... 16

5.8.2 Conformal coating and encapsulants ............................................................ 16

5.8.3 Spacers (permanent and temporary) ............................................................. 16

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SIST EN IEC 61191-1:2020
IEC 61191-1:2018 © IEC 2018 – 3 –

5.9 Chemical strippers .............................................................................................. 16

5.10 Cleaning Agents .................................................................................................. 16

5.11 Heat shrinkable soldering devices ....................................................................... 16

6 Components and printed board requirements ............................................................... 16

6.1 General ............................................................................................................... 16

6.2 Solderability ........................................................................................................ 17

6.2.1 Parts solderability ........................................................................................ 17

6.2.2 Reconditioning ............................................................................................. 17

6.2.3 Solderability testing of ceramic boards ......................................................... 17

6.3 Solderability maintenance ................................................................................... 17

6.3.1 General ....................................................................................................... 17

6.3.2 Preconditioning ............................................................................................ 17

6.3.3 Gold embrittlement of solder joints ............................................................... 17

6.3.4 Tinning of non-solderable parts .................................................................... 18

6.4 Solder purity maintenance ................................................................................... 18

6.5 Lead preparation ................................................................................................. 19

6.5.1 General ....................................................................................................... 19

6.5.2 Lead forming ................................................................................................ 19

6.5.3 Lead-forming limits ....................................................................................... 19

7 Assembly process requirements ................................................................................... 20

7.1 Overview............................................................................................................. 20

7.2 Cleanliness ......................................................................................................... 20

7.3 Part markings and reference designations ........................................................... 20

7.4 Solder connection contours ................................................................................. 20

7.5 Moisture traps ..................................................................................................... 20

7.6 Thermal dissipation ............................................................................................. 20

8 Assembly soldering requirements ................................................................................. 20

8.1 General ............................................................................................................... 20

8.1.1 Soldering process ........................................................................................ 20

8.1.2 Machine maintenance .................................................................................. 21

8.1.3 Handling of parts .......................................................................................... 21

8.1.4 Preheating ................................................................................................... 21

8.1.5 Carriers ....................................................................................................... 21

8.1.6 Hold down of surface mount leads ................................................................ 21

8.1.7 Heat application ........................................................................................... 21

8.1.8 Cooling ........................................................................................................ 21

8.2 Reflow soldering ................................................................................................. 21

8.2.1 Requirements .............................................................................................. 21

8.2.2 Process development for reflow soldering ..................................................... 22

8.2.3 Flux application ............................................................................................ 22

8.2.4 Solder application ........................................................................................ 22

8.3 Manual/hand soldering ........................................................................................ 23

8.3.1 Non-reflow manual soldering ........................................................................ 23

8.3.2 Reflow manual soldering .............................................................................. 23

9 Cleanliness and residue requirements .......................................................................... 24

9.1 General ............................................................................................................... 24

9.2 Qualified cleaning/manufacturing process ............................................................ 24

9.2.1 General ....................................................................................................... 24

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SIST EN IEC 61191-1:2020
– 4 – IEC 61191-1:2018 © IEC 2018

9.2.2 Cleaning designator ..................................................................................... 25

9.2.3 Upper specification limit ............................................................................... 25

9.3 Visual requirements ............................................................................................ 25

9.4 Correlation of ionic testers ................................................................................... 26

9.5 Non-ionic residues .............................................................................................. 26

9.6 SIR testing .......................................................................................................... 26

10 Assembly requirements ................................................................................................ 26

10.1 General ............................................................................................................... 26

10.2 Acceptance requirements .................................................................................... 26

10.2.1 Process control ............................................................................................ 26

10.2.2 Corrective action limits ................................................................................. 27

10.2.3 Control limit determination ............................................................................ 27

10.3 General assembly requirements .......................................................................... 27

10.3.1 Assembly integrity ........................................................................................ 27

10.3.2 Assembly damage ........................................................................................ 27

10.3.3 Markings ...................................................................................................... 28

10.3.4 Flatness (bow and twist) ............................................................................... 28

10.3.5 Solder connection ........................................................................................ 28

10.3.6 Interfacial connections ................................................................................. 30

11 Coating and encapsulation ........................................................................................... 30

11.1 Conformal coating ............................................................................................... 30

11.1.1 Coating instructions ..................................................................................... 30

11.1.2 Application ................................................................................................... 30

11.1.3 Performance requirements ........................................................................... 31

11.1.4 Rework of conformal coating ........................................................................ 32

11.1.5 Conformal coating inspection ....................................................................... 32

11.2 Encapsulation ..................................................................................................... 32

11.2.1 Encapsulation instructions ............................................................................ 32

11.2.2 Application ................................................................................................... 32

11.2.3 Performance requirements ........................................................................... 33

11.2.4 Rework of encapsulant material .................................................................... 33

11.2.5 Encapsulant inspection ................................................................................ 33

12 Rework and repair ....................................................................................................... 33

12.1 Rework of unsatisfactorily soldered electrical and electronic assemblies .............. 33

12.2 Repair ................................................................................................................. 34

12.3 Post rework/repair cleaning ................................................................................. 34

13 Product quality assurance ............................................................................................ 35

13.1 System requirements ........................................................................................... 35

13.2 Inspection methodology ....................................................................................... 35

13.2.1 Verification inspection .................................................................................. 35

13.2.2 Visual inspection .......................................................................................... 35

13.2.3 Sampling inspection ..................................................................................... 36

13.3 Process control ................................................................................................... 36

13.3.1 System details ............................................................................................. 36

13.3.2 Defect reduction ........................................................................................... 36

13.3.3 Variance reduction ....................................................................................... 37

14 Other requirements ...................................................................................................... 37

14.1 Health and safety ................................................................................................ 37

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SIST EN IEC 61191-1:2020
IEC 61191-1:2018 © IEC 2018 – 5 –

14.2 Special manufacturing requirements .................................................................... 37

14.2.1 Manufacture of devices incorporating magnetic windings .............................. 37

14.2.2 High-frequency applications ......................................................................... 37

14.2.3 High-voltage or high-power applications ....................................................... 37

14.3 Guidance on requirement flowdown ..................................................................... 37

15 Ordering data .............................................................................................................. 37

Annex A (normative) Requirements for soldering tools and equipment ................................ 39

A.1 Requirements for tools and equipment ................................................................. 39

A.2 Abrasives ............................................................................................................ 39

A.3 Benchtop and hand-soldering systems ................................................................. 39

A.4 Soldering iron holders ......................................................................................... 40

A.5 Wiping pads ........................................................................................................ 40

A.6 Soldering guns .................................................................................................... 40

A.7 Solder pots ......................................................................................................... 40

A.8 Process control ................................................................................................... 40

Annex B (normative) Quality assessment ........................................................................... 41

B.1 Process control (PC) ........................................................................................... 41

B.2 Reduction of quality conformance testing ............................................................. 41

B.3 Audit plan ........................................................................................................... 42

Bibliograp
...

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