SIST EN 60747-16-3:2004

Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
converters.

Halbleiterbauelemente -- Teil 16-3: Integrierte Schaltungen zur Frequenzumsetzung von Mikrowellen

Dispositifs à semiconducteurs -- Parie 16-3: Circuits intégrés hyperfréquences - Convertisseurs de fréquence

La CEI 60747-16-3:2002 spécifie de nouvelles méthodes de mesure, la terminologie et des symboles littéraux, ainsi que des valeurs limites et des caractéristiques essentielles pour les convertisseurs d'hyperfréquences à circuit intégré.

Polprevodniške naprave - 16-3. del: Mikrovalovna integrirana vezja - Frekvenčni pretvorniki (IEC 60747-16-3:2002)

General Information

• Status: Published
• Publication Date: 31-Oct-2004
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Nov-2004
• Due Date: 01-Nov-2004
• Completion Date: 01-Nov-2004
• Ref Project: EN 60747-16-3:2002 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

Relations

• Amended By: SIST EN 60747-16-3:2004/A1:2009 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002/A1:2009)
• Effective Date: 29-Jan-2023
• Amended By: SIST EN 60747-16-3:2004/A1:2009 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002/A1:2009)
• Effective Date: 01-Jun-2009
• Amended By: SIST EN 60747-16-3:2004/A2:2018 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002/A2:2017)
• Effective Date: 07-Jun-2016

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60747-16-3:2004
01-november-2004
3ROSUHYRGQLãNHQDSUDYHGHO0LNURYDORYQDLQWHJULUDQDYH]MD)UHNYHQþQL
SUHWYRUQLNL,(&
Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency
converters
Halbleiterbauelemente -- Teil 16-3: Integrierte Schaltungen zur Frequenzumsetzung von
Mikrowellen
Dispositifs à semiconducteurs -- Parie 16-3: Circuits intégrés hyperfréquences -
Convertisseurs de fréquence
Ta slovenski standard je istoveten z: EN 60747-16-3:2002
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 60747-16-3:2004 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

EUROPEAN STANDARD EN 60747-16-3
NORME EUROPÉENNE
EUROPÄISCHE NORM July 2002
ICS 31.080.99
English version
Semiconductor devices
Part 16-3: Microwave integrated circuits -
Frequency converters
(IEC 60747-16-3:2002)
Dispositifs à semiconducteurs Halbleiterbauelemente
Parie 16-3: Circuits intégrés Teil 16-3: Integrierte Schaltungen zur
hyperfréquences - Frequenzumsetzung von Mikrowellen
Convertisseurs de fréquence (IEC 60747-16-3:2002)
(CEI 60747-16-3:2002)
This European Standard was approved by CENELEC on 2002-07-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60747-16-3:2002 E

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EN 60747-16-3:2002 - 2 -
Foreword
The text of document 47E/212/FDIS, future edition 1 of IEC 60747-16-3, prepared by SC 47E, Discrete
semiconductor devices, of IEC TC 47, Semiconductor device, was submitted to the IEC-CENELEC
parallel vote and was approved by CENELEC as EN 60747-16-3 on 2002-07-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-04-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-07-01
Les annexes appelées "normatives" font partie du corps de la norme.
Dans la présente norme, l'annexe ZA est normative.
L'annexe ZA a été ajoutée par le CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60747-16-3:2002 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60747-16-3:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60617-12 - Graphical symbols for diagrams EN 60617-12 1998
Part 12: Binary logic elements
1) 2)
IEC 60617-13 - Part 13: Analogue elements EN 60617-13 1993
IEC 60747-1 1983 Semiconductor devices - Discrete--
devices and integrated circuits
Part 1: General
IEC 60748-2 1997 Semiconductor devices - Integrated--
circuits
Part 2: Digital integrated circuits
1)
IEC 60748-3 - Part 3: Analogue integrated circuits - -
1)
IEC 60748-4 - Part 4: Interface integrated circuits - -

1)
Undated reference.
2)
Valid edition at date of issue.

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INTERNATIONAL IEC
STANDARD
60747-16-3
First edition
2002-05
Semiconductor devices –
Part 16-3:
Microwave integrated circuits –
Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3:
Circuits intégrés hyperfréquences –
Convertisseurs de fréquence
 IEC 2002  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
W
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

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– 2 – 60747-16-3  IEC:2002(E)
CONTENTS
FOREWORD.3
1 Scope.4
2 Normative references .4
3 Terms and definitions .4
4 Abbreviated terms .6
5 Essential ratings and characteristics.6
5.1 General .6
5.2 Application description .7
5.3 Specification of the function .8
5.4 Limiting values (absolute maximum rating system) .9
5.5 Operating conditions (within the specified operating temperature range) .11
5.6 Electrical characteristics.11
5.7 Mechanical and environmental ratings, characteristics and data.12
5.8 Additional information.12
6 Measuring methods .13
6.1 General .13
6.2 Conversion gain (G ) .14
c
6.3 Conversion gain flatness (ΔG ).16
c
6.4 LO/IF isolation (P /P ) .18
LO LO(IF)
6.5 LO/RF isolation (P /P ) .19
LO LO(RF)
6.6 RF/IF isolation.20
6.7 Image rejection (P /P ) .24
o o(im)
6.8 Sideband suppression (P /P ).26
o o(U)
6.9 Output power (P ).28
o
6.10 Output power at 1-dB conversion compression (P ) .29
o(1dB)
6.11 Noise figure (F) .30
6.12 Intermodulation distortion (P /P ).32
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) .35
n(IP)
6.14 LO port return loss (L ) .36
ret(LO)
6.15 RF port return loss (L ) .37
ret(RF)
6.16 IF port return loss (L ).39
ret(IF)
Figure 1 – Electrical terminal symbols.9
Figure 2 – Circuit diagram for the measurement of conversion gain .14
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation .18
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation.19
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A .21
Figure 6 – Circuit diagram for the measurement of the RF/IF isolation for type B .23
Figure 7 – Circuit diagram for measurement of noise figure .30
Figure 8 – Circuit for the measurement of intermodulation distortion .33
Figure 9 – Circuit for the measurement of the LO port return loss .36
Figure 10 – Circuit for the measurement of the RF/IF port return loss .38
Table 1 – Function of terminal.8
Table 2 – Electrical limiting values .10
Table 3 – Electrical characteristics.12

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60747-16-3  IEC:2002(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-3 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/212/FDIS 47E/219/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged until
2008. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

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– 4 – 60747-16-3  IEC:2002(E)
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
converters.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1:1983, Semiconductor devices – Discrete devices and integrated circuits – Part 1:
General
IEC 60748-2:1997, Semiconductor devices – Integrated circuits – Part 2: Digital integrated
circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated circuits
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
3.1
conversion gain, G
c
ratio of the desired converted output power to the input power
NOTE Usually, the conversion gain is expressed in decibels.
3.2
conversion gain flatness, ΔΔΔΔG
c
difference between the maximum and the minimum conversion gain for a specified input
power in a specified frequency range
3.3
LO/RF isolation, P /P
LO LO(RF)
ratio of the incident local power to the local leakage power at the RF port with the IF port
terminated in a specified impedance

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60747-16-3  IEC:2002(E) – 5 –
3.4
LO/IF isolation, P /P
LO LO(IF)
ratio of the incident local power to the local leakage power at the IF port with the RF port
terminated in a specified impedance
3.5
RF/IF isolation, P /P
RF RF(IF)
ratio of the incident RF power to the RF feedthrough power at the IF port for a specified
local power
NOTE Usually, the RF/IF isolation is applied to the down-converter.
3.6
IF/RF isolation, P /P
IF IF(RF)
ratio of the incident IF power to the IF feedthrough power at the RF port for a specified
local power
NOTE Usually, the IF/RF isolation is applied to the up-converter.
3.7
image rejection, P /P
o o(im)
ratio of the output power when the RF signal is applied, to the output power when the image
signal is applied
NOTE Usually, the image rejection is applied to the down-converter.
3.8
sideband suppression, P /P
o o(U)
ratio of the output power of the desired sideband to the output power of the undesired
sideband
NOTE Usually, the sideband suppression is applied to the up-converter.
3.9
LO port return loss, L
ret(LO)
ratio of the specified incident power at the LO port to the reflected power at the LO port, with
the RF port and the IF port terminated in each specified impedance
3.10
RF port return loss, L
ret(RF)
ratio of the incident power at the RF port to the reflected power at the RF port for a specified
local power, with the IF port terminated in a specified impedance
3.11
IF port return loss, L
ret(IF)
ratio of the incident power at the IF port to the reflected power at the IF port for a specified
local power, with the RF port terminated in a specified impedance
3.12
output power, P
o
1
see IEC 60747-16-2, 3.3
3.13
output power at 1-dB conversion compression, P
o(1dB)
output power where the conversion gain decreases by 1 dB compared with the linear
conversion gain
———————
1
 IEC 60747-16-2:2001, Semiconductor devices – Part 16-2: Microwave integrated circuits – Frequency prescalers

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– 6 – 60747-16-3  IEC:2002(E)
3.14
noise figure, F
see IEC 60747-1 Chapter IV, 5.4.4
3.15
intermodulation distortion, P /P
n 1
ratio of the output power of the nth order component to the output power of the fundamental
component, at a specified input power
3.16
output power at the intercept point (for intermodulation products), P
n(IP)
output power at the intersection between the extrapolated output powers of the fundamental
component and the nth order intermodulation components, when the extrapolation is carried
out in a diagram showing the output power of the components (in decibels) as a function of
the input power (in decibels)
4 Abbreviated terms
The abbreviations used in this part of IEC 60747 are as follows:
RF Radio Frequency;
IF Intermediate Frequency;
LO Local Oscillator.
5 Essential ratings and characteristics
5.1 General
This clause gives ratings and characteristics required for specifying integrated circuit
microwave frequency converters.
5.1.1 Circuit identification and types
5.1.1.1 Designation and types
The identification of type (device name), the category of circuit and technology applied shall
be given.
Microwave frequency converters are divided into two categories:
– type A: down-converter;
– type B: up-converter.
5.1.1.2 General function description
A general description shall be made of the function performed by the integrated circuit
microwave frequency converters and the features for the application.
5.1.1.3 Manufacturing technology
The manufacturing technology, for example, semiconductor monolithic integrated circuit, thin
film integrated circuit, micro-assembly, shall be stated. This statement shall include details
of the semiconductor technologies such as Schottoky-barrier diode, MESFET, Si bipolar
transistor, HBT.

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60747-16-3  IEC:2002(E) – 7 –
5.1.1.4 Package identification
The following shall be stated:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, or of drawing of non-standard
package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic;
d) for chip form: outlines, dimensions, pad sizes, contact material, and recommended contact
technologies.
5.1.1.5 Main application
The main application shall be stated if necessary. If the device has restrictive applications,
these too shall be stated here.
5.2 Application description
Information on the application of the integrated circuit and its relation to the associated
devices shall be given.
5.2.1 Conformance to system and/or interface information
It shall be stated whether the integrated circuit conforms to an application system and/or an
interface standard or recommendation.
Detailed information about application systems, equipment and circuits such as VSAT
systems, DBS receivers, microwave landing systems shall also be given.
5.2.2 Overall block diagram
A block diagram of the applied systems shall be given if necessary.
5.2.3 Reference data
The most important properties required to permit comparison between derivative types shall
be given.
5.2.4 Electrical compatibility
It shall be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits or families of integrated circuits, or whether special interfaces are required.
Details shall be given concerning the type of the input and output circuits, for example,
input/output impedances, d.c. block, open-drain.
Interchangeability with other devices, if any, shall be given.
5.2.5 Associated devices
If applicable, mention shall be made here of
– devices necessary for correct operation (list with type number, name, and function);
– peripheral devices with direct interfacing (list with type number, name, and function).

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– 8 – 60747-16-3  IEC:2002(E)
5.3 Specification of the function
5.3.1 Detailed block diagram −−−− functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
frequency converters shall be given. The block diagram shall be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) interdependence between the separate functional blocks.
The block diagram shall identify the function of each external connection, and, where no
ambiguity can arise, it can also show the terminal symbols and/or numbers. If the
encapsulation has metallic parts, any connection to them from external terminals shall be
indicated. The connections with any associated external electrical elements shall be stated,
where necessary.
For the purpose of providing additional information, the complete electrical circuit diagram can
be reproduced, though this will not necessarily involve giving indications of the function. Rules
governing such diagrams may be obtained from IEC 60617-12 or IEC 60617-13.
5.3.2 Identification and function of terminals
All terminals shall be identified on the block diagram (supply terminals, input or output
terminals, input/output terminals).
The terminal functions 1) to 4) shall be indicated, as shown in table 1 below.
Table 1 – Function of terminals
1 2 3 4
Terminal Terminal
Terminal Function Input/output Type of input/
number symbol
designation identification output circuits
5.3.2.1 Function 1: Terminal designation
The terminal designation to indicate the terminal function shall be given. Supply terminals,
ground terminals, blank terminals (with abbreviation NC) and non-usable terminals (with
abbreviation NU) shall be distinguished.
5.3.2.2 Function 2: Function
A brief indication of the terminal function shall be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;
– each function of the integrated circuit selected by mutual pin connections, or
programming and/or application of function selection data to the function selection pin
such as mode selection pin.

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60747-16-3  IEC:2002(E) – 9 –
5.3.2.3 Function 3: Input/output identification
Input, output, input/output, and multiples of the input/output terminal shall be distinguished.
5.3.2.4 Function 4: Type of input/output circuits
The type of input and output circuits, for example, input/output impedances, with or without
d.c. block, etc., shall be distinguished.
5.3.2.5 Function 5: Type of ground
If the baseplate of the package is used as ground, this shall be stated.
EXAMPLE:
Supply voltage(s)
Integrated
Input(s) NC
circuit
microwave
frequency
NU Output(s)
converter
Ground
IEC  1072/02
Figure 1 – Electrical terminal symbols
5.3.3 Function description
The function performed by the circuit shall be specified, including the following information:
− basic function;
− relation to external terminals;
− operation mode (e.g., set-up method, preference, etc.);
− interruption handling.
5.3.4 Family related characteristics
All family-specific functional descriptions shall be stated (with reference to IEC 60748-2,
IEC 60748-3 and IEC 60748-4).
If ratings, characteristics and function characteristics exist for the family, the relevant part of
IEC 60748 shall be used (for example, for microprocessors, see IEC 60748-2, chapter III,
section 3).
NOTE For each new device family, specific items shall be added to the relevant part of IEC 60748.
5.4 Limiting values (absolute maximum rating system)
The table giving these values shall specify the following:
− any interdependence of limiting conditions;
− if externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached;

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– 10 – 60747-16-3  IEC:2002(E)
− if limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified;
− where minimum and maximum values differ during programming of the device, this shall
be stated;
− all voltages referenced to a specified reference terminal (V , GND, etc.);
ss
− in satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer shall indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity;
− the ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-
dependent, such dependence shall be indicated.
5.4.1 Electrical limiting values
Limiting values shall be specified as follows:
Table 2 – Electrical limiting values
Subclause Parameters Min. Max.
5.4.1.1 Ambient or case temperature + +
5.4.1.2 Storage temperature + +
5.4.1.3 Power supply voltage(s) +
5.4.1.4 Power supply current(s) (where appropriate) +
5.4.1.5 Terminal voltage(s) (where appropriate) + +
5.4.1.6 Terminal current(s) (where appropriate) +
5.4.1.7 Input power +
5.4.1.8 LO input power +
5.4.1.9 Power dissipation +
The detail specification may indicate those values within table 2, including note 1 and note 2.
Parameters (see notes 1 and 2) Symbols Min. Max. Unit
NOTE 1 Where appropriate, in accordance with the type of considered circuit.
NOTE 2 For power supply voltage range:
limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a special
electrical reference point;
where appropriate, limiting value between specified supply terminals;
when more than one voltage supply is required, a statement should be made as to whether the
sequence in which these supplies are applied is significant: if so, the sequence should be stated;
when more than one supply is needed, it may be necessary to state the combinations of ratings for
these supply voltages and currents.

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60747-16-3  IEC:2002(E) – 11 –
5.4.2 Temperatures
a) Operating temperature
b) Storage temperature
c) Channel temperature
d) Lead temperature (for soldering)
The detail specification may indicate those values within the table including the note.
Parameters (see note) Symbols Min. Max. Unit
NOTE Where appropriate, in accordance with the type of considered circuit.
5.5 Operating conditions (within the specified operating temperature range)
These are not to be inspected, but may be used for quality assessment purposes.
5.5.1 Power supplies – Positive and/or negative values
5.5.2 Initialization sequences (where appropriate)
If special initialization sequences are necessary, the power supply sequencing and
initialization procedure shall be specified.
5.5.3 Input voltage(s) or input signal (where appropriate)
5.5.4 Output current(s) (where appropriate)
5.5.5 Voltage and/or current of other terminal(s)
5.5.6 External elements (where appropriate)
5.5.7 Operating temperature range
5.6 Electrical characteristics
The characteristics shall apply over the full operating temperature range, unless otherwise
specified.
Each characteristic of 5.6 shall be stated: either
a) over the specified range of operating temperatures, or
b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.
The parameters shall be specified corresponding to the type as shown in table 3 below:

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– 12 – 60747-16-3  IEC:2002(E)
Table 3 – Electrical characteristics
Types
Sub-
Parameters Min. T
...