SIST EN 16602-70-61:2022
(Main)Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
This standard defines:
- the basic requirements for the verification and approval of automatic machine w ave soldering for use in spacecraft hardware. The process requirements for w ave soldering of doublesided and multilayer boards are also defined.
- the technical requirements and quality assurance provisions for the manufacture and verification of manuallysoldered, high-reliability electrical connections.
- the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
- the acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to w ithstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
- the proper tools, correct materials, design and w orkmanshipt. Workmanship standards are included to permit discrimination betw een proper and improper work.
SCOPE
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
The Standard defines w orkmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand normal terrestrial conditions and the environment imposed by space flight.
The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission w ithin the temperature limits of -55 °C to +85 °C at solder joint level.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 (equivalent to EN 16602-70-60) and ECSS-Q-ST-70-12 (equivalent to EN 16602-70-12).
This Standard does not cover the qualification and acceptance of the EQM and FM equipment w ith high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
This Standard does not cover verification of thermal properties for component assembly.
This Standard does not cover pressfit connectors.
The qualification and acceptance tests of equipment manufactured in accordance w ith this Standard are covered by ECSS-EST-10-03 (equivalent to EN 16603-10-03).
Raumfahrtproduktsicherung - Hochzuverlässige Montage von Oberflächen-Befestigungen und Durchgangslochverbindungen
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions électriques à montage en surface, à technologie combinée et montées à la main
La présente norme définit les exigences techniques et les dispositions relatives à l'assurance qualité pour la fabrication et la vérification de circuits électroniques de haute fiabilité, montés en surface avec trou traversant, assemblés sans soudure, et pour le brasage d'interconnexions de fils et de faisceaux de fils.
Cette norme définit les exigences d'exécution et les critères d'acceptation et de rejet pour les assemblages de haute fiabilité destinés à résister aux conditions d'essai au sol, y compris le LTS (stockage à long terme) et l'environnement imposé par les vols spatiaux et les lanceurs.
Le montage et le support des composants, bornes et conducteurs spécifiés dans la présente norme ne s'appliquent qu'aux assemblages conçus pour fonctionner en continu pendant toute la mission dans des limites de température de -55 °C à +85 °C au niveau des joints de soudure.
Les exigences relatives aux circuits imprimés figurent dans l'ECSS-Q-ST-70-60 et l'ECSS-Q-ST-70-12.
La présente norme ne couvre pas le brasage sans queue et les exigences associées.
La présente norme ne couvre pas la qualification et l'acceptation des équipements EQM et FM avec des assemblages de circuits électroniques à haute fiabilité avec montage en surface, trou traversant et sans brasure.
La présente norme ne couvre pas la vérification des propriétés thermiques pour l'assemblage des composants.
La présente norme ne couvre pas les connecteurs à ajustement forcé, à cause des risques d'endommager le PCB qui ne sont pas évalués dans le cadre de cette exigence d'essai.
Les essais de qualification et d'acceptation des équipements fabriqués conformément à la présente norme sont couverts par l'ECSS-E-ST-10-03.
La présente norme peut être adaptée aux caractéristiques et contraintes spécifiques d'un projet spatial, conformément à l'ECSS-S-ST-00.
Zagotavljanje varnih proizvodov v vesoljski tehniki - Visoko zanesljivo spajkanje za površinsko namestitev, mešano tehnologijo in ročno pritrjene električne priključke
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 16602-70-61:2022
01-december-2022
Nadomešča:
SIST EN 16602-70-07:2015
SIST EN 16602-70-08:2015
SIST EN 16602-70-38:2019
Zagotavljanje varnih proizvodov v vesoljski tehniki - Visoko zanesljivo spajkanje
za površinsko namestitev, mešano tehnologijo in ročno pritrjene električne
priključke
Space product assurance - High-reliability soldering for surface mount, mixed technology
and hand-mounted electrical connections
Raumfahrtproduktsicherung - Hochzuverlässige Montage von Oberflächen-
Befestigungen und Durchgangslochverbindungen
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions
électriques à montage en surface, à technologie combinée et montées à la main
Ta slovenski standard je istoveten z: EN 16602-70-61:2022
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-61:2022 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST EN 16602-70-61:2022
---------------------- Page: 2 ----------------------
SIST EN 16602-70-61:2022
EUROPEAN STANDARD EN 16602-70-61
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2022
ICS 25.160.50; 49.140
Supersedes EN 16602-70-07:2014, EN 16602-70-
08:2015, EN 16602-70-38:2019
English version
Space product assurance - High-reliability soldering for
surface mount, mixed technology and hand-mounted
electrical connections
Assurance produit des projets spatiaux - Soudure haute Raumfahrtproduktsicherung - Hochzuverlässige
fiabilité pour les connexions électriques à montage en Montage von Oberflächen-Befestigungen und
surface, à technologie combinée et montées à la main Durchgangslochverbindungen
This European Standard was approved by CEN on 29 August 2022.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Türkiye and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2022 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. EN 16602-70-61:2022 E
reserved worldwide for CEN national Members and for
CENELEC Members.
---------------------- Page: 3 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
Table of contents
European Foreword . 13
Introduction . 14
1 Scope . 21
2 Normative references . 22
3 Terms, definitions and abbreviated terms . 24
3.1 Terms from other standards . 24
3.2 Terms specific to the present standard . 24
3.3 Abbreviated terms. 29
3.4 Nomenclature . 31
4 Principles of reliable soldered connections . 32
5 Preparatory conditions . 33
5.1 Facility cleanliness . 33
5.2 Environmental conditions . 33
5.3 Lighting requirements . 34
5.4 Precautions against static discharges . 34
5.4.1 Overview . 34
5.4.2 General . 35
5.4.3 ESD Protected Area . 35
5.4.4 Precautions against ESD during manufacturing . 36
5.4.5 Protective packaging and ESD protection . 37
5.5 Equipment and tools . 37
5.5.1 General . 37
5.5.2 Brushes . 38
5.5.3 Cutters and pliers . 38
5.5.4 Bending tools . 39
5.5.5 Clinching tools . 39
5.5.6 Insulation strippers . 40
5.5.7 Hot air blower . 41
2
---------------------- Page: 4 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
5.5.8 Soldering tools . 41
5.5.9 Baking and curing ovens . 42
5.5.10 Solder deposition equipment . 43
5.5.11 Automatic component placement equipment . 43
5.5.12 Dynamic wave-solder machines . 43
5.5.13 Selective wave solder equipment . 44
5.5.14 Reflow process equipment . 45
5.5.15 Depanelization tool. 47
5.5.16 Cleanliness testing equipment . 47
5.5.17 Optical microscope . 47
5.5.18 Automatic Optical Inspection (AOI) equipment . 47
5.5.19 X-ray inspection equipment . 47
6 Material selection . 49
6.1 General . 49
6.2 Solder . 49
6.2.1 Form . 49
6.2.2 Composition . 50
6.2.3 Storage and handling of paste purity . 52
6.3 Fluxes . 52
6.3.1 Rosin based fluxes . 52
6.4 Solvents . 53
6.5 Flexible insulation materials . 54
6.6 Terminals . 54
6.6.1 Materials . 54
6.6.2 Tin, silver, and gold-plated terminals . 54
6.7 Wires . 55
6.8 Sculptured flex . 55
6.9 Printed circuits substrates . 55
6.9.1 Substrates selection . 55
6.9.2 Gold finish on PCBs footprint . 55
6.9.3 PCB design requirements for wave and selective wave soldering . 56
6.10 Components . 56
6.10.1 General . 56
6.10.2 Moisture sensitive components . 57
6.11 Adhesives, potting, underfill and conformal coatings . 57
7 Preparations prior to mounting and soldering . 58
3
---------------------- Page: 5 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
7.1 General handling . 58
7.2 Storage . 58
7.2.1 Components. 58
7.2.2 PCBs. 58
7.2.3 Materials requiring segregation . 58
7.3 Baking conditions of PCBs . 59
7.4 Baking and storage of moisture sensitive components . 59
7.5 Preparation of components, wires, terminals, and solder cups. 60
7.5.1 Damage to insulation . 60
7.5.2 Damage to conductors and braid . 60
7.5.3 Cleaning before soldering . 61
7.5.4 Insulation clearance . 61
7.5.5 Wire lay . 61
7.6 Degolding and pretinning . 61
7.6.1 General . 61
7.6.2 Solder baths method for degolding and pretinning of components
terminations and terminals . 62
7.6.3 Solder iron method for degolding and pretinning . 64
7.6.4 Pretinning processes . 64
7.7 Preparation of the soldering tip . 65
8 Components mounting requirements prior to soldering . 67
8.1 General requirements . 67
8.2 Mounting of through hole components . 67
8.2.1 General . 67
8.2.2 Heavy components . 68
8.2.3 Metal-case components . 68
8.2.4 Glass-encased components . 68
8.2.5 Stress relief of components with bendable leads . 68
8.2.6 Stress relief of components with non-bendable leads . 71
8.2.7 Bending of component leads . 72
8.2.8 Lead attachment to PCBs . 73
8.2.9 Mounting of through hole connectors to PCBs . 76
8.2.10 Mounting of swage terminals to PCBs . 77
8.2.11 Mounting of components to terminals . 78
8.3 Mounting of surface mount components . 79
8.3.1 General . 79
8.3.2 Lead forming . 80
4
---------------------- Page: 6 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
8.3.3 Inspection of solder paste deposition . 80
9 Attachment of conductors to terminals, solder cups and cables . 81
9.1 General . 81
9.2 Wire termination . 81
9.2.1 Breakouts from cables . 81
9.2.2 Insulation clearance . 82
9.3 Turret and straight-pin terminals . 82
9.4 Bifurcated terminals . 83
9.4.1 General . 83
9.4.2 Bottom route . 83
9.4.3 Side route . 84
9.4.4 Top route . 85
9.4.5 Combination of top and bottom routes. 86
9.4.6 Combination of side and bottom routes . 86
9.5 Hook terminals . 86
9.6 Pierced terminals . 87
9.7 Solder cups for connector . 87
9.8 Insulation sleeving . 88
9.9 Wire and cable interconnections . 89
9.9.1 General . 89
9.9.2 Preparation of wires . 89
9.9.3 Preparation of shielded wires and cables . 90
9.9.4 Pre-assembly of wires . 90
9.10 Connection of wires to PCBs . 91
9.11 Connection of coaxial cables to PCBs . 93
10 Assembly to terminals and to PCBs . 94
10.1 Overview . 94
10.2 General soldering conditions . 94
10.2.1 General . 94
10.2.2 Positioning . 95
10.2.3 Application of flux . 96
10.2.4 Flux controls for wave-soldering equipment . 97
10.2.5 Soldering temperatures . 97
10.2.6 Soldering of conductors in terminals . 99
10.3 Soldering of components, terminals, and wires into PCB through holes . 100
10.3.1 General . 100
5
---------------------- Page: 7 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
10.3.2 Solder fillets for wires and terminations . 100
10.3.3 Solder fillets for component leads in plated or non-plated through
holes . 101
10.4 Soldering of surface mount components . 102
10.4.1 General . 102
10.4.2 Rectangular and square end-capped or end-metallized leadless chip . 104
10.4.3 Cylindrical and square end-capped components with cylindrical or
oval body . 106
10.4.4 Bottom terminated chip components . 107
10.4.5 L-Shape inwards components . 109
10.4.6 Leadless component with plane termination . 110
10.4.7 Leaded component with plane termination . 110
10.4.8 Leadless castellated ceramic chip carrier components . 112
10.4.9 No lead Quad Flat Pack . 113
10.4.10 Flat pack and gull-wing leaded components with round, rectangular,
ribbon leads . 115
10.4.11 Components with “J” leads . 116
10.4.12 Components with ribbon terminals without stress relief . 117
10.4.13 Stacked modules components with leads protruding vertically from
bottom . 119
10.4.14 Area array devices . 120
10.5 Rework and repair . 122
10.5.1 Removal of solder on unpopulated PCB . 122
10.5.2 Rework, repair and modifications . 122
10.6 High-voltage connections. 123
10.7 Solderless components . 125
11 Post soldering process requirements . 126
11.1 Cleaning of PCB assemblies . 126
11.1.1 General . 126
11.1.2 Verification of cleanliness . 127
11.1.3 Surface Insulation Resistance (SIR) testing . 127
11.1.4 Sodium chloride (NaCl) equivalent ionic contaminants testing . 128
11.1.5 Monitoring of cleanliness . 129
11.2 Staking and bonding . 129
11.3 Conformal coating, potting and underfill . 130
12 Final inspection . 132
12.1 General . 132
12.2 Visual acceptance criteria . 132
6
---------------------- Page: 8 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
12.3 Visual rejection criteria . 133
12.4 X-ray rejection criteria . 135
12.5 Warp and twist of populated boards . 136
12.6 Inspection records . 136
13 Verification procedure. 137
13.1 Verification approval procedure . 137
13.1.1 Request for verification . 137
13.1.2 Technology sample . 137
13.1.3 Audit of assembly processing . 138
13.1.4 Verification programme documentation . 138
13.1.5 Verification samples and testing . 139
13.1.6 Final verification review . 140
13.1.7 Approval status of assembly line . 140
13.1.8 Withdrawal of approval status . 141
13.2 Verification programme . 141
13.2.1 General . 141
13.2.2 Verification for PTH manual soldering . 147
13.2.3 Additional verification for wave soldering . 147
13.2.4 Soldering log . 147
13.3 Special verification testing for ceramic area array components . 149
13.3.1 General . 149
13.3.2 Evaluation of AAD capability samples . 151
13.3.3 Electrical verification of AAD assembly . 151
13.4 Assembly verification with electrical testing procedure . 152
13.5 Verification programme with reduced temperature range . 155
13.6 Verification for solderless process . 156
13.7 Conditions for delta verification . 158
13.8 Verification by similarity . 160
13.8.1 General conditions for similarity . 160
13.8.2 Conditions for similarity for PTH components . 160
13.8.3 Conditions for similarity for SMD . 161
13.8.4 Conditions for similarity for solderless components . 164
14 Environmental tests conditions . 165
14.1 Overview . 165
14.2 Visual inspection . 165
14.3 X-ray inspection . 165
7
---------------------- Page: 9 ----------------------
SIST EN 16602-70-61:2022
EN 16602-70-61:2022 (E)
14.4 Cleanliness test . 165
14.5 Warp and twist of PCB . 165
14.6 Electrical continuity measurement . 166
14.7 Electrical continuity for wave soldered multilayers PCB . 166
14.8 Vibration . 167
14.9 Mechanical shock . 169
14.10 Damp heat test . 171
14.11 Temperature cycling test. 171
14.12 Temperature cycling test with reduced temperature range . 172
14.13 Life test . 174
14.14 Final visual inspection . 174
14.15 Microsection . 175
14.15.1 Microsection facilities . 175
14.15.2 Microsections location . 175
14.15.3 Microsection acceptance criteria . 176
14.15.4 Microsection acceptance criteria for ceramic chip capacitors . 189
14.16 Anomalies in PCB and sculptured flex during verification.
...
SLOVENSKI STANDARD
oSIST prEN 16602-70-61:2021
01-november-2021
Nadomešča:
SIST EN 16602-70-07:2015
SIST EN 16602-70-08:2015
SIST EN 16602-70-38:2019
Zagotavljanje vesoljskih izdelkov - visoko zanesljivo spajkanje za površinski
nosilec, mešano tehnologijo in ročno vgrajene električne priključke
Space product assurance - High-reliability soldering for surface mount, mixed technology
and hand-mounted electrical connections
Raumfahrtproduktsicherung - Hochzuverlässiges Löten von Oberflächen-Befestigungen
und Durchgangslochverbindungen
Assurance produit spatiale - Assamblage haute fiabilité pour technologies à montage de
surface et connexions traversantes
Ta slovenski standard je istoveten z: prEN 16602-70-61
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
49.140 Vesoljski sistemi in operacije Space systems and
operations
oSIST prEN 16602-70-61:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
oSIST prEN 16602-70-61:2021
---------------------- Page: 2 ----------------------
oSIST prEN 16602-70-61:2021
EUROPEAN STANDARD
DRAFT
prEN 16602-70-61
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2021
ICS 25.160.50; 49.140
Will supersede EN 16602-70-07:2014, EN 16602-70-
08:2015, EN 16602-70-38:2019
English version
Space product assurance - High-reliability soldering for
surface mount, mixed technology and hand-mounted
electrical connections
Assurance produit spatiale - Assamblage haute fiabilité Raumfahrtproduktsicherung - Hochzuverlässiges
pour technologies à montage de surface et connexions Löten von Oberflächen-Befestigungen und
traversantes Durchgangslochverbindungen
This draft European Standard is submitted to CEN members for enquiry. It has been drawn up by the Technical Committee
CEN/CLC/JTC 5.
If this draft becomes a European Standard, CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal
Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any
alteration.
This draft European Standard was established by CEN and CENELEC in three official versions (English, French, German). A
version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own
language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.Recipients of this draft are invited to submit, with their comments, notification
of any relevant patent rights of which they are aware and to provide supporting documentation.
Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without
notice and shall not be referred to as a European Standard.
---------------------- Page: 3 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
Table of contents
Table of contents . 2
European Foreword . 13
Introduction . 14
1 Scope . 21
2 Normative references . 22
3 Terms, definitions and abbreviated terms . 24
3.1 Terms from other standards . 24
3.2 Terms specific to the present standard . 24
3.3 Abbreviated terms. 29
3.4 Nomenclature . 30
4 Principles of reliable soldered connections . 32
5 Preparatory conditions . 33
5.1 Facility cleanliness . 33
5.2 Environmental conditions . 33
5.3 Lighting requirements . 34
5.4 Precautions against static discharges . 34
5.4.1 Overview . 34
5.4.2 General . 35
5.4.3 ESD Protected Area . 35
5.4.4 Precautions against ESD during manufacturing . 36
5.4.5 Protective packaging and ESD protection . 37
5.5 Equipment and tools . 37
5.5.1 General . 37
5.5.2 Brushes . 38
5.5.3 Cutters and pliers . 38
5.5.4 Bending tools . 39
5.5.5 Clinching tools . 39
5.5.6 Insulation strippers . 39
2
---------------------- Page: 4 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
5.5.7 Hot air blower . 41
5.5.8 Soldering tools . 41
5.5.9 Baking and curing ovens . 42
5.5.10 Solder deposition equipment . 42
5.5.11 Automatic component placement equipment . 42
5.5.12 Dynamic wave-solder machines . 43
5.5.13 Selective wave solder equipment . 43
5.5.14 Reflow process equipment . 44
5.5.15 Depanelisation tool. 46
5.5.16 Cleanliness testing equipment . 46
5.5.17 Optical microscope . 46
5.5.18 Automatic Optical Inspection (AOI) equipment . 46
5.5.19 X-ray inspection equipment . 47
6 Material selection . 48
6.1 General . 48
6.2 Solder . 48
6.2.1 Form . 48
6.2.2 Composition . 49
6.2.3 Maintenance of paste purity . 51
6.3 Fluxes . 51
6.3.1 Rosin based fluxes . 51
6.3.2 Application of flux . 52
6.3.3 Flux controls for wave-soldering equipment . 52
6.4 Solvents . 53
6.5 Flexible insulation materials . 53
6.6 Terminals . 54
6.6.1 Materials . 54
6.6.2 Tin, silver, and gold-plated terminals . 54
6.7 Wires . 55
6.8 Sculptured flex . 55
6.9 Printed circuits substrates . 55
6.9.1 Substrates selection . 55
6.9.2 Gold finish on PCBs footprint . 55
6.10 Components . 56
6.10.1 General . 56
6.10.2 Moisture sensitive components . 56
6.11 Adhesives, potting, underfill and conformal coatings . 57
3
---------------------- Page: 5 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
7 Preparations prior to mounting and soldering . 58
7.1 General handling . 58
7.2 Storage . 58
7.2.1 Components. 58
7.2.2 PCBs. 58
7.2.3 Materials requiring segregation . 58
7.3 Baking conditions of PCBs . 59
7.4 Baking and storage of moisture sensitive components . 59
7.5 Preparation of components, wires, terminals, and solder cups. 60
7.5.1 Insulation removal . 60
7.5.2 Surfaces to be soldered . 61
7.6 Degolding and pretinning . 62
7.6.1 General . 62
7.6.2 Solder baths method for degolding and pretinning of components
terminations and terminals . 62
7.6.3 Solder iron method for degolding and pretinning . 63
7.6.4 Pretinning processes . 64
7.7 Preparation of the soldering tip . 65
8 Components mounting requirements prior to soldering . 66
8.1 General requirements . 66
8.2 Mounting of through hole components . 66
8.2.1 General . 66
8.2.2 Heavy components . 66
8.2.3 Metal-case components . 67
8.2.4 Glass-encased components . 67
8.2.5 Stress relief of components with bendable leads . 67
8.2.6 Stress relief of components with non-bendable leads . 70
8.2.7 Bending of component leads . 70
8.2.8 Lead attachment to PCBs . 71
8.2.9 Mounting of swage terminals to PCBs . 73
8.2.10 Mounting of through hole connectors to PCBs . 73
8.2.11 Clinching of components in non-plated through holes . 74
8.2.12 Mounting of components to terminals . 76
8.3 Mounting of surface mount components . 77
8.3.1 General . 77
8.3.2 Lead forming . 78
8.3.3 Mounting components in solder paste . 78
4
---------------------- Page: 6 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
8.3.4 Leadless components . 78
9 Attachment of conductors to terminals, solder cups and cables . 80
9.1 General . 80
9.2 Wire termination . 80
9.2.1 Breakouts from cables . 80
9.2.2 Insulation clearance . 80
9.2.3 Stress relief . 81
9.3 Turret and straight-pin terminals . 81
9.3.1 Side route . 81
9.3.2 Bottom route . 81
9.4 Bifurcated terminals . 82
9.4.1 General . 82
9.4.2 Bottom route . 82
9.4.3 Side route . 83
9.4.4 Top route . 84
9.4.5 Combination of top and bottom routes. 85
9.4.6 Combination of side and bottom routes . 85
9.5 Hook terminals . 85
9.6 Pierced terminals . 85
9.7 Solder cups for connector . 86
9.8 Insulation sleeving . 87
9.9 Wire and cable interconnections . 88
9.9.1 General . 88
9.9.2 Preparation of wires . 88
9.9.3 Preparation of shielded wires and cables . 88
9.9.4 Pre-assembly . 89
9.9.5 Soldering of conductors onto terminals except cup terminals . 90
9.9.6 Soldering of conductors onto cup terminals . 90
9.10 Connection of wires to PCBs . 91
9.11 Connection of coaxial cables to PCBs . 93
10 Assembly to terminals and to PCBs . 94
10.1 Overview . 94
10.2 General soldering conditions . 94
10.3 Soldering of components, terminals, and wires into PCB through holes . 97
10.3.1 General . 97
10.3.2 Solder fillets for wires and terminations . 98
5
---------------------- Page: 7 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
10.3.3 Solder fillets for component leads in plated through-holes. 98
10.3.4 Solder fillets for component leads in non-plated through-holes . 99
10.3.5 PCB design requirements for wave and selective soldering . 100
10.4 Soldering of surface mount components . 100
10.4.1 General . 100
10.4.2 Rectangular and square end-capped or end-metallized leadless chip . 101
10.4.3 Cylindrical and square end-capped components with cylindrical or
oval body . 102
10.4.4 Bottom terminated chip components . 105
10.4.5 L-Shape inwards components . 106
10.4.6 Leadless component with plane termination . 106
10.4.7 Leaded component with plane termination . 107
10.4.8 Leadless castellated ceramic chip carrier components . 108
10.4.9 No lead Quad Flat Pack . 109
10.4.10 Flat pack and gull-wing leaded components with round, rectangular,
ribbon leads . 111
10.4.11 Components with “J” leads . 112
10.4.12 Components with ribbon terminals without stress relief . 113
10.4.13 Stacked modules components with leads protruding vertically from
bottom . 114
10.4.14 Area array devices . 115
10.5 Rework and repair . 116
10.5.1 Removal of solder on unpopulated PCB . 116
10.5.2 Rework , repair and modifications . 116
10.6 High-voltage connections. 117
10.7 Solderless components . 118
11 Post soldering process requirements . 120
11.1 Cleaning of PCB assemblies . 120
11.1.1 General . 120
11.1.2 Verification of cleanliness . 120
11.1.3 Surface Insulation Resistance (SIR) testing . 121
11.1.4 Monitoring of cleanliness . 121
11.1.5 Sodium chloride (NaCl) equivalent ionic contaminants testing . 122
11.2 Staking and bonding . 122
11.3 Conformal coating, potting and underfill . 123
12 Final inspection . 124
12.1 General . 124
6
---------------------- Page: 8 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
12.2 Visual acceptance criteria . 124
12.3 Visual rejection criteria . 125
12.4 X-ray rejection criteria . 127
12.5 Warp and twist of populated boards . 127
12.6 Inspection records . 128
13 Verification procedure. 129
13.1 Verification approval procedure . 129
13.1.1 Request for verification . 129
13.1.2 Technology sample . 129
13.1.3 Audit of assembly processing . 130
13.1.4 Verification programme documentation . 130
13.1.5 Verification samples and testing . 130
13.1.6 Final verification review . 131
13.1.7 Approval of assembly line . 132
13.1.8 Withdrawal of approval status . 132
13.2 Verification programme . 132
13.2.1 General . 132
13.2.2 Verification for PTH manual soldering . 138
13.2.3 Additional verification for wave soldering . 138
13.2.4 Soldering log . 138
13.3 Special verification testing for ceramic area array components . 141
13.3.1 General . 141
13.3.2 Evaluation of capability samples . 143
13.3.3 Electrical verification . 143
13.4 Component verification with electrical testing procedure . 144
13.5 Verification programme with reduced temperature range . 147
13.6 Verification for solderless process . 147
13.7 Conditions for delta verification . 149
13.8 Verification by similarity . 152
13.8.1 General conditions for similarity . 152
13.8.2 Conditions for similarity for PTH components . 152
13.8.3 Conditions for similarity for SMD . 153
13.8.4 Conditions for similarity for solderless components . 156
14 Environmental tests conditions . 157
14.1 Overview . 157
14.2 Visual inspection . 157
7
---------------------- Page: 9 ----------------------
oSIST prEN 16602-70-61:2021
prEN 16602-70-61:2021 (E)
14.3 X-ray inspection . 157
14.4 Cleanliness test . 157
14.5 Warp and twist of PCB . 157
14.6 Electrical continuity measurement . 157
14.7 Electrical continuity for wave soldered multilayers PCB . 158
14.8 Vibration . 159
14.9 Mechanical shock . 161
14.10 Damp heat test . 162
14.11 Temperature cycling test. 162
14.12 Temperature cycling test with reduced temperature range . 163
14.13 Final visual inspection . 165
14.14 Microsection . 165
14.14.1 Microsection facilities . 165
14.14.2 Microsections location . 166
14.14.3 Microsection acceptance and rejection criteria . 166
14.14.4 Microsection acceptance and rejection criteria for cera
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.