SIST EN 62047-22:2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.

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Dispositifs a semiconducteurs - Dispositifs microélectromécaniques - Partie 22: Méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples

L'IEC 62047-22:2014 spécifie une méthode d'essai de traction en vue de mesurer les propriétés électromécaniques des matériaux des systèmes microélectromécaniques (MEMS, Micro-Electromechanical Systems) de couches minces conductrices collés sur des substrats souples non conducteurs. Les structures en couches minces sur des substrats souples sont largement utilisées dans les MEMS, les produits grand public, et les électroniques montés sur support souple. Le comportement électrique des couches sur substrats souples diffère de celui des couches et substrats indépendants du fait des interactions liées aux interfaces. Différentes combinaisons de substrats souples et de couches minces influent souvent de diverses manières sur les résultats d'essai en fonction des conditions d'essais et de l'adhérence liée aux interfaces. L'épaisseur souhaitée d'un matériau MEMS mince est 50 fois plus mince que celle d'un substrat souple, alors que d'autres dimensions sont similaires les unes aux autres.

Polprevodniški elementi - Mikroelektromehanski elementi - 22. del: Metoda elektromehanskega nateznega preskušanja prevodnih tankih plasti na upogljivih podlagah (IEC 62047-22:2014)

Standard EN IEC 62047-22 določa metodo nateznega preskušanja za merjenje elektromehanskih lastnosti prevodnih tankih materialov mikroelektromehanskih sistemov (MEMS) na neprevodnih upogljivih podlagah. Prevodne tankoplastne strukture na upogljivih podlagah se obsežno uporabljajo v MEMS, potrošniških izdelkih in upogljivih elektronskih elementih. Električno obnašanje plasti na upogljivih podlagah se razlikuje od obnašanja prosto stoječih plasti in podlag zaradi medsebojnih vplivov površin. Različne kombinacije upogljivih podlag in tankih plasti pogosto vodijo v različne vplive na preskusne rezultate, odvisno od preskusnih pogojev in površinske sprijemljivosti. Želena debelina tankega materiala MEMS je 50-krat tanjša od debeline upogljive podlage, medtem ko so si vse druge mere podobne.

General Information

• Status: Published
• Publication Date: 12-Oct-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 09-Oct-2014
• Due Date: 14-Dec-2014
• Completion Date: 13-Oct-2014
• Ref Project: EN 62047-22:2014 - Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Overview

EN 62047-22:2014 (IEC 62047-22:2014) defines an electromechanical tensile test method for measuring the electrical and mechanical behaviour of conductive thin films bonded to non‑conductive flexible substrates. It is intended for thin micro‑electromechanical systems (MEMS) materials and flexible electronic structures where the thin film is much thinner than the substrate (target: thin film ≈ 1/50 of substrate thickness). The standard addresses how interfacial interactions between film and substrate affect electrical response under tensile strain and provides procedures to obtain repeatable electromechanical data.

Key topics and requirements

• Test scope: Measures electromechanical properties (resistance vs. strain, gauge factor, elongation at electrical failure) of conductive thin films on flexible substrates rather than freestanding films.
• Test specimen geometry: Uses a rectangular bilayer strip (not a dog‑bone) with a gauge region of nearly uniform strain. Gauge length should be at least 20× the specimen width to minimize grip boundary effects.
• Layer proportions: The standard targets thin films that are about 50 times thinner than the flexible substrate while other dimensions remain similar.
• Electrical measurement: Resistance is measured in the gauge region; lead wires should be placed in the tensile grips and mechanically secured to avoid detachment during testing.
• Tensile grips and apparatus: Test machine must permit simultaneous mechanical extension and electrical measurement; grips must secure both specimen and electrical leads without damaging the thin film.
• Dimensional accuracy: Gauge length, width and thickness of both layers must be measured accurately (thickness and dimensions used in result analysis with typical measurement error limits called out in the standard).
• Terminology: Defines gauge factor (change in resistance normalized by original resistance and engineering strain) and elongation at electrical failure (strain where resistance exceeds a specified limit).
• Test environment & procedure: Calls out test conditions, careful sample preparation (fabrication‑matched specimens, non‑damaging cutting/etching) and avoidance of delamination or edge damage.

Applications and who uses this standard

• MEMS and flexible electronics R&D: To quantify how conductive thin films behave electrically under mechanical strain for sensors, stretchable circuits and wearable devices.
• Materials and process development: For evaluating film/substrate combinations, adhesion effects, and selecting deposition/process parameters.
• Quality assurance and reliability testing: For production qualification of flexible assemblies and to define acceptance criteria (gauge factor, electrical failure strain).
• Test laboratories and certification bodies: To provide standardized, comparable electromechanical tensile data across vendors and projects.

Keywords: electromechanical tensile test, conductive thin films, flexible substrates, MEMS, flexible electronics, gauge factor, tensile grips, interfacial adhesion, test specimen.

Related standards

• IEC/EN 62047-2: Tensile testing method of thin film materials
• IEC/EN 62047-3: Thin film standard test piece for tensile testing
• IEC/EN 62047-8: Strip bending test method for tensile property measurement of thin films
• ISO 527-3: Test conditions for films and sheets

This standard is part of the IEC 62047 series covering tensile and electromechanical testing methods for thin-film MEMS materials.

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2014
Polprevodniški elementi - Mikroelektromehanski elementi - 22. del: Metoda
elektromehanskega nateznega preskušanja prevodnih tankih plasti na upogljivih
podlagah (IEC 62047-22:2014)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical
tensile test method for conductive thin films on flexible substrates
/
Dispositifs a semiconducteurs - Dispositifs microélectromécaniques - Partie 22: Méthode
d'essai de traction électromécanique pour les couches minces conductrices sur des
substrats souples
Ta slovenski standard je istoveten z: EN 62047-22:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62047-22

NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2014
ICS 01.080.99
English Version
Semiconductor devices - Micro-electromechanical devices -
Part 22: Electromechanical tensile test method for conductive
thin films on flexible substrates
(IEC 62047-22:2014)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Mikrosystemtechnik -
Partie 22: Méthode d'essai de traction électromécanique Teil 22: Elektromechanisches Zug-Prüfverfahren für
pour les couches minces conductrices sur des substrats leitfähige Dünnschichten auf flexiblen Substraten
souples (IEC 62047-22:2014)
(CEI 62047-22:2014)
This European Standard was approved by CENELEC on 2014-07-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-22:2014 E
Foreword
The text of document 47F/186/FDIS, future edition 1 of IEC 62047-22, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-22:2014.

The following dates are fixed:
(dop) 2015-04-24
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-07-24
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-22:2014 was approved by CENELEC as a European
Standard without any modification.

- 3 - EN 62047-22:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 62047-2 2006 Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices -
Part 2: Tensile testing method
of thin film materials
IEC 62047-3 2006 Semiconductor devices - Micro- EN 62047-3 2006
electromechanical devices -
Part 3: Thin film standard test piece
for tensile testing
IEC 62047-8 2011 Semiconductor devices - Micro- EN 62047-8 2011
electromechanical devices -
Part 8: Strip bending test method
for tensile property measurement
of thin films
ISO 527-3 1995 Plastics - Determination of tensile EN ISO 527-3 1995
properties -
Part-3: Test conditions for films
and sheets
IEC 62047-22 ®
Edition 1.0 2014-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 22: Electromechanical tensile test method for conductive thin films on

flexible substrates
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 22: Méthode d'essai de traction électromécanique pour les couches

minces conductrices sur des substrats souples

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX K
ICS 31.080.99 ISBN 978-2-8322-1649-1

– 2 – IEC 62047-22:2014 © IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions, symbols and designations . 5
3.1 Terms and definitions. 5
3.2 Symbols and designations . 6
4 Test piece . 6
4.1 General . 6
4.2 Shape of a test piece . 6
4.3 Measurement of dimensions . 7
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure. 9
5.4 Test environment . 9
6 Test report . 9

Figure 1 – Bilayered test piece. 6
Figure 2 – Schematic of an electromechanical test machine . 8
Figure 3 – Electromechanical tensile grip . 9

Table 1 – Symbols and designations of a test piece . 6

IEC 62047-22:2014 © IEC 2014 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 22: Electromechanical tensile test method
for conductive thin films on flexible substrates

FOREWORD
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