Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020)

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test
and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for
magnetic and capacitive couplers for basic insulation and reinforced insulation.

Halbleiterbauelemente - Teil 17: Magnetische und kapazitive Koppler für Basisisolierung und verstärkte Isolierung (IEC 60747-17:2020)

Dispositifs à semiconducteurs - Partie 17: Coupleur magnétique et capacitif pour l’isolation principale et renforcée (IEC 60747-17:2020)

L'IEC 60747-17:2020 spécifie la terminologie, les valeurs assignées essentielles, les caractéristiques, l’essai de sécurité et les méthodes de mesure des coupleurs magnétiques et des coupleurs capacitifs. Elle spécifie les principes et exigences de l’isolation et les caractéristiques d’isolement des coupleurs magnétiques et capacitifs pour l’isolation principale et l’isolation renforcée. Cette première édition annule et remplace l’IEC PAS 60747-17:2011. Cette édition constitue une révision technique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’IEC PAS 60747‑17:2011: a) introduction des facteurs de sécurité de durée de vie pour la prise en considération de la durée de vie améliorée, conformément aux mécanismes de vieillissement du dioxyde de silicium (TDDB) largement reconnus, et couches d’isolement en polymère à couches minces; b) prise en considération de l’alinéa et de la durée de vie statistique de l’"essai de fin de vie" considérablement améliorée par l’ajout d’une description détaillée du processus, des facteurs de sécurité, des méthodes de génération de points de données et des interpolations de la durée de vie respective, ainsi que par la spécification de la quantité minimale d'échantillons exigés; c) introduction du concept de certification par similarité, comprenant l’Annexe A, qui donne des recommandations relatives aux considérations de qualification et au processus de certification exigé; d) forme d'impulsion alternative admise pour l’essai d’impulsion de choc afin d'éviter les problèmes de disponibilité de l’appareil d’essai aux ondes de choc; e) plusieurs améliorations tout au long de la norme: amélioration des définitions, par exemple des types de coupleurs; introduction de la valeur assignée de l’impulsion de choc VIMP, utilisation d’une température de transition vitreuse, redéfinition du préconditionnement pour une utilisation améliorée et une meilleure compatibilité avec la conception et les fonctionnalités actuelles des coupleurs, les composants moulés disponibles, etc.

Polprevodniški elementi - 17. del: Magnetni in kapacitivni spojnik za osnovno in ojačeno izolacijo (IEC 60747-17:2020)

General Information

Status
Published
Publication Date
17-Nov-2020
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
13-Nov-2020
Due Date
18-Jan-2021
Completion Date
18-Nov-2020

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SLOVENSKI STANDARD
SIST EN IEC 60747-17:2021
01-januar-2021
Polprevodniški elementi - 17. del: Magnetni in kapacitivni spojnik za osnovno in
ojačeno izolacijo (IEC 60747-17:2020)
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and
reinforced insulation (IEC 60747-17:2020)

Halbleiterbauelemente - Teil 17: Magnetische und kapazitive Koppler für Basisisolierung

und verstärkte Isolierung (IEC 60747-17:2020)
Dispositifs à semiconducteurs - Partie 17: Coupleur magnétique et capacitif pour
l’isolation principale et renforcée (IEC 60747-17:2020)
Ta slovenski standard je istoveten z: EN IEC 60747-17:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60747-17:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 60747-17:2021
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SIST EN IEC 60747-17:2021
EUROPEAN STANDARD EN IEC 60747-17
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2020
ICS 31.080.99
English Version
Semiconductor devices - Part 17: Magnetic and capacitive
coupler for basic and reinforced insulation
(IEC 60747-17:2020)

Dispositifs à semiconducteurs - Partie 17: Coupleur Halbleiterbauelemente - Teil 17: Magnetische und

magnétique et capacitif pour l'isolation principale et kapazitive Koppler für Basisisolierung und verstärkte

renforcée Isolierung
(IEC 60747-17:2020) (IEC 60747-17:2020)

This European Standard was approved by CENELEC on 2020-10-26. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 60747-17:2020 E
---------------------- Page: 3 ----------------------
SIST EN IEC 60747-17:2021
EN IEC 60747-17:2020 (E)
European foreword

The text of document 47E/711/FDIS, future edition 1 of IEC 60747-17, prepared by SC 47E "Discrete

semiconductor devices" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC

parallel vote and approved by CENELEC as EN IEC 60747-17:2020.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2021-07-26

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2023-10-26

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60747-17:2020 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 60060-1:2010 NOTE Harmonized as EN 60060-1:2010 (not modified)
IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified)
IEC 60068-2-6:2007 NOTE Harmonized as EN 60068-2-6:2008 (not modified)
IEC 60068-2-17:1994 NOTE Harmonized as EN 60068-2-17:1994 (not modified)
IEC 60068-2-27:2008 NOTE Harmonized as EN 60068-2-27:2009 (not modified)
IEC 60270:2000 NOTE Harmonized as EN 60270:2001 (not modified)
IEC 60664-4:2005 NOTE Harmonized as EN 60664-4:2006 (not modified)
IEC 60747-5-5:2007 NOTE Harmonized as EN 60747-5-5:2011 (not modified)
IEC 61000-4-5:2014 NOTE Harmonized as EN 61000-4-5:2014 (not modified)
IEC 61000-4-8:2009 NOTE Harmonized as EN 61000-4-8:2010 (not modified)
IEC 61000-4-9:2016 NOTE Harmonized as EN 61000-4-9:2016 (not modified)
IEC 61649:2008 NOTE Harmonized as EN 61649:2008 (not modified)
IEC 62368-1:2018 NOTE Harmonized as EN IEC 62368-1:2020 (not modified)
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SIST EN IEC 60747-17:2021
EN IEC 60747-17:2020 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 2007 Environmental testing - Part 2-1: Tests - EN 60068-2-1 2007
Test A: Cold
IEC 60068-2-2 2007 Environmental testing - Part 2-2: Tests - EN 60068-2-2 2007
Test B: Dry heat

IEC 60068-2-14 2009 Environmental testing - Part 2-14: Tests - EN 60068-2-14 2009

Test N: Change of temperature

IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - EN 60068-2-20 2008

Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads

IEC 60068-2-30 2005 Environmental testing - Part 2-30: Tests - EN 60068-2-30 2005

Test Db: Damp heat, cyclic (12 h + 12 h
cycle)

IEC 60068-2-58 2015 Environmental testing - Part 2-58: Tests - EN 60068-2-58 2015

Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)

IEC 60068-2-67 1995 Environmental testing - Part 2-67: Tests - EN 60068-2-67 1996

Test Cy: Damp heat, steady state,
accelerated test primarily intended for
components
IEC 60112 2003 Method for the determination of the proof EN 60112 2003
and the comparative tracking indices of
solid insulating materials
IEC 60216-1 2013 Electrical insulating materials - Thermal EN 60216-1 2013
endurance properties - Part 1: Ageing
procedures and evaluation of test results
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SIST EN IEC 60747-17:2021
EN IEC 60747-17:2020 (E)
Publication Year Title EN/HD Year
IEC 60216-2 2005 Electrical insulating materials - Thermal EN 60216-2 2005
endurance properties - Part 2:
Determination of thermal endurance
properties of electrical insulating
materials - Choice of test criteria
IEC 60664-1 2007 Insulation coordination for equipment EN 60664-1 2007
within low-voltage systems - Part 1:
Principles, requirements and tests
IEC 60672-2 1999 Ceramic and glass insulating materials - EN 60672-2 2000
Part 2: Methods of test
IEC 60695-11-5 2016 Fire hazard testing - Part 11-5: Test EN 60695-11-5 2017
flames - Needle-flame test method -
Apparatus, confirmatory test arrangement
and guidance
IEC 62539 2007 Guide for the statistical analysis of - -
electrical insulation breakdown data
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SIST EN IEC 60747-17:2021
IEC 60747-17
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-8801-6

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 7 ----------------------
SIST EN IEC 60747-17:2021
– 2 – IEC 60747-17:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 8

4 Electrical characteristics – Coupler logic and timing definitions ...................................... 19

5 Coupler for protection against electrical shock ............................................................... 20

5.1 General ................................................................................................................. 20

5.2 Type ..................................................................................................................... 20

5.3 Ratings ................................................................................................................. 20

5.3.1 General ......................................................................................................... 20

5.3.2 Safety limiting values ..................................................................................... 20

5.3.3 Functional ratings .......................................................................................... 20

5.3.4 Rated isolation voltages................................................................................. 20

5.4 Electrical safety requirements ............................................................................... 20

5.5 Electrical, environmental and/or endurance test information .................................. 21

5.5.1 General ......................................................................................................... 21

5.5.2 Routine test ................................................................................................... 23

5.5.3 Sample test ................................................................................................... 23

5.5.4 Maximum surge isolation voltage ................................................................... 23

5.5.5 Type test ....................................................................................................... 24

6 Measuring methods for couplers .................................................................................... 35

6.1 General ................................................................................................................. 35

6.2 Isolation capacitance (C ) ................................................................................... 35

6.2.1 Purpose ......................................................................................................... 35

6.2.2 Circuit diagram .............................................................................................. 35

6.2.3 Measurement procedure ................................................................................ 36

6.2.4 Precautions to be observed ........................................................................... 36

6.2.5 Special conditions ......................................................................................... 36

6.3 Isolation resistance between input and output, R ............................................... 36

6.3.1 Purpose ......................................................................................................... 36

6.3.2 Circuit diagram .............................................................................................. 36

6.3.3 Precautions to be observed ........................................................................... 37

6.3.4 Measurement procedure ................................................................................ 37

6.3.5 Special conditions ......................................................................................... 37

6.4 Isolation test ......................................................................................................... 37

6.4.1 Purpose ......................................................................................................... 37

6.4.2 Circuit diagram .............................................................................................. 37

6.4.3 Test procedure .............................................................................................. 38

6.4.4 Requirements ................................................................................................ 38

6.5 Partial discharges of coupler ................................................................................. 39

6.5.1 Purpose ......................................................................................................... 39

6.5.2 Circuit diagram .............................................................................................. 39

6.5.3 Description of Figure 9 test circuit and requirements ..................................... 39

6.5.4 Test procedure .............................................................................................. 40

6.5.5 Description of calibration circuit (see Figure 10) ............................................ 40

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SIST EN IEC 60747-17:2021
IEC 60747-17:2020 © IEC 2020 – 3 –

6.5.6 Test methods ................................................................................................. 41

6.5.7 Specified conditions ....................................................................................... 41

6.5.8 Test voltage conditions .................................................................................. 42

6.6 Switching times of couplers ................................................................................... 42

6.6.1 Purpose ......................................................................................................... 42

6.6.2 Circuit diagram .............................................................................................. 42

6.6.3 Measurement procedure ................................................................................ 43

6.6.4 Specified conditions ....................................................................................... 44

6.7 Measuring methods of common-mode transient immunity (CMTI) for

magnetic and capacitive couplers ......................................................................... 44

6.7.1 Purpose ......................................................................................................... 44

6.7.2 Circuit diagram .............................................................................................. 44

6.7.3 Precautions to be observed ........................................................................... 45

6.7.4 Static CMTI measuring procedure .................................................................. 46

6.7.5 Specified conditions ....................................................................................... 47

6.7.6 Dynamic CMTI measuring procedure ............................................................. 47

Annex A (informative) Qualification guidance ....................................................................... 48

Bibliography .......................................................................................................................... 51

Figure 1 – Time intervals for methods a and b of the test voltage .......................................... 15

Figure 2 –1,2/50 µs surge pulse according 61000-4-5:2014 allowed as equivalent

impulse for isolation testing .................................................................................................. 24

Figure 3 – Determination of time to failure (referring to method in 5.5.5.8) ............................ 31

Figure 4 – Determination of working voltage (referring to method in 5.5.5.8 for

exponential model) ............................................................................................................... 32

Figure 5 – Determination of working voltage (referring to method in 5.5.5.8 for non-

linear model) ......................................................................................................................... 33

Figure 6 – Isolation capacitance measurement circuit ........................................................... 36

Figure 7 – Isolation resistance measurement circuit .............................................................. 37

Figure 8 – Isolation voltage measurement circuit .................................................................. 38

Figure 9 – Partial discharge test circuit ................................................................................. 39

Figure 10 – Connections for the calibration of the complete test arrangement ....................... 40

Figure 11 – Switching time test circuit ................................................................................... 43

Figure 12 – Transition time waveform measurement ............................................................. 43

Figure 13 – Propagation delay time waveform measurement ................................................. 44

Figure 14 – Static versus dynamic data source signal VI ....................................................... 45

Figure 15 – Common-mode transient immunity (CMTI) test setup for both static and

dynamic testing ..................................................................................................................... 45

Figure 16 – Static common-mode transient immunity (CMTI) and V and low to high

data transition waveform ....................................................................................................... 47

Figure A.1 – Lifetime verification ........................................................................................... 49

Table 1 – Overview on characteristics and symbols .............................................................. 19

Table 2 – Datasheet characteristics ...................................................................................... 21

Table 3 – Tests and test sequence for coupler providing basic insulation and reinforced

insulation for protection against electrical shock ................................................................... 22

Table 4 – Test conditions ...................................................................................................... 23

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SIST EN IEC 60747-17:2021
– 4 – IEC 60747-17:2020 © IEC 2020

Table 5 – Safety factor F....................................................................................................... 41

Table 6 – Specified conditions for method a and method b.................................................... 42

Table A.1 – Front end process changes within component .................................................... 49

Table A.2 – Front End Process Changes within SiO/SiN/imide-passivation ........................... 50

Table A.3 – Layout changes .................................................................................................. 50

Table A.4 – Backend changes ............................................................................................... 50

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SIST EN IEC 60747-17:2021
IEC 60747-17:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC

Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60747-17 has been prepared by subcommittee SC 47E: Discrete

semiconductor devices, of IEC technical committee TC 47: Semiconductor devices.

This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a

technical revision.

This edition includes the following significant technical changes with respect to

IEC PAS 60747-17:2011:

a) introduced lifetime safety factors for improved life time consideration, to comply with

widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer

isolation layers;

b) significantly improved "end of life testing" paragraph and statistical life time consideration

by adding detailed description on process, safety factors, methods of generating data

points and respective lifetime interpolations as well as being specific on minimum amount

of samples required;
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SIST EN IEC 60747-17:2021
– 6 – IEC 60747-17:2020 © IEC 2020

c) introduced concept of certification by similarity, including Annex A, giving guidance on

qualification considerations and required certification process;

d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester

availability;

e) various improvements throughout the standard: definitions, for example type of coupler

have been improved, introduction of surge impulse V rating, usage of glass transition

IMP

temperature, pre-conditioning have been redefined for improved usability and better

compatibility with today’s design and functionality of couplers, available mold compounds,

etc.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/711/FDIS 47E/715/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60747 series, published under the general title Semiconductor

devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SIST EN IEC 60747-17:2021
IEC 60747-17:2020 © IEC 2020 – 7 –
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
1 Scope

This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test

and the measuring methods of magnetic coupler and capacitive coupler.

It specifies the principles and requirements of insulation and isolation characteristics for

magnetic and capacitive couplers for basic insulation and reinforced insulation.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Test B: Dry heat

IEC 60068-2-14:2009, Environmental testing – Part 2-14: Tests – Test N: Change of

temperature

IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-30:2005, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic

(12 h + 12 h cycle)

IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)

IEC 60068-2-67:1995, Environmental testing – Part 2: Tests – Test Cy: Damp heat, steady

state, accelerated test primarily intended for components

IEC 60112:2003, Method for the determination of the proof and the comparative tracking

indices of solid insulating materials

IEC 60216-1:2013, Electrical insulating materials – Thermal endurance properties – Part 1:

Ageing procedures and evaluation of test results

IEC 60216-2:2005, Electrical insulating materials – Thermal endurance properties – Part 2:

Determination of thermal endurance properties of electrical insulating materials – Choice of

test criteria

IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:

Principles, requirements and tests
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SIST EN IEC 60747-17:2021
– 8 – IEC 60747-17:2020 © IEC 2020

IEC 60672-2:1999, Ceramic and glass insulating materials – Part 2: Methods of test

IEC 60695-11-5:2016, Fire hazard testing – Part 11-5: Test flames – Needle-flame test

method – Apparatus, confirmatory test arrangement and guidance

IEC 62539:2007, Guide for the statistical analysis of electrical insulation breakdown data

3 Terms and definitions
3.1
details of outline and encapsulation

information related method of encapsulation and terminal connections within the coupler's

isolation system
3.1.1
outline drawing

drawing or sketch restricted to line to describe the shape of objects or circuitry

3.1.2
method of encapsulation
encapsulating materials used forming part of the isolation system
3.1.3
terminal identification

terminal identification and indication of any connection between a terminal and the case

3.2
type of coupler
internal construction and insulation metho
...

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