Field Device Integration (FDI) - Part 101-2: Profiles - Foundation Fieldbus HSE (IEC 62769-101-2:2020)

IEC 62769-101-2:2020 is available as IEC 62769-101-2:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-101-2:2020 specifies the IEC 62769 profile for IEC 61784 1, CP 1/2 (FOUNDATION™ Fieldbus HSE).

Feldgeräteintegration (FDI) - Teil 101-2: Profile - Foundation Fieldbus HSE (IEC 62769-101-2:2020)

Intégration des appareils de terrain (FDI) - Partie 101-2: Profils - Foundation Fieldbus HSE (IEC 62769-101-2:2020)

IEC 62769-101-2:2020 est disponible sous forme de IEC 62769-101-2:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 62769-101-2:2020 spécifie le profil de l'IEC 62769 pour le profil de communication CP 1/2 (FOUNDATION™ Fieldbus HSE) défini dans l'IEC 61784-1.

Integracija procesne naprave (FDI) - 101-2. del: Profili - Osnovno procesno vodilo HSE (IEC 62769-101-2:2020)

General Information

Status
Published
Public Enquiry End Date
19-Dec-2018
Publication Date
03-Mar-2021
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
12-Jan-2021
Due Date
19-Mar-2021
Completion Date
04-Mar-2021

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SLOVENSKI STANDARD
SIST EN IEC 62769-101-2:2021
01-april-2021
Nadomešča:
SIST EN 62769-101-2:2015

Integracija procesne naprave (FDI) - 101-2. del: Profili - Osnovno procesno vodilo

HSE (IEC 62769-101-2:2020)

Field Device Integration (FDI) - Part 101-2: Profiles - Foundation Fieldbus HSE (IEC

62769-101-2:2020)

Feldgeräteintegration (FDI) - Teil 101-2: Profile - Foundation Fieldbus HSE (IEC 62769-

101-2:2020)

Intégration des appareils de terrain (FDI) - Partie 101-2: Profils - Foundation Fieldbus

HSE (IEC 62769-101-2:2020)
Ta slovenski standard je istoveten z: EN IEC 62769-101-2:2021
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
SIST EN IEC 62769-101-2:2021 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 62769-101-2:2021
---------------------- Page: 2 ----------------------
SIST EN IEC 62769-101-2:2021
EUROPEAN STANDARD EN IEC 62769-101-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
January 2021
ICS 25.040.40; 35.100.05 Supersedes EN 62769-101-2:2015 and all of its
amendments and corrigenda (if any)
English Version
Field Device Integration (FDI) - Part 101-2: Profiles - Foundation
Fieldbus HSE
(IEC 62769-101-2:2020)

Intégration des appareils de terrain (FDI) - Partie 101-2: Feldgeräteintegration (FDI) - Teil 101-2: Profile -

Profils - Foundation Fieldbus HSE Foundation Fieldbus HSE
(IEC 62769-101-2:2020) (IEC 62769-101-2:2020)

This European Standard was approved by CENELEC on 2020-12-24. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62769-101-2:2021 E
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SIST EN IEC 62769-101-2:2021
EN IEC 62769-101-2:2021 (E)
European foreword

The text of document 65E/621/CDV, future edition 2 of IEC 62769-101-2, prepared by SC 65E

"Devices and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement,

control and automation" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 62769-101-2:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2021-09-24

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2023-12-24

document have to be withdrawn

This document supersedes EN 62769-101-2:2015 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62769-101-2:2020 was approved by CENELEC as a

European Standard without any modification.
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SIST EN IEC 62769-101-2:2021
EN IEC 62769-101-2:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61784-1 - Industrial communication networks - EN IEC 61784-1 -
Profiles Part 1: Fieldbus profiles
IEC 61784-2 - Industrial communication networks - EN IEC 61784-2 -
Profiles - Part 2: Additional fieldbus
profiles for real-time networks based on
ISO/IEC/IEEE 8802-3
IEC 61804 series Devices and integration in enterprise EN IEC 61804-3 series
systems - Function blocks (FB) for
process control and electronic device
description language (EDDL)
IEC 62541-6 - OPC Unified Architecture - Part 6: EN IEC 62541-6 -
Mappings
IEC 62541-100 2015 OPC Unified Architecture - Part 100: EN 62541-100 2015
Device Interface
IEC 62769-2 - Field Device Integration (FDI) - Part 2: EN 62769-2 -
FDI Client
IEC 62769-3 - Field Device Integration (FDI) - Part 3: EN 62769-3 -
FDI Server
IEC 62769-4 - Field Device Integration (FDI) - Part 4: EN 62769-4 -
FDI Packages
IEC 62769-5 - Field Device Integration (FDI) - Part 5: EN 62769-5 -
FDI Information Model
IEC 62769-6 - Field Device Integration (FDI) - Part 6: EN 62769-6 -
FDI Technology Mapping
IEC 62769-7 - Field Device Integration (FDI) - Part 7: EN 62769-7 -
FDI Communication Devices

IEC 62769-101-1 - Field device Integration (FDI) - Part 101- EN IEC 62769-101-1 -

1: Profiles - Foundation Fieldbus H1
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SIST EN IEC 62769-101-2:2021
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SIST EN IEC 62769-101-2:2021
IEC 62769-101-2
Edition 2.0 2020-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Field device integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
Intégration des appareils de terrain (FDI) –
Partie 101-2: Profils – Foundation Fieldbus HSE
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9064-4

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 62769-101-2:2021
– 2 – IEC 62769-101-2:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms, definitions, abbreviated terms and conventions .................................................... 7

3.1 Terms and definitions .............................................................................................. 7

3.2 Abbreviated terms ................................................................................................... 7

3.3 Conventions ............................................................................................................ 7

3.3.1 EDDL syntax.................................................................................................... 7

3.3.2 XML syntax ...................................................................................................... 7

4 Profile for CP 1/2 (FOUNDATION™ HSE) ........................................................................... 7

4.1 General ................................................................................................................... 7

4.2 Catalog profile ........................................................................................................ 7

4.2.1 Protocol support file ......................................................................................... 7

4.2.2 CommunicationProfile definition ....................................................................... 8

4.2.3 Profile device ................................................................................................... 8

4.2.4 Protocol version information ............................................................................ 8

4.3 Associating a Package with a CP 1/2 device ........................................................... 8

4.3.1 Device type identification mapping ................................................................... 8

4.3.2 Device type revision mapping .......................................................................... 9

4.4 Information Model mapping ..................................................................................... 9

4.4.1 ProtocolType definition .................................................................................... 9

4.4.2 DeviceType mapping ....................................................................................... 9

4.4.3 FunctionalGroup Identification definition ........................................................ 10

4.4.4 BlockType property mapping ......................................................................... 10

4.4.5 Mapping to Block ParameterSet ..................................................................... 11

4.5 Topology elements ................................................................................................ 11

4.5.1 ConnectionPoint definition ............................................................................. 11

4.5.2 Communication Device definition ................................................................... 12

4.5.3 Communication service provider definition ..................................................... 13

4.5.4 Network definition .......................................................................................... 14

4.6 Methods ................................................................................................................ 15

4.6.1 Methods for FDI Communication Servers ....................................................... 15

4.6.2 Methods for Gateways ................................................................................... 21

Annex A (normative) Topology scan schema ........................................................................ 22

A.1 General ................................................................................................................. 22

A.2 Network ................................................................................................................ 22

A.3 FoundationHSEAddressT ...................................................................................... 22

A.4 FoundationHSEConnectionPointT ......................................................................... 22

A.5 FoundationHSENetworkT ...................................................................................... 23

A.6 FoundationBlockIdentificationT ............................................................................. 23

A.7 FoundationIdentificationT ...................................................................................... 24

Annex B (normative) Transfer service parameters ................................................................ 26

Annex C (informative) Communication service arguments for Transfer Method ................... 27

Bibliography .......................................................................................................................... 28

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SIST EN IEC 62769-101-2:2021
IEC 62769-101-2:2020 © IEC 2020 – 3 –

Table 1 – Capability File part .................................................................................................. 8

Table 2 – CommunicationProfile definition .............................................................................. 8

Table 3 – Device type catalog mapping ................................................................................... 9

Table 4 – ProtocolType Foundation_HSE definition ................................................................ 9

Table 5 – Inherited DeviceType property mapping .................................................................. 9

Table 6 – Identification parameters ....................................................................................... 10

Table 7 – Inherited BlockType property mapping................................................................... 10

Table 8 – ConnectionPointType ConnectionPoint_Foundation_HSE definition....................... 11

Table 9 – Communication device ParameterSet definition ..................................................... 13

Table 10 – Method Connect arguments ................................................................................. 15

Table 11 – Method Disconect arguments .............................................................................. 16

Table 12 – Method Transfer arguments ................................................................................. 17

Table 13 – Method GetPublishedData arguments.................................................................. 19

Table 14 – Method SetAddress arguments ............................................................................ 20

Table A.1 – Attributes of FoundationHSEConnectionPointT .................................................. 23

Table A.2 – Elements of FoundationHSEConnectionPointT ................................................... 23

Table A.3 – Elements of FoundationHSENetworkT ................................................................ 23

Table A.4 – Attributes of FoundationBlockIdentificationT....................................................... 24

Table A.5 – Attributes of FoundationIdentificationT ............................................................... 24

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SIST EN IEC 62769-101-2:2021
– 4 – IEC 62769-101-2:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62769-101-2 has been prepared by subcommittee 65E: Devices and

integration in enterprise systems, of IEC technical committee 65: Industrial-process

measurement, control and automation.

This second edition cancels and replaces the first edition published in 2015. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) support for generic protocol extension for faster adoption of other technologies;

b) support for Package developers to build EDDs targeted for today’s EDD bases system under

a single development tool.
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SIST EN IEC 62769-101-2:2021
IEC 62769-101-2:2020 © IEC 2020 – 5 –
The text of this International Standard is based on the following documents:
CDV Report on voting
65E/621/CDV 65E/684/RVC

Full information on the voting for the approval of this International Standard can be found in the

report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62769 series, published under the general title Field device

integration (FDI), can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SIST EN IEC 62769-101-2:2021
– 6 – IEC 62769-101-2:2020 © IEC 2020
FIELD DEVICE INTEGRATION (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
1 Scope

This part of IEC 62769 specifies the IEC 62769 profile for IEC 61784-1, CP 1/2 (FOUNDATION™

Fieldbus HSE) .
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.

IEC 61784-1, Industrial communication networks – Profiles – Part 1: Fieldbus Profiles

IEC 61784-2, Industrial communication networks – Profiles – Part 2: Additional fieldbus profiles

for real-time networks based on ISO/IEC/IEEE 8802-3

IEC 61804 (all parts), Function blocks (FB) for process control and electronic device description

language (EDDL)
IEC 62541-6, OPC unified architecture – Part 6: Mappings
IEC 62541-100:2015, OPC unified architecture – Part 100: Device Interface
IEC 62769-2, Field Device Integration (FDI) – Part 2: FDI Client
IEC 62769-3, Field Device Integration (FDI) – Part 3: FDI Server
IEC 62769-4, Field Device Integration (FDI) – Part 4: FDI Packages
IEC 62769-5, Field Device Integration (FDI) – Part 5: FDI Information Model
IEC 62769-6, Field Device Integration (FDI) – Part 6: FDI Technology Mapping
IEC 62769-7, Field Device Integration (FDI) – Part 7: FDI Communication Devices

IEC 62769-101-1, Field Device Integration (FDI) – Part 101-1: Profiles – Foundation

Fieldbus H1
_____________

FOUNDATION™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the

convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its

products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name

holder.
---------------------- Page: 12 ----------------------
SIST EN IEC 62769-101-2:2021
IEC 62769-101-2:2020 © IEC 2020 – 7 –
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 61784-1,

IEC 61784-2, IEC 61804 (all parts), IEC 62541-100, IEC 62769-2, IEC 62769-3, IEC 62769-4,

IEC 62769-5, IEC 62769-6, IEC 62769-7 and IEC 62769-101-1 apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2 Abbreviated terms
For the purposes of this document, the following abbreviated terms apply:
CFF common file format
CP communication profile (see IEC 61784-1 or IEC 61784-2)
CPF communication profile family (see IEC 61784-1 or IEC 61784-2)
EDD Electronic Device Description (see IEC 61804 (all parts))
FB Function Block
IM Information Model
SMIB System Management Information Base
VFD virtual field device
3.3 Conventions
3.3.1 EDDL syntax

This document specifies content for the EDD component that is part of FDI Communication

Packages. EDDL syntax uses the font Courier New. EDDL syntax is used for method
signature, variable, data structure and component declarations.
3.3.2 XML syntax

XML syntax examples use the font Courier New. The XML syntax is used to describe XML

document schema.
EXAMPLE
4 Profile for CP 1/2 (FOUNDATION™ HSE)
4.1 General

This profile specifies the protocol specifics needed for FDI Packages describing communication

servers, gateways and devices. Requirements for Direct Access transfer service parameters

are given in Annex B.
4.2 Catalog profile
4.2.1 Protocol support file

Each CP 1/2 FDI Device Package shall contain a capability file. The capability file part is

described in Table 1.
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SIST EN IEC 62769-101-2:2021
– 8 – IEC 62769-101-2:2020 © IEC 2020
Table 1 – Capability File part
Parameter Description
Content Type txt/plain
Root Namespace Not applicable

Source Relationship http://fdi-cooperation.com/2010/relationships/attachment-protocol

Filename Use file extension .CFH
4.2.2 CommunicationProfile definition

IEC 62769-4 defines a CommunicationProfileT string type for the Catalog XML schema.

Table 2 defines the CP 1/2 specific values for this string.
Table 2 – CommunicationProfile definition
CommunicationProfile Description
foundation_hse CP 1/2 device type
4.2.3 Profile device
Not supported in this document.
4.2.4 Protocol version information

IEC 62769-4 defines an element type named InterfaceT for the Catalog XML Schema. Element

type InterfaceT contains an element named Version which is supposed to provide version

information about the applied communication protocol profile. The value follows the

IEC 62769-4 defined version information schema defined in element type VersionT.

The major version part of VersionT shall be set to the ITK_VER parameter. The minor and builds

parts shall be set to 0.
EXAMPLE For ITK_VER 5, the value for InterfaceT is 5.0.0.
4.3 Associating a Package with a CP 1/2 device
4.3.1 Device type identification mapping

CP 1/2 device types are uniquely identified by the parameters MANUFAC_ID, DEVICE_TYPE

and DEV_REV found in the Resource Block of the Function Block VFD. These parameters are

used to associate a given device instance to an FDI Device Package. These parameters are

mapped to the FDI Device Package Catalog according to Table 3.
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SIST EN IEC 62769-101-2:2021
IEC 62769-101-2:2020 © IEC 2020 – 9 –
Table 3 – Device type catalog mapping
Catalog Element CP Mapping
Manufacturer element of InterfaceT (IEC 62769-4) MANUFAC_ID
String format "0xdddd" where dddd is the
MANUFAC_ID number in hexadecimal format.
DeviceModel element of InterfaceT String format DEVICE_TYPE
"0xdddd" where dddd is the DEVICE_TYPE number in
String format "0xdddd" where dddd is the
hexadecimal format. (IEC 62769-4)
DEVICE_TYPE number in hexadecimal format.
DeviceRevision element
DEV_REV
ListOfSupportedDeviceRevisionsT (IEC 62769-4)
String format "x.0.0" where x is the DEV_REV in
decimal format (no leading zeros).
Conditional: Shall be available if the device exposes a Function Block VFD.
4.3.2 Device type revision mapping
Each device type is identified per 4.3.1. A device may also include a parameter

COMPATIBILITY_REV from the Resource Block. This parameter specifies the lowest device

version (DEV_REV) that a new device can replace while maintaining compatibility with a prior

FDI Device Package.
4.4 Information Model mapping
4.4.1 ProtocolType definition
Table 4 defines the ProtocolType used to identify CP 1/2 network communications.
Table 4 – ProtocolType Foundation_HSE definition
Attribute Value
BrowseName Foundation_HSE
IsAbstract False
References NodeClass BrowseName DataType TypeDefinition ModellingRule
Inherits the properties of ProtocolType defined in IEC 62541-100.
4.4.2 DeviceType mapping

Each device type inherits the properties of DeviceType. The mapping of the inherited properties

from DeviceType is defined in Table 5.
Table 5 – Inherited DeviceType property mapping
Property CP Mapping
SerialNumber DEV_ID (System Management Information Base)
RevisionCounter −1 (not defined)
Manufacturer String obtained from FDI package catalog
(ManufacturerName from PackageT)
Model String obtained from FDI package catalog (Name of
DeviceTypeT, which is a localized name)
DeviceManual
entry text string (not supported)
DeviceRevision
DEV_REV (Resource Block)
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SIST EN IEC 62769-101-2:2021
– 10 – IEC 62769-101-2:2020 © IEC 2020
Property CP Mapping
SoftwareRevision SOFTWARE_REV (if available, otherwise empty
string)
HardwareRevision HARDWARE_REV (if available, otherwise empty
string)
Device manuals are exposed as attachments of the FDI Device Package.
Conditional: Shall be available if the device exposes a Function Block VFD.
4.4.3 FunctionalGroup Identification definition

As defined in IEC 62541-100, each device representation in the FDI Server hosted Information

Model shall contain a protocol specific FunctionalGroup called Identification. This

FunctionalGroup organizes variables found in the Resource Block of the device type instance.

The FunctionalGroup Identification for CP 1/2 is defined in Table 6.
Table 6 – Identification parameters
BrowseName VariableType Optional/Mandatory
MANUFAC_ID UInt32 Mandatory
DEV_TYPE UInt16 Mandatory
DEV_REV UInt8
Conditional
HARDWARE_REV String Optional
SOFTWARE_REV String Optional
COMPATIBILITY_REV UInt8 Optional
CAPABILITY_LEV UInt8 Optional
ITK_VER UInt16
Conditional
SIF_ITK_VER UInt16 Optional
FD_VER UInt16 Optional
Conditional: Shall be available if the device exposes a Function Block VFD.
4.4.4 BlockType property mapping

CP 1/2 device types are block-oriented according to IEC 62541-100. IEC 62769-5 specifies the

mapping of EDDL BLOCK_A elements to block types and instances.

The BLOCK_A maps as a subtype of the topology element BlockType and inherits the properties

as per IEC 62541-100. The mappi
...

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