SIST EN IEC 61967-1:2019

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions (IEC 61967-1:2018)

This part of IEC 61967 provides general information and definitions on the measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. Test method comparison tables are included in
Annex A to assist in selecting the appropriate measurement method(s).
The object of this document is to describe general conditions in order to establish a uniform
testing environment and to obtain a quantitative measure of RF disturbances from integrated
circuits (IC). Critical parameters that are expected to influence the test results are described.
Deviations from this document are noted explicitly in the individual test report. The
measurement results can be used for comparison or other purposes.
Measurement of the voltage and current of conducted RF emissions or radiated RF
disturbances, coming from an integrated circuit under controlled conditions, yields information
about the potential for RF disturbances in an application of the integrated circuit.
The applicable frequency range is described in each part of IEC 61967.

Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 1: Allgemeine Bedingungen und Definitionen (IEC 61967-1:2018)

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 1: Conditions générales et définitions (IEC 61967-1:2018)

IEC 61967-1:2018 est disponible sous forme de IEC 61967-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L'IEC 61967-1:2018 fournit des informations générales et des définitions sur la mesure des perturbations électromagnétiques conduites et rayonnées par les circuits intégrés. Elle décrit également les conditions de mesure, l'appareillage et le montage d'essai, ainsi que les procédures d'essai et le contenu des rapports d'essai. L'Annexe A fournit des tableaux de comparaison des méthodes d'essai permettant de choisir la ou les méthodes de mesure appropriées. Le présent document a pour objet de définir des conditions générales afin d'établir un environnement d'essai uniforme et d'obtenir une mesure quantitative des perturbations RF par les circuits intégrés (CI). Il décrit les paramètres fondamentaux supposés avoir une incidence sur les résultats des essais. Tout écart par rapport au présent document est consigné de manière explicite dans les rapports d'essai. Les résultats des mesures peuvent être utilisés notamment à des fins de comparaison. La mesure de la tension et du courant des  émissions RF conduits ou des perturbations RF rayonnées provenant d'un circuit intégré dans des conditions contrôlées, fournit des informations sur les perturbations RF potentielles dans une application du circuit intégré. La gamme de fréquences applicable est décrite dans chaque partie de l'IEC 61967. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- la gamme de fréquences 150 kHz à 1 GHz a été supprimée du titre;
- un palier de fréquences au-dessus de 1 GHz a été ajouté dans le Tableau 1, le Tableau 2 et au Paragraphe 5.4;
- le Tableau A.1 a été divisé en deux tableaux et l'IEC 61967-8 a été ajoutée au Tableau A.2 de l'Annexe A;
- la description générale de la carte d'essai a été déplacée à l'Annexe D.

Integrirana vezja - Meritve elektromagnetnega sevanja - 1. del: Splošni pogoji in definicije (IEC 61967-1:2018)

Ta del standarda IEC 61967 podaja splošne informacije in definicije za meritve prevodnih ter sevanih elektromagnetnih motenj integriranih vezij. Podaja tudi opis merilnih pogojev, preskuševalne opreme in namestitve, pa tudi preskusnih postopkov ter vsebine poročil o preskusih. Primerjalne preglednice preskusnih metod so vključene v dodatku A za pomoč pri izbiri ustrezne metode meritve.
Cilj tega dokumenta je opisati splošne pogoje za zagotovitev enotnega preskusnega okolja in pridobitev rezultatov količinske meritve RF motenj iz integriranih vezij (IC). Opisani so kritični parametri, za katere se pričakuje, da bodo vplivali na rezultate preskusa.
Odkloni od tega dokumenta so izrecno navedeni v poročilu o posameznem preskusu. Rezultate meritev je mogoče uporabiti za primerjavo ali za druge namene.
Meritev napetosti in toka prevodnih RF emisij ali sevanih RF motenj, do katerih pride v integriranem vezju pod nadzorovanimi pogoji, zagotavlja informacije o potencialnih RF motnjah pri uporabi integriranega vezja.
Razpon frekvence, ki ga je treba uporabiti, je opisan v posameznih delih standarda IEC 61967.

General Information

• Status: Published
• Publication Date: 11-Mar-2019
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 21-Feb-2019
• Due Date: 28-Apr-2019
• Completion Date: 12-Mar-2019
• Ref Project: EN IEC 61967-1:2019 - Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

Relations

• Revised: SIST EN 61967-1:2005 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 1: General conditions and definitions
• Effective Date: 20-Jun-2017
• Replaces: SIST EN 61967-1:2005 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 1: General conditions and definitions
• Effective Date: 19-Feb-2019

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61967-1:2019
01-april-2019
1DGRPHãþD
SIST EN 61967-1:2005
Integrirana vezja - Meritve elektromagnetnega sevanja - 1. del: Splošni pogoji in
definicije (IEC 61967-1:2018)
Integrated circuits - Measurement of electromagnetic emissions - Part 1: General
conditions and definitions (IEC 61967-1:2018)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 1:
Allgemeine Bedingungen und Definitionen (IEC 61967-1:2018)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 1: Conditions
générales et définitions (IEC 61967-1:2018)
Ta slovenski standard je istoveten z: EN IEC 61967-1:2019
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN IEC 61967-1:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN IEC 61967-1:2019

---------------------- Page: 2 ----------------------

SIST EN IEC 61967-1:2019


EUROPEAN STANDARD EN IEC 61967-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
February 2019
ICS 31.200 Supersedes EN 61967-1:2002
English Version
Integrated circuits - Measurement of electromagnetic emissions -
Part 1: General conditions and definitions
(IEC 61967-1:2018)
Circuits intégrés - Mesure des émissions Integrierte Schaltungen - Messung von
électromagnétiques - Partie 1: Conditions générales et elektromagnetischen Aussendungen - Teil 1: Allgemeine
définitions Bedingungen und Definitionen
(IEC 61967-1:2018) (IEC 61967-1:2018)
This European Standard was approved by CENELEC on 2019-01-16. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61967-1:2019 E

---------------------- Page: 3 ----------------------

SIST EN IEC 61967-1:2019
EN IEC 61967-1:2019 (E)
European foreword
The text of document 47A/1062/FDIS, future edition 2 of IEC 61967-1, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 61967-1:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-10-16
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-01-16
document have to be withdrawn

This document supersedes EN 61967-1:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61967-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61967-2 NOTE Harmonized as EN 61967-2
IEC 61967-4 NOTE Harmonized as EN 61967-4
IEC 61967-5 NOTE Harmonized as EN 61967-5
IEC 61967-6 NOTE Harmonized as EN 61967-6
IEC 61967-8 NOTE Harmonized as EN 61967-8
IEC 62132-1 NOTE Harmonized as EN 62132-1
CISPR 25:2008 NOTE Harmonized as EN 55025:2008 (not modified)


2

---------------------- Page: 4 ----------------------

SIST EN IEC 61967-1:2019
EN IEC 61967-1:2019 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.

Publication Year Title EN/HD Year
CISPR 16-1-1 - Specification for radio disturbance and EN 55016-1-1 -
immunity measuring apparatus
and Methods - Part 1-1: Radio disturbance and
immunity measuring apparatus - Measuring
apparatus




3

---------------------- Page: 5 ----------------------

SIST EN IEC 61967-1:2019

---------------------- Page: 6 ----------------------

SIST EN IEC 61967-1:2019
IEC 61967-1
®

Edition 2.0 2018-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic emissions –
Part 1: General conditions and definitions
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 1: Conditions générales et définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6284-9
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN IEC 61967-1:2019
– 2 – IEC 61967-1:2018 © IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test conditions . 10
4.1 General . 10
4.2 Ambient conditions. 10
4.2.1 General . 10
4.2.2 Ambient temperature . 11
4.2.3 Ambient RF field strength . 11
4.2.4 Other ambient conditions . 11
4.2.5 IC stability over time . 11
5 Test equipment . 11
5.1 General . 11
5.2 Shielding . 11
5.3 RF measuring instrument . 11
5.3.1 General . 11
5.3.2 Measuring receiver . 11
5.3.3 Spectrum analyser . 12
5.3.4 Other RBW for narrowband emissions . 12
5.3.5 Emission type, detector type and sweep speed . 12
5.3.6 Video bandwidth . 12
5.3.7 Verification of calibration for the RF measuring instrument . 12
5.4 Frequency range . 13
5.5 Preamplifier or attenuator . 13
5.6 System gain . 13
5.7 Other components . 13
6 Test set-up . 13
6.1 General . 13
6.2 Test circuit board . 13
6.3 IC pin loading. 13
6.4 Power supply requirements – Test board power supply . 14
6.5 IC specific considerations . 14
6.5.1 IC supply voltage . 14
6.5.2 IC decoupling . 14
6.5.3 Activity of IC . 14
6.5.4 Guidelines regarding IC operation . 14
7 Test procedure . 15
7.1 Ambient RF noise check . 15
7.2 Operational check . 15
7.3 Specific procedures . 15
8 Test report . 15
8.1 General . 15
8.2 Ambient RF noise . 15
8.3 Description of device . 15
8.4 Description of set-up . 16

---------------------- Page: 8 ----------------------

SIST EN IEC 61967-1:2019
IEC 61967-1:2018 © IEC 2018 – 3 –
8.5 Description of software . 16
8.6 Data presentation . 16
8.6.1 General . 16
8.6.2 Graphical presentation . 16
8.6.3 Measurement data . 16
8.6.4 Data processing . 16
8.7 RF emission limits . 16
8.8 Interpretation of results . 16
8.8.1 Comparison between IC(s) using the same test method . 16
8.8.2 Comparison between different test methods . 16
8.8.3 Correlation to module test methods . 16
Annex A (informative) Test method comparison tables . 17
Annex B (informative) Flow chart of a counter test code . 19
Annex C (informative) Description of worst-case application software . 20
Annex D (informative) General test board description . 21
D.1 General . 21
D.2 Board description – Mechanical . 21
D.3 Board description – Electrical . 21
D.4 Ground planes . 21
D.5 Package pins . 22
D.5.1 General . 22
D.5.2 DIL packages . 22
D.5.3 SOP, PLCC, QFP packages . 22
D.5.4 PGA packages . 22
D.5.5 BGA packages . 22
D.6 Via diameters . 22
D.7 Via distance . 22
D.8 Additional components . 22
D.9 Supply decoupling. 22
D.9.1 General . 22
D.9.2 IC decoupling capacitors . 23
D.9.3 Power supply decoupling for the test board . 23
D.10 I/O load . 23
Bibliography . 25

Figure B.1 – Test code flow chart . 19
Figure D.1 – Example of an emission test board . 24

Table 1 – Measuring receiver bands and resolution bandwidth (RBW) default settings . 11
Table 2 – Spectrum analyser bands and RBW default settings . 12
Table 3 – IC pin loading recommendations . 14
Table A.1 – Conducted emission . 17
Table A.2 – Radiated emission . 18
Table D.1 – Position of vias over the board . 21

---------------------- Page: 9 ----------------------

SIST EN IEC 61967-1:2019
– 4 – IEC 61967-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 1: General conditions and definitions

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-1 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the frequency range of 150 kHz to 1 GHz has been deleted from the title;
b) the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
c) Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2
of Annex A;
d) the general test board description has been moved to Annex D.

---------------------- Page: 10 ----------------------

SIST EN IEC 61967-1:2019
IEC 61967-1:2018 © IEC 2018 – 5 –
The text of this International Standard is based on the following documents:
FDIS Report on voting
47A/1062/FDIS 47A/1066/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
Measurement of electromagnetic emissions, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

---------------------- Page: 11 ----------------------

SIST EN IEC 61967-1:2019
– 6 – IEC 61967-1:2018 © IEC 2018
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 1: General conditions and definitions



1 Scope
This part of IEC 61967 provides general information and definitions on the measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. Test method comparison tables are included in
Annex A to assist in selecting the appropriate measurement method(s).
The object of this document is to describe general conditions in order to establish a uniform
testing environment and to obtain a quantitative measure of RF disturbances from integrated
circuits (IC). Critical parameters that are expected to influence the test results are described.
Deviations from this document are noted explicitly in the individual test report. The
measurement results can be used for comparison or other purposes.
Measurement of the voltage and current of conducted RF emissions or radiated RF
disturbances, coming from an integrated circuit under controlled conditions, yields information
about the potential for RF disturbances in an application of the integrated circuit.
The applicable frequency range is described in each part of IEC 61967.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
CISPR 16-1-1, Specification for radio disturbance and immunity measuring apparatus and
Methods – Part 1-1: Radio disturbance and immunity measuring apparatus – Measuring
apparatus
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
artificial network
AN
network presenting a reference load impedance (simulated) to the DUT (e.g. extended power
or communication lines) across which the RF disturbance voltage is measured and which
isolates the apparatus from the power supply or loads in a given frequency range

---------------------- Page: 12 ----------------------

SIST EN IEC 61967-1:2019
IEC 61967-1:2018 © IEC 2018 – 7 –
Note 1 to entry: This note applies to the French language only.
3.2
associated equipment
transducers (e.g. probes, networks and antennae) connected to a measuring receiver or test
generator, also transducers used in the signal or disturbance transmission path between a
DUT and measuring equipment or a (test-) signal generator
3.3
broadband disturbance
broadband emission
electromagnetic disturbance which has a bandwidth greater than that of a particular
measuring apparatus, receiver or susceptible device
Note 1 to entry: For some purposes, particular spectral components of a broadband disturbance may be
considered as narrowband disturbances.
Note 2 to entry: Emission that has a bandwidth greater than that of a particular measuring apparatus or receiver.
[SOURCE: IEC 60050-161:1990, 161-06-11, modified – Note 2 to entry and the second
preferred term "broadband emission" have been added.]
3.4
common mode voltage
asymmetrical disturbance voltage
mean of the phasor voltages appearing between each conductor and a specified reference,
usually earth or frame
[SOURCE: IEC 60050-161:1990, 161-04-09, modified – The word "disturbance" has been
added to the admitted term.]
3.5
common mode current
vector sum of the currents flowing through two or more conductors at a specified cross-
section of a mathematical plane intersected by these conductors
3.6
conducted emission
transient and/or other disturbance observed on the external terminals of a device during its
normal operation
3.7
continuous disturbance
electromagnetic disturbance the effects of which on a particular device or equipment cannot
be resolved into a succession of distinct effects
Note 1 to entry: RF disturbance with a duration of more than 200 ms at the IF-output of a measuring receiver that
causes a deflection on the meter of a measuring receiver in quasi-peak detection mode that does not decrease
immediately.
[SOURCE: IEC 60050-161:1990, 161-02-11, modified – Note 1 to entry has been added.]
3.8
DUT
device under test
device, equipment or system being evaluated
Note 1 to entry: As used in this document, DUT refers to a semiconductor device being tested.
Note 2 to entry: This note applies to the French language only.

---------------------- Page: 13 ----------------------

SIST EN IEC 61967-1:2019
– 8 – IEC 61967-1:2018 © IEC 2018
3.9
die shrink
reduction of die size by using an advanced fabrication process including finer lithography
node and masks
3.10
differential mode current
in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the
magnitude of the difference of the phasors representing the currents in each conductor
[SOURCE: IEC 60050-161:1990, 161-04-38]
3.11
differential mode voltage
voltage between any two of a specified set of active conductors
[SOURCE: IEC 60050-161:1990, 161-04-08, modified – The second preferred term
"symmetrical voltage" has been removed.]
3.12
discontinuous disturbance
electromagnetic disturbance, the effects of which on a particular device or equipment can be
resolved into a succession of distinct effects
Note 1 to entry: It is recognised that this definition does not characterise the disturbance independently of the
effect that it produces. As a practical matter, any measure of a disturbance should be relatable to its effect on a
susceptible device.
Note 2 to entry: For counted clicks, disturbance with a duration of less than 200 ms at the IF-output of a
measuring receiver, which causes a transient deflection on the meter of a measuring receiver in quasi-peak
detection mode.
[SOURCE: IEC 60050-161:1990, 161-02-28, modified – Note 2 to entry has been added.]
3.13
electrically small PCB
printed circuit board with length and width shorter than λ/2, for example 100 mm to 150 mm
at 1 GHz
3.14
EMC
electromagnetic compatibility
ability of an apparatus or system to function satisfactorily in its electromagnetic environment
without introducing intolerable electromagnetic disturbances to anything in that environment
3.15
electromagnetic emission
phenomenon by which electromagnetic energy emanates from a source
3.16
electromagnetic radiation
radiated emission
1) phenomen
...