Environmental testing -- Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.

Umgebungseinflüsse -- Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten Anschlüssen

Essais d'environnement -- Partie 2-20: Essais - Essai T: Méthodes d'essai pour la brasabilité et la résistance à la chaleur de brasage des dispositifs plombés

La CEI 60068-2-20:2008 décrit l'essai T qui s'applique aux dispositifs à broches. Les essais de brasage des composants pour montage en surface (CMS) sont décrits dans la CEI 60068-2-58. La présente norme fournit des procédures pour déterminer la brasabilité et la résistance à la chaleur de brasage des dispositifs dans les applications utilisant des alliages de brasure, qui sont soit des brasures étain plomb (Pb) eutectique ou quasi eutectique, soit des alliages de brasure sans plomb. Les procédures de la présente norme incluent les méthodes dites de bain de brasage et de fer à braser. Le but de la présente norme est de s'assurer que les broches des composants ou la brasabilité de leurs extrémités est en mesure de satisfaire aux exigences applicables aux joints de brasures des CEI 61191-3 et 61191-4. De plus, des méthodes d'essai sont fournies pour s'assurer que le corps du composant peut résister à la charge calorifique à laquelle il est exposé pendant le brasage. Les principales modifications techniques par rapport à la quatrième édition sont les suivantes: - l'essai de gouttelette de brasure est supprimé; - des conditions et des exigences d'essai concernant les brasures sans plomb sont ajoutées.

Okoljski preskusi - 2-20. del: Preskusi - Preskus T: Preskusne metode za določanje spajkljivosti in odpornosti proti toploti spajkanja za komponente z izvodi (IEC 60068-2-20:2008)

General Information

Status
Published
Publication Date
16-Nov-2008
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
05-Nov-2008
Due Date
10-Jan-2009
Completion Date
17-Nov-2008

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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Umgebungseinflüsse -- Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten AnschlüssenEssais d'environnement -- Partie 2-20: Essais - Essai T: Méthodes d'essai pour la brasabilité et la résistance à la chaleur de brasage des dispositifs plombésEnvironmental testing -- Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads19.040Preskušanje v zvezi z okoljemEnvironmental testingICS:Ta slovenski standard je istoveten z:EN 60068-2-20:2008SIST EN 60068-2-20:2009en,de01-januar-2009SIST EN 60068-2-20:2009SLOVENSKI

STANDARDSIST HD 323.2.20 S3:20031DGRPHãþD
SIST EN 60068-2-20:2009
EUROPEAN STANDARD EN 60068-2-20 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2008

CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -

All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60068-2-20:2008 E
ICS 19.040 Supersedes HD 323.2.20 S3:1988
English version
Environmental testing -
Part 2-20: Tests -
Test T: Test methods for solderability and resistance
to soldering heat of devices with leads (IEC 60068-2-20:2008)
Essais d'environnement -
Partie 2-20: Essais -
Essai T: Méthodes d'essai
pour la brasabilité et la résistance
à la chaleur de brasage
des dispositifs plombés (CEI 60068-2-20:2008)
Umgebungseinflüsse -
Teil 2-20: Prüfungen -
Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit
von Bauelementen mit herausgeführten Anschlüssen (IEC 60068-2-20:2008)

This European Standard was approved by CENELEC on 2008-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

SIST EN 60068-2-20:2009

EN 60068-2-20:2008 – 2 – Foreword The text of document 91/764/FDIS, future edition 5 of IEC 60068-2-20, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60068-2-20 on 2008-08-01. This European Standard supersedes HD 323.2.20 S3:1988. The major technical changes with regard to HD 323.2.20 S3:1988 are the following: – the solder globule test is deleted; – test conditions and requirements for lead-free solders are added.

The following dates were fixed: – latest date by which the EN has to be implemented

at national level by publication of an identical
national standard or by endorsement
(dop) 2009-05-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn

(dow) 2011-08-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60068-2-20:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-54 NOTE

Harmonized as EN 60068-2-54:2006 (not modified). IEC 60068-2-58 NOTE
Harmonized as EN 60068-2-58:2004 (not modified). IEC 60068-2-69 NOTE
Harmonized as EN 60068-2-69:2007 (not modified). IEC 61190-1-3 NOTE

Harmonized as EN 61190-1-3:2007 (not modified). __________ SIST EN 60068-2-20:2009

– 3 – EN 60068-2-20:2008
Annex ZA
(normative)

Normative references to international publications with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.

NOTE

When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.

Publication Year Title EN/HD Year
IEC 60068-1 - 1) Environmental testing -
Part 1: General and guidance EN 60068-1 1994 2)
IEC 60068-2-2 - 1) Environmental testing -
Part 2-2: Tests - Test B: Dry heat EN 60068-2-2 2007 2)
IEC 60068-2-66 - 1) Environmental testing -

Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) EN 60068-2-66 1994 2)

IEC 60068-2-78 - 1) Environmental testing -
Part 2-78: Tests - Test Cab: Damp heat, steady state EN 60068-2-78 2001 2)

IEC 60194 - 1) Printed board design, manufacture and assembly - Terms and definitions EN 60194 2006 2)

IEC 61191-3 - 1) Printed board assemblies -
Part 3: Sectional specification -
Requirements for through-hole mount soldered assemblies EN 61191-3 1998 2)
IEC 61191-4 - 1) Printed board assemblies -
Part 4: Sectional specification -
Requirements for terminal soldered assemblies EN 61191-4 1998 2)
1) Undated reference.
2) Valid edition at date of issue.
SIST EN 60068-2-20:2009
SIST EN 60068-2-20:2009
IEC 60068-2-20Edition 5.0 2008-07INTERNATIONAL STANDARD
Environmental testing –

Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads

INTERNATIONAL ELECTROTECHNICAL COMMISSION RICS 19.040 PRICE CODEISBN 2-8318-9919-2

® Registered trademark of the International Electrotechnical Commission SIST EN 60068-2-20:2009

– 2 – 60068-2-20 © IEC:2008(E) CONTENTS FOREWORD...........................................................................................................................4 1 Scope and object..............................................................................................................6 2 Normative references.......................................................................................................6 3 Terms and definitions.......................................................................................................7 4 Test Ta: Solderability of wire and tag terminations............................................................8 4.1 Object and general description of the test................................................................8 4.1.1 Test methods...............................................................................................8 4.1.2 Specimen preparation..................................................................................8 4.1.3 Initial measurements...................................................................................9 4.1.4 Accelerated ageing......................................................................................9 4.2 Method 1: Solder bath.............................................................................................9 4.2.1 Description of the solder bath......................................................................9 4.2.2 Flux...........................................................................................................10 4.2.3 Procedure..................................................................................................10 4.2.4 Test conditions..........................................................................................10 4.2.5 Final measurements and requirements......................................................11 4.3 Method 2: Soldering iron at 350 °C........................................................................11 4.3.1 Description of soldering irons....................................................................11 4.3.2 Solder and flux..........................................................................................12 4.3.3 Procedure..................................................................................................12 4.3.4 Final measurements and requirements......................................................13 4.4 Information to be given in the relevant specification..............................................13 5 Test Tb: Resistance to soldering heat.............................................................................13 5.1 Object and general description of the test..............................................................13 5.1.1 Test methods.............................................................................................13 5.1.2 Initial measurements.................................................................................14 5.2 Method 1: Solder bath...........................................................................................14 5.2.1 Description of the solder bath....................................................................14 5.2.2 Flux...........................................................................................................14 5.2.3 Procedure..................................................................................................14 5.2.4 Test conditions..........................................................................................14 5.2.5 De-wetting.................................................................................................15 5.3 Method 2: Soldering iron.......................................................................................15 5.3.1 Description of soldering iron......................................................................15 5.3.2 Solder and flux..........................................................................................15 5.3.3 Procedure..................................................................................................15 5.4 Recovery...............................................................................................................16 5.5 Final measurements and requirements..................................................................16 5.6 De-wetting (if applicable).......................................................................................16 5.7 Information to be given in the relevant specification..............................................17 Annex A (informative) Example of apparatus for accelerated steam ageing process.............18 Annex B (normative) Specification for flux constituents.........................................................19 Bibliography..........................................................................................................................20

Figure 1 – Diagram of contact angle.......................................................................................7 SIST EN 60068-2-20:2009

60068-2-20 © IEC:2008(E) – 3 – Figure 2 – Position of soldering iron......................................................................................12 Figure A.1 – Example of apparatus.......................................................................................18

Table 1 – Solderability, Solder bath method: Test severities (duration and temperature).......11 Table 2 – Resistance to soldering heat, Solder bath method: Test severities (duration and temperature)..................................................................................................................15

SIST EN 60068-2-20:2009

– 4 – 60068-2-20 © IEC:2008(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________

ENVIRONMENTAL TESTING –
Part 2-20: Tests –

Test T: Test methods for solderability and resistance to soldering heat of devices with leads

FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-2-20 has been prepared by IEC technical committee 91: Electronics assembly technology. This fifth edition cancels and replaces the fourth edition, published in 1979 and its Amendment 2 (1987). Amendment 2 includes Amendment 1. This fifth edition constitutes a technical revision and includes test conditions and requirements for use of lead-free solder. The major technical changes with regard to the fourth edition are the following: – the solder globule test is deleted; – test conditions and requirements for lead-free solders are added. SIST EN 60068-2-20:2009

60068-2-20 © IEC:2008(E) – 5 – The text of this standard is based on the following documents: FDIS Report on voting 91/764/FDIS 91/774/RVD

Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60068 series, under the general title Environmental testing, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be • reconfirmed, • withdrawn, • replaced by a revised edition, or • amended. A bilingual version of this publication may be issued at a later date.

SIST EN 60068-2-20:2009
– 6 – 60068-2-20 © IEC:2008(E) ENVIRONMENTAL TESTING –

Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads

1 Scope and object This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance. See IEC 60068-2-54 (solder bath method) and IEC 60068-2-69 (solder bath and solder globule method for SMDs). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing – Part 1: General and guidance IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Tests B: Dry heat IEC 60068-2-66, Environmental testing – Part 2-66: Test methods: Test Cx: Damp heat, steady state (unsaturated pressurized vapour) IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady State IEC 60194, Printed board design, manufacture and assembly – Terms and definitions IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies SIST EN 60068-2-20:2009

60068-2-20 © IEC:2008(E) – 7 – 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1

colophony natural resin obtained as the residue after removal of turpentine from the oleo-resin of the pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin acid esters NOTE "Rosin" is a synonym for colophony, and is deprecated because of the common confusion with the generic term "resin". 3.2

contact angle in general the angle enclosed between two planes, tangent to a liquid surface and a solid/liquid interface at their intersection (see Figure 1). In particular the contact angle of liquid solder in contact with a solid metal surface

Contact angle Liquid Solid IEC
1234/08
Figure 1 – Diagram of contact angle 3.3

wetting formation of an adherent coating of solder on a surface. A small contact angle is indicative of wetting 3.4

non-wetting inability to form an adherent coating of solder on a surface. In this case the contact angle is greater than 90° 3.5

de-wetting retraction of molten solder on a solid area that it has initially wetted NOTE In some cases an extremely thin film of solder may remain. As the solder retracts the contact angle increases. 3.6

solderability ability of the termination or lead of device to be wetted by solder at the temperature of the termination or lead which is assumed to be the lowest temperature in the soldering process within solderable temperature of solder alloy SIST EN 60068-2-20:2009

– 8 – 60068-2-20 © IEC:2008(E) 3.7

soldering time time required for a defined surface area to be wetted under specific conditions 3.8

resistance to soldering heat ability of device to withstand the highest temperature of the termination or lead in soldering process, within applicable temperature range of solder alloy 3.9

lead-free solder alloy that does not contain more than 0,1 % lead (Pb) by weight as its constituent and is used for joining components to substrates or for coating surfaces [75.1904 of IEC 60194] 4 Test Ta: Solderability of wire and tag terminations 4.1 Object and general description of the test 4.1.1 Test methods Test Ta provides two different test methods to determine the solderability of the areas on wire and tag terminations that are required to be wetted by solder. – Method 1: Solder bath – Method 2: Soldering iron The test method to be used shall be indicated in the relevant specification. The solder bath method is the one which simulates most closely the soldering procedures of flow soldering and similar soldering processes. The soldering iron method may be used in cases where Method 1 is impracticable. If required by the relevant specification, the test conditioning may be preceded by accelerated ageing. The following are recommended conditions: Ageing 1a: 1 h steam ageing Ageing 1b: 4 h steam ageing Ageing 2: 10 days damp heat, steady state condition (40 ± 2) °C; (93 ± 3) % RH

(Test Cab) Ageing 3a: 4 h at 155 °C dry heat (Test Bb) Ageing 3b: 16 h at 155 °C dry heat (Test Bb). Ageing 4: 4 h unsaturated pres

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