Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification

ICS proforma for ETS 300 417-4-1

Prenos in multipleksiranje (TM) – Generične zahteve za prenosno funkcionalnost opreme – 4-2. del: Funkcije plasti poti pri sinhroni digitalni hierarhiji (SDH)– Proforma specifikacija izjave o skladnosti izvedbe (ICS)

General Information

Status
Published
Publication Date
30-Nov-2003
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Dec-2003
Due Date
01-Dec-2003
Completion Date
01-Dec-2003

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SIST EN 300 417-4-2 V1.1.1:2003
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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.XQNFLRQDOQRVWTransmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification33.040.20Prenosni sistemTransmission systemsICS:Ta slovenski standard je istoveten z:EN 300 417-4-2 Version 1.1.1SIST EN 300 417-4-2 V1.1.1:2003en01-december-2003SIST EN 300 417-4-2 V1.1.1:2003SLOVENSKI

STANDARD
SIST EN 300 417-4-2 V1.1.1:2003

EN 300 417-4-2 V1.1.1 (1999-06)European Standard (Telecommunications series)Transmission and Multiplexing (TM);Generic requirements of transport functionality of equipment;Part 4-2: Synchronous Digital Hierarchy (SDH)path layer functions;Implementation Conformance Statement (ICS)proforma specificationSIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)2ReferenceDEN/TM-01015-4-2 (3v10iico.PDF)KeywordsSDH, testingETSIPostal addressF-06921 Sophia Antipolis Cedex - FRANCEOffice address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00

Fax: +33 4 93 65 47 16Siret N° 348 623 562 00017 - NAF 742 CAssociation à but non lucratif enregistrée à laSous-Préfecture de Grasse (06) N° 7803/88Internetsecretariat@etsi.frIndividual copies of this ETSI deliverablecan be downloaded fromhttp://www.etsi.orgIf you find errors in the present document, send yourcomment to: editor@etsi.frCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© European Telecommunications Standards Institute 1999.All rights reserved.SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)3ContentsIntellectual Property Rights.............................................................................................................................11Foreword..........................................................................................................................................................11Introduction......................................................................................................................................................121Scope......................................................................................................................................................132References.............................................................................................................................................133Definitions and abbreviations................................................................................................................143.1Definitions.......................................................................................................................................................143.2Abbreviations...................................................................................................................................................144Conformance to this ICS proforma specification..................................................................................17Annex A (normative):ICS proforma for EN 300 417-4-1...............................................................18A.1Guidance for completing the ICS proforma..........................................................................................18A.1.1Purposes and structure.....................................................................................................................................18A.1.2Abbreviations and conventions........................................................................................................................18A.1.3Instructions for completing the ICS proforma.................................................................................................20Annex B (normative):ICS proforma for S4 Path Layer.................................................................21B.1Identification of the implementation.....................................................................................................21B.1.1Date of the statement.......................................................................................................................................21B.1.2Implementation Under Test (IUT) identification.............................................................................................21B.1.3System Under Test (SUT) identification..........................................................................................................22B.1.4Product supplier...............................................................................................................................................22B.1.5Client...............................................................................................................................................................23B.1.6ICS contact person...........................................................................................................................................23B.2Identification of the EN.........................................................................................................................24B.3Global statement of conformance of S4 Path Layer..............................................................................24B.4S4 Path Layer functions.........................................................................................................................24B.4.1S4 Path Layer Description...............................................................................................................................24B.4.2VC-4 Layer Transmission Tables....................................................................................................................30B.4.2.1VC-4 Layer Connection Function: S4_C...................................................................................................30B.4.2.1.1Routing process....................................................................................................................................30B.4.2.1.2Unequipped VC generation..................................................................................................................30B.4.2.1.3SNC protection process........................................................................................................................31B.4.2.2VC-4 Layer Trail Termination Functions: S4_TT_So, S4_TT_Sk, S4m_TT_Sk, S4s_TT_So andS4s_TT_Sk.................................................................................................................................................34B.4.2.2.1In service error monitoring process......................................................................................................34B.4.2.2.2Remote indicator monitoring process...................................................................................................35B.4.2.2.2.1VC-4 Remote Defect Indication (VC-4 RDI).................................................................................35B.4.2.2.2.2VC-4 Remote Error Indication (S4 REI)........................................................................................36B.4.2.2.3Trail Trace Identifier............................................................................................................................37B.4.2.2.4Supervisory Unequipped indication......................................................................................................39B.4.2.3Activation/deactivation of VC-4 Layer payload Adaptation Functions (S4/P4x_A, S4/P4e_A,S4/TUG_A, S4/DQDB_A, S4/Avp_A and S4/TSS1_A)...........................................................................39B.4.2.4VC-4 Layer to P4x Layer Adaptation Functions: S4/P4x_A_So and S4/P4x_A_Sk.................................40B.4.2.4.1VC-4 Layer to P4x Layer frequency justification and bitrate adaptation processes.............................40B.4.2.4.2Justification control..............................................................................................................................41B.4.2.4.3Smoothing and jitter limiting process...................................................................................................42B.4.2.4.4Payload type processing.......................................................................................................................42B.4.2.4.5H4 byte processing...............................................................................................................................43SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)4B.4.2.5VC-4 Layer to P4e Layer Adaptation Functions: S4/P4e_A_So and S4/P4e_A_Sk..................................43B.4.2.5.1VC-4 Layer to P4e Layer frequency justification and bitrate adaptation processes..............................44B.4.2.5.2Justification control..............................................................................................................................45B.4.2.5.3Smoothing and jitter limiting process...................................................................................................45B.4.2.5.4Frame Alignment process.....................................................................................................................46B.4.2.5.5Payload type processing.......................................................................................................................46B.4.2.5.6H4 byte processing...............................................................................................................................47B.4.2.6VC-4 Layer to VC-3, VC-2, VC-12 and VC-11 Layer Compound Adaptation Functions:S4/SX_A_So and S4/SX_A_Sk.................................................................................................................47B.4.2.6.1VC-4 Layer to TUG Adaptation Functions: S4/TUG_A_So and S4/TUG_A_Sk................................47B.4.2.6.1.1Payload type processing..................................................................................................................48B.4.2.6.1.2Multiframe Indicator processing.....................................................................................................48B.4.2.6.1.3Fixed Stuff insertion........................................................................................................................49B.4.2.6.2TUG to VC-3/2/12/11 Layer Adaptation Functions: TUG/S3_A_So, TUG/S3_A_Sk,TUG/S2_A_So, TUG/S2_A_Sk, TUG/S12_A_So, TUG/S12_A_Sk, TUG/S11*_A_So andTUG/S11*_A_Sk.................................................................................................................................49B.4.2.6.2.1TUG to VC-3/2/12/11 Layer frequency justification and bitrate adaptation processes...................51B.4.2.6.2.2TUG to VC-3/2/12/11 Layer alignment process.............................................................................53B.4.2.6.2.3VC-4 Layer to VC-3/2/12/11 Layer multiplexing and demultiplexing processes...........................63B.4.2.7VC-4 Layer to DQDB Layer Adaptation Functions: S4/DQDB_A_So and S4/DQDB_A_Sk..................64B.4.2.7.1DQDB slot payload scrambling/descrambling......................................................................................65B.4.2.7.2DQDB slot boundary indication/delineation process............................................................................66B.4.2.7.3Link Status Signal processing...............................................................................................................67B.4.2.7.4Payload type processing.......................................................................................................................68B.4.2.7.5DQDB Layer management information transport.................................................................................68B.4.2.8VC-4 Layer to ATM Layer Compound Adaptation Functions: S4/Avp_A_So and S4/Avp_A_Sk...........68B.4.2.9VC-4 Layer to LC Layer Adaptation Function: S4/LC_A_So...................................................................68B.4.2.10VC-4 Layer to TSS1 Layer Adaptation Functions: S4/TSS1_A_So and S4/TSS1_A_Sk.........................69B.4.2.10.1Payload type processing.......................................................................................................................69B.4.2.10.2H4 byte processing...............................................................................................................................70B.4.2.11VC-4 Layer to P0s Layer Adaptation Functions: S4/P0s_A_So and S4/P0s_A_Sk...................................70B.4.2.11.1VC-4 Layer to P0s Layer frequency justification and bitrate adaptation processes..............................70B.4.2.11.2Data latching and smoothing process...................................................................................................71B.4.3VC-4 Layer Linear Trail Protection Transmission Tables...............................................................................72B.4.3.1VC-4 Layer Linear Trail Protection Connection Function: S4P_C............................................................73B.4.3.2VC-4 Layer Linear Trail Protection Trail Termination Functions: S4P_TT_So and S4P_TT_Sk............74B.4.3.3VC-4 Layer Linear Trail Protection Adaptation Functions:S4/S4P_A_So and S4/S4P_A_Sk..................74B.4.3.3.1VC-4 Layer to VC-4 Protection Layer multiplexing and demultiplexing processes.............................74B.4.4VC-4 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes....................75B.4.4.1APS externally initiated commands............................................................................................................75B.4.4.2APS automatically initiated commands......................................................................................................76B.4.4.3APS generalities.........................................................................................................................................77B.4.4.4APS sub-processes.....................................................................................................................................77B.4.4.5APS status report........................................................................................................................................78B.4.5VC-4 Tandem Connection Sub-layer Transmission Tables.............................................................................79B.4.5.1VC-4 Tandem Connection Sub-layer Trail Termination Functions: S4D_TT_So, S4D_TT_Sk andS4Dm_TT_Sk............................................................................................................................................79B.4.5.1.1In service error monitoring process......................................................................................................79B.4.5.1.2Tandem Connection Error Count processes.........................................................................................80B.4.5.1.3Tandem Connection Multiframe Alignment process............................................................................81B.4.5.1.4VC-4 Tandem Connection Remote indicator monitoring process........................................................81B.4.5.1.4.1VC-4 Tandem Connection Remote Defect Indication (TC RDI)....................................................81B.4.5.1.4.2VC-4 Tandem Connection Remote Error Indication (TC REI)......................................................82B.4.5.1.5VC-4 Tandem Connection Outgoing indicator monitoring process......................................................83B.4.5.1.5.1VC-4 Tandem Connection Outgoing Defect Indication (TC ODI).................................................83B.4.5.1.5.2VC-4 Tandem Connection Outgoing Error Indication (TC OEI)....................................................84B.4.5.1.6Tandem Connection Trace Identifier....................................................................................................85B.4.5.2VC-4 Tandem Connection to VC-4 Layer Adaptation Functions: S4D/S4_TT_So and S4D/S4_A_Sk....86B.4.6VC-4 Layer Defect, Consequent Action, Defect Correlation and Performance Monitoring Tables................87B.4.6.1Port Status Management.............................................................................................................................87SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)5B.4.6.2Defect detection and clearance criteria......................................................................................................87B.4.6.3Consequent action activation and clearance criteria...................................................................................93B.4.6.4Defect correlation.......................................................................................................................................99B.4.6.5Performance monitoring...........................................................................................................................101B.4.6.5.1Near End Performance monitoring.....................................................................................................101B.4.6.5.2Far End Performance monitoring.......................................................................................................102B.4.7VC-4 Layer Linear Trail Protection Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.........................................................................................................................................102B.4.7.1Consequent action activation and clearance criteria.................................................................................102B.4.7.2Defect correlation.....................................................................................................................................103B.4.8VC-4 Tandem Connection Sub-layer Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.........................................................................................................................................103B.4.8.1Port Status Management...........................................................................................................................103B.4.8.2Defect detection and clearance criteria....................................................................................................104B.4.8.3Consequent action activation and clearance criteria.................................................................................106B.4.8.4Defect correlation.....................................................................................................................................110B.4.8.5Performance monitoring...........................................................................................................................112B.4.8.5.1Near End Performance monitoring.....................................................................................................112B.4.8.5.2Far End Performance Monitoring.......................................................................................................112B.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.............................................................113Annex C (normative):ICS proforma for S3 Path Layer...............................................................114C.1Identification of the implementation...................................................................................................114C.1.1Date of the statement.....................................................................................................................................114C.1.2Implementation Under Test (IUT) identification...........................................................................................114C.1.3System Under Test (SUT) identification........................................................................................................115C.1.4Product supplier.............................................................................................................................................115C.1.5Client.............................................................................................................................................................116C.1.6ICS contact person.........................................................................................................................................116C.2Identification of the EN.......................................................................................................................117C.3Global statement of conformance of S3 Path Layer............................................................................117C.4S3 Path Layer functions.......................................................................................................................117C.4.1S3 Path Layer Description.............................................................................................................................117C.4.2VC-3 Layer Transmission Tables..................................................................................................................121C.4.2.1VC-3 Layer Connection Function: S3_C.................................................................................................121C.4.2.1.1Routing process..................................................................................................................................121C.4.2.1.2Unequipped VC generation................................................................................................................122C.4.2.1.3SNC protection process......................................................................................................................122C.4.2.2VC-3 Layer Trail Termination Functions: S3_TT_So, S3_TT_Sk, S3m_TT_Sk, S3s_TT_So andS3s_TT_Sk...............................................................................................................................................124C.4.2.2.1In service error monitoring process....................................................................................................125C.4.2.2.2Remote indicator monitoring process.................................................................................................126C.4.2.2.2.1VC-3 Remote Defect Indication (VC-3 RDI)...............................................................................126C.4.2.2.2.2VC-3 Remote Error Indication (S3 REI)......................................................................................127C.4.2.2.3Trail Trace Identifier..........................................................................................................................128C.4.2.2.4Supervisory Unequipped indication....................................................................................................129C.4.2.3Activation/deactivation of VC-3 Layer payload Adaptation Functions (S3/P31x_A, S3/P31e_A,S3/Avp_A and S3/TSS3_A).....................................................................................................................130C.4.2.4VC-3 Layer to P31x Layer Adaptation Functions: S3/P31x_A_So and S3/P31x_A_Sk.........................131C.4.2.4.1VC-3 Layer to P31x Layer frequency justification and bitrate adaptation processes.........................131C.4.2.4.2Justification control............................................................................................................................133C.4.2.4.3Smoothing and jitter limiting process.................................................................................................133C.4.2.4.4Payload typeSignal Label processing.................................................................................................134C.4.2.4.5H4 byte processing.............................................................................................................................134C.4.2.5VC-3 Layer to P31e Layer Adaptation Functions: S3/P31e_A_So and S3/P31e_A_Sk..........................135C.4.2.5.1VC-3 Layer to P31e Layer frequency justification and bitrate adaptation processes..........................135C.4.2.5.2Justification control............................................................................................................................137C.4.2.5.3Smoothing and jitter limiting process.................................................................................................137SIST EN 300 417-4-2 V1.1.1:2003

ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)6C.4.2.5.4Frame Alignment process...................................................................................................................138C.4.2.5.5Payload typeSignal Label processing.................................................................................................138C.4.2.5.6H4 byte processing.............................................................................................................................139C.4.2.6VC-3 Layer to ATM Layer Compound Adaptation Functions: S3/Avp_A_So and S3/Avp_A_Sk.........139C.4.2.7VC-4 Layer to LC Layer Adaptation Function: S3/LC_A_So.................................................................139C.4.2.8VC-3 Layer to TSS3 Layer Adaptation Functions: S3/TSS3_A_So and S3/TSS3_A_Sk.......................139C.4.2.8.1Payload typeSignal Label processing.................................................................................................140C.4.2.8.2H4 byte processing.............................................................................................................................140C.4.2.9VC-3 Layer to P0s Layer Adaptation Functions: S3/P0s_A_So and S3/P0s_A_Sk.................................140C.4.2.9.1VC-3 Layer to P0s Layer frequency justification and bitrate adaptation processes............................141C.4.2.9.2Data latching and smoothing process.................................................................................................142C.4.3VC-3 Layer Linear Trail Protection Transmission Tables.............................................................................142C.4.3.1VC-3 Layer Linear Trail Protection Connection Function: S3P_C..........................................................143C.4.3.2VC-3 Layer Linear Trail Protection Trail Termination Functions: S3P_TT_So and S3P_TT_Sk..........144C.4.3.3VC-3 Layer Linear Trail Protection Adaptation Functions:S3/S3P_A_So and S3/S3P_A_Sk................144C.4.3.3.1VC-3 Layer to VC-3 Protection Layer multiplexing and demultiplexing processes...........................144C.4.4VC-3 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes..................145C.4.4.1APS externally initiated commands..........................................................................................................145C.4.4.2APS automatically initiated commands....................................................................................................146C.4.4.3APS generalities.......................................................................................................................................147C.4.4.4APS switch performance..........................................................................................................................148C.4.4.5APS sub-processes...................................................................................................................................148C.4.4.6APS signal interpretation.........................................................................................................................149C.4.4.7APS status report......................................................................................................................................149C.4.5VC-3 Tandem Connection Sub-layer Transmission Tables...........................................................................150C.4.5.1VC-3 Tandem Connection Sub-layer Trail Termination Functions: S3D_TT_So, S3D_TT_Sk andS3Dm_TT_Sk..........................................................................................................................................150C.4.5.1.1In service error monitoring process....................................................................................................150C.4.5.1.2Tandem Connection Error Count process...........................................................................................151C.4.5.1.3Tandem Connection Multiframe Alignment process..........................................................................152C.4.5.1.4VC-3 Tandem Connection Remote indicator monitoring process......................................................152C.4.5.1.4.1VC-3 Tandem Connection Remote Defect Indication (TC RDI)..................................................152C.4.5.1.4.2VC-3 Tandem Connection Remote Error Indication (TC REI)....................................................153C.4.5.1.5VC-3 Tandem Connection Outgoing indicator monitoring process....................................................154C.4.5.1.5.1VC-3 Tandem Connection Outgoing Defect Indication (TC ODI)...............................................154C.4.5.1.5.2VC-3 Tandem Connection Outgoing Error Indication (TC OEI)..................................................155C.4.5.1.6Tandem Connection Trace Identifier..................................................................................................156C.4.5.2VC-3 Tandem Connection to VC-3 Layer Adaptation Functions: S3D/S3_TT_So and S3D/S3_A_Sk..157C.4.6VC-

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