SIST EN 61188-7:2017
(Main)Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
This part of IEC 61188 establishes a consistent technique for the description of electronic
component orientation, and their land pattern geometries. This facilitates and encourages a
common data capture and transfer methodology amongst and between global trading partners.
Leiterplatten und Flachbaugruppen – Konstruktion und Anwendung – Teil 7: Nullorientierung elektronischer Bauelemente für CAD-Bibliotheksaufbau
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 7: Orientation nulle des composants électroniques pour l'élaboration de la bibliothèque CAO
L’IEC 61188-7:2017 établit une technique cohérente pour décrire l’orientation des composants électroniques, ainsi que les géométries de leurs zones de report. Cela facilite et encourage une méthodologie commune de saisie et de transfert des données parmi et entre les partenaires commerciaux mondiaux.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) la Figure 1 a été corrigée;
b) le terme “ rectangle “ a été généralement remplacé par “ polygone “;
c) le niveau B a été indiqué comme niveau à privilégier pour les nouvelles bibliothèques.
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Oblika in uporaba - 7. del: Ničelna orientacija elektronske komponente za izdelavo knjižnice CAD
Ta del standarda IEC 61188 določa dosledno tehniko za opis orientacije elektronske komponente in njenih oblik vzorcev za postavitev elementov. To olajšuje in spodbuja skupno metodologijo za zajemanje in prenos podatkov med globalnimi poslovnimi partnerji.
General Information
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Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.&$'Leiterplatten und Flachbaugruppen – Konstruktion und Anwendung – Teil 7: Nullorientierung elektronischer Bauelemente für CAD-BibliotheksaufbauCartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 7: Orientation nulle des composants électroniques
pour l'élaboration de la bibliothèque CAOPrinted boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 61188-7:2017SIST EN 61188-7:2017en01-oktober-2017SIST EN 61188-7:2017SLOVENSKI
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SIST EN 61188-7:2017
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 61188-7
June 2017 ICS 31.180
Supersedes
EN 61188-7:2009
English Version
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 7: Orientation nulle des composants électroniques
pour l'élaboration de la bibliothèque CAO (IEC 61188-7:2017)
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 7: Nullorientierung elektronischer Bauelemente für CAD-Bibliotheksaufbau (IEC 61188-7:2017) This European Standard was approved by CENELEC on 2017-05-15. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,
B-1000 Brussels © 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61188-7:2017 E SIST EN 61188-7:2017
EN 61188-7:2017 2 European foreword The text of document 91/1382/CDV, future edition 2 of IEC 61188-7, prepared by IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61188-7:2017.
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-02-15 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-05-15
This document supersedes EN 61188-7:2009.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61188-7:2017 was approved by CENELEC as a European Standard without any modification. SIST EN 61188-7:2017
EN 61188-7:2017 3
Annex ZA (normative)
Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year IEC 61188-5 series
Printed boards and printed board assemblies - Design and use EN 61188-5 series
SIST EN 61188-7:2017
SIST EN 61188-7:2017
IEC 61188-7 Edition 2.0 2017-04 INTERNATIONAL STANDARD
Printed boards and printed board assemblies – Design and use –
Part 7: Electronic component zero orientation for CAD library construction
INTERNATIONAL ELECTROTECHNICAL COMMISSION
ICS 31.180
ISBN 978-2-8322-4165-3
® Registered trademark of the International Electrotechnical Commission ®
Warning! Make sure that you obtained this publication from an authorized distributor. SIST EN 61188-7:2017 colourinside
– 2 – IEC 61188-7:2017 IEC 2017 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 Basic rules . 6 4.1 Common rules. 6 4.2 General basic rules . 6 4.3 Level A basic rule . 7 4.4 Level B basic rule . 7 4.5 File description definition . 7 4.6 Component orientations . 8 5 Origin point of land pattern . 18 5.1 General . 18 5.2 Surface mount components . 18 5.3 Through-hole leaded components . 19 6 Land pattern to footprint comparison . 19 7 Components with one terminal . 20 7.1 Surface mount components . 20 7.2 Through-hole leaded components . 20
Figure 1 – Example of level A orientation concepts . 8 Figure 2 – Connector and switch library symbol examples . 19 Figure 3 – Through-hole components with terminal point of origin orientation . 19 Figure 4 – Circular or square one-terminal component . 20 Figure 5 – Rectangular or oval one-terminal component . 20 Figure 6 – Surface mount components with one lead offset . 20
Table 1 – Discrete component land pattern conventions . 9 Table 2 – Diode and transistor land pattern conventions . 10 Table 3 – Transistor and IC land pattern conventions . 11 Table 4 – Integrated circuit packages land pattern conventions . 12 Table 5 – Integrated circuit packages land pattern conventions . 14 Table 6 – BGA land pattern conventions . 15 Table 7 – Resistor array and connector land pattern conventions. 16 Table 8 – Level A land pattern convention summary . 17 Table 9 – Level B land pattern convention summary . 18
SIST EN 61188-7:2017
IEC 61188-7:2017 IEC 2017 – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 7: Electronic component zero orientation
for CAD library construction
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-7 has been prepared by IEC technical committee 91: Electronics assembly technology. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition: a) Figure 1 has been corrected; b) the term “rectangle” has generally been replaced by “polygon”; c) level B has been indicated as preferred level for new libraries. SIST EN 61188-7:2017
– 4 – IEC 61188-7:2017 IEC 2017 The text of this International Standard is based on the following documents: CDV Report on voting 91/1382/CDV 91/1428/RVC
Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies – Design and use, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific document. At this date, the document will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended. A bilingual version of this publication may be issued at a later date.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer.
SIST EN 61188-7:2017
IEC 61188-7:2017 IEC 2017 – 5 – INTRODUCTION One of the factors of establishing a CAD library component description and land pattern standard is to adopt a fixed zero component orientation so that all CAD images are built with the same rotation for the purpose of assembly machine automation. The land pattern standards clearly define all the properties necessary for standardization and acceptability of a one world CAD library. The main objective in defining a one world CAD library is to achieve the highest level of electronic product development automation. This encompasses all the processes involved from engineering to PCB layout to fabrication, assembly and test. The data format standards need this type of consistency in order to meet the efficiency that electronic data transfer can bring to the industry. Many large firms have spent millions of dollars creating and implementing their own unique standards for their own electronic product development automation. These standards are proprietary to each firm and are not openly shared with the rest of the industry. This has resulted in massive duplication of effort, costing the industry millions of man hours in waste and creating industry chaos and global non-standardization. The main purpose of creating the land pattern standards is to achieve reliable solder joint formation platforms; the reason for developing the data transfer structure is to improve the efficiency with which engineering intelligence is converted into manufacturing reality. Even if the neutral CAD format can drive all the manufacturing machines, it would be meaningless unless the component description standard for CAD land patterns were implemented with some consistency. Zero component orientation has a key role in machine automation. The obvious choice for global standardization for EE hardware engineering, PCB design layout, manufacturing, assembly and testing processes is to incorporate the standard land pattern conventions. Any other option continues the confusion and additional manual hours of intervention in order to achieve the goals of automation. In addition, the ease of having one system export a file so that another system can accomplish the work can require unnecessary manipulation of the neutral format in order to meet the object of clear, unambiguous software code. The design of any assembly will continue to permit arrangement and orientation of components at any orientation consistent with design standards. Starting from a commonly understood data capture concept will benefit the entire supply chain. This standard defines angle
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