SIST EN 60191-6-12:2011

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

Mechanische Normung von Halbleiterbauelementen - Teil 6-12: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Land-Grid-Array (FLGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers FLGA

La CEI 60191-6-12:2011 fournit les dessins d'encombrement, les dimensions, et les variations recommandées, normalisés pour tous les boîtiers matriciels à plots et à pas fins (FLGA: Fine-Pitch Ball Grid Array Package) comportant des pas de bornes inférieurs ou égaux à 0,8 mm. La présente édition inclut les modifications significatives suivantes par rapport à l'édition antérieure:  - le domaine d'application est étendu afin que la présente norme couvre aussi les FLGA de type carré. Le titre de la norme a été modifié en conséquence. 'Type rectangulaire'  a été supprimé du titre;  - le pas de bille de 0,3 mm a été ajouté;  - la référence passe de 'référence du corps' à 'référence de la bille';  - les listes de combinaison de D, E, MD, et ME ont été révisées.

Standardizacija mehanskih lastnosti polprevodniških elementov - 6-12. del: Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov za površinsko montažo - Vodilo za konstruiranje drobne rastrske mreže priključkov v ravnini (FLGA)

Ta del IEC 60191 podaja standardne tehnične risbe, mere in priporočene variacije vseh paketov drobnih rastrskih mrež priključkov v ravnini (FLGA) z zaključnim rastrom 0,8 mm ali manj.

General Information

• Status: Published
• Publication Date: 15-Sep-2011
• ICS: 01.100.25 - Electrical and electronics engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 07-Sep-2011
• Due Date: 12-Nov-2011
• Completion Date: 16-Sep-2011
• Ref Project: EN 60191-6-12:2011 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Relations

• Replaces: SIST EN 60191-6-12:2005 - Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
• Effective Date: 28-Jan-2023
• Revised: SIST EN 60191-6-12:2005 - Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
• Effective Date: 12-Oct-2010
• Revised: SIST EN 60191-6-12:2005 - Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
• Effective Date: 06-May-2014
• Replaces: SIST EN 60191-6-12:2005 - Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-12:2011
01-oktober-2011
6WDQGDUGL]DFLMDPHKDQVNLKODVWQRVWLSROSUHYRGQLãNLKHOHPHQWRYGHO
6SORãQDSUDYLOD]DSULSUDYRWHKQLþQLKULVERNURYRYSROSUHYRGQLãNLKHOHPHQWRY]D
SRYUãLQVNRPRQWDåR9RGLOR]DNRQVWUXLUDQMHGUREQHUDVWUVNHPUHåHSULNOMXþNRYY
UDYQLQL)/*$
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Design guide for fine-pitch land grid array (FLGA)
Mechanische Normung von Halbleiterbauelementen - Teil 6-12: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen -
Konstruktionsleitfaden für Feinraster-Land-Grid-Array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12: Règles
générales pour la préparation des dessins d'encombrement des dispositifs à
semiconducteurs pour montage en surface - Guide de conception pour les boîtiers FLGA
Ta slovenski standard je istoveten z: EN 60191-6-12:2011
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-12:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 60191-6-12:2011

---------------------- Page: 2 ----------------------

SIST EN 60191-6-12:2011

EUROPEAN STANDARD
EN 60191-6-12

NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM

ICS 31.080.01 Supersedes EN 60191-6-12:2002


English version


Mechanical standardization of semiconductor devices -
Part 6-12: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages -
Design guidelines for fine-pitch land grid array (FLGA)
(IEC 60191-6-12:2011)


Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Partie 6-12: Règles générales pour la Teil 6-12: Allgemeine Regeln für die
préparation des dessins d'encombrement Erstellung von Gehäusezeichnungen von
des boîtiers des dispositifs à SMD-Halbleitergehäusen -
semiconducteurs à montage en surface - Konstruktionsleitfaden für Feinraster-
Lignes directrices de conception pour les Land-Grid-Array (FLGA)
boîtiers matriciels à plots et à pas fins (IEC 60191-6-12:2011)
(FLGA)
(CEI 60191-6-12:2011)


This European Standard was approved by CENELEC on 2011-07-13. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-12:2011 E

---------------------- Page: 3 ----------------------

SIST EN 60191-6-12:2011
EN 60191-6-12:2011 - 2 -
Foreword
The text of document 47D/784/CDV, future edition 2 of IEC 60191-6-12, prepared by SC 47D, Mechanical
standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the
IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-12 on 2011-07-13.
This European Standard supersedes EN 60191-6-12:2002.
EN 60191-6-12:2011 includes the following significant changes with respect to EN 60191-6-12:2002:
a) scope is expanded so that this standard include the square type FLGA. The title of this standard has
been changed accordingly: “Rectangular type” has been deleted from the title;
b) ball pitch of 0,3 mm has been added;
c) datum is changed from the body datum to the ball datum;
d) combination lists of D, E, M , and M have been revised.
D E
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2012-04-13
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-07-13
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-12:2011 was approved by CENELEC as a European
Standard without any modification.
__________

---------------------- Page: 4 ----------------------

SIST EN 60191-6-12:2011
- 3 - EN 60191-6-12:2011
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60191 Series Mechanical standardization of semiconductor EN 60191 Series
devices


IEC 60191-6 - Mechanical standardization of semiconductor EN 60191-6 -
devices -
Part 6: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages

---------------------- Page: 5 ----------------------

SIST EN 60191-6-12:2011

---------------------- Page: 6 ----------------------

SIST EN 60191-6-12:2011

IEC 60191-6-12
®

Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Mechanical standardization of semiconductor devices –
Part 6-12: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guidelines for fine-pitch land
grid array (FLGA)

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-12: Règles générales pour la préparation des dessins d'encombrement
des boîtiers des dispositifs à semiconducteurs à montage en surface – Lignes
directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.080.01 ISBN 978-2-88912-527-2

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 60191-6-12:2011
– 2 – 60191-6-12 © IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Nominal package dimension . 6
6 Outline drawings and principle dimensions . 7
7 Dimensions . 10

Figure 1 – Flange-type FLGA . 6
Figure 2 – Rectangle-type FLGA . 6
Figure 3 – Flange-type FLGA . 7
Figure 4 – Rectangle-type FLGA . 8
e
Figure 5 – Mechanical gauge drawing . 9
f
Figure 6 – Pattern of terminal position area . 9

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability . 10
Table 2 – Group 2: Dimensions and tolerances . 14
Table 3 – Combination list of D, E, M , and M – e = 0,80mm pitch . 15
D E
Table 4 – Combination list of D, E, M , and M – e = 0,65 mm pitch . 16
D E
Table 5 – Combination list of D, E, M , and M – e = 0,50 mm pitch . 17
D E
Table 6 – Combination list of D, E, M , and M – e = 0,40 mm pitch . 18
D E
Table 7 – Combination list of D, E, M , and M – e = 0,30 mm pitch . 19
D E

---------------------- Page: 8 ----------------------

SIST EN 60191-6-12:2011
60191-6-12 © IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-12: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guidelines for fine-pitch land grid array (FLGA)


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-12 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This second edition of IEC 60191-6-12 cancels and replaces the first edition, published in
2002 and constitutes a technical revision. This edition includes the following significant
changes with respect to the previous edition:
a) scope is expanded so that this standard include the square type FLGA. The title of this
standard has been changed accordingly: “Rectangular type” has been deleted from the
title.
b) ball pitch of 0,3 mm has been added;
c) datum is changed from the body datum to the ball datum;
d) combination lists of D, E, M , and M have been revised.
D E

---------------------- Page: 9 ----------------------

SIST EN 60191-6-12:2011
– 4 – 60191-6-12 © IEC:2011
The text of this standard is based on the following documents:
CDV Report on voting
47D/784/CDV 47D/795/RVC

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC
...