SIST IEC 60104:1999

Aluminium-magnesium-silicon alloy wire for overhead line conductors

Is applicable to aluminium-magnesium-silicon alloy wires of two types having different mechanical and electrical properties for the manufacture of stranded conductors for overhead power transmission purposes. It specifies the mechanical and electrical properties of wires in the diameter range 1.50 mm to 4.50 mm.

Fils en alliage d'aluminium-magnésium-silicium pour conducteurs de lignes aériennes

Est applicable aux fils en alliage d'aluminium-magnésium-silicium de deux types, ayant différentes propriétés mécaniques et électriques, pour la fabrication de conducteurs câblés pour lignes aériennes de transport d'énergie électrique. Elle spécifie les propriétés mécaniques et électrique des fils dans la gamme de diamètres de 1,50 mm à 4,50 mm.

Aluminium-magnesium-silicon alloy wire for overhead line conductors

General Information

• Status: Withdrawn
• Publication Date: 31-Oct-1999
• Withdrawal Date: 31-May-2003
• ICS: 29.060.10 - Wires
• ICS: 29.240.20 - Power transmission and distribution lines
• Technical Committee: GAV - Bare aluminium conductors
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 01-Jun-2003
• Due Date: 01-Jun-2003
• Completion Date: 01-Jun-2003
• Ref Project: IEC 61189-3-913:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

Standards Content (sample)

SLOVENSKI STANDARD
SIST IEC 60104:1999
01-november-1999
Aluminium-magnesium-silicon alloy wire for overhead line conductors
Aluminium-magnesium-silicon alloy wire for overhead line conductors

Fils en alliage d'aluminium-magnésium-silicium pour conducteurs de lignes aériennes

Ta slovenski standard je istoveten z: IEC 60104
ICS:
29.060.10 Žice Wires
29.240.20 Daljnovodi Power transmission and
distribution lines
SIST IEC 60104:1999 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST IEC 60104:1999
---------------------- Page: 2 ----------------------
SIST IEC 60104:1999
NORME CEI
INTERNATIONALE IEC
60104
INTERNATIONAL
Deuxième édition
STAN DARD
Second edition
1987-12
Fils en alliage d'aluminium-magnésium-silicium
pour conducteurs de lignes aériennes
Aluminium-magnesium-silicon alloy wire
for overhead line conductors
© IEC 1987
Droits de reproduction réservés —
Copyright - all rights reserved
Aucune partie de

cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in

utilisée quelque

sous forme que ce soit et par aucun any form or by any means, electronic or mechanical,

procédé, électronique ou mécanique, y compris la photo- including photocopying and microfilm, without permission in

copie et les microfilms, sans l'accord écrit de l'éditeur. writing from the publisher.

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• • For price, see current catalogue
---------------------- Page: 3 ----------------------
SIST IEC 60104:1999
104 © IEC 1987 –3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
ALUMINIUM-MAGNESIUM-SILICON ALLOY WIRE
FOR OVERHEAD LINE CONDUCTORS
FOREWORD

1) The formal decisions or agreements of the I E C on technical matters, prepared by Technical Committees on which all the

National Committees having a special interest therein are represented, express, as nearly as possible, an international

consensus of opinion on the subjects dealt with.

They have the form of recommendations for international use and they are accepted by the National Committees in that sense.

3) fi

In order to promote international uni cation, the I E C expresses the wish that all National Committees should adopt the text

of the I E C recommendation for their national rules in so far as national conditions will permit. Any divergence between the

I E C recommendation and the corresponding national rules should, as far as possible, be clearly indicated in the latter.

PREFACE

This standard has been prepared by I E C Technical Committee No. 7 : Bare Aluminium Conductors.

This second edition of I E C Publication 104 replaces the first edition, which was issued in 1958.

This standard replaces Clauses 3, 5, 6 and 13, and the requirements of Clauses 4 and 12 and Sub-

clause 8.1 of I E C Publication 208 (1966) : Aluminium Alloy Stranded Conductors (Aluminium-

Magnesium-Silicon Type). It also replaces Clauses 3, 6, 15, Sub-clause 7.1 and the requirements of

Clause 5, Sub-clauses 9.1, 13.2 and 13.3 of IEC Publication 210 (1966) : Aluminium Alloy

Conductors, Steel-reinforced.
The text of this standard is based on the following documents:
Six Months' Rule Report on Voting
7(CO)420 7(CO)423

Further information can be found in the Report on Voting indicated in the table above.

The following !EC publication is quoted in this standard:

Publication No. 468 (1974): Method of Measurement of Resistivity of Metallic Materials.

Other publications quoted:
ISO Standard 6892 (1984) : Metallic Materials – Tensile Testing.
ISO Standard 7802 (1983): Metallic Materials – Wire-Wrapping Test.
---------------------- Page: 4 ----------------------
SIST IEC 60104:1999
104 © I E C – 5
1987
ALUMINIUM-MAGNESIUM-SILICON ALLOY WIRE
FOR OVERHEAD LINE CONDUCTORS
1. Scope

This standard is applicable to aluminium-magnesium-silicon alloy wires of two types having

different mechanical and electrical properties for the manufacture of stranded conductors for

overhead power transmission purposes. It specifies the mechanical and electrical properties of

wires in the diameter range 1.50 mm to 4.50 mm.
The two types are designated Type A and Type B respectively.
Values for alumini
...

IEC 61189-3-913
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3-913: Test method for thermal conductivity of printed circuit boards for
high-brightness LEDs
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 3-913: Méthodes d'essai pour la conductivité thermique des circuits
imprimés pour les LED à forte luminosité
IEC 61189-3-913:2016-01(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61189-3-913
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3-913: Test method for thermal conductivity of printed circuit boards for
high-brightness LEDs
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 3-913: Méthodes d'essai pour la conductivité thermique des circuits
imprimés pour les LED à forte luminosité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3104-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61189-3-913:2016 © IEC 2016
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Pre–conditioning .............................................................................................................. 6

5 Test methods ................................................................................................................... 6

5.1 General ................................................................................................................... 6

5.2 Thermal conductivity ............................................................................................... 6

5.2.1 Measurement of thermal resistance on the plane ............................................. 6

5.2.2 Measurement of thermal resistance across the thickness ................................. 8

Annex A (normative) Boards and panels .............................................................................. 13

A.1 Panel and board sizes .......................................................................................... 13

A.1.1 Board size ..................................................................................................... 13

A.1.2 Allowance of dimensions ............................................................................... 13

A.1.3 Perforation and slit ........................................................................................ 14

A.1.4 V-cut.............................................................................................................. 14

A.2 Total board thickness ............................................................................................ 15

A.3 Holes .................................................................................................................... 16

A.3.1 Insertion holes and vias ................................................................................. 16

A.3.2 Datum hole .................................................................................................... 19

A.3.3 Assembly hole (through-hole without wall plating) .......................................... 19

A.4 Conductor ............................................................................................................. 19

A.4.1 Width of conductor pattern and its allowance ................................................. 19

A.4.2 Distance between conductors and its allowance ............................................ 20

A.4.3 Thickness of the insulating layer .................................................................... 21

A.5 Printed contact ...................................................................................................... 21

A.5.1 Allowance of the distance between the centers of two adjacent printed

contacts ......................................................................................................... 21

A.5.2 Allowance of the terminal width of printed contacts ........................................ 22

A.5.3 Shift of the center of printed contacts on the front and back sides of a

board ............................................................................................................. 22

A.6 Land pattern ......................................................................................................... 23

A.6.1 Allowance of the distance between the centers of two lands .......................... 23

A.6.2 Allowance of a land width .............................................................................. 23

A.6.3 Land diameter and its allowance for BGA/CSP .............................................. 24

A.7 Fiducial mark and mark for component positioning ................................................ 25

A.7.1 Typical form and size of the fiducial mark ...................................................... 25

A.7.2 Dimensional allowance of fiducial mark and component positioning mark ...... 26

A.7.3 Position allowance of the component positioning mark................................... 26

A.8 Interlayer connection – Copper plating .................................................................. 26

Annex B (normative) Equilibrium test ................................................................................... 27

Bibliography .......................................................................................................................... 28

Figure 1 – Illustration of an apparatus for the thermal conductivity test ................................. 10

Figure 2 – Surface layer specimen pattern for thermal conductivity test ................................ 11

Figure 3 – Test equipment for thermal resistance to the thickness direction .......................... 12

---------------------- Page: 4 ----------------------
IEC 61189-3-913:2016 © IEC 2016 – 3 –

Figure A.1 – Board arrangement in a panel ........................................................................... 13

Figure A.2 – Distances from the datum point to perforation and slit ....................................... 14

Figure A.3 – Distance from the datum point to the V-cut ....................................................... 15

Figure A.4 – Allowance of position off-set of V-cuts on front and back surfaces .................... 15

Figure A.5 – PWB board with symbol mark, solder resist, copper foil and plating .................. 16

Figure A.6 – Positions of component insertion holes ............................................................. 17

Figure A.7 – Distance between the wall of a hole and the board edge ................................... 18

Figure A.8 – Wall of a hole and the minimum designed spacing to the inner conductor ......... 19

Figure A.9 – Width of finished conductor ............................................................................... 20

Figure A.10 – Distance between conductor and board edge .................................................. 21

Figure A.11 – Thickness of the insulating layer ..................................................................... 21

Figure A.12 – Distance between centers of terminals of printed contacts .............................. 22

Figure A.13 – Terminal width of a printed contact ................................................................. 22

Figure A.14 – Shift of the center of printed contacts on front and back sides of a board ........ 23

Figure A.15 – Land pattern ................................................................................................... 23

Figure A.16 – Land width of a land pattern ............................................................................ 24

Figure A.17 – Land diameter of BGA/CSP formed of a conductor only .................................. 24

Figure A.18 – Land diameter (d) of BGA/CSP formed at the opening of solder resist ............ 25

Figure A.19 – Examples of fiducial mark and component positioning mark ............................ 26

Table 1 – Applied power (P) that corresponds to a range of thermal resistance

on the plane ............................................................................................................................ 8

Table 2 – Applied power (P) that corresponds to a range of thermal resistance

across the thickness (K/W) ..................................................................................................... 9

Table A.1 – Panel dimensions ............................................................................................... 13

Table A.2 – Allowance of dimensions .................................................................................... 14

Table A.3 – Allowance of the distances from the datum point to perforation and slit ............. 14

Table A.4 – Allowance of the distance from the datum point to the center of the V-cut .......... 15

Table A.5 – Total thickness and its allowance ....................................................................... 16

Table A.6 – Allowance of holes for component insertion........................................................ 16

Table A.7 – Position allowance of component insertion holes ................................................ 17

Table A.8 – Distance between the wall of a hole and board edge .......................................... 18

Table A.9 – Minimum clearance between the wall of a hole and the inner layer

conductor .............................................................................................................................. 18

Table A.10 – Allowance of conductor width ........................................................................... 20

Table A.11 – Allowance of the distance between conductors ................................................. 20

Table A.12 – Allowance of terminal width of a printed contact ............................................... 22

Table A.13 – Allowance of terminal width of a printed contact ............................................... 23

Table A.14 – Allowance of the width of a land of a land pattern ............................................. 24

Table A.15 – Land diameter and its allowance for BGA/CSP ................................................. 25

Table A.16 – Allowance of the land diameter (d) of BGA/CSP formed at the opening of

solder resist .......................................................................................................................... 25

Table A.17 – Shapes and sizes of typical fiducial marks and component positioning

marks ................................................................................................................................... 26

Table A.18 – Minimum thickness of copper plating ................................................................ 26

---------------------- Page: 5 ----------------------
– 4 – IEC 61189-3-913:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 3-913: Test method for thermal conductivity of printed
circuit boards for high-brightness LEDs
FOREWORD

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International Standard IEC 61189-3-913 has been prepared by IEC technical committee 91:

Electronics assembly technology.

This first edition cancels and replaces the first edition of IEC PAS 61189-3-913 published in

2011. This edition constitutes a technical revision. This edition focused only on the test

methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.

The text of this standard is based on the following documents:
FDIS Report on voting
91/1304A/FDIS 91/1328/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.
---------------------- Page: 6 ----------------------
IEC 61189-3-913:2016 © IEC 2016 – 5 –

A list of all parts in the IEC 61189, published under the general title Test methods for

electrical materials, printed boards and other interconnection structures and assemblies, can

be found on the IEC website.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 7 ----------------------
– 6 – IEC 61189-3-913:2016 © IEC 2016
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 3-913: Test method for thermal conductivity of printed
circuit boards for high-brightness LEDs
1 Scope

This part of IEC 61189 specifies the test methods for thermal conductivity specific to printed

circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high-

brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic

control devices (ECDs).
2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and

are indispensable for its application. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any
amendments) applies.

IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

IEC 62326-20, Printed boards – Part 20: Printed circuit boards for high-brightness LEDs

3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60194 apply, unless

otherwise specified.
4 Pre–conditioning

Pre-conditioning described in a) or b) below shall be carried out in accordance with the

specific standard.
a) Leave a specimen for 24 h in the standard condition.

b) Leave a specimen for 60 min in a thermostat chamber at 85 °C and then leave the

specimen for 24 ± 4 h in the standard atmospheric condition.
5 Test methods
5.1 General

In this standard, the following test methods are specified in order to classing the printed

circuit board in accordance with Table 1 in IEC 62326-20.
5.2 Thermal conductivity
5.2.1 Measurement of thermal resistance on the plane

In this subclause, the measurement of thermal resistance on the plane (horizontal direction of

the specimen) is addressed as follows.
---------------------- Page: 8 ----------------------
IEC 61189-3-913:2016 © IEC 2016 – 7 –
a) Apparatus

Use the apparatus specified in EIA/JEDEC STD 51-2, or equivalent. The equipment shall

have a set of a specimen and a thermocouple in the centre of a cubic chamber of 30 cm

side length. An apparatus is shown in Figure 1.
b) Specimen

Unless otherwise specified, use the specimen illustrated in Figure 2. All the dimensions in

Figure 2 shall be requirements. This specimen uses a TEG chip (5 mm × 5 mm) with a

temperature measuring sensor, which is wire-bonded to the centre of the specimen board

as a heat source. The detail specification of the printed board shall be in accordance with

Annex A.
c) Pre-conditioning

Pre-conditioning shall be in accordance with Clause 4. And, the test specimen shall be

fixed horizontally in the chamber of the equipment.

d) Thermal resistance and heat transfer parameter on the plane (horizontal direction of the

specimen). The following procedure shall be respected:
• provide a specimen assembled with a heater with a TEG chip with a temperature
measuring sensor;
• specify the temperature coefficient of the sensor prior to the measurement;

• operate the heater and arrange the applied power (P) based upon the range of thermal

resistance on the plane (horizontal direction of the specimen) as shown in Table 1;

• measure the temperature of the TEG chip with a temperature measuring sensor (T )

and the temperature inside the chamber (T ) after the temperature of the TEG chip

with a temperature measuring sensor has reached a stable state;

• calculate the thermal resistance on the plane (horizontal direction of the specimen)

(R ) with the following equation:
R = (T – T ) / P
p s a

• using the thermal resistance (R ), calculate the thermal transfer parameter (he) by the

following equation:
he = W/m K
R × 0,002 5
Equilibrium verification shall be in accordance with Annex B.
---------------------- Page: 9 ----------------------
– 8 – IEC 61189-3-913:2016 © IEC 2016
Table 1 – Applied power (P) that corresponds to a range of thermal
resistance on the plane
Range of thermal resistance
Applied power on the plane
(horizontal direction of the specimen) (R )
W K/W
0,1 300 > R
0,2 200 < R < 300
0,3 150 < R < 200
0,4 100 < R < 150
0,75
60 < R < 100
1,0 30 < R < 60
2,0 20 < R < 30
3,0 15 < R < 20
5,0 5 < R < 15
10,0 < 5
5.2.2 Measurement of thermal resistance across the thickness

In this subclause, the measurement of thermal resistance across the thickness is addressed

as follows.
a) Apparatus

The testing apparatus is as shown in Figure 3. The apparatus shall consist of a metal

block (aluminium or copper) which can hold the specimen specified in 5.2.1 b) and a

cooling system to keep the temperature of the metal block constant.
b) Specimen
Specimen shall be as specified in 5.2.1 b).
c) Pre-conditioning
Pre-conditioning shall be in accordance with Clause 4.
d) Test
The procedure shall be as follows:

• provide a specimen, which is screwed to the metal block, assembled with a heater that

contains a TEG chip with a temperature measuring sensor;
• specify the temperature coefficient of the sensor prior to the measurement;

• apply thermal conductive materials such as thermal grease between the specimen and

the metal block to reduce thermal resistivity;
• install a thermocouple within a 10 mm distance from the edge of the specimen;
• install another thermocouple in the water sink;
• fix the metal block to the cooling system;
• keep the water temperature constant by the water-cooled system as shown in
Figure 3;

• operate the heater and arrange the applied power (P) based on the thermal resistance

across the thickness, as shown in Table 2;

• measure the temperature of the TEG chip with a temperature measuring sensor (T )

and the temperature on the metal block (T ) as soon as the temperature of the TEG

chip with a temperature measuring sensor has reached the stable state;

• calculate the thermal resistance across the thickness (R ) by the following equation:

---------------------- Page: 10 ----------------------
IEC 61189-3-913:2016 © IEC 2016 – 9 –
R = (T − T ) /P (K/W)
t s b

The thermal conductivity parameter (Ke) shall be calculated with the following equation using

R .
Ke = W/m K
R × 2,5 ×10
where
t is the thickness (m);
–5 2
2,5 × 10 (m ) is the area of the TEG chip with a temperature measuring sensor.
Table 2 – Applied power (P) that corresponds to a range of thermal
resistance across the thickness (K/W)
Applied power Range of thermal resistance across the thickness (R )
W K/W
0,1
300 > R
0,2
200 < R < 300
0,3 150 < R < 200
0,4 100 < R < 150
0,75 60 < R < 100
1,0
30 < R < 60
2,0
20 < R < 30
3,0 15 < R < 20
5,0 5 < R < 15
10,0
R < 5
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– 10 – IEC 61189-3-913:2016 © IEC 2016
Dimensions in millimetres
Thermocouple
Specimen
Arrange as to the heating
TEG (test equipment
group) to the center of the
cabinet
...