SIST EN IEC 62769-4:2023

Field Device Integration (FDI®) - Part 4: FDI Packages (IEC 62769-4:2023)

IEC 62769-4:2023 is available as IEC 62769-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Feldgeräteintegration (FDI®) - Teil 4: FDI-Packages (IEC 62769-4:2023)

Intégration des appareils de terrain (FDI®) - Partie 4: Paquetages FDI (IEC 62769-4:2023)

IEC 62769-4:2023 est disponible sous forme de IEC 62769-4:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L'IEC 62769-4:2023 spécifie les Paquetages FDI®[1]. L'architecture FDI® complète est représentée à la Figure 1. Les composants architecturaux qui relèvent du domaine d'application du présent document ont été mis en évidence dans Diagramme de l'architecture figure.
[1] FDI® est une marque déposée de l’organisation à but non lucratif Fieldbus Foundation, Inc. Cette information est donnée à l'intention des utilisateurs du présent document et ne signifie nullement que l'IEC approuve le détenteur de la marque ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de la marque. L'utilisation de la marque exige l'autorisation du détenteur de la marque.

Integracija procesne naprave (FDI®) - 4. del: Paketi FDI (IEC 62769-4:2023)

Ta del standarda IEC 62769 določa pakete FDI® 1.

General Information

• Status: Published
• Public Enquiry End Date: 22-May-2022
• Publication Date: 09-Oct-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• ICS: 35.240.50 - IT applications in industry
• Technical Committee: MOV - Measuring equipment for electromagnetic quantities
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 04-Jul-2023
• Due Date: 08-Sep-2023
• Completion Date: 10-Oct-2023
• Ref Project: EN IEC 62769-4:2023 - Field Device Integration (FDI®) - Part 4: FDI Packages

Relations

• Revised: SIST EN IEC 62769-4:2021 - Field Device Integration (FDI) - Part 4: FDI Packages (IEC 62769-4:2021)
• Effective Date: 09-Nov-2021

Overview - IEC 62769-4:2023 (FDI® Part 4: FDI Packages)

SIST EN IEC 62769-4:2023 (identical to IEC 62769-4:2023) defines the structure, contents and rules for FDI Packages - the deployable containers used to deliver field device integration software and metadata for industrial automation systems. Part 4 is a core element of the FDI® architecture (Field Device Integration) and supersedes the 2021 edition. It standardizes how device descriptions, user interface plug‑ins, attachments and related metadata are packaged, versioned, signed and consumed by FDI Hosts.

Note: FDI® is a registered trademark of Fieldbus Foundation, Inc.; its use in the standard does not imply endorsement by IEC.

Key topics and technical requirements

• FDI Package model and elements
  Defines mandatory and optional package components such as the Package Catalog, Package Feature Table, Electronic Device Description (EDD), User Interface Plug-in (UIP) and Attachments.

• FDI Package types
  Standardizes types including FDI Device Package, FDI Communication Package, FDI UIP Package and FDI Profile Package, each with defined roles and expected contents.

• Packaging technology
  Requires use of standardized packaging conventions (Open Packaging Conventions / OPC) and specifies handling of unknown/invalid parts, relationships, thumbnails and core properties.

• Implementation details
  Rules for package parts, file name conventions (Annex A), XML catalog schemas (Annex E), plus guidance on creation, binding and conformance testing (Annex B, D).

• Versioning and compatibility
  Defines a version scheme, version hierarchy and UIP compatibility rules to manage updates and backward compatibility.

• Security and provenance
  Specifies digital signature mechanisms, FDI Registration Certificates and signing processes so packages can be validated by FDI Hosts.

• Deployment guidance
  Informative annexes cover deployment scenarios for PC‑based client/server and standalone FDI systems (Annex C).

Practical applications and who uses this standard

FDI Packages standardized by IEC 62769-4:2023 are used to deliver interoperable device integration assets across process and factory automation:

• Device manufacturers - package device descriptions (EDD), UIPs and assets for distribution to customers.
• System integrators and OEMs - deploy and manage device packages in DCS/SCADA/asset-management systems.
• FDI Host and client developers - implement package ingestion, validation, version handling and UIP loading.
• Certification bodies and registries - validate digital signatures and FDI Registration Certificates.
• Automation engineers and maintenance teams - install consistent device drivers and vendor UIs for commissioning, diagnostics and lifecycle management.

Related standards

Key related references include:

• IEC 62769-1, -2, -5, -6, -7 (other FDI parts)
• IEC 61804-3 and IEC 61804-5 (EDD / function blocks)
• ISO/IEC OPC/packaging and document standards (Open Packaging Conventions, PDF/metadata)
• Security and signature standards referenced for signing and certificates

This standard is essential for anyone packaging, distributing or consuming device integration assets in process and industrial automation environments.

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2023
Integracija procesne naprave (FDI®) - 4. del: Paketi FDI (IEC 62769-4:2023)
Field Device Integration (FDI®) - Part 4: FDI Packages (IEC 62769-4:2023)
Feldgeräteintegration (FDI®) - Teil 4: FDI-Packages (IEC 62769-4:2023)
Intégration des appareils de terrain (FDI®) - Partie 4: Paquetages FDI (IEC 62769-
4:2023)
Ta slovenski standard je istoveten z: EN IEC 62769-4:2023
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62769-4

NORME EUROPÉENNE
EUROPÄISCHE NORM May 2023
ICS 25.040.40; 35.100.05 Supersedes EN IEC 62769-4:2021
English Version
Field Device Integration (FDI®) - Part 4: FDI Packages
(IEC 62769-4:2023)
Intégration des appareils de terrain (FDI®) - Partie 4: Feldgeräteintegration (FDI®) - Teil 4: FDI-Packages
Paquetages FDI (IEC 62769-4:2023)
(IEC 62769-4:2023)
This European Standard was approved by CENELEC on 2023-05-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62769-4:2023 E

European foreword
The text of document 65E/857/CDV, future edition 3 of IEC 62769-4, prepared by SC 65E "Devices
and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement, control and
automation" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-02-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-05-10
document have to be withdrawn
This document supersedes EN IEC 62769-4:2021 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62769-4:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 61784-1-1:2023 NOTE Approved as EN IEC 61784-1-1:2023 (not modified)
IEC 61784-1-3:2023 NOTE Approved as EN IEC 61784-1-3:2023 (not modified)
IEC 61784-1-9:2023 NOTE Approved as EN IEC 61784-1-9:2023 (not modified)
IEC 62591 NOTE Approved as EN 62591
IEC 62734 NOTE Approved as EN 62734
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61804-3 - Devices and integration in enterprise systems EN IEC 61804-3 -
- Function blocks (FB) for process control and
electronic device description language
(EDDL) - Part 3: EDDL syntax and semantics
IEC 61804-5 2020 Devices and intergration in enterprise EN IEC 61804-5 2020
systems - Function blocks (FB) for process
control and electronic device description
language (EDDL) - Part 5: EDDL Builtin
library
IEC 62769-1 - Field Device Integration (FDI®) - Part 1: EN IEC 62769-1 -
Overview
IEC 62769-2 - Field Device Integration (FDI®) - Part 2: EN IEC 62769-2 -
Client
IEC 62769-5 - Field Device Integration (FDI®) - Part 5: FDI EN IEC 62769-5 -
Information Model
IEC 62769-6 - Field Device Integration (FDI®) - Part 6: FDI EN IEC 62769-6 -
Technology Mappings
IEC 62769-7 - Field Device Integration (FDI®) - Part 7: EN IEC 62769-7 -
Communication Devices
IEC 62769-1xx series Field device integration (FDI®) - Part 1xx-y: - -
Profiles
ISO/IEC 11578 - Information technology - Open Systems - -
Interconnection - Remote Procedure Call
(RPC)
ISO/IEC 29500-2 2021 Document description and processing - -
languages - Office Open XML file formats -
Part 2: Open packaging conventions
ISO 639-1 - Codes for the representation of names of - -
languages - Part 1: Alpha-2 code
ISO 32000-1 - Document management - Portable document - -
format - Part 1: PDF 1.7
Publication Year Title EN/HD Year
Dublin Core 2020 DCMI Metadata Terms - -
Metadata Initiative
FCG TS10099 - Field Device Integration (FDI®) - Technology - -
Management
FIPS 140-3 2019 Security Requirements for Cryptographic - -
Modules
ETSI EN 319 132-1 - Electronic Signatures and Infrastructures - -
(ESI); XAdES digital signatures; Part 1:
Building blocks and XAdES baseline
signatures
ETSI TS 101 733 - Electronic Signatures and Infrastructures - -
(ESI); CMS Advanced Electronic Signatures
(CAdES)
IEC 62769-4 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside ®
Field Device Integration (FDI ) –
Part 4: FDI Packages ®
Intégration des appareils de terrain (FDI ) –
Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6794-3
– 2 – IEC 62769-4:2023 © IEC 2023
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms, definitions, abbreviated terms and acronyms . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms and acronyms . 12
3.3 Conventions . 13 ®
4 FDI Package Model . 13
4.1 Overview. 13 ®
4.2 FDI Package Elements . 14
4.2.1 Package Catalog . 14
4.2.2 Package Feature Table . 14
4.2.3 Feature Unit Conversion . 15
4.2.4 Electronic Device Description . 15
4.2.5 User Interface Plug-in . 15
4.2.6 Attachment . 17 ®
4.3 FDI Package Types . 17 ®
4.3.1 FDI Device Package . 17 ®
4.3.2 FDI Communication Package . 18 ®
4.3.3 FDI UIP Package . 18 ®
4.3.4 FDI Profile Package . 19 ®
5 FDI Package implementation . 20
5.1 Packaging technology . 20
5.2 Use of Open Packaging Conventions . 20
5.2.1 Unknown parts . 20
5.2.2 Invalid parts . 21
5.2.3 Unknown relationships . 21
5.2.4 Interleaving. 21
5.2.5 Core properties . 21
5.2.6 Thumbnails . 21
5.2.7 Digital Signatures . 21 ®
5.3 FDI Package parts. 21
5.3.1 Package Catalog . 21
5.3.2 Package Feature Table . 22
5.3.3 Electronic Device Description . 23
5.3.4 User Interface Plug-in . 23
5.3.5 Attachments . 26 ®
6 FDI Package versioning . 29
6.1 Version scheme . 29
6.2 Versioned elements . 29
6.3 Version hierarchy . 30
6.4 UIP compatibility . 31 ®
7 Digital Signatures and FDI Registration Certificates . 32
7.1 Signed elements and certification documents . 32
7.2 Signing mechanism . 33
® ®
7.3 FDI Package Originator, FDI Registration Authority . 34

IEC 62769-4:2023 © IEC 2023 – 3 – ®
7.4 FDI Host behaviour . 34
Annex A (normative) File name conventions . 35
A.1 Identification . 35 ®
A.2 FDI Package filename convention . 35 ®
Annex B (informative) FDI Package creation . 37
B.1 General . 37
B.2 Tools and components . 37
B.2.1 Overview . 37 ®
B.2.2 FDI Reference Implementation/Common EDD Engine . 37 ®
B.2.3 FDI Package IDE . 37 ®
B.2.4 FDI Device Package Conformance Test Tool . 37
B.3 Development . 37 ®
B.3.1 FDI Package core development . 37
B.3.2 User Interface Plug-in development . 38 ®
B.3.3 FDI Package Attachment development . 38 ®
B.3.4 FDI Package binding and packaging . 38
B.3.5 Conformance Test . 39 ®
Annex C (informative) FDI Package deployment . 40
C.1 General . 40
C.2 Scenarios . 40 ®
C.2.1 FDI Package deployment to PC based client/server systems . 40
® ®
C.2.2 FDI Package deployment to an FDI standalone system . 41
Annex D (informative) Example . 43
D.1 General . 43
D.2 Open Packaging Conventions . 43
D.2.1 Overview . 43
D.2.2 Parts. 43
D.2.3 Relationships . 44
D.2.4 OPC Core features . 44
D.2.5 OPC additional features . 45 ®
D.3 Creation and handling of FDI Packages. 46 ®
D.4 FDI Device Package example . 46
D.4.1 Overview . 46
D.4.2 User Interface Plug-in . 51
D.4.3 EDD reference to UIP . 53 ®
D.4.4 FDI Registration Certificate . 54 ®
Annex E (normative) FDI Package Catalog XML Schema . 55
E.1 Target Namespace . 55
E.2 Catalog . 55
E.3 ClassificationIdT . 55
E.4 CommunicationProfileT . 55
E.5 CommunicationRoleT . 55
E.6 CommunicationServerT . 56
E.7 DeviceTypeT . 56
E.8 FDIRegistrationCert . 57
E.9 FDIRegistrationCertT . 57
E.10 InterfaceT . 58
E.11 ListOfCommunicationProfilesT . 59

– 4 – IEC 62769-4:2023 © IEC 2023
E.12 ListOfDeviceImagesT . 59
E.13 ListOfDeviceTypesT . 60
E.14 ListOfDocumentsT . 60
E.15 ListOfInterfacesT . 61
E.16 ListOfLocalizedStringsT . 61
E.17 ListOfProtocolSupportFilesT . 62
E.18 ListOfRegDeviceTypesT . 62
E.19 ListOfRegistrationsT . 62
E.20 ListOfSupportedDeviceRevisionsT . 63
E.21 ListOfSupportedUipsT . 63
E.22 ListOfUipVariantsT . 64
E.23 LocalizedStringT . 64
E.24 PackageT . 64
E.25 PackageTypeT . 65
E.26 PlatformT . 66
E.27 RegDeviceTypeT . 66
E.28 RegistrationT . 67
E.29 RelationshipIdT . 67
E.30 String256T . 68
E.31 SupportedUipT . 68
E.32 UipCatalog . 68
E.33 UipStyleT . 69
E.34 UipT . 69
E.35 UipVariantT . 70
E.36 UuidT . 71
E.37 VersionSupportedT . 71
E.38 VersionT . 71
Annex F (normative) Communication protocol specific profiles . 72 ®
Annex G (informative) FDI Package life-cycle use cases . 73
G.1 New device type . 73
G.2 Replacement of device . 73
G.3 Firmware enhancements . 73 ®
G.4 FDI Package life-cycle polices . 74 ®
G.5 FDI Package update . 74 ®
G.6 FDI Package upgrade . 74 ®
G.7 FDI Package replacement/exchange . 74 ®
G.8 FDI Package uninstallation . 75
Annex H (normative) Health status Method . 76
H.1 Background. 76
H.2 Device health status model . 76
H.3 Standard EDD Method signature . 76
H.4 Performance considerations . 77
Annex I (normative) Modular devices . 78
I.1 Concept . 78
I.2 EDDL usage profile . 78
I.3 Processing recommendations . 79
I.3.1 Monolithic device with device variants . 79
I.3.2 Remote IOs . 79

IEC 62769-4:2023 © IEC 2023 – 5 –
I.3.3 How to identify the top level topology element . 79
I.3.4 Packaging details example . 79
® ®
Annex J (normative) FDI Communication Packages for FDI Communication Server . 81
J.1 General . 81
J.2 Protocol Support File . 81
J.3 CommunicationProfile definition . 81
J.4 Profile Device . 81
J.5 Protocol version information . 81 ®
J.6 Associating a Package with an FDI Communication Server . 81
J.7 Handling of Catalog elements . 81
J.8 Example. 82 ®
Annex K (normative) FDI Profile for EDDs . 83
K.1 Overview. 83
K.2 Entry point to online handling . 83
K.3 Entry point to offline handling . 83
K.4 Non-interactive upload and download. 83
K.5 Interactive download . 83
K.6 Interactive upload . 83
K.7 Initial data set . 83
K.8 Method GetHealthStatus . 84
K.9 Actions . 84
K.9.1 Pre- and Post-Read Actions . 84
K.9.2 Pre- and Post-Write Actions . 84
K.9.3 Refresh Actions on Variables . 84
K.9.4 Actions on BIT_ENUMERATION . 84
K.10 Shared files . 84 ®
Annex L (normative) FDI Package Documentation Catalog Schema . 85
L.1 Target namespace . 85
L.2 ListOfDocumentMetadataT . 85
L.3 DocumentMetadataT . 85 ®
Annex M (normative) FDI Package Feature Table Schema . 87
M.1 Target namespace . 87
M.2 FeatureTableT . 87
M.3 Feature . 87
M.4 FeatureProvidedbyPackage . 87
M.5 UnitConversion . 88
Bibliography . 89
®
Figure 1 – FDI architecture diagram . 10 ®
Figure 2 – FDI Package Model . 13
Figure 3 – Architectural mapping . 14
Figure 4 – User Interface Plug-in Reference Model . 16 ®
Figure 5 – Multiple FDI Packages referencing a common UIP . 17 ®
Figure 6 – FDI Device Package . 17 ®
Figure 7 – FDI Communication Package . 18 ®
Figure 8 – FDI UIP Package . 19 ®
Figure 9 – FDI Profile Package . 19

– 6 – IEC 62769-4:2023 © IEC 2023
Figure 10 – Device Function and Parameter sets (type and profile specific) . 20
Figure 11 – Catalog Element . 22
Figure 12 – User Interface Plug-in . 24
Figure 13 – UIP Catalog . 25 ®
Figure 14 – FDI Registration Certificate . 29
Figure 15 – Version hierarchy . 30
Figure 16 – UIP version support concept . 32 ®
Figure 17 – FDI Package signing . 33 ®
Figure B.1 – Tools used for FDI Package development . 38
Figure D.1 – Parts and relationships in a package . 43 ®
Figure D.2 – Creating an FDI Package with the content files . 46 ®
Figure D.3 – FDI Device Package example . 47
Figure D.4 – User Interface Plug-in example (fancytrend.uip) . 51
Figure I.1 – Modular device's package . 78

Table 1 – UIP Platform Capabilities . 16
Table 2 – Package Catalog part . 22
Table 3 – Package Feature Table part . 23
Table 4 – EDD part . 23
Table 5 – User Interface Plug-in part . 24
Table 6 – UIP Catalog part. 26
Table 7 – UIP Variant part . 26
Table 8 – Image part . 27
Table 9 – Documentation part . 27
Table 10 – Documentation Catalog part . 27
Table 11 – Protocol Support File part . 28 ®
Table 12 – FDI Registration Certificate part . 28
Table 13 – Versioned elements . 30 ®
Table 14 – Influence on FDI Package version. 31 ®
Table A.1 – FDI Package Naming Convention . 36 ®
Table D.1 – Examples of standard MIME media types that can be used in FDI
Packages . 45
® ®
Table D.2 – Examples of FDI -custom MIME media types that can be used in FDI

Packages . 45
Table E.1 – Enumerations of CommunicationRoleT . 56
Table E.2 – Elements of CommunicationServerT . 56
Table E.3 – Elements of DeviceTypeT . 57
Table E.4 – Elements of FDIRegistrationCertT . 58
Table E.5 – Elements of InterfaceT . 59
Table E.6 – Elements of ListOfCommunicationProfilesT . 59
Table E.7 – Elements of ListOfDeviceImagesT . 60
Table E.8 – Elements of ListOfDeviceTypesT . 60
Table E.9 – Elements of ListOfDocumentsT . 61
Table E.10 – Elements of ListOfInterfacesT . 61

IEC 62769-4:2023 © IEC 2023 – 7 –
Table E.11 – Elements of ListOfLocalizedStringsT . 61
Table E.12 – Elements of ListOfProtocolSupportFilesT . 62
Table E.13 – Elements of ListOfRegDeviceTypesT . 62
Table E.14 – Elements of ListOfRegistrationsT . 63
Table E.15 – Elements of ListOfSupportedDeviceRevisionsT . 63
Table E.16 – Elements of ListOfSupportedUipsT . 63
Table E.17 – Elements of ListOfUipVariantsT. 64
Table E.18 – Attributes of LocalizedStringT . 64
Table E.19 – Elements of PackageT . 65
Table E.20 – Enumerations of PackageTypeT . 66
Table E.21 – Enumerations of PlatformT . 66
Table E.22 – Elements of RegDeviceTypeT . 67
Table E.23 – Elements of RegistrationT . 67
Table E.24 – Elements of SupportedUipT. 68
Table E.25 – Enumerations of UipStyleT . 69
Table E.26 – Elements of UipT . 70
Table E.27 – Elements of UipVariantT . 70
Table F.1 – Communication protocol interest groups (alphabetical order) . 72
Table G.1 – Device replacement guidelines . 73
Table G.2 – Firmware enhancement guidelines . 74
Table H.1 – Health status state . 76
Table J.1 – Catalog Mapping . 81
Table J.2 – Handling of Catalog elements . 81
Table L.1 – Elements of ListOfDocumentsMetadataT . 85
Table L.2 – Enumerations of DocumentMetadataT . 86

– 8 – IEC 62769-4:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 4: FDI Packages
FOREWORD
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62769-4 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2021. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added DocumentClass to Package Schema, Description of Feature Table and
Documentation Catalog, individual schemas for Feature Table and Package Documentation
Catalog, schema for UnitConversion, interactive download to device, and Feature Unit
Conversion;
b) moved DocumentClass to Package Documentation Catalog Schema;
c) updated Description of Feature Table updated XML schema for Feature Table.

IEC 62769-4:2023 © IEC 2023 – 9 –
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/857/CDV 65E/914/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/pu
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