SIST EN 60747-16-4:2005
(Main)Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches
Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
Halbleiterbauelemente -- Teil 16-4: Integrierte Mikrowellenschaltkreise - Schalter
Dispositifs à semiconducteurs -- Partie 16-4 : Circuits intégrés hyperfréquences - Commutateurs
Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SPDT single pole double throw. However, this standard is applicable to the other types of switches.
Polprevodniški elementi – 16-4. del: Mikrovalovna integrirana vezja – Stikala (IEC 60747-16-4:2004)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60747-16-4:2005
01-december-2005
Polprevodniški elementi – 16-4. del: Mikrovalovna integrirana vezja – Stikala (IEC
60747-16-4:2004)
Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches
Halbleiterbauelemente -- Teil 16-4: Integrierte Mikrowellenschaltkreise - Schalter
Dispositifs à semiconducteurs -- Partie 16-4 : Circuits intégrés hyperfréquences -
Commutateurs
Ta slovenski standard je istoveten z: EN 60747-16-4:2004
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 60747-16-4:2005 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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EUROPEAN STANDARD EN 60747-16-4
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2004
ICS 31.080.99
English version
Semiconductor devices
Part 16-4: Microwave integrated circuits –
Switches
(IEC 60747-16-4:2004)
Dispositifs à semiconducteurs Halbleiterbauelemente
Partie 16-4 : Circuits intégrés Teil 16-4: Integrierte
hyperfréquences – Mikrowellenschaltkreise –
Commutateurs Schalter
(CEI 60747-16-4:2004) (IEC 60747-16-4:2004)
This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60747-16-4:2004 E
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EN 60747-16-4:2004 - 2 -
Foreword
The text of document 47E/256/FDIS, future edition 1 of IEC 60747-16-4, prepared by SC 47E,
Discrete semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the
IEC-CENELEC parallel vote and was approved by CENELEC as EN 60747-16-4 on 2004-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60747-16-4:2004 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60747-16-1 NOTE Harmonized as EN 60747-16-1:2002 (not modified).
__________
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- 3 - EN 60747-16-4:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60617-12 - Graphical symbols for diagrams EN 60617-12 1998
Part 12: Binary logic elements
1) 2)
IEC 60617-13 - Part 13: Analogue elements EN 60617-13 1993
IEC 60747-1 1983 Semiconductor devices - Discrete devices- -
Part 1: General
A3 1996 - -
1)
IEC 60747-4 - Part 4: Microwave diodes and transistors- -
1)
IEC 60748-2-1 - Semiconductors devices - Integrated - -
circuits
Part 2: Digital integrated circuits - Section
one - Blank detail specification for bipolar
monolithic digital integrated circuit gates
(excluding uncommitted logic arrays)
1)
IEC 60748-3 - Part 3: Analogue integrated circuits - -
1)
IEC 60748-4 - Part 4: Interface integrated circuits - -
1)
Undated reference.
2)
Valid edition at date of issue.
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INTERNATIONAL IEC
STANDARD 60747-16-4
First edition
2004-07
Semiconductor devices –
Part 16-4:
Microwave integrated circuits –
Switches
” IEC 2004 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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U
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– 2 – 60747-16-4 ” IEC:2004(E)
CONTENTS
FOREWORD.3
1 Scope .5
2 Normative references .5
3 Terms and definitions .5
4 Essential ratings and characteristics .7
4.1 Circuit identification and types .7
4.2 Application description.8
4.3 Specification of the function .8
4.4 Limiting values (absolute maximum rating system) .10
4.5 Operating conditions (within the specified operating temperature range) .11
4.6 Electrical characteristics .11
4.7 Mechanical and environmental ratings, characteristics and data .12
4.8 Additional information .12
5 Measuring methods .13
5.1 General .13
5.2 Insertion loss (L ) .14
ins
5.3 Isolation (L ) .16
iso
5.4 Return loss (L ) .18
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) .20
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ).21
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) .23
o(mod) adj
5.8 n-th order harmonic distortion ratio (P /P ).26
nth 1
Bibliography .28
Figure 1 – Circuit diagram for the measurement of the insertion loss L .14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L .16
iso
Figure 3 – Circuit for the measurements of the return loss .18
Figure 4 – Circuit for the measurements of switching time.21
Figure 5 – Input and output waveforms.21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio .23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio .26
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60747-16-4 ” IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/256/FDIS 47E/261/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
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– 4 – 60747-16-4 ” IEC:2004(E)
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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60747-16-4 ” IEC:2004(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –
Part 1: General
Amendment 3 (1996)
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
Terms related to electrical characteristics
3.1
insertion loss
L
ins
ratio of the output power at the switched on port to the input power in the linear region of the
power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
o i
NOTE 2 Usually the insertion loss is expressed in decibels.
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– 6 – 60747-16-4 ” IEC:2004(E)
3.2
isolation
L
iso
ratio of the output power at the switched off port to the input power in the linear region of the
power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
o i
NOTE 2 Usually the isolation is expressed in decibels.
3.3
return loss
L
ret
ratio of the incident power P at the specified port to the reflected power P at the same
inc ref
port in the linear region of the power transfer curve P (dBm) = f(P )
ref inc
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
ref inc
NOTE 2 Usually the return loss is expressed in decibels.
3.4
input power at 1 dB compression
P
i(1 dB)
input power where the insertion loss increases by 1 dB compared with insertion loss in linear
region
3.5
output power at 1 dB compression
P
o(1dB)
output power where the insertion loss increases by 1 dB compared with insertion loss in linear
region
3.6
turn on time
t
on
interval between the lower reference point on the leading edge of the control voltage and the
upper reference point on the leading edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.7
turn off time
t
off
interval between the upper reference point on the trailing edge of the control voltage and the
lower reference point on the trailing edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.8
rise time
t
r(out)
interval between the lower reference point on the leading edge of the output voltage and the
upper reference point on the leading edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
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60747-16-4 ” IEC:2004(E) – 7 –
3.9
fall time
t
f(out)
interval between the upper reference point on the trailing edge of the output voltage and the
lower reference point on the trailing edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.10
adjacent channel power ratio
P /P
o(mod) adj
ratio of the total power in the specified carrier signal frequency band to total output power in
the specified frequency band away from the specified carrier signal frequency, at the specified
output power when the modulation signal is supplied
3.11
n-th order harmonic distortion ratio
P /P
nth 1
See 3.14 of IEC 60747-16-1(2001).
4 Essential ratings and characteristics
This clause gives ratings and characteristics required for specifying integrated circuit micro-
wave switches.
4.1 Circuit identification and types
4.1.1 Designation and types
Identification of type (device name), category of circuit and technology applied should be
given. Microwave switches comprise one category.
4.1.2 General function description
A general description of the function performed by the integrated circuit microwave switches
and the features for the application should be made.
4.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, etc. should be stated. This statement should include
details of the semiconductor technologies such as Schottky-barrier diode, PIN diode, MESFET,
Si bipolar transistor, etc.
IEC 60747-4 should be referred to for terminology and letter symbols, essential ratings and
characteristics and measuring methods of such microwave devices.
4.1.4 Package identification
The following statements should be made:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, of drawing of non-standard
package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
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4.1.5 Main application
The main application should be stated. If the device has restrictive applications, these should
be stated here.
4.2 Application description
Information on application of the integrated circuit and its relation to the associated devices
should be given.
4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or a recommendation.
Detailed information concerning application systems, equipment and circuits such as VSAT
systems, DBS receivers, microwave landing systems, etc. should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties that permit comparison between derivative types should be
given.
4.2.4 Electrical compatibility
It should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits, or families of integrated circuits, or whether special interfaces are required.
Details should be given concerning the type of input and output circuits, e.g. input/output
impedances, d.c. block, open-drain, etc. Interchangeability with other devices, if any, should
also be given.
4.2.5 Associated devices
If applicable, the following should be stated:
– devices necessary for correct operation (list with type number, name and function);
– peripheral devices with direct interfacing (list with type number, name and function).
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
switches should be given. The block diagram should be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
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60747-16-4 ” IEC:2004(E) – 9 –
The block diagram should identify the function of each external connection and, where no
ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has
metallic parts, any connection to them from external terminals should be indicated. The
connections with any associated external electrical elements should be stated, where
necessary.
As additional information, the complete electrical circuit diagram can be reproduced, but not
necessarily with indications of the values of the circuit components. The graphical symbol for
the function shall be given. Rules governing such diagrams may be obtained from IEC 60617-12
or IEC 60617-13.
4.3.2 Identification and function of terminals
All terminals should be identified on the block diagram (supply terminals, input or output
terminals, input/output terminals).
The terminal functions 1) to 4) should be indicated in a table as follows:
Function of terminal
Terminal Terminal 1) Terminal
2) Function
3) Input/output 4) Type of input/
number symbol designation
identification output circuits
1) Terminal designation
A terminal designation to indicate the function of the terminal should be given. Supply
terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals
(with abbreviation NU) should be distinguished.
2) Function
A brief indication of the terminal function should be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;
– each function of integrated circuit selected by mutual pin connections, programming
and/or application of function selection data to the function selection pin, such as
mode selection pin.
3) Input/output identification
Input, output, input/output and multiplex input/output terminals should be distinguished.
4) Type of input/output circuits
The type of input and output circuit, e.g. input/output impedances, with or without d.c.
block, etc., should be distinguished.
5) Type of ground
If the baseplate of the package is used as ground, this should be stated.
Example:
Bias supply voltage(s) Control supply voltage(s)
Input(s) Integrated NC
circuit
microwave
NU Output(s)
switch
Ground
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4.3.3 Function description
The function performed by the circuit should be specified, including the following information:
– basic function;
– relation to external terminals;
– operation mode (e.g., set-up method, preference, etc.);
– interrupt handling.
4.3.4 Family related characteristics
In this part, all the family specific functional descriptions shall be stated (referred to
IEC 60748-2, IEC 60748-3 and IEC 60748-4).
If ratings and characteristics, as well as function characteristics exist for the family, the
relevant part of IEC 60748 should be used (e.g. for microprocessors, see IEC 60748-2,
Chapter III, Section Three).
NOTE For each new device family, specific items should be added the relevant part of IEC 60748.
4.4 Limiting values (absolute maximum rating system)
The table for these values should contain the following:
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this should
be stated.
– All voltages are referenced to a specified reference terminal (V , ground, etc.).
ss
– In satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer shall indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity.
– The ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-dependent,
these dependence should be indicated.
4.4.1 Electrical limiting values
Limiting values should be specified as follows:
Subclause Parameters Min. Max.
4.4.1.1 Bias supply voltage(s) (where appropriate) +
4.4.1.2 Bias supply current(s) (where appropriate) +
4.4.1.3 Control supply voltage(s) (where appropriate) +
4.4.1.4 Control supply current(s) (where appropriate) +
4.4.1.5 Terminal voltage(s) (where appropriate) + +
4.4.1.6 Terminal current(s) (where appropriate) +
4.4.1.7 Input power +
4.4.1.8 Power dissipation +
NOTE It is necessary to select either 4.4.1.1 or 4.4.1.2, either 4.4.1.3 or 4.4.1.4, and either
4.4.1.5 or 4.4.1.6.
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60747-16-4 ” IEC:2004(E) – 11 –
The detail specification may indicate those values within the table including notes 1 and 2.
Parameters (Note 1, Note 2) Symbols Min. Max. Unit
NOTE 1 Where appropriate, in accordance with the type of circuit considered.
NOTE 2 For power supply voltage range:
– limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a special electrical
reference point;
– where appropriate, limiting value between specified supply terminals;
– when more than one voltage supply is required, a statement should be made as to whether the sequence in
which these supplies are applied is significant: if so, the sequence should be stated;
– when more than one supply is needed, it may be necessary to state the combinations of ratings for these supply
voltages and currents.
4.4.2 Temperatures
a) Operating temperature
b) Ambient or case temperature
c) Storage temperature
d) Channel temperature
e) Lead temperature (for soldering).
The detail specification may indicate those values within the table including the note.
Parameters (Note) Symbols Min. Max. Unit
NOTE Where appropriate, in accordance with the type of circuit considered.
4.5 Operating conditions (within the specified operating temperature range)
They are not to be inspected, but may be used for quality assessment purposes.
4.5.1 Power supplies – Positive and/or negative values
4.5.2 Initialization sequences (where appropriate)
If special initialization sequences are necessary, power supply sequencing and initialization
procedure should be specified.
4.5.3 Input voltage(s) (where appropriate)
4.5.4 Output current(s) (where appropriate)
4.5.5 Voltage and/or current of other terminal(s)
4.5.6 External elements (where appropriate)
4.5.7 Operating temperature range
4.6 Electrical characteristics
The characteristics shall apply over the full operating temperature range, unless otherwise
specified. Each characteristic of 4.6.1 and 4.6.2 should be stated either
a) over the specified range of operating temperatures, or
b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.
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The parameters should be specified corresponding to the type as follows:
a
Subclause Parameters Min. Typical Max.
4.6.1 Bias supply operating current + +
4.6.2 Control supply operating current + +
4.6.3 Insertion loss + +
4.6.4 Isolation (where appropriate
...
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