Programmable controllers - Part 9: Single-drop digital communication interface for small sensors and actuators (SDCI) (IEC 61131-9:2022)

This part of IEC 61131 specifies a single-drop digital communication interface technology for small sensors and actuators SDCI (commonly known as IO-LinkTM2), which extends the traditional digital input and digital output interfaces as defined in IEC 61131-2 towards a point-to-point communication link. This technology enables the transfer of parameters to Devices and the delivery of diagnostic information from the Devices to the automation system.
This technology is mainly intended for use with simple sensors and actuators in factory automation, which include small and cost-effective microcontrollers.
This part specifies the SDCI communication services and protocol (physical layer, data link layer and application layer in accordance with the ISO/OSI reference model) for both SDCI Masters and Devices.
This part also includes EMC test requirements.
This part does not cover communication interfaces or systems incorporating multiple point or multiple drop linkages, or integration of SDCI into higher level systems such as fieldbuses.

Speicherprogrammierbare Steuerungen - Teil 9: Schnittstelle für die Kommunikation mit kleinen Sensoren und Aktoren über eine Punkt-zu-Punkt-Verbindung (IEC 61131-9:2022)

Automates programmables - Partie 9: Interface de communication numérique point à point pour les petits capteurs et actionneurs (SDCI) (IEC 61131-9:2022)

L'IEC 61131-9:2022 spécifie une technologie d'interface de communication numérique point à point pour petits capteurs et actionneurs – SDCI – (généralement connue sous l'appellation IO-Link™[1]). Elle permet d'étendre les interfaces classiques d'entrées et de sorties numériques (telles que définies dans l'IEC 61131-2) en une liaison de communication point à point pour l'échange de données complexe dans les deux sens. Cette technologie permet également de transférer des paramètres aux Dispositifs et de fournir au système d'automatisation des informations de diagnostic et d'identification depuis les Dispositifs.
Cette technologie est principalement destinée à l’utilisation en automatisation d'usine avec de simples capteurs et actionneurs intégrant de petits microcontrôleurs économiques.
Le présent document spécifie les services et le protocole de communication SDCI (couche physique, couche de liaison de données et couche Application conformément au modèle de référence ISO/OSI) pour les Maîtres et Dispositifs SDCI.
Le présent document inclut également des exigences d'essai CEM.
Le présent document ne couvre pas les interfaces ou systèmes de communication comportant des connexions multipoints ou à liaisons multiples, ou encore l'intégration de SDCI dans des systèmes de niveau supérieur tels que les bus de terrain.
[1] IO-LinkTM est une marque commerciale de "IO-Link Community". Cette information est fournie pour la commodité des utilisateurs du présent document et ne signifie nullement que l'IEC recommande l'emploi exclusif de la marque ou de l’un quelconque de ses produits. La conformité au présent document ne nécessite pas l’utilisation des logos déposés pour IO-LinkTM. L’utilisation des logos déposés pour IO-LinkTM nécessite l’autorisation du "IO-Link Community".

Programirljivi krmilniki - 9. del: Enožični digitalni komunikacijski vmesnik za male senzorje in dajalnike (SDCI) (IEC 61131-9:2022)

Ta del standarda IEC 61131 določa tehnologijo enožičnih digitalnih komunikacijskih vmesnikov za male senzorje in dajalnike SDCI (znane kot IO-LinkTM2), ki razširjajo tradicionalne digitalne vhodne in izhodne vmesnike, kot so opredeljeni v standardu IEC 61131-2, na komunikacijsko povezavo od točke do točke. Ta tehnologija omogoča prenos parametrov v naprave in posredovanje diagnostičnih informacij iz naprav v avtomatizacijski sistem.
Ta tehnologija je namenjena predvsem uporabi z enostavnimi senzorji in dajalniki v tovarniški avtomatizaciji, ki vsebuje majhne in stroškovno učinkovite mikrokrmilnike.
Ta del določa komunikacijske storitve SDCI in protokol (fizično plast, plast podatkovnih povezav in aplikacijsko plast v skladu z referenčnim modelom ISO/OSI) za prednaprave in naprave SDCI.
Ta del prav tako vključuje zahteve za preskus elektromagnetne združljivosti.
Ta del ne zajema komunikacijskih vmesnikov ali sistemov, ki vsebujejo večtočkovne ali multidrop povezave, ali integracijo SDCI v sisteme višje ravni, kot so področna vodila.

General Information

Status
Published
Public Enquiry End Date
25-Jul-2021
Publication Date
08-Sep-2022
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
27-Jul-2022
Due Date
01-Oct-2022
Completion Date
09-Sep-2022

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SLOVENSKI STANDARD
01-oktober-2022
Nadomešča:
SIST EN 61131-9:2014
Programirljivi krmilniki - 9. del: Enožični digitalni komunikacijski vmesnik za male
senzorje in dajalnike (SDCI) (IEC 61131-9:2022)
Programmable controllers - Part 9: Single-drop digital communication interface for small
sensors and actuators (SDCI) (IEC 61131-9:2022)
Speicherprogrammierbare Steuerungen - Teil 9: Schnittstelle für die Kommunikation mit
kleinen Sensoren und Aktoren über eine Punkt-zu-Punkt-Verbindung (IEC 61131-
9:2022)
Automates programmables - Partie 9: Interface de communication numérique point à
point pour les petits capteurs et actionneurs (SDCI) (IEC 61131-9:2022)
Ta slovenski standard je istoveten z: EN IEC 61131-9:2022
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61131-9

NORME EUROPÉENNE
EUROPÄISCHE NORM July 2022
ICS 25.040.40; 35.240.50 Supersedes EN 61131-9:2013
English Version
Programmable controllers - Part 9: Single-drop digital
communication interface for small sensors and actuators (SDCI)
(IEC 61131-9:2022)
Automates programmables - Partie 9: Interface de Speicherprogrammierbare Steuerungen - Teil 9:
communication numérique point à point pour les petits Schnittstelle für die Kommunikation mit kleinen Sensoren
capteurs et actionneurs (SDCI) und Aktoren über eine Punkt-zu-Punkt-Verbindung
(IEC 61131-9:2022) (IEC 61131-9:2022)
This European Standard was approved by CENELEC on 2022-07-04. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61131-9:2022 E

European foreword
The text of document 65B/1218/FDIS, future edition 2 of IEC 61131-9, prepared by SC 65B
"Measurement and control devices" of IEC/TC 65 "Industrial-process measurement, control and
automation" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-04-04
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-07-04
document have to be withdrawn
This document supersedes EN 61131-9:2013 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61131-9:2022 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60870-5-1 NOTE Harmonized as EN 60870-5-1
IEC 61158-2 NOTE Harmonized as EN 61158-2
IEC/TR 62453-61 NOTE Harmonized as CLC/TR 62453-61
IEC 62443 (series) NOTE Harmonized as EN IEC 62443 (series)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60664 series Insulation coordination for equipment EN IEC 60664 series
within low-voltage supply systems
IEC 60947-5-2 - Low-voltage switchgear and controlgear - EN IEC 60947-5-2 -
Part 5-2: Control circuit devices and
switching elements - Proximity switches
IEC 61000-4-2 - Electromagnetic compatibility (EMC) - EN 61000-4-2 -
Part 4-2: Testing and measurement
techniques - Electrostatic discharge
immunity test
IEC 61000-4-3 - Electromagnetic compatibility (EMC) - EN IEC 61000-4-3 -
Part 4-3: Testing and measurement
techniques - Radiated, radio-frequency,
electromagnetic field immunity test
IEC 61000-4-4 - Electromagnetic compatibility (EMC) - EN 61000-4-4 -
Part 4-4: Testing and measurement
techniques - Electrical fast transient/burst
immunity test
IEC 61000-4-5 - Electromagnetic compatibility (EMC) - EN 61000-4-5 -
Part 4-5: Testing and measurement
techniques - Surge immunity test
IEC 61000-4-6 - Electromagnetic compatibility (EMC) - EN 61000-4-6 -
Part 4-6: Testing and measurement
techniques - Immunity to conducted
disturbances, induced by radio-frequency
fields
IEC 61000-4-11 - Electromagnetic compatibility (EMC) - EN IEC 61000-4-11 -
Part 4-11: Testing and measurement
techniques - Voltage dips, short
interruptions and voltage variations
immunity tests for equipment with input
current up to 16 A per phase
IEC 61000-6-2 - Electromagnetic compatibility (EMC) - EN IEC 61000-6-2 -
Part 6-2: Generic standards - Immunity
standard for industrial environments
Publication Year Title EN/HD Year
IEC 61000-6-4 - Electromagnetic compatibility (EMC) - EN IEC 61000-6-4 -
Part 6-4: Generic standards - Emission
standard for industrial environments
IEC 61010-2-201 - Safety requirements for electrical EN IEC 61010-2-201 -
equipment for measurement, control, and
laboratory use - Part 2-201: Particular
requirements for control equipment
IEC 61076-2-101 - Connectors for electronic equipment - EN 61076-2-101 -
Product requirements - Part 2-101:
Circular connectors - Detail specification
for M12 connectors with screw-locking
IEC 61131-1 - Programmable controllers - Part 1: EN 61131-1 -
General information
IEC 61131-2 - Industrial-process measurement and - -
control - Programmable controllers -
Part 2: Equipment requirements and tests

IEC 61131-9 ®
Edition 2.0 2022-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Programmable controllers –
Part 9: Single-drop digital communication interface for small sensors and

actuators (SDCI)
Automates programmables –
Partie 9: Interface de communication numérique point à point pour petits

capteurs et actionneurs (SDCI)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.240.50 ISBN 978-2-8322-1261-5

– 2 – IEC 61131-9:2022 © IEC 2022
CONTENTS
FOREWORD . 20
INTRODUCTION . 22
0.1 General . 22
0.2 Patent declaration . 23
1 Scope . 24
2 Normative references . 24
3 Terms, definitions, symbols, abbreviated terms, and conventions . 25
3.1 Terms and definitions . 25
3.2 Symbols and abbreviated terms . 29
3.3 Conventions . 31
3.3.1 General . 31
3.3.2 Service parameters. 32
3.3.3 Service procedures . 32
3.3.4 Service attributes . 32
3.3.5 Figures . 33
3.3.6 Tables . 33
3.3.7 Transmission octet order . 33
3.3.8 Behavioral descriptions . 33
TM
4 Overview of SDCI (IO-Link ) . 35
4.1 Purpose of technology . 35
4.2 Positioning within the automation hierarchy . 35
4.3 Wiring, connectors and power . 36
4.4 Communication features of SDCI . 36
4.5 Role of a Master . 39
4.6 SDCI configuration . 40
4.7 Mapping to fieldbuses and/or other upper-level systems . 40
4.8 Standard structure . 40
5 Physical Layer (PL) . 41
5.1 General . 41
5.1.1 Basics . 41
5.1.2 Topology . 41
5.2 Physical layer services. 42
5.2.1 Overview . 42
5.2.2 PL services . 43
5.3 Transmitter/Receiver . 45
5.3.1 Description method . 45
5.3.2 Electrical requirements . 45
5.3.3 Timing requirements . 50
5.4 Power supply . 54
5.4.1 Power supply options . 54
5.4.2 Port Class B . 55
5.4.3 Power-on requirements . 56
5.5 Medium . 56
5.5.1 Connectors . 56
5.5.2 Cable . 57
6 Standard Input and Output (SIO) . 58

IEC 61131-9:2022 © IEC 2022 – 3 –
7 Data link layer (DL) . 59
7.1 General . 59
7.2 Data link layer services . 60
7.2.1 DL-B services . 60
7.2.2 DL-A services . 71
7.3 Data link layer protocol . 75
7.3.1 Overview . 75
7.3.2 DL-mode handler . 76
7.3.3 Message handler . 84
7.3.4 Process Data handler . 92
7.3.5 On-request Data handler . 95
7.3.6 ISDU handler . 98
7.3.7 Command handler . 102
7.3.8 Event handler . 105
8 Application layer (AL) . 108
8.1 General . 108
8.2 Application layer services . 109
8.2.1 AL services within Master and Device . 109
8.2.2 AL Services . 110
8.3 Application layer protocol . 118
8.3.1 Overview . 118
8.3.2 On-request Data transfer . 118
8.3.3 Event processing . 124
8.3.4 Process Data cycles . 127
9 System Management (SM) . 128
9.1 General . 128
9.2 System Management of the Master . 128
9.2.1 Overview . 128
9.2.2 SM Master services . 130
9.2.3 SM Master protocol . 135
9.3 System Management of the Device . 143
9.3.1 Overview . 143
9.3.2 SM Device services . 145
9.3.3 SM Device protocol. 151
10 Device . 158
10.1 Overview. 158
10.2 Process Data Exchange (PDE) . 159
10.3 Parameter Manager (PM) . 159
10.3.1 General . 159
10.3.2 Parameter Manager state machine . 159
10.3.3 Dynamic parameter . 162
10.3.4 Single parameter . 162
10.3.5 Block Parameter . 163
10.3.6 Concurrent parameterization access . 166
10.3.7 Command handling . 166
10.4 Data Storage (DS) . 167
10.4.1 General . 167
10.4.2 Data Storage state machine . 167

– 4 – IEC 61131-9:2022 © IEC 2022
10.4.3 DS configuration . 169
10.4.4 DS memory space . 169
10.4.5 DS Index_List . 169
10.4.6 DS parameter availability . 170
10.4.7 DS without ISDU . 170
10.4.8 DS parameter change indication . 170
10.5 Event Dispatcher (ED) . 170
10.6 Device features . 170
10.6.1 General . 170
10.6.2 Device backward compatibility . 170
10.6.3 Protocol revision compatibility . 171
10.6.4 Visual SDCI indication . 171
10.6.5 Parameter access locking . 171
10.6.6 Data Storage locking . 171
10.6.7 Locking of local parameter entries . 171
10.6.8 Locking of local user interface . 171
10.6.9 Offset time . 171
10.6.10 Data Storage concept . 172
10.6.11 Block Parameter . 172
10.7 Device reset options . 172
10.7.1 Overview . 172
10.7.2 Device reset . 173
10.7.3 Application reset . 173
10.7.4 Restore factory settings . 174
10.7.5 Back-to-box . 174
10.8 Device design rules and constraints . 174
10.8.1 General . 174
10.8.2 Process Data . 174
10.8.3 Communication loss . 175
10.8.4 Direct Parameter . 175
10.8.5 ISDU communication channel . 175
10.8.6 DeviceID rules related to Device variants . 175
10.8.7 Protocol constants . 176
10.9 IO Device description (IODD) . 176
10.10 Device diagnosis . 176
10.10.1 Concepts . 176
10.10.2 Events . 177
10.10.3 Visual indicators . 178
10.11 Device connectivity . 179
11 Master . 179
11.1 Overview. 179
11.1.1 Positioning of Master and Gateway Applications . 179
11.1.2 Structure, applications, and services of a Master . 180
11.1.3 Object view of a Master and its Ports . 181
11.2 Services of the Standardized Master Interface (SMI) . 182
11.2.1 Overview . 182
11.2.2 Structure of SMI service arguments . 183
11.2.3 Concurrency and prioritization of SMI services . 184
11.2.4 SMI_MasterIdentification . 185

IEC 61131-9:2022 © IEC 2022 – 5 –
11.2.5 SMI_PortConfiguration. 186
11.2.6 SMI_ReadbackPortConfiguration . 187
11.2.7 SMI_PortStatus . 189
11.2.8 SMI_DSToParServ . 190
11.2.9 SMI_ParServToDS . 191
11.2.10 SMI_DeviceWrite . 193
11.2.11 SMI_DeviceRead . 194
11.2.12 SMI_ParamWriteBatch . 195
11.2.13 SMI_ParamReadBatch . 197
11.2.14 SMI_PortPowerOffOn . 198
11.2.15 SMI_DeviceEvent . 200
11.2.16 SMI_PortEvent . 201
11.2.17 SMI_PDIn . 201
11.2.18 SMI_PDOut . 203
11.2.19 SMI_PDInOut . 204
11.2.20 SMI_PDInIQ . 205
11.2.21 SMI_PDOutIQ . 207
11.2.22 SMI_PDReadbackOutIQ . 208
11.3 Configuration Manager (CM) . 209
11.3.1 Coordination of Master applications . 209
11.3.2 State machine of the Configuration Manager . 212
11.4 Data Storage (DS) . 217
11.4.1 Overview . 217
11.4.2 DS data object . 217
11.4.3 Backup and Restore . 217
11.4.4 DS state machine . 217
11.4.5 Parameter selection for Data Storage . 224
11.5 On-request Data exchange (ODE) . 224
11.6 Diagnosis Unit (DU) . 225
11.6.1 General . 225
11.6.2 Device specific Events . 226
11.6.3 Port specific Events . 226
11.6.4 Dynamic diagnosis status . 227
11.6.5 Best practice recommendations . 227
11.7 PD Exchange (PDE). 228
11.7.1 General . 228
11.7.2 Process Data input mapping . 228
11.7.3 Process Data output mapping . 229
11.7.4 Process Data invalid/valid qualifier status . 230
12 Holistic view on Data Storage . 231
12.1 User point of view . 231
12.2 Operations and preconditions . 232
12.2.1 Purpose and objectives . 232
12.2.2 Preconditions for the activation of the Data Storage mechanism . 232
12.2.3 Preconditions for the types of Devices to be replaced . 232
12.2.4 Preconditions for the parameter sets . 232
12.3 Commissioning . 233
12.3.1 On-line commissioning. 233
12.3.2 Off-site commissioning . 233

– 6 – IEC 61131-9:2022 © IEC 2022
12.4 Backup Levels . 234
12.4.1 Purpose . 234
12.4.2 Overview . 234
12.4.3 Commissioning ("Disable"). 235
12.4.4 Production ("Backup/Restore") . 235
12.4.5 Production ("Restore") . 236
12.5 Use cases . 236
12.5.1 Device replacement ("Backup/Restore") . 236
12.5.2 Device replacement ("Restore") . 236
12.5.3 Master replacement . 236
12.5.4 Project replication . 237
13 Integration . 237
13.1 Generic Master model for system integration . 237
13.2 Role of gateway applications. 238
13.2.1 Clients . 238
13.2.2 Coordination . 238
13.3 Security . 238
13.4 Special gateway applications . 238
13.4.1 Changing Device configuration including Data Storage . 238
13.4.2 Parameter server and recipe control . 239
13.5 Port and Device Configuration Tool (PDCT) . 239
13.5.1 Strategy . 239
13.5.2 Accessing Masters via SMI . 239
13.5.3 Basic layout examples . 239
Annex A (normative) Codings, timing constraints, and errors . 241
A.1 General structure and encoding of M-sequences. 241
A.1.1 Overview . 241
A.1.2 M-sequence control (MC). 241
A.1.3 Checksum/M-sequence type (CKT) . 242
A.1.4 User data (PD or OD) . 242
A.1.5 Checksum/status (CKS) . 243
A.1.6 Calculation of the checksum . 244
A.2 M-sequence types . 245
A.2.1 Overview . 245
A.2.2 M-sequence TYPE_0 . 245
A.2.3 M-sequence TYPE_1_x . 245
A.2.4 M-sequence TYPE_2_x . 247
A.2.5 M-sequence type 3 . 249
A.2.6 M-sequence type usage for STARTUP, PREOPERATE and OPERATE
modes . 249
A.3 Timing constraints . 251
A.3.1 General . 251
A.3.2 Bit time . 251
A.3.3 UART frame transmission delay of Master (Ports) . 251
A.3.4 UART frame transmission delay of Devices . 251
A.3.5 Response time of Devices . 251
A.3.6 M-sequence time . 251
A.3.7 Cycle time . 252
A.3.8 Idle time . 253

IEC 61131-9:2022 © IEC 2022 – 7 –
A.3.9 Recovery time . 253
A.4 Errors and remedies . 253
A.4.1 UART errors . 253
A.4.2 Wake-up errors . 253
A.4.3 Transmission errors . 253
A.4.4 Protocol errors . 254
A.5 General structure and encoding of ISDUs . 254
A.5.1 Overview . 254
A.5.2 I-Service . 254
A.5.3 Extended length (ExtLength) . 255
A.5.4 Index and Subindex . 256
A.5.5 Data . 256
A.5.6 Check ISDU (CHKPDU) . 256
A.5.7 ISDU examples . 257
A.6 General structure and encoding of Events . 259
A.6.1 General . 259
A.6.2 StatusCode type 1 (no details) . 259
A.6.3 StatusCode type 2 (with details) . 260
A.6.4 EventQualifier . 261
A.6.5 EventCode . 262
Annex B (normative) Parameters and commands . 263
B.1 Direct Parameter pages 1 and 2 . 263
B.1.1 Overview . 263
B.1.2 MasterCommand . 264
B.1.3 MasterCycleTime and MinCycleTime . 265
B.1.4 M-sequenceCapability . 266
B.1.5 RevisionID (RID) . 267
B.1.6 ProcessDataIn . 267
B.1.7 ProcessDataOut . 268
B.1.8 VendorID (VID) . 268
B.1.9 DeviceID (DID) . 268
B.1.10 FunctionID (FID) . 268
B.1.11 SystemCommand . 269
B.1.12 Device specific Direct Parameter page 2 . 269
B.2 Predefined Device parameters . 269
B.2.1 Overview . 269
B.2.2 SystemCommand . 272
B.2.3 DataStorageIndex . 273
B.2.4 DeviceAccessLocks . 274
B.2.5 ProfileCharacteristic . 276
B.2.6 PDInputDescriptor . 276
B.2.7 PDOutputDescriptor . 276
B.2.8 VendorName . 276
B.2.9 VendorText . 276
B.2.10 ProductName . 276
B.2.11 ProductID . 276
B.2.12 ProductText . 276
B.2.13 SerialNumber. 277
B.2.14 HardwareRevision . 277

– 8 – IEC 61131-9:2022 © IEC 2022
B.2.15 FirmwareRevision . 277
B.2.16 ApplicationSpecificTag . 277
B.2.17 FunctionTag . 277
B.2.18 LocationTag . 277
B.2.19 ErrorCount .
...

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