Filters using waveguide type dielectric resonators -- Part 1: Generic specification

Lists the test and measurement procedures which may be selected for use in detail specifications for filters using waveguide type dielectric resonators.

Filter mit dielektrischen Resonatoren vom Wellenleitertyp -- Teil 1: Fachgrundspezifikation

Filtres utilisant des résonateurs diélectriques à modes guidés -- Partie 1: Informations générales

Lists the test and measurement procedures which may be selected for use in detail specifications for filters using waveguide type dielectric resonators.

Filtri z dielektričnimi resonatorji valovodnega tipa – 1. del: Generična specifikacija (IEC 61337-1:2004)

General Information

Status
Published
Publication Date
30-Nov-2005
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Dec-2005
Due Date
01-Dec-2005
Completion Date
01-Dec-2005

Relations

Buy Standard

Standard
SIST EN 61337-1:2005
English language
28 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

SLOVENSKI SIST EN 61337-1:2005
STANDARD
december 2005
Filtri z dielektričnimi resonatorji valovodnega tipa – 1. del: Generična
specifikacija (IEC 61337-1:2004)

Filters using waveguide type dielectric resonators – Part 1: Generic specification

(IEC 61337-1:2004)
ICS 31.140; 31.160 Referenčna številka
SIST EN 61337-1:2005(en)

© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

---------------------- Page: 1 ----------------------
EUROPEAN STANDARD EN 61337-1
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2004
ICS 31.140 Supersedes EN 171000:2001
English version
Filters using waveguide type dielectric resonators
Part 1: Generic specification
(IEC 61337-1:2004)
Filtres utilisant des résonateurs Filter mit dielektrischen Resonatoren
diélectriques à modes guidés vom Wellenleitertyp
Partie 1: Informations générales Teil 1: Fachgrundspezifikation
(CEI 61337-1:2004) (IEC 61337-1:2004)

This European Standard was approved by CENELEC on 2004-10-01. CENELEC members are bound to

comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European

Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and

notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech

Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,

Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61337-1:2004 E
---------------------- Page: 2 ----------------------
EN 61337-1:2004 - 2 -
Foreword

The text of document 49/685/FDIS, future edition 1 of IEC 61337-1, prepared by IEC TC 49,

Piezoelectric and dielectric devices for frequency control and selection, was submitted to the

IEC-CENELEC parallel vote and was approved by CENELEC as EN 61337-1 on 2004-10-01.

This European Standard supersedes EN 171000:2001.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-08-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 61337-1:2004 was approved by CENELEC as a European

Standard without any modification.
__________
---------------------- Page: 3 ----------------------
- 3 - EN 61337-1:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
Publication Year Title EN/HD Year
IEC 60027 Series Letter symbols to be used in electrical HD 245 Series
technology HD 60027 Series
IEC 60050-561 1991 International Electrotechnical - -
Vocabulary (IEV)
Chapter 561: Piezoelectric devices for
frequency control and selection
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-1 1990 Part 2: Tests - Tests A: Cold EN 60068-2-1 1993
IEC 60068-2-2 1974 Part 2: Tests - Tests B: Dry heat EN 60068-2-2 1993
IEC 60068-2-6 1995 Part 2: Tests - Test Fc: Vibration EN 60068-2-6 1995
(sinusoidal)
IEC 60068-2-7 1983 Part 2: Tests - Test Ga: Acceleration, EN 60068-2-7 1993
steady state
IEC 60068-2-13 1983 Part 2: Tests - Test M: Low air EN 60068-2-13 1999
pressure
IEC 60068-2-14 1984 Part 2: Tests - Test N: Change of EN 60068-2-14 1999
temperature
IEC 60068-2-20 1979 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988
IEC 60068-2-21 1999 Part 2-21: Tests - Test U: Robustness EN 60068-2-21 1999
of terminations and integral mounting
devices
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1:1988.
EN 60068-2-2 includes supplement A:1976 to IEC 60068-2-2:1974.
EN 60068-2-7 includes A1:1986 to IEC 60068-2-7:1983.
EN 60068-2-14 includes A1:1986 to IEC 60068-2-14:1984.
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20:1979.
---------------------- Page: 4 ----------------------
EN 61337-1:2004 - 4 -
Publication Year Title EN/HD Year
IEC 60068-2-27 1987 Part 2: Tests - Test Ea and guidance: EN 60068-2-27 1993
Shock
IEC 60068-2-29 1987 Part 2: Tests - Test Eb and guidance: EN 60068-2-29 1993
Bump
IEC 60068-2-30 1980 Part 2: Tests - Test Db and guidance: EN 60068-2-30 1999
Damp heat, cyclic (12 + 12-hour cycle)
IEC 60068-2-58 1999 Part 2-58: Tests - Test Td: Test EN 60068-2-58 1999
methods for solderability, resistance to
dissolution of metallization and to
soldering heat of surface mounting
devices (SMD)
IEC 60068-2-78 2001 Part 2-78: Tests - Test Cab: Damp EN 60068-2-78 2001
heat, steady state
IEC 60617 database Graphical symbols for diagrams - -
IEC QC 001002-2 1998 IEC Quality Assessment System for - -
Electronic Components (IECQ) -
Rules of Procedure
Part 2: Documentation
IEC QC 001001 2000 IEC Quality Assessment System for - -
Electronic Components (IECQ) - Basic
rules
IEC QC 001002-3 1998 IEC Quality Assessment System for - -
Electronic Components (IECQ) -
Rules of Procedure
Part 3: Approval procedures
IEC QC 001005 2000 Register of firms, products and - -
services approved under the IECQ
system, including ISO 9000
ISO 1000 1992 SI units and recommendations for the - -
use of their multiples and of certain
other units
EN 60068-2-30 includes A1:1985 to IEC 60060-2-30:1980.

EN 60068-2-58 is superseded by EN 60068-2-58:2004, which is based on IEC 60068-2-58:2004.

---------------------- Page: 5 ----------------------
INTERNATIONAL IEC
STANDARD 61337-1
First edition
2004-11
Filters using waveguide type
dielectric resonators –
Part 1:
Generic specification
 IEC 2004  Copyright - all rights reserved

No part of this publication may be reproduced or utilized in any form or by any means, electronic or

mechanical, including photocopying and microfilm, without permission in writing from the publisher.

International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland

Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch

PRICE CODE
Commission Electrotechnique Internationale T
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
---------------------- Page: 6 ----------------------
– 2 – 61337-1  IEC:2004(E)
CONTENTS

FOREWORD...........................................................................................................................3

1 General ............................................................................................................................5

1.1 Scope......................................................................................................................5

1.2 Normative references ..............................................................................................5

1.3 Order of precedence ...............................................................................................6

2 Terminology and general requirements.............................................................................6

2.1 General ...................................................................................................................6

2.2 Terms and definitions ..............................................................................................6

2.3 Preferred ratings and characteristics .....................................................................13

2.4 Marking .................................................................................................................14

3 Quality assessment procedures......................................................................................14

3.1 Primary stage of manufacture................................................................................14

3.2 Structurally similar components.............................................................................14

3.3 Sub-contracting .....................................................................................................14

3.4 Incorporated components ......................................................................................14

3.5 Manufacturer’s approval ........................................................................................14

3.6 Approval procedures .............................................................................................14

3.7 Procedures for capability approval ........................................................................15

3.8 Procedures for qualification approval.....................................................................16

3.9 Test procedures ....................................................................................................16

3.10 Screening requirements ........................................................................................16

3.11 Rework and repair work.........................................................................................16

3.12 Certified records of released lots...........................................................................16

3.13 Validity of release..................................................................................................17

3.14 Release for delivery ..............................................................................................17

3.15 Unchecked parameters..........................................................................................17

4 Test and measurement procedures.................................................................................17

4.1 General .................................................................................................................17

4.2 Test and measurement conditions .........................................................................17

4.3 Visual inspection ...................................................................................................18

4.4 Dimensions and gauging procedures .....................................................................18

4.5 Electrical test procedures ......................................................................................18

4.6 Mechanical and environmental test procedures .....................................................22

Figure 1 – Equivalent circuit....................................................................................................7

Figure 2 – Typical frequency characteristics of a band-pass filter .........................................10

Figure 3 – Typical frequency characteristics of a band-stop filter ..........................................11

Figure 4 – Insertion attenuation and group delay measurement ............................................20

Figure 5 – Return attenuation measurement .........................................................................20

---------------------- Page: 7 ----------------------
61337-1  IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FILTERS USING WAVEGUIDE TYPE
DIELECTRIC RESONATORS –
Part 1: Generic specification
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 61337-1 has been prepared by IEC technical committee 49:

Piezoelectric and dielectric devices for frequency control and selection.

This part of IEC 61337 cancels and replaces IEC 61337-1-1:1995 and IEC 61337-1-2:1999.

The text of this standard is based on the following documents:
FDIS Report on voting
49/685/FDIS 49/695/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 8 ----------------------
– 4 – 61337-1  IEC:2004(E)

IEc 61337 consists of the following parts, under the general title Filters using waveguide type

dielectric resonators:
Part 1: Generic specification
Part 2: Guidance for use

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual edition of this generic specification may be issued at a later date.
---------------------- Page: 9 ----------------------
61337-1  IEC:2004(E) – 5 –
FILTERS USING WAVEGUIDE TYPE
DIELECTRIC RESONATORS –
Part 1: Generic specification
1 General
1.1 Scope

This part of IEC 61337 applies to filters using waveguide type dielectric resonators of

assessed quality using either capability approval or qualification approval procedures. It also

lists the test and measurement procedures which may be selected for use in detail

specifications for such filters.
1.2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology

IEC 60050(561):1991, International Electrotechnical Vocabulary (IEV) – Chapter 561: Piezo-

electric devices for frequency control and selection
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-1:1990, Environmental testing – Part 2: Tests – Test A: Cold
IEC 60068-2-2:1974, Environmental testing – Part 2: Tests – Test B: Dry Heat

IEC 60068-2-6:1995, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)

IEC 60068-2-7:1983, Environmental testing – Part 2: Tests – Test Ga: Acceleration, steady

state

IEC 60068-2-13:1983, Environmental testing – Part 2: Tests – Test M: Low air pressure

IEC 60068-2-14:1984, Environmental testing – Part 2: Tests – Test N: Change of temperature

IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering

IEC 60068-2-21:1999, Environmental testing – Part 2-21: Tests – Test U: Robustness of

terminations and integral mounting devices

IEC 60068-2-27:1987, Environmental testing – Part 2: Tests – Test Ea and guidance: Shock

IEC 60068-2-29:1987, Environmental testing – Part 2: Tests – Test Eb and guidance: Bump

IEC 60068-2-30:1980, Environmental testing – Part 2: Tests – Test Db and guidance: Damp

heat, cyclic (12 + 12 hour cycle)
---------------------- Page: 10 ----------------------
– 6 – 61337-1  IEC:2004(E)

IEC 60068-2-58:1999, Environmental testing – Part 2-58: Tests – Tests Td: Test methods for

solderability, resistance to dissolution of metalization and to soldering heat of surface

mounting devices (SMD)

IEC 60068-2-78:2001, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat,

steady state
IEC 60617 (all parts) [DB] , Graphical symbols for diagrams

QC 001001:2000, IEC Quality Assessment System for Electronic Components (IECQ) – Basic

Rules

QC 001002-2:1998, IEC Quality Assessment System for Electronic Components (IECQ) –

Rules of Procedure – Part 2: Documentation

QC 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) –

Rules of Procedure – Part 3: Approval Procedures

QC 001005:2000, Register of Firms, Products and Services approved under the IECQ System,

including ISO 9000

ISO 1000:1992, SI units and recommendation for the use of their multiples and of certain

other units
1.3 Order of precedence

Where any discrepancies occur for any reason, documents shall rank in the following order of

authority:
– detail specification;
– sectional specification;
– generic specification;

– any other international documents (for example, of the IEC) to which reference is made.

The same order of precedence shall apply to equivalent national documents.
2 Terminology and general requirements
2.1 General

Units, graphical symbols, letter symbols and terminology shall whenever possible, be taken

from IEC 60617, IEC 60027, IEC 60050(561) and ISO 1000.

Any other units, symbols and terminology peculiar to one of the components covered by the

Generic Specification, shall be taken from the relevant IEC or ISO documents listed under 1.2.

2.2 Terms and definitions

For the purposes of this part of IEC 61337, the following terms and definitions apply.

Further detailed information may be provided in IEC 61994-1 for some of the following terms.

___________
“DB” refers to the IEC on-line database.
---------------------- Page: 11 ----------------------
61337-1  IEC:2004(E) – 7 –
2.2.1
dielectric filter
filter in which one or more dielectric resonators are incorporated
2.2.2
dielectric mono-block filter

filter consisting of a metallized rectangular ceramic block with cylindrical holes, which

functions as a TEM (Transverse-ElectroMagnetic) mode filter with two or more stages

2.2.3
stripline filter

filter consisting of stripline resonators, which functions as a TEM mode filter with two or more

stages
2.2.4
microstripline filter

filter consisting of microstripline resonators, which functions as a TEM mode filter with two or

more stages
2.2.5
coplanar filter

filter consisting of coplanar line resonators, which functions as a TEM mode filter with two or

more stages
2.2.6
coupling factor

coupling factor of a band-pass filter is the degree of coupling between two resonators.

NOTE The coupling between dielectric resonators is mainly done either magnetically or electrically. According to

each case, the equivalent circuit of coupling is expressed by inductive or capacitive coupling, respectively, see

Figure 1.
C – C
2 m
C L L C L L
1 1 2 2 1 2
C – C
1 m
IEC 1343/04 IEC 1344/04
(a) Inductive coupling (b) Capacitive coupling
Figure 1 – Equivalent circuit

The coupling factor by inductive or capacitive coupling is defined by the following respective

equations:
M C
k = k =
L × L C × C
1 2 1 2
where
L , C and L , C are the resonance circuit elements;
1 1 2 2
M is the mutual inductance;
C is the coupling capacitance;
k is the coupling factor.
---------------------- Page: 12 ----------------------
– 8 – 61337-1  IEC:2004(E)

In the case of a symmetrical circuit of coupling, the coupling factor can be obtained from two

resonance frequencies calculated or measured for the coupled resonators:
2 2
f − f
o e
k =
2 2
f + f
o e
where
f is the resonance frequency in the case of even mode excitation (open-circuited
symmetric plane);
f is the resonance frequency in the case of odd mode excitation (short-circuited
symmetric plane).

The coupling factor of a band-stop filter is the degree of coupling between the resonator and

the transmission line. The coupling factor k is defined as the ratio of the external power loss

(P ) of the resonator system to the internal power loss (P ) of the resonator and can be

e u
expressed by a function of quality factor as follows:
P Q Q
e u u
k = = = −1
P Q Q
u e L
where
Q is the unloaded quality factor of resonator;
Q is the external quality factor of resonator;
Q is the loaded quality factor of resonator.
2.2.7
mid-band frequency
arithmetic mean of the cut-off frequencies (see Figures 2 and 3)
2.2.8
cut-off frequency

frequency of the pass band at which the relative attenuation reaches a specified value (see

Figures 2 and 3)
2.2.9
trap frequency

frequency of the trap at which the attenuation reaches a large peak value (see Figure 2)

2.2.10
pass-band

band of frequencies in which the relative attenuation is equal to or less than a specified value

(see Figures 2 and 3)
2.2.11
pass bandwidth

separation of the frequencies between which the attenuation is equal to or less than a

specified value (see Figure 2)
2.2.12
stop band

band of frequencies in which the relative attenuation is equal to or greater than a specified

value (see Figures 2 and 3)
---------------------- Page: 13 ----------------------
61337-1  IEC:2004(E) – 9 –
2.2.13
stop bandwidth

separation of frequencies between which the attenuation is equal to or greater than a

specified value (see Figures 2 and 3)
2.2.14
fractional bandwidth

a) ratio of the pass bandwidth to the mid-band frequency in the case of band-pass filter

b) ratio of the stop bandwidth to the mid-band frequency in the case of band-stop filter

2.2.15
insertion attenuation

logarithmic ratio of the power delivered directly to the load impedance before insertion of the

filter to the power delivered to the load impedance after the insertion of the filter

The value is defined by
10log ()dB
where
P is the power delivered to the load impedance before insertion of the filter;
P is the power delivered to the load impedance after insertion of the filter.
---------------------- Page: 14 ----------------------
– 10 – 61337-1  IEC:2004(E)
Minimum insertion
attenuation
Pass-band
Maximum insertion
ripple
attenuation
Spurius response
Pass band
Pass bandwidth
Stop bandwidth
Stop band
Frequency
Cut-off
Mid-band Cut-off
frequency
frequency frequency
Trap frequency
Frequency
Frequency
IEC 1345/04
Figure 2 – Typical frequency characteristics of a band-pass filter
Insertion phase shift
Insertion attenuation dB
Return attenuation dB
Group delay
---------------------- Page: 15 ----------------------
61337-1  IEC:2004(E) – 11 –
Maximum insertion
Minimum insertion
attenuation Pass-band
attenuation
ripple
Pass band Pass band
Stop
bandwidth
Stop
band
Frequency
Cut-off Mid-band
Cut-off
frequency frequency
frequency
Frequency
Frequency
IEC 1346/04
Figure 3 – Typical frequency characteristics of a band-stop filter
Insertion attenuation dB
Insertion phase shift
Return attenuation dB
Group delay
---------------------- Page: 16 ----------------------
– 12 – 61337-1  IEC:2004(E)
2.2.16
relative attenuation

difference between the attenuation at a given frequency and the attenuation at the reference

frequency
2.2.17
minimum insertion attenuation
the minimum value of insertion attenuation in the pass band
2.2.18
maximum insertion attenuation
the maximum value of insertion attenuation in the pass band
2.2.19
pass-band ripple

maximum variation of attenuation within a defined portion of a pass band (see Figures 2 and 3)

2.2.20
spurious response

the response of a filter other than that associated with the working frequency (see Figure 2)

2.2.21
spurious response rejection

difference between the maximum level of spurious response and the minimum insertion

attenuation
2.2.22
return attenuation
logarithmic ratio of the power P to the power P
o r
The value is defined by
10log ()dB
where
P is the power available from the oscillator;

P is the power reflected from the filter after insertion of the filter with the load impedance.

NOTE Alternative expression by VSWR (Voltage Standing Wave Ratio) is:
1+ Γ
VSWR =
1− Γ
where
is the modulus of the reflection coefficient.
Γ =
2.2.23
insertion phase shift
change in phase caused by the insertion of the filter into a transmission system
2.2.24
group delay

time equal to the first derivative of the phase shift in radians with respect to the angular

frequency
---------------------- Page: 17 ----------------------
61337-1  IEC:2004(E) – 13 –
2.2.25
group delay distortion

difference between the lowest and highest value of group delay in a specified frequency band

2.2.26
maximum power level

power level above which intolerable signal distortion or irreversible changes in a structure

may take place
2.2.27
reference frequency

frequency defined by the specification to which other frequencies may be referred

2.2.28
Band-Pass Filter
BPF
filter having a signal pass band between two specified stop bands
2.2.29
Band-Stop Filter
BSF
filter having a signal stop band between two specified pass bands
2.3 Preferred ratings and characteristics
Values should preferably be chosen from the following Subclauses.
2.3.1 Temperature ranges in degrees Celsius (°°C) for ambient operation
–20 to +75 –30 to +60 –35 to +85 0 to +55

NOTE Other temperature ranges may be used, but the lowest temperature should not be lower than –60 °C and

the highest temperature should not exceed 125 °C.
2.3.2 Climatic category
40/085/56

For requirements where the operating temperature range of the filter is greater than –40 °C to

+85 °C, a climatic category consistent with the operating temperature range shall be specified.

2.3.3 Bump severity

4 000 ± 10 bumps at 40 g peak acceleration in each direction along three mutually

perpendicular axis. Pulse duration 6 ms.
2.3.4 Vibration severity
Frequency Vibration severity
10 to 500 Hz 0,75 mm amplitude or 10 g acceleration;
10 to 2 000 Hz 0,75 mm amplitude or 10 g acceleration;
10 to 2 000 Hz 1,5 mm amplitude or 20 g acceleration.
2.3.5 Shock severity
6 ms duration, 100 g acceleration.
-------------------
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.