General Information

Abstract

ICS proforma for ETS 300 417-4-1

Status
Published
Publication Date
30-Nov-2003
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Dec-2003
Due Date
01-Dec-2003
Completion Date
01-Dec-2003

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SIST EN 300 417-4-2 V1.1.1:2003

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Overview

SIST EN 300 417-4-2 V1.1.1:2003 is a Slovenian standard that provides the Implementation Conformance Statement (ICS) proforma for the Synchronous Digital Hierarchy (SDH) path layer functions. Published by the Slovenski inštitut za standardizacijo (SIST), this standard is identical to the European Norm EN 300 417-4-2 and aligns with the requirements set forth by ETSI for transmission and multiplexing (TM) equipment. The ICS proforma aims to enable manufacturers, testers, and users to consistently declare and assess the conformity of SDH path layer functions in transport equipment, ensuring interoperability and performance across communication networks.

Key Topics

  • Synchronous Digital Hierarchy (SDH) Path Layer Functions: Focused on the path layer within SDH, which is essential for reliable transport of digital signals across telecommunication networks.
  • Implementation Conformance Statement (ICS) Proforma: Structured forms and guidelines for documenting the compliance of equipment implementations with the referenced base standard, EN 300 417-4-1.
  • Structured Assessment: Detailed instructions and sections for identifying products, system configuration, and responsible contacts, ensuring transparent and repeatable conformance assessment.
  • Layer Functions Coverage: The proforma covers functions for several SDH path layers, including S4, S3, and S2, reflecting different granularity and transport requirements.
  • Conformance Reporting: Provides methods for recording equipment support for transmission processes, adaptation functions, error monitoring, protection mechanisms, and performance monitoring.
  • Guidance for Manufacturers and Operators: Contains annexes with step-by-step guidance and tables for completing the conformance statement.

Applications

SIST EN 300 417-4-2 V1.1.1:2003 finds its key applications in the field of telecommunications, especially where SDH technology is implemented. Its primary users include:

  • Telecommunications Equipment Manufacturers: Leveraging the ICS proforma to declare the conformance of new or existing products, supporting seamless integration into standards-based networks.
  • Network Operators and Service Providers: Ensuring that deployed SDH equipment is compliant, thus promoting network reliability, service quality, and interoperability between multi-vendor systems.
  • Independent Test Laboratories: Utilizing the ICS proforma as a structured approach to verify product compliance against European and national requirements.
  • Regulatory Authorities and Procurement: Relying on standardized declarations of conformity in procurement, certification, and regulatory processes.

Benefits of implementing the standard include:

  • Clear, consistent assessment and reporting of conformance
  • Enhanced interoperability between SDH network elements
  • Reduced risk of equipment incompatibility in multi-vendor scenarios
  • Streamlined product certification and market entry

Related Standards

For a comprehensive approach to SDH and transport functionality, the following standards should be considered alongside SIST EN 300 417-4-2 V1.1.1:2003:

  • EN 300 417-4-1: Generic requirements of transport functionality of equipment - the base standard referenced by this ICS proforma.
  • ETSI EN 300 417 Series: Covers additional requirements for various layers and aspects of synchronous transmission systems.
  • ITU-T G.707, G.783, G.803: International standards detailing SDH network structure, functionality, and interworking.
  • Other SIST and ETSI Standards: Related to digital transmission systems, multiplexing, and network management.

By utilizing SIST EN 300 417-4-2 V1.1.1:2003 in tandem with these related standards, organizations can ensure robust, standards-compliant deployment and operation of SDH-based transport networks, facilitating efficient and high-performance communication infrastructures.

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SIST EN 300 417-4-2 V1.1.1:2003

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Frequently Asked Questions

SIST EN 300 417-4-2 V1.1.1:2003 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification". This standard covers: ICS proforma for ETS 300 417-4-1

ICS proforma for ETS 300 417-4-1

SIST EN 300 417-4-2 V1.1.1:2003 is classified under the following ICS (International Classification for Standards) categories: 33.040.20 - Transmission systems. The ICS classification helps identify the subject area and facilitates finding related standards.

SIST EN 300 417-4-2 V1.1.1:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.XQNFLRQDOQRVWTransmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification33.040.20Prenosni sistemTransmission systemsICS:Ta slovenski standard je istoveten z:EN 300 417-4-2 Version 1.1.1SIST EN 300 417-4-2 V1.1.1:2003en01-december-2003SIST EN 300 417-4-2 V1.1.1:2003SLOVENSKI
STANDARD
EN 300 417-4-2 V1.1.1 (1999-06)European Standard (Telecommunications series)Transmission and Multiplexing (TM);Generic requirements of transport functionality of equipment;Part 4-2: Synchronous Digital Hierarchy (SDH)path layer functions;Implementation Conformance Statement (ICS)proforma specificationSIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)2ReferenceDEN/TM-01015-4-2 (3v10iico.PDF)KeywordsSDH, testingETSIPostal addressF-06921 Sophia Antipolis Cedex - FRANCEOffice address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00
Fax: +33 4 93 65 47 16Siret N° 348 623 562 00017 - NAF 742 CAssociation à but non lucratif enregistrée à laSous-Préfecture de Grasse (06) N° 7803/88Internetsecretariat@etsi.frIndividual copies of this ETSI deliverablecan be downloaded fromhttp://www.etsi.orgIf you find errors in the present document, send yourcomment to: editor@etsi.frCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© European Telecommunications Standards Institute 1999.All rights reserved.SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)3ContentsIntellectual Property Rights.11Foreword.11Introduction.121Scope.132References.133Definitions and abbreviations.143.1Definitions.143.2Abbreviations.144Conformance to this ICS proforma specification.17Annex A (normative):ICS proforma for EN 300 417-4-1.18A.1Guidance for completing the ICS proforma.18A.1.1Purposes and structure.18A.1.2Abbreviations and conventions.18A.1.3Instructions for completing the ICS proforma.20Annex B (normative):ICS proforma for S4 Path Layer.21B.1Identification of the implementation.21B.1.1Date of the statement.21B.1.2Implementation Under Test (IUT) identification.21B.1.3System Under Test (SUT) identification.22B.1.4Product supplier.22B.1.5Client.23B.1.6ICS contact person.23B.2Identification of the EN.24B.3Global statement of conformance of S4 Path Layer.24B.4S4 Path Layer functions.24B.4.1S4 Path Layer Description.24B.4.2VC-4 Layer Transmission Tables.30B.4.2.1VC-4 Layer Connection Function: S4_C.30B.4.2.1.1Routing process.30B.4.2.1.2Unequipped VC generation.30B.4.2.1.3SNC protection process.31B.4.2.2VC-4 Layer Trail Termination Functions: S4_TT_So, S4_TT_Sk, S4m_TT_Sk, S4s_TT_So andS4s_TT_Sk.34B.4.2.2.1In service error monitoring process.34B.4.2.2.2Remote indicator monitoring process.35B.4.2.2.2.1VC-4 Remote Defect Indication (VC-4 RDI).35B.4.2.2.2.2VC-4 Remote Error Indication (S4 REI).36B.4.2.2.3Trail Trace Identifier.37B.4.2.2.4Supervisory Unequipped indication.39B.4.2.3Activation/deactivation of VC-4 Layer payload Adaptation Functions (S4/P4x_A, S4/P4e_A,S4/TUG_A, S4/DQDB_A, S4/Avp_A and S4/TSS1_A).39B.4.2.4VC-4 Layer to P4x Layer Adaptation Functions: S4/P4x_A_So and S4/P4x_A_Sk.40B.4.2.4.1VC-4 Layer to P4x Layer frequency justification and bitrate adaptation processes.40B.4.2.4.2Justification control.41B.4.2.4.3Smoothing and jitter limiting process.42B.4.2.4.4Payload type processing.42B.4.2.4.5H4 byte processing.43SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)4B.4.2.5VC-4 Layer to P4e Layer Adaptation Functions: S4/P4e_A_So and S4/P4e_A_Sk.43B.4.2.5.1VC-4 Layer to P4e Layer frequency justification and bitrate adaptation processes.44B.4.2.5.2Justification control.45B.4.2.5.3Smoothing and jitter limiting process.45B.4.2.5.4Frame Alignment process.46B.4.2.5.5Payload type processing.46B.4.2.5.6H4 byte processing.47B.4.2.6VC-4 Layer to VC-3, VC-2, VC-12 and VC-11 Layer Compound Adaptation Functions:S4/SX_A_So and S4/SX_A_Sk.47B.4.2.6.1VC-4 Layer to TUG Adaptation Functions: S4/TUG_A_So and S4/TUG_A_Sk.47B.4.2.6.1.1Payload type processing.48B.4.2.6.1.2Multiframe Indicator processing.48B.4.2.6.1.3Fixed Stuff insertion.49B.4.2.6.2TUG to VC-3/2/12/11 Layer Adaptation Functions: TUG/S3_A_So, TUG/S3_A_Sk,TUG/S2_A_So, TUG/S2_A_Sk, TUG/S12_A_So, TUG/S12_A_Sk, TUG/S11*_A_So andTUG/S11*_A_Sk.49B.4.2.6.2.1TUG to VC-3/2/12/11 Layer frequency justification and bitrate adaptation processes.51B.4.2.6.2.2TUG to VC-3/2/12/11 Layer alignment process.53B.4.2.6.2.3VC-4 Layer to VC-3/2/12/11 Layer multiplexing and demultiplexing processes.63B.4.2.7VC-4 Layer to DQDB Layer Adaptation Functions: S4/DQDB_A_So and S4/DQDB_A_Sk.64B.4.2.7.1DQDB slot payload scrambling/descrambling.65B.4.2.7.2DQDB slot boundary indication/delineation process.66B.4.2.7.3Link Status Signal processing.67B.4.2.7.4Payload type processing.68B.4.2.7.5DQDB Layer management information transport.68B.4.2.8VC-4 Layer to ATM Layer Compound Adaptation Functions: S4/Avp_A_So and S4/Avp_A_Sk.68B.4.2.9VC-4 Layer to LC Layer Adaptation Function: S4/LC_A_So.68B.4.2.10VC-4 Layer to TSS1 Layer Adaptation Functions: S4/TSS1_A_So and S4/TSS1_A_Sk.69B.4.2.10.1Payload type processing.69B.4.2.10.2H4 byte processing.70B.4.2.11VC-4 Layer to P0s Layer Adaptation Functions: S4/P0s_A_So and S4/P0s_A_Sk.70B.4.2.11.1VC-4 Layer to P0s Layer frequency justification and bitrate adaptation processes.70B.4.2.11.2Data latching and smoothing process.71B.4.3VC-4 Layer Linear Trail Protection Transmission Tables.72B.4.3.1VC-4 Layer Linear Trail Protection Connection Function: S4P_C.73B.4.3.2VC-4 Layer Linear Trail Protection Trail Termination Functions: S4P_TT_So and S4P_TT_Sk.74B.4.3.3VC-4 Layer Linear Trail Protection Adaptation Functions:S4/S4P_A_So and S4/S4P_A_Sk.74B.4.3.3.1VC-4 Layer to VC-4 Protection Layer multiplexing and demultiplexing processes.74B.4.4VC-4 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.75B.4.4.1APS externally initiated commands.75B.4.4.2APS automatically initiated commands.76B.4.4.3APS generalities.77B.4.4.4APS sub-processes.77B.4.4.5APS status report.78B.4.5VC-4 Tandem Connection Sub-layer Transmission Tables.79B.4.5.1VC-4 Tandem Connection Sub-layer Trail Termination Functions: S4D_TT_So, S4D_TT_Sk andS4Dm_TT_Sk.79B.4.5.1.1In service error monitoring process.79B.4.5.1.2Tandem Connection Error Count processes.80B.4.5.1.3Tandem Connection Multiframe Alignment process.81B.4.5.1.4VC-4 Tandem Connection Remote indicator monitoring process.81B.4.5.1.4.1VC-4 Tandem Connection Remote Defect Indication (TC RDI).81B.4.5.1.4.2VC-4 Tandem Connection Remote Error Indication (TC REI).82B.4.5.1.5VC-4 Tandem Connection Outgoing indicator monitoring process.83B.4.5.1.5.1VC-4 Tandem Connection Outgoing Defect Indication (TC ODI).83B.4.5.1.5.2VC-4 Tandem Connection Outgoing Error Indication (TC OEI).84B.4.5.1.6Tandem Connection Trace Identifier.85B.4.5.2VC-4 Tandem Connection to VC-4 Layer Adaptation Functions: S4D/S4_TT_So and S4D/S4_A_Sk.86B.4.6VC-4 Layer Defect, Consequent Action, Defect Correlation and Performance Monitoring Tables.87B.4.6.1Port Status Management.87SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)5B.4.6.2Defect detection and clearance criteria.87B.4.6.3Consequent action activation and clearance criteria.93B.4.6.4Defect correlation.99B.4.6.5Performance monitoring.101B.4.6.5.1Near End Performance monitoring.101B.4.6.5.2Far End Performance monitoring.102B.4.7VC-4 Layer Linear Trail Protection Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.102B.4.7.1Consequent action activation and clearance criteria.102B.4.7.2Defect correlation.103B.4.8VC-4 Tandem Connection Sub-layer Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.103B.4.8.1Port Status Management.103B.4.8.2Defect detection and clearance criteria.104B.4.8.3Consequent action activation and clearance criteria.106B.4.8.4Defect correlation.110B.4.8.5Performance monitoring.112B.4.8.5.1Near End Performance monitoring.112B.4.8.5.2Far End Performance Monitoring.112B.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.113Annex C (normative):ICS proforma for S3 Path Layer.114C.1Identification of the implementation.114C.1.1Date of the statement.114C.1.2Implementation Under Test (IUT) identification.114C.1.3System Under Test (SUT) identification.115C.1.4Product supplier.115C.1.5Client.116C.1.6ICS contact person.116C.2Identification of the EN.117C.3Global statement of conformance of S3 Path Layer.117C.4S3 Path Layer functions.117C.4.1S3 Path Layer Description.117C.4.2VC-3 Layer Transmission Tables.121C.4.2.1VC-3 Layer Connection Function: S3_C.121C.4.2.1.1Routing process.121C.4.2.1.2Unequipped VC generation.122C.4.2.1.3SNC protection process.122C.4.2.2VC-3 Layer Trail Termination Functions: S3_TT_So, S3_TT_Sk, S3m_TT_Sk, S3s_TT_So andS3s_TT_Sk.124C.4.2.2.1In service error monitoring process.125C.4.2.2.2Remote indicator monitoring process.126C.4.2.2.2.1VC-3 Remote Defect Indication (VC-3 RDI).126C.4.2.2.2.2VC-3 Remote Error Indication (S3 REI).127C.4.2.2.3Trail Trace Identifier.128C.4.2.2.4Supervisory Unequipped indication.129C.4.2.3Activation/deactivation of VC-3 Layer payload Adaptation Functions (S3/P31x_A, S3/P31e_A,S3/Avp_A and S3/TSS3_A).130C.4.2.4VC-3 Layer to P31x Layer Adaptation Functions: S3/P31x_A_So and S3/P31x_A_Sk.131C.4.2.4.1VC-3 Layer to P31x Layer frequency justification and bitrate adaptation processes.131C.4.2.4.2Justification control.133C.4.2.4.3Smoothing and jitter limiting process.133C.4.2.4.4Payload typeSignal Label processing.134C.4.2.4.5H4 byte processing.134C.4.2.5VC-3 Layer to P31e Layer Adaptation Functions: S3/P31e_A_So and S3/P31e_A_Sk.135C.4.2.5.1VC-3 Layer to P31e Layer frequency justification and bitrate adaptation processes.135C.4.2.5.2Justification control.137C.4.2.5.3Smoothing and jitter limiting process.137SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)6C.4.2.5.4Frame Alignment process.138C.4.2.5.5Payload typeSignal Label processing.138C.4.2.5.6H4 byte processing.139C.4.2.6VC-3 Layer to ATM Layer Compound Adaptation Functions: S3/Avp_A_So and S3/Avp_A_Sk.139C.4.2.7VC-4 Layer to LC Layer Adaptation Function: S3/LC_A_So.139C.4.2.8VC-3 Layer to TSS3 Layer Adaptation Functions: S3/TSS3_A_So and S3/TSS3_A_Sk.139C.4.2.8.1Payload typeSignal Label processing.140C.4.2.8.2H4 byte processing.140C.4.2.9VC-3 Layer to P0s Layer Adaptation Functions: S3/P0s_A_So and S3/P0s_A_Sk.140C.4.2.9.1VC-3 Layer to P0s Layer frequency justification and bitrate adaptation processes.141C.4.2.9.2Data latching and smoothing process.142C.4.3VC-3 Layer Linear Trail Protection Transmission Tables.142C.4.3.1VC-3 Layer Linear Trail Protection Connection Function: S3P_C.143C.4.3.2VC-3 Layer Linear Trail Protection Trail Termination Functions: S3P_TT_So and S3P_TT_Sk.144C.4.3.3VC-3 Layer Linear Trail Protection Adaptation Functions:S3/S3P_A_So and S3/S3P_A_Sk.144C.4.3.3.1VC-3 Layer to VC-3 Protection Layer multiplexing and demultiplexing processes.144C.4.4VC-3 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.145C.4.4.1APS externally initiated commands.145C.4.4.2APS automatically initiated commands.146C.4.4.3APS generalities.147C.4.4.4APS switch performance.148C.4.4.5APS sub-processes.148C.4.4.6APS signal interpretation.149C.4.4.7APS status report.149C.4.5VC-3 Tandem Connection Sub-layer Transmission Tables.150C.4.5.1VC-3 Tandem Connection Sub-layer Trail Termination Functions: S3D_TT_So, S3D_TT_Sk andS3Dm_TT_Sk.150C.4.5.1.1In service error monitoring process.150C.4.5.1.2Tandem Connection Error Count process.151C.4.5.1.3Tandem Connection Multiframe Alignment process.152C.4.5.1.4VC-3 Tandem Connection Remote indicator monitoring process.152C.4.5.1.4.1VC-3 Tandem Connection Remote Defect Indication (TC RDI).152C.4.5.1.4.2VC-3 Tandem Connection Remote Error Indication (TC REI).153C.4.5.1.5VC-3 Tandem Connection Outgoing indicator monitoring process.154C.4.5.1.5.1VC-3 Tandem Connection Outgoing Defect Indication (TC ODI).154C.4.5.1.5.2VC-3 Tandem Connection Outgoing Error Indication (TC OEI).155C.4.5.1.6Tandem Connection Trace Identifier.156C.4.5.2VC-3 Tandem Connection to VC-3 Layer Adaptation Functions: S3D/S3_TT_So and S3D/S3_A_Sk.157C.4.6VC-3 Layer Defect, Consequent Action, Defect correlation and Performance Monitoring Tables.158C.4.6.1Port Status Management.158C.4.6.2Defect detection and clearance criteria.158C.4.6.3Consequent action activation and clearance criteria.162C.4.6.4Defect Correlation.166C.4.6.5Performance monitoring.167C.4.6.5.1Near End Performance monitoring.167C.4.6.5.2Far End Performance Monitoring.168C.4.7VC-3 Layer Linear Trail Protection Defect, Defect, Consequent Action, Defect Correlation andPerformance Monitoring Tables.169C.4.7.1Consequent action activation and clearance criteria.169C.4.7.2Defect correlation.169C.4.8VC-3 Tandem Connection Sub-layer Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.170C.4.8.1Port Status Management.170C.4.8.2Defect detection and clearance criteria.170C.4.8.3Consequent action activation and clearance criteria.173C.4.8.4Defect correlation.176C.4.8.5Performance Monitoring.177C.4.8.5.1Near End Performance Monitoring.177C.4.8.5.2Far End Performance Monitoring.178C.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.178SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)7Annex D (normative):ICS proforma for S2 Path Layer.180D.1Identification of the implementation.180D.1.1Date of the statement.180D.1.2Implementation Under Test (IUT) identification.180D.1.3System Under Test (SUT) identification.181D.1.4Product supplier.181D.1.5Client.182D.1.6ICS contact person.182D.2Identification of the EN.183D.3Global statement of conformance of S2 Path Layer.183D.4S2 Path Layer functions.183D.4.1S2 Path Layer Description.183D.4.2VC-2 Layer Transmission Tables.187D.4.2.1VC-2 Layer Connection Function: S2_C.187D.4.2.1.1Routing process.187D.4.2.1.2Unequipped VC generation.188D.4.2.1.3SNC protection process.188D.4.2.2VC-2 Layer Trail Termination Functions: S2_TT_So, S2_TT_Sk, S2m_TT_Sk, S2s_TT_So andS2s_TT_Sk.191D.4.2.2.1In service error monitoring process.191D.4.2.2.2Remote indicator monitoring process.192D.4.2.2.2.1VC-2 Remote Defect Indication (VC-2 RDI).192D.4.2.2.2.2VC-2 Remote Error Indication (S2 REI).193D.4.2.2.3Trail Trace Identifier.194D.4.2.2.4Supervisory Unequipped indication.196D.4.2.3Activation/deactivation of VC-2 Layer payload Adaptation Functions (S2/Avp_A and S2/TSS4_A).196D.4.2.4VC-2 Layer to ATM Layer Compound Adaptation Functions: S2/Avp_A_So and S2/Avp_A_Sk.196D.4.2.5VC-2 Layer to LC Layer Adaptation Function: S2/LC_A_So.196D.4.2.6VC-2 Layer to TSS4 Layer Adaptation Functions: S2/TSS4_A_So and S2/TSS4_A_Sk.197D.4.2.6.1Payload typeSignal Label processing.197D.4.3VC-2 Layer Linear Trail Protection Transmission Tables.198D.4.3.1VC-2 Layer Linear Trail Protection Connection Function: S2P_C.199D.4.3.2VC-2 Layer Linear Trail Protection Trail Termination Functions: S2P_TT_So and S2P_TT_Sk.200D.4.3.3VC-2 Layer Linear Trail Protection Adaptation Functions:S2/S2P_A_So and S2/S2P_A_Sk.200D.4.3.3.1VC-2 Layer to VC-2 Protection Layer multiplexing and demultiplexing processes.200D.4.4VC-2 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.201D.4.4.1APS externally initiated commands.201D.4.4.1.1APS automatically initiated commands.202D.4.4.1.2APS generalities.203D.4.4.1.3APS switch performance.203D.4.4.1.4APS sub-processes.203D.4.4.1.5APS status report.205D.4.5VC-2 Tandem Connection Sub-layer Transmission Tables.205D.4.5.1VC-2 Tandem Connection Sub-layer Trail Termination Functions: S2D_TT_So, S2D_TT_Sk andS2Dm_TT_Sk.205D.4.5.1.1VC-2 in service error monitoring process.206D.4.5.1.2Tandem Connection in service error monitoring process.206D.4.5.1.3Tandem Connection Multiframe Alignment process.207D.4.5.1.4VC-2 Tandem Connection Remote indicator monitoring process.208D.4.5.1.4.1VC-2 Tandem Connection Remote Defect Indication (TC RDI).208D.4.5.1.4.2VC-2 Tandem Connection Remote Error Indication (TC REI).209D.4.5.1.5VC-2 Tandem Connection Outgoing indicator monitoring process.209D.4.5.1.5.1VC-2 Tandem Connection Outgoing Defect Indication (TC ODI).209D.4.5.1.5.2VC-2 Tandem Connection Outgoing Error Indication (TC OEI).210D.4.5.1.6Tandem Connection Trace Identifier.211D.4.5.1.7Incoming AIS code process.213D.4.5.2VC-2 Tandem Connection to VC-2 Layer Adaptation Functions: S2D/S2_TT_So and S2D/S2_A_Sk.213D.4.6VC-2 Layer Defect, Consequent Action, Defect Correlation and Performance Monitoring Tables.213SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)8D.4.6.1Port Status Management.213D.4.6.2Defect detection and clearance criteria.214D.4.6.3Consequent action activation and clearance criteria.216D.4.6.4Defect correlation.219D.4.6.5Performance monitoring.220D.4.6.5.1Near End Performance monitoring.220D.4.6.5.2Far End Performance monitoring.221D.4.7VC-2 Layer Linear Trail Protection Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.221D.4.7.1Consequent action activation and clearance criteria.221D.4.7.2Defect correlation.222D.4.8VC-2 Tandem Connection Sub-layer Defect, Consequent Action, Defect correlation and PerformanceMonitoring Tables.222D.4.8.1Port Status Management.222D.4.8.2Defect detection and clearance criteria.223D.4.8.3Consequent action activation and clearance criteria.225D.4.8.4Defect correlation.229D.4.8.5Performance monitoring.230D.4.8.5.1Near End Performance monitoring.230D.4.8.5.2Far End Performance Monitoring.231D.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.231Annex E (normative):ICS proforma for S12 Path Layer.233E.1Identification of the implementation.233E.1.1Date of the statement.233E.1.2Implementation Under Test (IUT) identification.233E.1.3System Under Test (SUT) identification.234E.1.4Product supplier.
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