SIST EN 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures

This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen -- Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen

Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles -- Partie 2: Méthodes d'essai des matériaux pour structures d'interconnexion

Preskusne metode za električne materiale, tiskane plošče, povezovalne strukture in sestave - 2. del: Preskusne metode za materiale povezovalnih struktur (IEC 61189-2:2006)

General Information

• Status: Published
• Publication Date: 30-Nov-2006
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Dec-2006
• Due Date: 01-Dec-2006
• Completion Date: 01-Dec-2006
• Ref Project: EN 61189-2:2006 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Relations

• Replaces: SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 01-Nov-2009
• Replaces: SIST EN 61189-2:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 01-Dec-2006
• Replaces: SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 29-Jan-2023
• Replaces: SIST EN 61189-2:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 29-Jan-2023
• Replaces: SIST EN 61189-2:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 06-May-2014
• Replaces: SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 06-May-2014
• Replaces: SIST EN 61189-2:2002 + A1:2002 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 07-Jun-2022
• Replaces: SIST EN 61189-2:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures
• Effective Date: 07-Jun-2022

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---------------------- Page: 1 ----------------------

EUROPEAN STANDARD
EN 61189-2

NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM

ICS 31.180 Supersedes EN 61189-2:1997 + A1:2000


English version


Test methods for electrical materials, printed boards
and other interconnection structures and assemblies
Part 2: Test methods for materials
for interconnection structures
(IEC 61189-2:2006)


Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées Leiterplatten und andere
et autres structures d'interconnexion Verbindungsstrukturen
et ensembles und Baugruppen
Partie 2: Méthodes d'essai des matériaux Teil 2: Prüfverfahren für Materialien
pour structures d'interconnexion für Verbindungsstrukturen
(CEI 61189-2:2006) (IEC 61189-2:2006)




This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-2:2006 E

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EN 61189-2:2006 - 2 -
Foreword
The text of document 91/564/FDIS, future edition 2 of IEC 61189-2, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-2 on 2006-09-01.
This European Standard supersedes EN 61189-2:1997 + A1:2000.
The significant technical changes with respect to EN 61189-2:1997 + A1:2000 concern the addition of
several new tests in the following categories:
- C: Chemical test methods
- D: Dimensional test methods
- E: Electrical test methods
- M: Mechanical test methods
- N: Environmental test methods
- X: Miscellaneous test methods
This standard forms part of a series and should be used in conjunction with other parts in the same
series, under the main title Test methods for electrical materials, interconnection structures and
assemblies:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
Part 4: Test methods for electronic components assembling characteristics
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in electronic assemblies
It should also be read in conjunction with EN 60068, Environmental testing.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-06-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-09-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-2:2006 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 61189-2:2006
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance


2)
IEC 60068-2-2 1974 Environmental testing EN 60068-2-2 1993
Part 2: Tests - Tests B: Dry heat


IEC 60068-2-78 2001 Environmental testing EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state


IEC 60093 1980 Methods of test for volume resistivity and HD 429 S1 1983
surface resistivity of solid electrical insulating
materials


IEC 60243-1 1998 Electrical strength of insulating materials - EN 60243-1 1998
Test methods
Part 1: Tests at power frequencies


IEC 61189-3 1997 Test methods for electrical materials, printed EN 61189-3 1997
boards and other interconnection structures
and assemblies
Part 3: Test methods for interconnection
structures (printed boards)


ISO 3274 1996 Geometrical Product Specifications (GPS) - EN ISO 3274 1997
Surface texture: Profile method - Nominal
characteristics of contact (stylus) instruments


ISO 9001 2000 Quality management systems - EN ISO 9001 2000
Requirements


ANSI/UL-94 1993 Standard for tests for flammability of plastic - -
materials for parts in devices and aplliances




1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
EN 60068-2-2 includes Supplement A:1976 to IEC 60068-2-2.

---------------------- Page: 4 ----------------------

INTERNATIONAL IEC


STANDARD 61189-2





Second edition
2006-05


Test methods for electrical materials, printed
boards and other interconnection structures
and assemblies –
Part 2:
Test methods for materials
for interconnection structures

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XF
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

---------------------- Page: 5 ----------------------

– 2 – 61189-2  IEC:2006(E)
CONTENTS
FOREWORD.6
INTRODUCTION.8

1 Scope.9
2 Normative references.9
3 Accuracy, precision and resolution .9
3.1 Accuracy .10
3.2 Precision .10
3.3 Resolution .11
3.4 Report .11
3.5 Student’s "t" distribution.11
3.6 Suggested uncertainty limits .12
4 Catalogue of approved test methods .13
5 P: Preparation/conditioning test methods .13
5.1 Test 2P01: Dry heat (under consideration) .13
5.2 Test 2P02: Solder float stress (under consideration) .13
6 V: Visual test methods .13
7 D: Dimensional test methods .13
7.1 Test 2D01: Thickness of base materials and rigid boards .13
8 C: Chemical test methods .15
8.1 Test 2C01: Resistance to sodium hydroxide of base materials.15
8.2 Test 2C02: Gel time of epoxy based prepreg materials.16
8.3 Test 2C03: Resin content of prepreg materials by treated weight.17
8.4 Test 2C04: Volatile content of prepreg materials .19
8.5 Test 2C05: Blistering during heat shock .21
8.6 Test 2C06: Flammability, vertical burning test for rigid materials .23
8.7 Test 2C07: Flammability; horizontal burning test for rigid materials.26
8.8 Test 2C08: Flammability, flex material .29
8.9 Test 2C09: Melting viscosity of prepreg materials.33
8.10 Test 2C10: Resin content of prepreg materials by sublimation.35
8.11 Test 2C11: UV blocking characteristics of laminates .37
8.12 Test 2C12: Total halogen content in base materials .38
9 M: Mechanical test methods.42
9.1 Test 2M01: Test method for bow and twist .42
9.2 Test 2M02: Bow/twist after etching and heating.43
9.3 Test 2M03: Cure factor of base materials by differential scanning calorimetry
(DSC) or thermomechanical analysis (TMA) .45
9.4 Test 2M04: Twist after heating (under consideration) .46
9.5 Test 2M05: Pull-off strength.46
9.6 Test 2M06: Peel strength after exposure to solvent vapour.48
9.7 Test 2M07: Peel strength after immersion in solvent .50
9.8 Test 2M08: Flexural strength (under consideration).51
9.9 Test 2M09: Resin flow of prepreg material .51
9.10 Test 2M10: Glass transition temperature of base materials by differential
scanning calorimetry (DSC) .53

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61189-2  IEC:2006(E) – 3 –
9.11 Test 2M11: Glass transition temperature of base materials by
thermomechanical analysis (TMA) .55
9.12 Test 2M12: Surface waviness .58
9.13 Test 2M13: Peel strength as received .59
9.14 Test 2M14: Peel strength after heat shock .60
9.15 Test 2M15: Peel strength after dry heat.63
9.16 Test 2M16: Peel strength after simulated plating .64
9.17 Test 2M17: Peel strength at high temperature .66
9.18 Test 2M18: Surface quality (under consideration).68
9.19 Test 2M19: Punching (under consideration) .68
9.20 Test 2M20: Flexural strength .68
9.21 Test 2M21: Rolling fatigue of flexible base materials .69
9.22 Test 2M22: Weight of foil after lamination .71
9.23 Test method 2M23: Rectangularity of cut panels .73
9.24 Test 2M24: Coefficient of thermal expansion (under consideration) .74
9.25 Test 2M25: Time to delamination by thermomechanical analysis (TMA).74
9.26 Test 2M26: Scaled flow test for prepreg materials .75
9.27 Test 2M27: The resin flow properties of coverlay films, bonding films and
adhesive cast films used in the fabrication of flexible printed boards .78
10 Electrical test methods.83
10.1 Test 2E01: Surface tracking, moisture condition (under consideration) .83
10.2 Test 10.2 2E02: Dielectric breakdown of base materials parallel to
laminations .83
10.3 Test 2E03: Surface resistance after damp heat, steady state .85
10.4 Test 2E04: Volume resistivity and surface resistivity.90
10.5 Test 2E05: Permittivity and dielectric dissipation (under consideration).94
10.6 Test 2E06: Volume and surface resistivity, 3 electrodes (under consideration).94
10.7 Test 2E07: Surface and volume resistivity, elevated temperature (under
consideration).94
10.8 Test 2E08: Surface corrosion.94
10.9 Test 2E09: Comparative tracking index (CTI) .96
10.10 Test 2E10: Permittivity and dissipation factor (under consideration). 100
10.11 Test 2E11: Electric strength (under consideration) . 100
10.12 Test 2E12: Resistance of foil (under consideration). 100
10.13 Test 2E13: Corrosion at edge (under consideration). 100
10.14 Test 2E14: Arc resistance. 100
10.15 Test 2E15: Dielectric break-down (under consideration) . 104
10.16 Test 2E16: Contact resistance of printed circuit keypad cont (under
consideration). 104
10.17 Test 2E17: Insulation resistance of printed board materials . 104
10.18 Test 2E18: Fungus resistance of printed board materials . 105
11 N: Environmental test methods . 109
11.1 Test 2N01: Pressure cooker test (under consideration) . 109
11.2 Test 2N02: Water absorption . 109
12 X: Miscellaneous test methods. 110
12.1 Test 2X02: Dimensional stability of thin laminates . 110

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– 4 – 61189-2  IEC:2006(E)
Annex A (informative) Worked examples . 114
Annex B (informative) Conversion table. 116
Annex C (informative) Laboratory pro forma (form) . 121
Annex D (informative) Laboratory pro forma . 122

Figure 1 – Thickness measuring points.14
Figure 2 – Position of specimens.20
Figure 3 – Fluidized sand bath.22
Figure 4 – Test fixture .28
Figure 5 – V method (Vertical flammability method) .32
Figure 6 – VTM method (vertical flammability method for recaltrant specimens).32
Figure 7 – Example of prepreg melting viscosity .35
Figure 8 – Position of specimens for resin content.36
Figure 9 – Absorption of combustion gas using a combustion flask set-up.40
Figure 10 – Composition of ion exchange chromatograph .40
Figure 11 – Specimen for peel strength measurement .49
Figure 12 – Differential scanning calorimetry .54
Figure 13 – Thermomechanical analysis (expansion mode) .57
Figure 14 – Test specimen pattern .70
Figure 15 – General arrangement of apparatus.70
Figure 16 – Scaled flow test specimen before lamination .77
Figure 17 – Scaled flow test specimen measurement points .77
Figure 18 – Test patterns for clearance filling test.79
Figure 19 – Punched test pattern for squeeze-out test .80
Figure 20 – Standard lay-up of materials in the press to prepare the test specimens for
referee tests .81
Figure 21 – Profiles of press conditions to prepare the test specimens for referee tests .82
Figure 22 – Measurement of volume resistance.89
Figure 23 – Measurement of surface resistance.89
Figure 25 – Electrode connections for measuring volume resistance.93
Figure 26 – Electrode connections for measuring surface resistance .93
Figure 27 – Ring and disk pattern.95
Figure 28 – Comb pattern.96
Figure 31 – Example of test apparatus .98
Figure 32 – Example of test circuit .98
Figure 33 – Arc-resistance test circuit. 101
Figure 34 – Tungsten steel rod electrode assembly . 102
Figure 35 – Test specimen for insulation resistance. 104
Figure 36 – Location of specimens on original sheet for dimensional stability test . 111
Figure 37 – Location of marks on specimen for dimensional stability. 112

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61189-2  IEC:2006(E) – 5 –
Table 1 – Student’s "t" distribution.12
Table 2 – Example of analysing conditions for the ion exchange chromatography .41
Table 3 – Specimen dimensions .68
Table 4 – Number of plies per specimen as a function of glass thickness.76
Table 6 – Specimen dimension (cm).86
Table 7 – Test pattern dimensions.91
Table 8 – Arc resistance. 103

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– 6 – 61189-2  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2: Test methods for materials for interconnection structures

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-2 has been prepared by IEC technical committee 91: Surface
mounting technology, in cooperation with technical committee 52: Printed circuits (now
disbanded), and technical committee 50: Environmental testing.
This second edition replaces the first edition, published in 1997, and its Amendment 1 (2000).
It constitutes a technical revision.
The document 91/564/FDIS, circulated to the National Committees as Amendment 2, led to the
publication of this new edition.

---------------------- Page: 10 ----------------------

61189-2  IEC:2006(E) – 7 –
The text of this standard is based on the first edition, its amendment 1 and on the following
documents:
FDIS Report on voting
91/564/FDIS 91/572/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The significant technical changes with respect to the previous edition concern the addition of
several new tests in the following categories:
− C: Chemical test methods
− D: Dimensional test methods:
− E: Electrical test methods
− M: Mechanical test methods
− N: Environmental test methods
− X: Miscellaneous test methods
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This standard forms part of a series and should be used in conjunction with other parts in the
same series, all under the main title Test methods for electrical materials, interconnection
structures and assemblies:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 3: Test methods for interconnection structures (printed boards)
1
Part 4: Test methods for electronic components assembling characteristics
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in electronic assemblies
It should also be read in conjunction with IEC 60068: Environmental testing.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

___________
1
 Under consideration.

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– 8 – 61189-2  IEC:2006(E)
INTRODUCTION
IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as
related materials or component robustness, irrespective of their method of manufacture.
The standard is divided into separate parts, covering information for the designer and the test
methodology engineer or technician. Each part has a specific focus; methods are grouped
according to their application and numbered sequentially as they are developed and released.
In some instances test methods developed by other TCs (e.g. TC 50) have been reproduced
from existing IEC standards in order to provide the reader with a
...