SIST EN 61709:2017

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2017)

This document gives guidance on the use of failure rate data for reliability prediction of
electric components used in equipment.
The method presented in this document uses the concept of reference conditions which are
the typical values of stresses that are observed by components in the majority of applications.
Reference conditions are useful since they provide a known standard basis from which failure
rates can be modified to account for differences in environment from the environments taken
as reference conditions. Each user can use the reference conditions defined in this document
or use their own. When failure rates stated at reference conditions are used it allows realistic
reliability predictions to be made in the early design phase.
The stress models described herein are generic and can be used as a basis for conversion of
failure rate data given at these reference conditions to actual operating conditions when
needed and this simplifies the prediction approach. Conversion of failure rate data is only
possible within the specified functional limits of the components.
This document also gives guidance on how a database of component failure data can be
constructed to provide failure rates that can be used with the included stress models.
Reference conditions for failure rate data are specified, so that data from different sources
can be compared on a uniform basis. If failure rate data are given in accordance with this
document then additional information on the specified conditions can be dispensed with.
This document does not provide base failure rates for components – rather it provides models
that allow failure rates obtained by other means to be converted from one operating condition
to another operating condition.
The prediction methodology described in this document assumes that the parts are being
used within its useful life. The methods in this document have a general application but are
specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2.

Elektrische Bauelemente - Zuverlässigkeit - Referenzbedingungen für Ausfallraten und Beanspruchungsmodelle zur Umrechnung (IEC 61709:2017)

Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance et modèles de contraintes pour la conversion (IEC 61709:2017)

NEW!IEC 61709:2017 est disponible sous forme de IEC 61709:2017 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

IEC 61709:2017 donne des recommandations concernant l'utilisation des données de taux de défaillance pour les prévisions de fiabilité de composants électriques utilisés dans les équipements. La méthode exposée dans le présent document utilise le concept des conditions de référence, qui sont les valeurs typiques des contraintes observées sur les composants dans la plupart des applications. Les conditions de référence sont utiles dans la mesure où elles fournissent une base normalisée connue à partir de laquelle les taux de défaillance peuvent être modifiés afin de prendre en compte les différences observées dans l'environnement en fonction des environnements pris comme conditions de référence. Chaque utilisateur peut appliquer les conditions de référence définies dans le présent document ou bien appliquer ses propres conditions de référence. Lorsque les taux de défaillance indiqués dans les conditions de référence sont utilisés, cela permet de réaliser des prévisions de fiabilité réalistes dès la première phase de conception. Les modèles de contraintes décrits dans le présent document sont génériques et peuvent être utilisés comme base de conversion des données de taux de défaillance dans ces conditions de référence, dans des conditions de fonctionnement réelles si nécessaire, ce qui simplifie l'approche prévisionnelle. La conversion des données de taux de défaillance n'est possible que dans les limites de fonctionnement spécifiées pour les composants. Le présent document donne également des recommandations concernant les méthodes pour constituer une base de données de taux de défaillance des composants afin que les taux fournis puissent être employés avec les modèles de contraintes fournis. Les conditions de référence pour les données de taux de défaillance sont définies, de façon à permettre de comparer, dans des conditions uniformes, des données d'origines différentes. Si les données de taux de défaillance sont fournies conformément au présent document, il est possible de se dispenser d'information supplémentaire sur les conditions définies Le présent document ne fournit pas des taux de défaillance de base pour les composants; elle fournit en revanche des modèles qui permettent de convertir les taux de défaillance obtenus par d'autres moyens d’une condition de fonctionnement à l’autre. La méthodologie de prévision décrite dans le présent document pose comme hypothèse l'utilisation des éléments au cours de leur durée de vie. Les méthodes décrites dans le présent document ont une application générale, mais s’appliquent spécifiquement à une sélection de types de composants définis de l’Article 6 à l’Article 20 et en I.2. Cette troisième édition annule et remplace la deuxième édition, parue en 2011. Cette édition constitue une révision technique. Cette troisième édition constitue une fusion entre l’IEC 61709:2011 et l’IEC TR 62380:2004.
Cette édition inclut  les modifications techniques majeures suivantes par rapport à l’édition précédente: ajout de 4.5 Choix des composants, 4.6 Croissance de la fiabilité pendant la phase de déploiement du nouvel équipement, 4.7 Méthode d’utilisation du présent docume

Električne komponente - Zanesljivost - Referenčni pogoji za pogostost odpovedi in modele obremenjevanja za pretvarjanje (IEC 61709:2017)

Ta dokument podaja napotke o uporabi podatkov o pogostosti odpovedi za napoved zanesljivosti električnih komponent v opremi.
Metoda, predstavljena v tem dokumentu, uporablja koncept referenčnih pogojev, ki so tipične vrednosti obremenitev, ki se pojavljajo pri komponentah v večini načinov uporabe.
Referenčni pogoji so uporabni, ker podajajo poznano osnovo standarda, na podlagi katere se lahko spremenijo pogostosti odpovedi, da se upoštevajo razlike okolja od okolij, ki predstavljajo referenčne pogoje. Vsak uporabnik lahko uporabi referenčne pogoje, določene v tem dokumentu, ali lastne referenčne pogoje. Kadar so v referenčnih pogojih uporabljene pogostosti odpovedi, to omogoča realistično napoved zanesljivosti v zgodnji fazi načrtovanja.
V tem dokumentu opisani modeli obremenjevanja so generični in se lahko po potrebi uporabijo kot osnova za pretvarjanje podatkov o pogostosti odpovedi, podanih v teh referenčnih pogojih, v dejanske obratovalne pogoje, kar poenostavlja pristop k napovedi. Pretvarjanje podatkov o pogostosti odpovedi je mogoče le znotraj podanih funkcijskih omejitev komponent.
Ta dokument podaja tudi napotke, kako zdelati zbirko podatkov o odpovedih komponent, ki podaja pogostosti odpovedi, ki se lahko uporabijo z vključenimi modeli obremenjevanja.
Referenčni pogoji za podatke o pogostosti odpovedi so podani, tako da je mogoče podatke iz drugih virov primerjati na enotni osnovi. Če so podatki o pogostosti odpovedi podani v skladu s tem dokumentom, se lahko dodatne informacije o podanih pogojih izpustijo.
Ta dokument ne podaja osnovnih pogostosti odpovedi za komponente, ampak podaja modele, ki omogočajo pretvarjanje pogostosti odpovedi, pridobljenih z drugimi sredstvi, iz enega obratovalnega pogoja v drug obratovalni pogoj.
Metodologija napovedi, opisana v tem dokumentu, predpostavlja, da se deli uporabljajo v življenjski dobi. Metode v tem dokumentu so splošno uporabne, vendar se uporabljajo posebej za izbiro tipov komponent, kot določajo točke od 6 do 20 in točka I.2.

General Information

• Status: Published
• Publication Date: 01-Jun-2017
• ICS: 21.020 - Characteristics and design of machines, apparatus, equipment
• ICS: 31.020 - Electronic components in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 24-May-2017
• Due Date: 29-Jul-2017
• Completion Date: 02-Jun-2017
• Ref Project: EN 61709:2017 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

Relations

• Revised: SIST EN 61709:2011 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
• Effective Date: 13-Oct-2015
• Corrected By: SIST EN 61709:2017/AC:2020 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2017/COR1:2019)
• Effective Date: 05-Nov-2019
• Replaces: SIST EN 61709:2011 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
• Effective Date: 23-May-2017
• Replaces: SIST EN 61709:2011 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61709:2017
01-julij-2017
1DGRPHãþD
SIST EN 61709:2011
(OHNWULþQHNRPSRQHQWH=DQHVOMLYRVW5HIHUHQþQLSRJRML]DSRJRVWRVWRGSRYHGLLQ
PRGHOHREUHPHQMHYDQMD]DSUHWYDUMDQMH,(&
Electric components - Reliability - Reference conditions for failure rates and stress
models for conversion (IEC 61709:2017)
Elektrische Bauelemente - Zuverlässigkeit - Referenzbedingungen für Ausfallraten und
Beanspruchungsmodelle zur Umrechnung (IEC 61709:2017)
Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance
et modèles de contraintes pour la conversion (IEC 61709:2017)
Ta slovenski standard je istoveten z: EN 61709:2017
ICS:
21.020 =QDþLOQRVWLLQQDþUWRYDQMH Characteristics and design of
VWURMHYDSDUDWRYRSUHPH machines, apparatus,
equipment
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 61709:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 61709:2017

---------------------- Page: 2 ----------------------

SIST EN 61709:2017


EUROPEAN STANDARD EN 61709

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2017
ICS 31.020 Supersedes EN 61709:2011
English Version
Electric components - Reliability - Reference conditions for
failure rates and stress models for conversion
(IEC 61709:2017)
Composants électriques - Fiabilité - Conditions de référence Bauelemente der Elektronik - Zuverlässigkeit -
pour les taux de défaillance et modèles de contraintes pour Referenzbedingungen für Ausfallraten und
la conversion Beanspruchungsmodelle zur Umrechnung
(IEC 61709:2017) (IEC 61709:2017)
This European Standard was approved by CENELEC on 2017-03-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61709:2017 E

---------------------- Page: 3 ----------------------

SIST EN 61709:2017
EN 61709:2017
European foreword
The text of document 56/1714/FDIS, future edition 3 of IEC 61709, prepared by
IEC/TC 56 "Dependability" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61709:2017.

The following dates are fixed:
(dop) 2017-12-24
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-03-24
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61709:2011.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights
Endorsement notice
The text of the International Standard IEC 61709:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60300-3-2:2004 NOTE Harmonized as EN 60300-3-2:2005.
IEC 60300-3-3 NOTE Harmonized as EN 60300-3-3.
IEC 60721 (series) NOTE Harmonized as EN 60721 (series).
IEC 60721-3-3 NOTE Harmonized as EN 60721-3-3.
IEC 60721-3-4 NOTE Harmonized as EN 60721-3-4.
IEC 60721-3-5 NOTE Harmonized as EN 60721-3-5.
IEC 60721-3-7 NOTE Harmonized as EN 60721-3-7.
IEC 61014:2003 NOTE Harmonized as EN 61014:2003.
IEC 61360 (series) NOTE Harmonized as EN 61360 (series).
IEC 61360-1:2009 NOTE Harmonized as EN 61360-1:2010.
IEC 61360-4:2005 NOTE Harmonized as EN 61360-4:2005.
IEC 61508 (series) NOTE Harmonized as EN 61508 (series).
IEC 61649:2008 NOTE Harmonized as EN 61649:2008.
IEC 61703:2002 NOTE Harmonized as EN 61703:2002.
IEC 61710 NOTE Harmonized as EN 61710.
2

---------------------- Page: 4 ----------------------

SIST EN 61709:2017
EN 61709:2017
IEC 61810-2:2011 NOTE Harmonized as EN 61810-2:2011.
IEC 61810-2-1:2011 NOTE Harmonized as EN 61810-2-1:2011.
IEC 62007 (series) NOTE Harmonized as EN 62007 (series).
IEC 62741 NOTE Harmonized as EN 62741.
IEC 62308:2006 NOTE Harmonized as EN 62308:2006.

3

---------------------- Page: 5 ----------------------

SIST EN 61709:2017
EN 61709:2017

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-192 2015 International electrotechnical vocabulary - - -
Part 192: Dependability

4

---------------------- Page: 6 ----------------------

SIST EN 61709:2017




IEC 61709

®


Edition 3.0 2017-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Electric components – Reliability – Reference conditions for failure rates and

stress models for conversion




Composants électriques – Fiabilité – Conditions de référence pour les taux de

défaillance et modèles de contraintes pour la conversion
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.020 ISBN 978-2-8322-3902-5



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 61709:2017
– 2 – IEC 61709:2017 © IEC 2017
CONTENTS
FOREWORD . 9
INTRODUCTION . 11
1 Scope . 12
2 Normative references . 12
3 Terms, definitions and symbols . 12
3.1 Terms and definitions. 12
3.2 Symbols . 16
4 Context and conditions . 17
4.1 Failure modes and mechanisms . 17
4.2 Thermal modelling . 18
4.3 Mission profile consideration . 18
4.3.1 General . 18
4.3.2 Operating and non-operating conditions . 18
4.3.3 Dormancy . 19
4.3.4 Storage . 19
4.4 Environmental conditions . 19
4.5 Components choice . 21
4.6 Reliability growth during the deployment phase of new equipment . 22
4.7 How to use this document . 23
5 Generic reference conditions and stress models . 24
5.1 Recommended generic reference conditions . 24
5.2 Generic stress models . 25
5.2.1 General . 25
5.2.2 Stress factor for voltage dependence, π . 26
U
5.2.3 Stress factor for current dependence, π . 26
I
5.2.4 Stress factor for temperature dependence, π . 26
T
5.2.5 Environmental application factor, π . 28
E
5.2.6 Dependence on switching rate, π . 28
S
5.2.7 Dependence on electrical stress, . 29
π
ES
5.2.8 Other factors of influence . 29
6 Integrated semiconductor circuits . 29
6.1 Specific reference conditions . 29
6.2 Specific stress models . 31
6.2.1 General . 31
6.2.2 Voltage dependence, factor . 32
π
U
6.2.3 Temperature dependence, factor . 32
π
T
7 Discrete semiconductors . 35
7.1 Specific reference conditions . 35
7.2 Specific stress models . 36
7.2.1 General . 36
7.2.2 Voltage dependence for transistors, factor π . 37
U
7.2.3 Temperature dependence, factor π . 37
T
8 Optoelectronic components . 39

---------------------- Page: 8 ----------------------

SIST EN 61709:2017
IEC 61709:2017 © IEC 2017 – 3 –
8.1 Specific reference conditions . 39
8.2 Specific stress models . 41
8.2.1 General . 41
8.2.2 Voltage dependence, factor π . 41
U
8.2.3 Current dependence, factor π . 41
I
8.2.4 Temperature dependence, factor π . 42
T
9 Capacitors . 44
9.1 Specific reference conditions . 44
9.2 Specific stress model . 44
9.2.1 General . 44
9.2.2 Voltage dependence, factor π . 44
U
9.2.3 Temperature dependence, factor π . 46
T
10 Resistors and resistor networks . 47
10.1 Specific reference conditions . 47
10.2 Specific stress models . 48
10.2.1 General . 48
10.2.2 Temperature dependence, factor π . 48
T
11 Inductors, transformers and coils . 49
11.1 Reference conditions . 49
11.2 Specific stress model . 49
11.2.1 General . 49
11.2.2 Temperature dependence, factor π . 49
T
12 Microwave devices . 50
12.1 Specific reference conditions . 50
12.2 Specific stress models . 51
13 Other passive components . 51
13.1 Specific reference conditions . 51
13.2 Specific stress models . 51
14 Electrical connections . 51
14.1 Specific reference conditions . 51
14.2 Specific stress models . 52
15 Connectors and sockets . 52
15.1 Reference conditions . 52
15.2 Specific stress models . 52
16 Relays . 52
16.1 Reference conditions . 52
16.2 Specific stress models . 53
16.2.1 General . 53
16.2.2 Dependence on switching rate, factor π . 53
S
16.2.3 Dependence on electrical stress, factor π . 54
ES
16.2.4 Temperature dependence, factor π . 55
T
17 Switches and push-buttons . 55
17.1 Specific reference conditions . 55
17.2 Specific stress model . 56
17.2.1 General . 56

---------------------- Page: 9 ----------------------

SIST EN 61709:2017
– 4 – IEC 61709:2017 © IEC 2017
17.2.2 Dependence on electrical stress, factor π . 56
ES
18 Signal and pilot lamps . 57
18.1 Specific reference conditions . 57
18.2 Specific stress model . 57
18.2.1 General . 57
18.2.2 Voltage dependence, factor π . 58
U
19 Printed circuit boards (PCB) . 58
20 Hybrid circuits . 58
Annex A (normative) Failure modes of components . 59
Annex B (informative) Thermal model for semiconductors . 62
B.1 Thermal model . 62
B.2 Junction temperature calculation . 63
B.3 Thermal resistance evaluation . 64
B.4 Power dissipation of an integrated circuit P . 65
Annex C (informative) Failure rate prediction . 68
C.1 General . 68
C.2 Failure rate prediction for assemblies . 68
C.2.1 General . 68
C.2.2 Assumptions and limitations . 69
C.2.3 Process for failure rate prediction . 69
C.2.4 Prediction models . 70
C.2.5 Other methods of reliability prediction . 71
C.2.6 Validity considerations of reliability models and predictions . 72
C.3 Component considerations . 73
C.3.1 Component model . 73
C.3.2 Components classification . 73
C.4 General consideration about failure rate . 73
C.4.1 General . 73
C.4.2 General behaviour of the failure rate of components . 74
C.4.3 Expected values of failure rate. 75
C.4.4 Sources of variation in failure rates . 75
Annex D (informative) Considerations on mission profile . 77
D.1 General . 77
D.2 Dormancy . 77
D.3 Mission profile . 78
D.4 Example of mission profile . 79
Annex E (informative) Useful life models . 80
E.1 General . 80
E.2 Power transistors . 80
E.3 Optocouplers . 80
E.3.1 Useful life L . 80
E.3.2 Factor L . 81
0
E.3.3 Factor κ . 81
0
E.3.4 Factor κ . 82
1
E.3.5 Factor κ . 82
2
E.3.6 Factor κ . 82
3
E.4 LED and LED modules . 83

---------------------- Page: 10 ----------------------

SIST EN 61709:2017
IEC 61709:2017 © IEC 2017 – 5 –
E.4.1 Useful life L . 83
E.4.2 Factor L . 83
0
E.4.3 Factor κ . 84
0
E.4.4 Factor κ . 84
1
E.4.5 Factor κ . 85
2
E.4.6 Factor κ . 85
3
E.5 Aluminium, non-solid electrolyte capacitors . 85
E.6 Relays . 86
E.7 Switches and keyboards . 86
E.8 Connectors . 86
Annex F (informative) Physics of failure . 87
F.1 General . 87
F.2 Failure mechanisms of integrated circuits . 88
Annex G (informative) Considerations for the design of a data base on failure rates . 89
G.1 General . 89
G.2 Data collection acquisition – collection process . 89
G.3 Which data to collect and how to collect it . 89
G.4 Calculation and decision making . 90
G.5 Data descriptions . 90
G.6 Identification of components . 90
G.6.1 General . 90
G.6.2 Component identification . 91
G.6.3 Component technology . 91
G.7 Specification of components . 91
G.7.1 General . 91
G.7.2 Electrical specification of components . 91
G.7.3 Environmental specification of components . 92
G.8 Field related issues data . 92
G.8.1 General . 92
G.8.2 Actual field conditions . 92
G.8.3 Data on field failures . 92
G.9 Test related issues data . 93
G.9.1 General . 93
G.9.2 Actual test conditions . 93
G.9.3 Data on test failures . 93
G.10 Failure rate database attributes . 94
Annex H (informative) Potential sources of failure rate data and methods of selection . 96
H.1 General . 96
H.2 Data source selection . 96
H.3 User data . 97
H.4 Manufacturer’s data . 97
H.5 Handbook reliability data . 98
H.5.1 General . 98
H.5.2 Using handbook data with this document . 98
H.5.3 List of available handbooks . 99
Annex I (informative) Overview of component classification . 102
I.1 General . 102
I.2 The IEC 61360 system . 102

---------------------- Page: 11 ----------------------

SIST EN 61709:2017
– 6 – IEC 61709:2017 © IEC 2
...