SIST EN 61188-5-5:2008

Printed boards and printed board assemblies - Design and use -- Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is above that temperature a sufficient time to form a reliable metallurgical bond.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-5: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit Gullwing-Anschlüssen auf vier Seiten

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-5: Considérations sur les liaisons pistes-soudures - Composants à sorties en aile de mouette sur quatre côtés

La CEI 61188-5-5:2007 fournit des informations sur la géométrie des plages d'accueil utilisées pour la fixation en surface des composants électronique à sorties en aile de mouette sur quatre côtés. Le but des informations indiquées dans la présente norme est de fournir les dimensions, formes et tolérances appropriées des plages d'accueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure, mais également pour permettre l'inspection, la mise en essai et les retouches des joints de brasure.
Cette publication doit être lue conjointement avec la CEI 61188-5-1 :2002.

Tiskane plošče in sestavi tiskanih plošč - Načrtovanje in uporaba - 5-5. del: Zahteve za posamezne dele - Pregledovanje povezav (ploskev/stik) - Komponente z gull-wing vodili na štirih straneh (IEC 61188-5-5:2007)

General Information

• Status: Published
• Publication Date: 11-May-2008
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 03-Dec-2007
• Due Date: 07-Feb-2008
• Completion Date: 12-May-2008
• Ref Project: EN 61188-5-5:2007 - Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61188-5-5:2008
01-junij-2008
7LVNDQHSORãþHLQVHVWDYLWLVNDQLKSORãþ1DþUWRYDQMHLQXSRUDEDGHO
=DKWHYH]DSRVDPH]QHGHOH3UHJOHGRYDQMHSRYH]DYSORVNHYVWLN.RPSRQHQWH
]JXOOZLQJYRGLOLQDãWLULKVWUDQHK,(&
Printed boards and printed board assemblies - Design and use - Part 5-5: Sectional
requirements - Attachment (land/joint) considerations - Components with gull-wing leads
on four sides
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-5:
Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit Gullwing-
Anschlüssen auf vier Seiten
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-5:
Considérations sur les liaisons pistes-soudures - Composants a sorties en aile de
mouette sur quatre côtés
Ta slovenski standard je istoveten z: EN 61188-5-5:2007
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61188-5-5:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

EUROPEAN STANDARD
EN 61188-5-5

NORME EUROPÉENNE
November 2007
EUROPÄISCHE NORM

ICS 31.180


English version


Printed boards and printed board assemblies -
Design and use -
Part 5-5: Attachment (land/joint) considerations -
Components with gull-wing leads on four sides
(IEC 61188-5-5:2007)


Cartes imprimées et  Leiterplatten und Flachbaugruppen -
cartes imprimées équipées - Konstruktion und Anwendung -
Conception et utilisation - Teil 5-5: Betrachtungen zur Montage
Partie 5-5: Considérations (Anschlussfläche/Verbindung) -
sur les liaisons pistes-soudures - Bauelemente mit
Composants à sorties Gullwing-Anschlüssen
en aile de mouette sur quatre côtés auf vier Seiten
(CEI 61188-5-5:2007) (IEC 61188-5-5:2007)




This European Standard was approved by CENELEC on 2007-11-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-5-5:2007 E

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EN 61188-5-5:2007 - 2 -
Foreword
The text of document 91/704/FDIS, future edition 1 of IEC 61188-5-5, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61188-5-5 on 2007-11-01.
This standard is to be used in conjunction with EN 61188-5-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-08-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2010-11-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61188-5-5:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-54 NOTE  Harmonized as EN 60068-2-54:2006 (not modified).
IEC 60068-2-58 NOTE  Harmonized as EN 60068-2-58:2004 (not modified).
IEC 61191-1 NOTE  Harmonized as EN 61191-1:1998 (not modified).
__________

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- 3 - EN 61188-5-5:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1) 2)
IEC 61188-5-1 - Printed boards and printed board EN 61188-5-1 2002
assemblies - Design and use -
Part 5-1: Attachment (land/joint)
considerations - Generic requirements




1)
Undated reference.
2)
Valid edition at date of issue.

---------------------- Page: 4 ----------------------

IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD

Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.180 ISBN 2-8318-9342-9

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– 2 – 61188-5-5 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .8
3.4 Process considerations .8
4 PQFP (square) .8
4.1 Field of application .8
4.2 Component descriptions .8
4.3 Component dimensions .9
4.4 Solder joint fillet design .13
4.5 Land pattern dimensions .14
5 PQFP (rectangular) .17
5.1 Field of application .17
5.2 Component descriptions .18
5.3 Component dimensions .19
5.4 Solder joint fillet design .19
5.5 Land pattern dimensions .21
6 PLQFP (square) .23
6.1 Field of application .23
6.2 Component descriptions .23
6.3 Component dimensions .24
6.4 Solder joint fillet design .26
6.5 Land pattern dimensions .28
7 PLQFP (rectangular) .31
7.1 Field of application .31
7.2 Component descriptions .31
7.3 Component dimensions .32
7.4 Solder joint fillet design .33
7.5 Land pattern dimensions .34
8 PTQFP (square) .35
8.1 Field of application .35
8.2 Component descriptions .35
8.3 Component dimensions .36
8.4 Solder joint fillet design .39
8.5 Land pattern dimensions .40

Figure 1 – PQFP (square).9
Figure 2 – PQFP (square) component dimensions .10
Figure 3 – Solder joint fillet design.14
Figure 4 – PQFP (square) land pattern dimensions.17

---------------------- Page: 6 ----------------------

61188-5-5 © IEC:2007(E) – 3 –
Figure 5 – PQFP (rectangular) .18
Figure 6 – PQFP (rectangular) component dimensions .19
Figure 7 – Solder joint fillet design.21
Figure 8 – PQFP (rectangular) land pattern dimensions .22
Figure 9 – PLQFP (square) .23
Figure 10 – PLQFP (square) component dimensions .24
Figure 11 – Solder joint fillet design.28
Figure 12 – PLQFP (square) land pattern dimensions .31
Figure 13 – PLQFP (rectangular) .32
Figure 14 – PLQFP (rectangular) component dimensions.32
Figure 15 – Solder joint fillet design.34
Figure 16 – PLQFP (rectangular) land pattern dimensions .35
Figure 17 – PTQFP (square).36
Figure 18 – PTQFP component dimensions .37
Figure 19 – Solder joint fillet design.40
Figure 20 – PTQFP land pattern dimensions.42

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– 4 – 61188-5-5 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –

Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-5 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/704/FDIS 91/736/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-5 is to be read in conjunction with IEC 61188-5-1.

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61188-5-5 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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– 6 – 61188-5-5 © IEC:2007(E)
INTRODUCTION
This part of IEC 61188 covers land patterns for components with gull-wing leads on four sides.
Each clause gives information in accordance with the following format.
The proposed land pattern dimensions in this standard are based upon the fundamental
tolerance calculation combined with the given land protrusions and courtyard excesses (see
IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal
manufacturing necessities.
The unaltered land pattern dimensions of this part are generally applicable for the solder
paste application plus reflow soldering process. For application of the wave soldering process,
the land pattern dimensions normally have to be modified. Orientation parallel to the wave
direction is preferable and special, suitably dimensioned solder thieves should be added.
This standard offers a threefold land pattern dimensioning (levels 1, 2, and 3) on the basis of
a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn)
and minimum (min.). Each land pattern has been assigned an identification number to indicate
the characteristics of the specific robustness of the land patterns. Users also have the
opportunity to organize the information so that it is most useful for their particular design.
If a user has good reason to use a concept different from that of IEC 61188-5-1, or if the user
prefers unusual land protrusions, this standard should be used for checking the resulting
solder fillet size.
It is the responsibility of the user to verify the SMD land patterns used for achieving an
undisturbed mounting process including testing and an ensured reliability for the product
stress conditions in use.
Component dimensions listed in this standard are those available on the market and should
be regarded as for reference only.

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61188-5-5 © IEC:2007(E) – 7 –
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –

Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides



1 Scope
This part of IEC 61188 provides information on land pattern geometries used for the surface
attachment of electronic components with gull-wing leads on four sides. The intent of the
information presented herein is to provide the appropriate size, shape and tolerances of
surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also
allow for inspection, testing and reworking of those solder joints.
Each clause contains a specific set of criteria such that the information presented is
consistent, providing information on the component, the component dimensions, the solder
joint design and the land pattern dimensions.
The land pattern dimensions are based on a mathematical model that establishes a platform
for a solder joint attachment to the printed board. The existing models create a platform that is
capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.).
Process requirements for solder reflow are different based on the solder alloy and should be
analyzed in order that the process is above that temperature a sufficient time to form a
reliable metallurgical bond.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61188-5-1, Printed boards and printed board assemblies – Design and use – Part 5-1:
Attachment (land/joint) considerations – Generic requirements
3 General information
3.1 General component description
The four-sided gull wing family is characterized by gull-wing leads on four sides of a square or
rectangular package. The family includes both molded plastic and ceramic case styles. The
acronyms PQFP (plastic quad flat pack) and CQFP (ceramic quad flat pack) are also used to
describe the family.
There are several lead pitches within the family form 1,0 mm to 0,30 mm. High lead-court
packages are available in this family that accommodate complex, high lead-count chips.
3.2 Marking
The PQFP and CQFP families of parts are generally marked with the manufacturer’s part
numbers, manufacturer’s name or symbol and a pin 1 indicator. Some parts may have a pin 1
feature in the case shape instead of pin 1 marking. Additional markings may include date-
code manufacturing lot and/or manufacturing location.

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– 8 – 61188-5-5 © IEC:2007(E)
3.3 Carrier packaging format
Carrier packaging format may be provided in tube but packaging tray carries are preferred for
best handling and high volume applications. Bulk packaging is not acceptable because of lead
co-planarity required for placement and soldering.
3.4 Process considerations
PQFP and CQFP packages are normally processed by reflow solder operations.
High lead-count fine pitch parts may require special processing outside the normal pick/place
and reflow manufacturing operations.
4 PQFP (square)
4.1 Field of application
This clause provides the component and land pattern dimensions for square PQFP (plastic
quad flat pack) components. Basic construction of the PQFP device is also covered. At the
end of this clause is a listing of the tolerances and target solder joint dimensions used to
arrive at the land pattern dimensions.
4.2 Component descriptions
PQFPs are widely used in a variety of applications for commercial, industrial or military
electronics.
4.2.1 Basic construction
The quad flat pack has been developed for applications requiring low height and high density.
The PQFP, along with the LSOP components, are frequently used in memory card
applications (see Figure 1).
4.2.1.1 Termination materials
Leads shall be solder-coated with a tin/lead alloy. The solder should contain between 58 % to
68 % tin. Solder may be applied to the leads by hot dipping or by plating from solution. Plated
solder terminations should be subjected to post plating reflow operation to fuse the solder.
The tin/lead finish should be at least 0,007 5 mm thick.
4.2.1.2 Marking
All parts shall be marked with a part number and an index area. The index area shall identify
the location of pin 1.
4.2.1.3 Carrier package format
The carrier package format for flat packs may be tubular in shape but, in most instances, flat
packs are delivered in a carrier tray.
4.2.1.4 Process considerations
PQFPs are usually processed using standard reflow solder processes. Parts should be
capable of withstanding ten cycles through a standard reflow system operating at 235 °C.
Each cycle shall consist of 60 s exposure at 235 °C.

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61188-5-5 © IEC:2007(E) – 9 –

IEC  2022/07

Figure 1 – PQFP (square)
4.3 Component dimensions
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA sheets.
Figure 2 provides the component dimensions for PQFP (square) components.

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– 10 – 61188-5-5 © IEC:2007(E)


Lp
A
L1
S
IEC  2023/07

Dimensions in millimetres
L2 L1 Lp
EIAJ codes JEDEC code
Min. Max. Min. Max. Min. Max.
P-QFP-0036-0505-1,00 P-QFP/036-5x5-1,00 12,95 13,45 12,95 13,45 0,73 1,03
P-QFP-0044-0505-0,80 P-QFP/044-5x5-0,80 12,95 13,45 12,95 13,45 0,73 1,03
P-QFP-0052-0505-0,65 P-QFP/052-5x5-0,65 12,95 13,45 12,95 13,45 0,73 1,03
P-QFP-0048-1212-0,80 P-QFP/048-12x12-0,80 14,95 15,45 14,95 13,45 0,73 1,03
P-QFP-0052-1414-1,00 P-QFP/052-14x14-1,00 16,95 17,45 16,95 17,45 0,73 1,03
P-QFP-0064-1414-0,80 P-QFP/064-14x14-0,80 16,95 17,45 16,95 17,45 0,73 1,03
P-QFP-0080-1414-0,65 P-QFP/080-14x14-0,65 15,75 17,45 16,95 17,45 0,73 1,03
P-QFP-0100-1414-0,50 P-QFP/100-14x14-0,50 15,75 16,25 15,75 16,25 0,45 0,75
P-QFP-0120-1414-0,40 P-QFP/120-14x14-0,40 15,75 16,25 15,75 16,25 0,45 0,75
P-QFP-0168-1414-0,30 P-QFP/168-14x14-0,30 15,75 16,25 15,75 16,25 0,45 0,75
P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80
22,95 23,45 22,95 23,45 0,73 1,03
W S* B A P H
Remarks
Min. Nom. Max. Min. Max.
0,34 0,40 0,46 10,89 11,55 10,0 10,0 1,00 2,45
0,29 0,35 0,41 10,89 11,55 10,0 10,0 0,80 2,45
0,22 0,30 0,36 10,89 11,55 10,0 10,0 0,65 2,45
0,29 0,35 0,41 12,89 13,55 12,0 12,0 0,80 2,45
0,34 0,40 0,46 14,89 15,55 14,0 14,0 1,00 3,15
0,29 0,35 0,41 14,89 15,55 14,0 14,0 0,80 3,15
0,22 0,30 0,36 14,89 15,55 14,0 14,0 0,65 3,15
0,17 0,20 0,23 14,25 14,91 14,0 14,0 0,50 3,15
0,13 0,16 0,19 14,25 14,91 14,0 14,0 0,40 3,15
0,09 0,12 0,15 14,25 14,91 14,0 14,0 0,40 3,15
0,34 0,40 0,46 20,89 21,55 20,0 20,0 1,00 3,15 Low stand-off
0,34 0,40 0,46 20,89 21,55 20,0 20,0 1,00 3,40 High stand-off
0,29 0,35 0,41 20,89 21,55 20,0 20,0 0,80 3,15 Low stand-off
0,29 0,35 0,41 20,89 21,55 20,0 20,0 0,80 3,40 High stand-off
* Calculated value.

Figure 2 – PQFP (square) component dimensions
L2
B
H W P
0,25

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61188-5-5 © IEC:2007(E) – 11 –


Lp
A
L1
S
IEC  2023/07

Dimensions in millimetres
L2 L1 Lp
EIAJ codes JEDEC code
Min. Max. Min. Max. Min. Max.
P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0240-2020-0,30 P-QFP/240-20x20-0,30 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 30,95 31,45 30,95 31,45 0,73 1,03
P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 30,95 31,45 30,95 31,45 0,73 1,03
P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 30,95 31,45 30,95 31,45 0,73 1,03

W S*
B A P H Remarks
Min. Nom. Max. Min. Max.
0,22 0,30 0,36 20,89 21,55 20,0 20,0 0,65 3,15 Low stand-off
0,22 0,30 0,36 20,89 21,55 20,0 20,0 0,65 3,40 High stand-off
0,17 0,2 0,23 20,25 20,91 20,0 20,0 0,50 3,15 Low stand-off
0,17 0,2 0,23 20,25 20,91 20,0 20,0 0,50 3,40 High stand-off
0,13 0,16 0,19 20,25 20,91 20,0 20,0 0,40 3,15 Low stand-off
0,13 0,16 0,19 20,25 20,91 20,0 20,0 0,40 3,40 High stand-off
0,09 0,12 0,15 20,25 20,91 20,0 20,0 0,30 3,40 Low stand-off
0,17 0,2 0,23 24,85 25,51 24,0 24,0 0,50 3,85 High stand-off
0,17 0,2 0,23 24,85 25,51 24,0 24,0 0,50 4,10 Low stand-off
0,13 0,16 0,19 24,85 25,51 24,0 24,0 0,40 3,85 High stand-off
0,13 0,16 0,19 24,85 25,51 24,0 24,0 0,40 4,10 Low stand-off
0,29 0,35 0,41 28,89 29,55 28,0 28,0 0,80 3,85 High stand-off
0,29 0,35 0,41 28,89 29,55 28,0 28,0 0,80 4,10 Low stand-off
0,22 0,3 0,36 28,89 29,55 28,0 28,0 0,65 3,85 High stand-off
* Calculated value.
Figure 2 (continued)

L2
B
H W P
0,25

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– 12 – 61188-5-5 © IEC:2007(E)

Lp
A
L1
S
IEC  2023/07

Dimensions in millimetres
EIAJ codes JEDEC code L2 L1 Lp
...