Fixed resistors for use in electronic equipment - Part 1: Generic specification

IEC 60115-1: 2008(E) is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This fourth edition cancels and replaces the third edition issued in 1999 and Amendment 1 (2001). It constitutes a technical revision. It contains the following significant technical changes with respect to the previous edition:
a) implementation of Annex Q which replaces Clause 3;
b) addition of new tests procedures in 4.34 through 4.38;
c) removal of the property 'temperature characteristics' from 4.8;
d) introduction of a new system of test severities for the shear test in  4.32;
e) introduction of new bias voltages for the damp heat steady-state test in 4.24;
f) furthermore, this fourth edition cancels and replaces the third edition published in 1999 and constitutes minor revisions related to tables, figures and references.

Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1: Fachgrundspezifikation

Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification générique

La CEI 60115-1:2008 est une spécification générique et s'applique aux résistances fixes utilisées dans les équipements électroniques. Elle définit les termes normalisés, les procédures d'inspection et les méthodes d'essai utilisés dans les spécifications intermédiaires et particulières des composants électroniques dans le cadre de l'assurance qualité, ainsi qu'à d'autres fins. La présente norme annule et remplace la CEI 61045-1 (1991), la CEI 61045-2 (1991) et la CEI 61045-2-1 (1991). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) mise en place de l'Annexe Q qui remplace l'Article 3; b) addition de nouvelles procédures d'essai de 4.34 au 4.38; c) retrait de la propriété "caractéristiques de température" de 4.8; d) introduction d'un nouveau système de sévérités des essais pour l'essai de cisaillement de 4.32; e) introduction de nouvelles tensions de polarisation pour l'essai continu en chaleur humide de 4.24; f) de plus, cette quatrième édition annule et remplace la troisième édition publiée en 1999 et ajoute des révisions mineures relatives aux tableaux, figures et références.

Fiksni upori za elektronsko opremo - 1. del: Rodovna specifikacija

Ta del IEC 60115 je rodovna specifikacija in velja za fiksne upore za elektronsko opremo. Vzpostavlja standardne izraze, nadzorne postopke in metode preskušanja, ki se uporabljajo za področno in podrobno specifikacijo elektronskih komponent za ocenjevanje kakovosti ali druge namene.

General Information

Status
Published
Publication Date
30-Nov-2011
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
23-Nov-2011
Due Date
28-Jan-2012
Completion Date
01-Dec-2011

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SLOVENSKI STANDARD
SIST EN 60115-1:2012
01-januar-2012
Fiksni upori za elektronsko opremo - 1. del: Rodovna specifikacija
Fixed resistors for use in electronic equipment - Part 1: Generic specification
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1:
Fachgrundspezifikation
Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification
générique
Ta slovenski standard je istoveten z: EN 60115-1:2011
ICS:
31.040.10 Fiksni upor Fixed resistors
SIST EN 60115-1:2012 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60115-1:2012

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SIST EN 60115-1:2012

EUROPEAN STANDARD
EN 60115-1

NORME EUROPÉENNE
November 2011
EUROPÄISCHE NORM

ICS 31.040.10 Supersedes EN 60115-1:2001 + A1:2001 + A11:2007


English version


Fixed resistors for use in electronic equipment -
Part 1: Generic specification
(IEC 60115-1:2008, modified)


Résistances fixes utilisées dans les Festwiderstände zur Verwendung in
équipements électroniques - Geräten der Elektronik -
Partie 1: Spécification générique Teil 1: Fachgrundspezifikation
(CEI 60115-1:2008, modifiée) (IEC 60115-1:2008, modifiziert)





This European Standard was approved by CENELEC on 2011-08-15. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60115-1:2011 E

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Contents
1 General . 7
1.1 Scope . 7
1.2 Normative references . 7
2 Technical data . 9
2.1 Units and symbols . 9
2.2 Terms and definitions . 9
2.3 Preferred values . 13
2.4 Marking . 13
2.5 Coding . 13
2.6 Packaging . 13
2.7 Storage . 14
2.8 Transportation . 14
3 Quality assessment procedures . 14
4 Test and measurement procedures . 14
4.1 General . 14
4.2 Standard atmospheric conditions . 14
4.3 Drying . 15
4.4 Visual examination and checking of dimensions . 15
4.5 Resistance . 16
4.6 Insulation resistance . 17
4.7 Voltage proof . 20
4.8 Variation of resistance with temperature . 20
4.9 Reactance . 22
4.10 Non-linearity . 23
4.11 Voltage coefficient . 23
4.12 Current Noise . 24
4.13 Short time overload . 24
4.14 Temperature rise . 24
4.15 Robustness of the resistor body . 25
4.16 Robustness of terminations . 26
4.17 Solderability . 27
4.18 Resistance to soldering heat . 28
4.19 Rapid change of temperature . 28
4.20 Bump . 29
4.21 Shock . 29
4.22 Vibration . 30
4.23 Climatic sequence . 30
4.24 Damp heat, steady state . 32
4.25 Endurance . 33
4.26 Accidental overload test . 42

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4.27 Single-pulse high-voltage overload test . 44
4.28 Periodic-pulse high-voltage overload test . 47
4.29 Component solvent resistance . 49
4.30 Solvent resistance of marking . 50
4.31 Mounting of surface mount resistors . 50
4.32 Shear test . 51
4.33 Substrate bending test . 51
4.34 Corrosion . 52
4.35 Flammability . 52
4.36 Operation at low temperature . 52
4.37 Damp heat, steady state, accelerated . 53
4.38 Electrostatic discharge . 53
4.39 Periodic-pulse overload test . 54
4.40 Whisker growth test . 55
4.41 Hydrogen sulphide test . 55
Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors
for electronic equipment for use within the IECQ system . 56
Annex C (informative) Example of test equipment for the periodic-pulse high-voltage overload test . 57
Annex F (informative) Letter symbols and abbreviations . 59
Annex G (informative) Index table for test and measurement procedures . 61
Annex Q (normative) Quality assessment procedures . 63
Annex ZA (informative) Example of a certified test record . 71
Annex ZR (normative) Failure rate level evaluation, determination and qualification . 73
Annex ZX (informative) Cross reference . 80
Figures
Figure 1 – Insulation resistance and voltage proof test jig for rectangular surface mount resistors . 18
Figure 2 – Insulation resistance and voltage proof test jig for cylindrical surface mount resistors . 19
Figure 3 – Test circuit . 22
Figure 4 – Oscilloscope trace . 23
Figure 5 – Testing of resistor body robustness . 26
Figure 6 – Derating curve with specification of a suitable test dissipation . 37
Figure 7 – Derating curve without specification of a suitable test dissipation . 37
Figure 8 – Derating curve for UCT = MET . 40
Figure 9 – Derating curve for UCT < MET . 41
Figure 10 – Gauze cylinder fixture . 43
Figure 11 – Pulse generator 1,2/50 . 45
Figure 12 – Pulse generator 10/700 . 45
Figure C.1 – Block diagram of test equipment . 57
Figure C.2 – Tolerances on the pulse shape . 58

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Tables
Table 1 – Referee conditions . 15
Table 2 – Measuring voltages . 16
Table 3 – Calculation of resistance value (R) and change in resistance (∆R) . 21
Table 4 – Calculation of temperature differences (∆T) . 21
Table 5 – Tensile force for wire terminations. 26
Table 6 – Torque . 27
Table 7 – Number of cycles . 31
Table 8 – Severities . 46
Table 9 – List of preferred severities . 48
Table 10 – Periodic-pulse overload test condition . 54
Table ZR.1 – Component hours and permitted number of non-conformances for the qualification
and extension of the qualification of a failure rate level (60 % statistic confidence level) . 74
Table ZR.2 – Component hours, permitted number of non-conformances and periodicity for the
maintenance of the qualification of a failure rate level (10 % statistic confidence level) . 76
Table ZR.3 – Environmental factor π . 79
E

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Foreword
This document EN 60115-1 consists of the text of IEC 60115-1:2008 prepared by IEC TC 40, Capacitors and
resistors for electronic equipment, together with the common modifications prepared by the Technical
Committee CENELEC TC 40XB, Resistors.


The following dates are fixed:

• latest date by which the document has to be (dop) 2012-08-15
implemented at national level
by publication of an identical
national standard or by endorsement
(dow) 2014-08-15
• latest date by which the national standards conflicting
with the document have to be withdrawn
This document supersedes EN 60115-1:2001 + A1:2001 + A11: 2007.
European common modifications to the text of IEC 60115-1:2008 are incdicated by a vertical line in the left
margin of the text.
Clauses, subclauses, notes, tables and figures which are additional to those in IEC 60115-1:2008 are
prefixed “Z”.
Preceding documents on the subject covered by this specification have been:
– EN 140000:1993-12
– CECC 40 000:1973-00, 1979:00
Compared to EN 60115-1:2001, the following changes have been implemented:
— revision of the terms and definitions in 2.2;
— removal of the property “temperature characteristics” from 4.8;
— revision of the solderability test in 4.17;
— revision of the resistance to soldering heat test in 4.18;
— introduction of new bias voltages for the damp heat, steady-state test in 4.24;
— revision of Clause 4.25;
— introduction of new test severities for the single-pulse high-voltage overload test on 4.27;
— introduction of a new system of test severities for the shear test in 4.32;
— deletion of the seal test in 4.36;
— introduction of the operation at low temperature test in 4.36, as a replacement of 4.38;
— revision of the damp heat, steady state, accelerated test in 4.37, as a replacement of 4.39, with
introduction of a new test severity
— introduction of the electrostatic discharge test in 4.38, as a replacement of 4.40;
— revision of the periodic-pulse overload test in 4.39, as a replacement of 4.37;
— introduction of a whisker growth test in 4.40;
— deletion of normative Annex A;
— revision of normative Annex B;
— deletion of normative Annexes D and E;
— introduction of informative Annexes F and G;
— revision of normative Annex Q, as a replacement of Clause 3;
— revision of informative Annex ZA;
— revision of normative Annex ZR, as a replacement of Annex ZB;
— editorial revision.
See also the cross reference of informative Annex ZX.

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This document has been prepared under a mandate given to CENELEC by the European Commission and
the European Free Trade Association, and supports essential requirements of EU Directive(s).

Endorsement notice
The text of the International Standard IEC 60115-1:2008 was approved by CENELEC as a European
Standard with common modifications.
___________

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1 General
1.1 Scope
This part of IEC 60115 is a generic specification and is applicable to fixed resistors for use in electronic
equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail
specifications of electronic components for quality assessment or any other purpose.
1.2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
EN 60027-1, Letter symbols to be used in electrical technology - Part 1: General (IEC 60027-1)
EN 60060-1:2010, High-voltage test techniques – Part 1: General definitions and test requirements
(IEC 60060-1:2010)
EN 60062, Marking codes for resistors and capacitors (IEC 60062)
EN 60068-1:1994, Environmental testing - Part 1: General and guidance
(IEC 60068-1:1988 + A1:1992 + corrigendum Oct. 1988)
EN 60068-2-1, Environmental testing - Part 2-1: Tests - Test A: Cold (IEC 60068-2-1)
EN 60068-2-2, Environmental testing - Part 2-2: Tests - Test B: Dry heat (IEC 60068-2-2)
EN 60068-2-6, Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) (IEC 60068-2-6)
EN 60068-2-11, Environmental testing - Part 2: Tests - Test Ka: Salt mist (IEC 60068-2-11)
EN 60068-2-13, Environmental testing - Part 2: Tests - Test M: Low air pressure, (IEC 60068-2-13)
EN 60068-2-14, Environmental testing - Part 2-14: Tests - Test N: Change of temperature (IEC 60068-2-14)
EN 60068-2-20:2008, Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and
resistance to soldering heat of devices with leads (IEC 60068-2-20:2008)
EN 60068-2-21, Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral
mounting devices (IEC 60068-2-21)
EN 60068-2-27, Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock (IEC 60068-2-27)
EN 60068-2-30, Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
(IEC 60068-2-30)
EN 60068-2-45, Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning
solvents (IEC 60068-2-45)
EN 60068-2-54, Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic
components by the wetting balance method (IEC 60068-2-54)
EN 60068-2-58, Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance
to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58)
EN 60068-2-67:1996, Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated
test primarily intended for components (IEC 60068-2-67:1995)
EN 60068-2-69, Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69)
EN 60068-2-78, Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
(IEC 60068-2-78)

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EN 60068-2-82:2007, Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for
electronic and electric components (IEC 60068-2-82:2007 + corrigendum Dec. 2009)
EN 60286 (all parts), Packaging of components for automatic handling
EN 60695-11-5:2005, Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus,
confirmatory test arrangement and guidance (IEC 60695-11-5:2004)
EN 61193-2, Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of
electronic components and packages (IEC 61193-2)
EN 61249-2-7, Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base
materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning
test), copper-clad (IEC 61249-2-7)
EN 61249-2-22, Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced
base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of
defined flammability (vertical burning test), copper-clad (IEC 61249-2-22)
EN 61249-2-35, Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced
base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability
(vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35)
EN 61340-3-1, Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms (IEC 61340-3-1)
EN 61760-1, Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs) (IEC 61760-1)
EN 61760-2, Surface mounting technology - Part 2: Transportation and storage conditions of surface
mounting devices (SMD) - Application guide (IEC 61760-2)
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 60063:1963, Preferred number series for resistors and capacitors
A1:1967
A2:1977
IEC 60195, Method of measurement of current noise generated in fixed resistors
IEC 60294:1969, Measurement of the dimensions of a cylindrical component having two axial terminations
IEC 60410, Sampling plans and procedures for inspection by attributes
IEC/TR 60440, Method of measurement of non-linearity in resistors
IEC 60617, Graphical symbols for diagrams
IEC QC 001002-2:1998, IEC Quality Assessment System for Electronic Components (IECQ) – Rules of
procedure – Part 2: Documentation
IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) – Rules of
procedure – Part 3: Approval procedures
IEC QC 210000, Technology Approval Schedules – Requirements under the IECQ Quality Assessment
System for Electronic Components
ISO 80000-1, Quantities and unitis – Part 1: General

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2 Technical data
2.1 Units and symbols
Units, graphical symbols and letter symbols should, whenever possible, be taken from the following
publications:
– EN 60027-1;
– IEC 60050;
– IEC 60617;
– ISO 80000-1.
When further items are required they shall be derived in accordance with the principles of the publications
listed above.
2.2 Terms and definitions
For the purposes of this document, the following terms and definitions apply, in alphabetical order of the
English terms:
NOTE The sequential numbering of terms and definations is not suitable for referencing.
2.2.1
category dissipation
fraction of the rated dissipation exactly defined in the detail specification, applicable at the upper category
temperature, taking account of the derating curve prescribed in the detail specification
NOTE 1 For resistors the category dissipation is zero, where the upper category temperature is the maximum element
temperature.
NOTE 2 Related terminology: rated dissipation, upper category temperature, derating curve.
2.2.2
category temperature range
range of ambient temperatures for which the resistor has been designed to operate continuously; this is
given by the lower and upper category temperature
NOTE Related terminology: lower category temperature, upper category temperature.
2.2.3
critical resistance
resistance value at which the rated voltage is equal to the limiting element voltage
NOTE 1 At an ambient temperature of 70 °C, the maximum voltage which may be applied across the terminations of a
resistor is either the calculated rated voltage, if the resistance is less than the critical resistance, or the limiting element
voltage, if the resistance is equal to or greater than the critical resistance. At temperatures other than 70 °C, it is
important that account be taken of the derating curve and of the limiting element voltage in the calculation of any voltage
to be applied.
NOTE 2 Related terminology: Rated voltage, limiting element voltage.
2.2.4
derating curve
curve which shows the maximum allowable dissipation at ambient temperatures between the upper
and lower category temperature
NOTE 1 In the range between lower category temperature and rated temperature it shows the rated dissipation, and
between rated temperature and maximum element temperature it shows a linear slope down to zero dissipation at the
maximum element temperature. The slope depends on the thermal properties of the resistor, i.e. its capability to abduct
the dissipation to the environment.
NOTE 2 Related terminology: rated dissipation, rated temperature, maximum element temperature.

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2.2.5
failure rate level
accumulated number of non-conforming units under specified operating conditions and specified
accumulation time, evaluated for a given confidence level
NOTE Related terminology: non-conformance, non-conforming unit.
2.2.6
grade
term indicating additional general characteristics concerning the intended application, for example,
long-life applications
NOTE 1 The term "grade" may be used only in combination with one or more words (for example, long-life grade) and
not with a single letter or number.
NOTE 2 Related terminology: stability class.
2.2.7
heat-sink resistor
resistor type designed for mounting on a separate heat-sink
NOTE Related terminology: rated dissipation
2.2.8
insulated resistor
resistor which fulfils the voltage proof and insul
...

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