SIST EN 61189-5-503:2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF)
and specifies not only the steady-state temperature and humidity test, but also a temperaturehumidity
cyclic test and an unsaturated pressurized vapour test (HAST).

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-503: Allgemeine Prüfverfahren für Materialien und Baugruppen - Leitfähige anodische Fasern (CAF), Prüfung für Leiterplatten

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-503 : Méthodes d’essai générales pour les matériaux et les assemblages - Essais des filaments anodiques conducteurs (CAF) des cartes à circuit imprimé

L’IEC 61189-5-503:2017 spécifie le filament anodique conducteur (ci-après appelé CAF) et spécifie non seulement l’essai continu de température et d’humidité, mais aussi un essai cyclique de température-humidité et un essai de vapeur pressurisée non saturée (HAST).

Preskusne metode za električne materiale, tiskane plošče ter druge povezovalne strukture in sestave - 5-503. del: Splošne preskusne metode za materiale in sestave - Preskušanje tiskanih vezij s prevodnimi anodnimi vlakni (CAF)

Ta del standarda IEC 61189 opredeljuje prevodno anodno vlakno (v nadaljevanju CAF) ter navaja preskus s stalno temperaturo in vlago, ciklični preskus s temperaturo in vlago in preskus z nenasičeno paro pod pritiskom (HAST).

General Information

• Status: Published
• Publication Date: 30-Aug-2017
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 24-Aug-2017
• Due Date: 29-Oct-2017
• Completion Date: 31-Aug-2017
• Ref Project: EN 61189-5-503:2017 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-5-503:2017
01-oktober-2017
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQHSORãþHWHUGUXJHSRYH]RYDOQH
VWUXNWXUHLQVHVWDYHGHO6SORãQHSUHVNXVQHPHWRGH]DPDWHULDOHLQ
VHVWDYH3UHVNXãDQMHWLVNDQLKYH]LMVSUHYRGQLPLDQRGQLPLYODNQL&$)
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-503: General test methods for materials and assemblies -
Conductive Anodic Filaments (CAF) testing of circuit boards
Ta slovenski standard je istoveten z: EN 61189-5-503:2017
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61189-5-503:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-5-503:2017

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SIST EN 61189-5-503:2017


EUROPEAN STANDARD EN 61189-5-503

NORME EUROPÉENNE

EUROPÄISCHE NORM
August 2017
ICS 31.180

English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 5-503: General
test method for materials and assemblies - Conductive anodic
filaments (CAF) testing of circuit boards
(IEC 61189-5-503:2017)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 5-
ensembles - Partie 5-503 : Méthodes d'essai générales 503: Allgemeine Prüfverfahren für Materialien und
pour les matériaux et les assemblages - Essais des Baugruppen - Leitfähige anodische Fasern (CAF), Prüfung
filaments anodiques conducteurs (CAF) des cartes à circuit für Leiterplatten
imprimé (IEC 61189-5-503:2017)
(IEC 61189-5-503:2017)
This European Standard was approved by CENELEC on 2017-06-26. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61189-5-503:2017 E

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SIST EN 61189-5-503:2017
EN 61189-5-503:2017
European foreword
The text of document 91/1433/FDIS, future edition 1 of IEC 61189-5-503, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-5-503:2017.

The following dates are fixed:
(dop) 2018-03-26
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-06-26
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61189-5-503:2017 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-3-4 NOTE Harmonized as EN 60068-3-4.
IEC 60068-3-5 NOTE Harmonized as EN 60068-3-5.
IEC 60721-1 NOTE Harmonized as EN 60721-1.
IEC 60721-2-1 NOTE Harmonized as EN 60721-2-1.
IEC 60721-3-0 NOTE Harmonized as EN 60721-3-0.

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SIST EN 61189-5-503:2017
 EN 61189-5-503:2017

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 2013 Environmental testing -- Part 1: General EN 60068-1 2014
and guidance
IEC 60068-2-30 -  Environmental testing -- Part 2-30: Tests - EN 60068-2-30 -
Test Db: Damp heat, cyclic (12 h + 12 h
cycle)
IEC 60068-2-38 -  Environmental testing -- Part 2-38: Tests - EN 60068-2-38 -
Test Z/AD: Composite
temperature/humidity cyclic test
IEC 60068-2-66 -  Environmental testing -- Part 2-66: Test EN 60068-2-66 -
methods - Test Cx: Damp heat, steady
state (unsaturated pressurized vapour)
IEC 60068-2-67 -  Environmental testing -- Part 2: Tests - EN 60068-2-67 -
Test Cy: Damp heat, steady state,
accelerated test primarily intended for
components
IEC 60068-2-78 -  Environmental testing -- Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions
IPC-TM-650 No -  Electrochemical Migration Resistance Test - -
2.6.14.1
IPC-TM-650 No -  Conductive Anodic Filament (CAF) - -
2.6.25 Resistance Test: X-Y Axis

3

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SIST EN 61189-5-503:2017

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SIST EN 61189-5-503:2017




IEC 61189-5-503

®


Edition 1.0 2017-05




INTERNATIONAL



STANDARD








colour

inside










Test methods for electrical materials, printed board and other interconnection

structures and assemblies –

Part 5-503: General test method for materials and assemblies – Conductive


anodic filaments (CAF) testing of circuit boards
























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.180 ISBN 978-2-8322-4320-6



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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SIST EN 61189-5-503:2017
– 2 – IEC 61189-5-503:2017  IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Testing condition . 7
4.1 Standard condition . 7
4.2 Judgment state . 8
5 Specimen . 8
5.1 Outline of CAF test vehicle design . 8
5.1.1 Evaluation design for the glass cloth direction . 8
5.1.2 Design between plated through hole (PTH) . 9
5.2 CAF test board . 10
5.2.1 Example A . 10
5.2.2 Example B . 11
5.3 Number of specimens . 13
6 Equipment/Apparatus or material . 13
6.1 Environmental test chamber . 13
6.2 Measuring equipment . 13
6.3 Power supply . 13
6.4 Current limiting resistors . 14
6.5 Connecting wire . 14
6.6 Other dedicated fixtures . 14
7 Resistance measurement method . 14
7.1 Manual insulation resistance measurement method . 14
7.2 Automatic insulation resistance measurement method . 15
8 Test method . 16
8.1 Test method selection . 16
8.2 Steady-state temperature and humidity test . 16
8.2.1 Object . 16
8.2.2 Test condition . 16
8.3 Temperature and humidity (12 h + 12 h) cycle test . 16
8.3.1 Object . 16
8.3.2 Test condition . 17
8.3.3 Number of cycles of the test . 17
8.4 Temperature and humidity cyclic test with and without low temperature
exposure . 17
8.4.1 Object . 17
8.4.2 Test condition . 17
8.5 Steady-state high temperature and high humidity (unsaturated pressurized
vapour) test . 17
8.5.1 Object . 17
8.5.2 Test condition . 18
9 Procedure . 18
9.1 Test specimen preparation . 18
9.1.1 General . 18
9.1.2 Sample identification . 18

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SIST EN 61189-5-503:2017
IEC 61189-5-503:2017  IEC 2017 – 3 –
9.1.3 Prescreen for opens and shorts . 18
9.1.4 Cleaning . 19
9.1.5 Connecting wire . 19
9.1.6 Cleaning after attachment . 19
9.1.7 Dry . 19
9.2 Precondition . 19
9.3 Test procedure . 19
9.3.1 Setting of the specimen . 19
9.3.2 Test voltage and measuring voltage . 19
9.3.3 Temperature and humidity condition at the start time of the test . 20
9.3.4 Measurement . 20
9.3.5 Procedure in test interruption . 21
9.3.6 End of test . 21
9.4 Visual inspection . 21
9.4.1 General . 21
9.4.2 Shape of electrochemical migration . 21
Annex A (informative) Forms of electrochemical migration . 22
A.1 Example of dendrite-shaped migration . 22
A.2 CAF (Example of migration along the glass fibre) . 22
Bibliography . 23

Figure 1 – Schematic of in-line test comb, with possible failure site . 8
Figure 2 – Schematic of staggered test comb, with possible failure site . 9
Figure 3 – Manhattan distance . 9
Figure 4 – Schematic section of via pair with bias . 10
Figure 5 – Example of inner layer via pads and layer patterns . 10
Figure 6 – Example of no inner layer via pads and layer patterns . 10
Figure 7 – Insulation evaluation pattern for through-holes and via holes . 11
Figure 8 – Layouts of the two versions of the CAF test boards . 12
Figure 9 – Measurement with insulation resistance meter . 15
Figure 10 – Temperature and humidity in a test . 20
Figure A.1 – Example which is generated on the board surface . 22
Figure A.2 – Example of CAF . 22

Table 1 – Dimension of insulation evaluation pattern for through-holes . 11
Table 2 – Test structures A1 through A4 design rules . 12
Table 3 – Test structures B1 through B4 design rules . 13
Table 4 – Test condition . 16
Table 5 – Number of cycles of the test . 17
Table 6 – Test condition . 17
Table 7 – Test condition (IEC 60068-2-66) . 18

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SIST EN 61189-5-503:2017
– 4 – IEC 61189-5-503:2017  IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-503: General test method for materials and assemblies –
Conductive anodic filaments (CAF) testing of circuit boards

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-5-503 been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1433/FDIS 91/1443/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 61189-5-503:2017
IEC 61189-5-503:2017  IEC 2017 – 5 –
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 61189-5-503:2017
– 6 – IEC 61189-5-503:2017  IEC 2017
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-503: General test method for materials and assemblies –
Conductive anodic filaments (CAF) testing of circuit boards



1 Scope
This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF)
and specifies not only the steady-state temperature and humidity test, but also a temperature-
humidity cyclic test and an unsaturated pressurized vapour test (HAST).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-38, Environmental testing – Part 2-38: Tests – Test Z/AD: Composite
temperature/humidity cyclic test
IEC 60068-2-66, Environmental testing – Part 2: Test methods – Test Cx: Damp heat, steady
state (unsaturated pressurized vapour)
IEC 60068-2-67, Environmental testing – Part 2: Tests – Test Cy: Damp heat, steady state,
accelerated test primarily intended for components
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IPC-TM-650 No.2.6.14.1, Electrochemical Migration Resistance Test [viewed 2017-01-31].
Available at: https://www.ipc.org/TM/2-6_2-6-14-1.pdf
IPC-TM-650 No.2.6.25, Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis [viewed
2017-01-31]. Available at: https://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2-6-25.pdf
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 and
IEC 60068-1 as well as the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:

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SIST EN 61189-5-503:2017
IEC 61189-5-503:2017  IEC 2017 – 7 –
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
electrochemical migration
degradation of insulation characteristics between conductors due to eletrochemical elution of
ions in a humid environment when voltage is applied to conductors of a printed wiring board
Note 1 to entry: In addition, ionic impurities present in the insulations contribute to their degradation.
Note 2 to entry: Electrochemical migration may take the forms of dendrite (3.2) and CAF(3.3).
3.2
dendrite
metal migration
Note 1 to entry: Dendrite is visible in that it creates a branching and tree like structure on the surface, on the
interface between layers, etc. of a printed wiring board.
3.3
CAF
conductive anodic filament
migration which occurs along the monofilament of reinforcing material such as glass cloth in
an inner layer part of a printed wiring board
3.4
HAST
highly accelerated temperature and humidity stress test
stress test under unsaturated pressurized vapour test
Note 1 to entry: See IEC 60068-2-66.
3.5
automatic insulation resistance measurement
measurement to take continuous or predetermined periodic test data using an automatic
measurement system without an operator
3.6
manual insulation resistance measurement
measurement to take predetermined periodic test data using measurement equipment by an
operator
Note 1 to entry: Measurement can be done with or without taking out a specimen from the test chamber.
3.7
test voltage
voltage to apply on the specimen as a stress in the testing environment
3.8
measuring voltage
voltage to apply on the specimen in order to measure the insulation resistance
4 Testing condition
4.1 Standard condition
Measurement is performed under the standard atmospheric condition which is specified in
Clause 4 of IEC 60068-1:2013.

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SIST EN 61189-5-503:2017
– 8 – IEC 61189-5-503:2017  IEC 2017
It depends on a reference condition stated in 4.2 when an ambiguity is found for the judgment
in the standard atmospheric condition or when it is required in particular.
It may be performed under other conditions than the standard atmospheric condition, when no
doubt about the judgment subsits and when measuring in standard condition proves difficult,
or when specified in particular specifications.
4.2 Judgment state
Reference condition is the standard atmospheric condition for measurement as stated in 4.2
of IEC 60068-1:2013.
5 Specimen
5.1 Outline of CAF test vehicle design
5.1.1 Evaluation design for the glass cloth direction
The in-line test combs are comprised of a series of alternate rows of via holes with a voltage
applied across the comb. They represent the most common failure sites where CAF can occur:
between via hole walls. The via holes are in line with one another and in alignment with the
woven glass fibre reinforcement. The closest point between each via pair is the most likely
point for CAF growth (example highlighted in Figure 1). The black spots represent the drilled
hole, and the copper pads associated with the via holes are in orange.
The construction of staggered combs is similar to that of the in-line combs, however, the via
pairs are arranged at 45°. This means that the most likely route for potential CAF growth is
longer since the orientation of the glass fibres may only permit growth in the horizontal and
vertical directions (as represented by the white ellipses in Figure 2).
Fibre weave
IEC

Figure 1 – Schematic of in-line test comb, with possible failure site

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SIST EN 61189-5-503:2017
IEC 61189-5-503:2017  IEC 2017 – 9 –
Fibre weave

IEC
Figure 2 – Schematic of staggered test comb, with possible failure site
"Manhattan distance" is the shortest orthogonal distance along the X- and/or Y- axes lines
between adjacent drilled hole features (corresponds to the orthogonal nature of the laminate
material’s woven glass fibre reinforcement (Figure 3).
y
x
b
a
''Manhattan distance" = a + b
IEC

Figure 3 – Manhattan distance
5.1.2 Design between plated through hole (PTH)
a) Without inner layer pattern
Example design between PTH without inner layer pattern is shown in Figure 4, which is a
schematic cross-section of a via
...