Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices (IEC 62150-6:2022)

This part of IEC 62150 specifies a generic mezzanine board system to support test and measurement of devices based on micro-optical and micro-photonic technologies, including but not limited to photonic integrated circuit (PIC) devices.

Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf- und Messverfahren - Teil 6: Universelle Mezzanine Platinen zur Prüfung und Messung von photonischen Baugruppen (IEC 62150-6:2022)

Composants et dispositifs actifs fibroniques - Procédures d'essais de base et de mesures - Partie 6: Cartes mezzanines universelles pour les essais et les mesures des dispositifs photoniques (IEC 62150-6:2022)

IEC 62150-6:2022 spécifie un système de carte mezzanine générique pour prendre en charge les essais et les mesures des dispositifs basés sur des technologies micro‑optiques et microphotoniques, incluant, entre autres, les dispositifs à circuit intégré photonique (PIC).

Optične aktivne komponente in naprave - Preskusni in merilni postopki - 6. del: Univerzalne medetažne plošče za preizkušanje in merjenje fotonskih naprav (IEC 62150-6:2022)

Ta del standarda IEC 62150 določa splošni sistem medetažnih plošč za podporo preizkušanja in merjenja naprav, ki temeljijo na mikrooptičnih in mikrofotonskih tehnologijah, kar med drugim vključuje naprave s fotonskim integriranim vezjem (PIC).

General Information

Status
Published
Publication Date
03-Apr-2022
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
25-Mar-2022
Due Date
30-May-2022
Completion Date
04-Apr-2022

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SLOVENSKI STANDARD
SIST EN IEC 62150-6:2022
01-maj-2022
Optične aktivne komponente in naprave - Preskusni in merilni postopki - 6. del:
Univerzalne medetažne plošče za preizkušanje in merjenje fotonskih naprav (IEC
62150-6:2022)

Fibre optic active components and devices - Test and measurement procedures - Part 6:

Universal mezzanine boards for test and measurement of photonic devices (IEC 62150-

6:2022)

Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf- und Messverfahren - Teil 6:

Universelle Mezzanine Platinen zur Prüfung und Messung von photonischen
Baugruppen (IEC 62150-6:2022)
Composants et dispositifs actifs fibroniques - Procédures d'essais de base et de

mesures - Partie 6: Cartes mezzanines universelles pour les essais et les mesures des

dispositifs photoniques (IEC 62150-6:2022)
Ta slovenski standard je istoveten z: EN IEC 62150-6:2022
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
SIST EN IEC 62150-6:2022 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62150-6:2022
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SIST EN IEC 62150-6:2022
EUROPEAN STANDARD EN IEC 62150-6
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2022
ICS 33.180.20
English Version
Fibre optic active components and devices - Test and
measurement procedures - Part 6: Universal mezzanine boards
for test and measurement of photonic devices
(IEC 62150-6:2022)

Composants et dispositifs actifs fibroniques - Procédures Aktive Lichtwellenleiter-Bauteile und -Bauelemente - Prüf-

d'essais de base et de mesures - Partie 6: Cartes und Messverfahren - Teil 6: Universelle Mezzanine Platinen

mezzanines universelles pour les essais et les mesures des zur Prüfung und Messung von photonischen Baugruppen

dispositifs photoniques (IEC 62150-6:2022)
(IEC 62150-6:2022)

This European Standard was approved by CENELEC on 2022-03-04. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62150-6:2022 E
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SIST EN IEC 62150-6:2022
EN IEC 62150-6:2022 (E)
European foreword

The text of document 86C/1721/CDV, future edition 1 of IEC 62150-6, prepared by SC 86C "Fibre

optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC

parallel vote and approved by CENELEC as EN IEC 62150-6:2022.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022-12-04

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2025-03-04

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 62150-6:2022 was approved by CENELEC as a European

Standard without any modification.
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SIST EN IEC 62150-6:2022
EN IEC 62150-6:2022 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-731 - International Electrotechnical Vocabulary - - -
Part 731: Optical fibre communication
IEC 62150-1 - Fibre optic active components and devices - EN 62150-1 -
Test and measurement procedures - Part 1:
General and guidance
IEC TR 63072-1 - Photonic integrated circuits - Part 1: - -
Introduction and roadmap for standardization
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SIST EN IEC 62150-6:2022
IEC 62150-6
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Test and measurement
procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic
devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-1074-9

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
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SIST EN IEC 62150-6:2022
– 2 – IEC 62150-6:2022 © IEC 2022
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Mezzanine board requirements ........................................................................................ 7

4.1 Functional description ............................................................................................. 7

4.2 Critical dimensions .................................................................................................. 9

4.3 Daughtercard and extended system ...................................................................... 11

4.4 Power and signal flows ......................................................................................... 15

Annex A (informative) International collaborative research and development ...................... 18

A.1 Overview............................................................................................................... 18

A.2 European FP7 PhoxTroT project ........................................................................... 19

A.3 European H2020 Nephele project ......................................................................... 19

A.4 European H2020 COSMICC project ...................................................................... 19

A.5 Benefit of universal test board............................................................................... 20

Bibliography .......................................................................................................................... 21

Figure 1 – Outlines of mezzanine test boards ......................................................................... 7

Figure 2 – Attachment of PDS onto M2 board ......................................................................... 8

Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal

connectors on top and bottom surfaces and mezzanine board origin ....................................... 9

Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal

connectors on top and bottom surfaces and mezzanine board origin ..................................... 10

Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power

and low speed signal connectors on bottom surfaces and mezzanine board origin ................ 10

Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard

with electrical edge connectors and cut-outs to accommodate optical backplane

connectors ............................................................................................................................ 12

Figure 7 – Attachment of M2 boards onto daughtercard ........................................................ 13

Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards

attached................................................................................................................................ 14

Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards

attached................................................................................................................................ 14

Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards

and one M2 board attached .................................................................................................. 15

Figure 11 – Functional diagram showing power and low speed signal distribution

between PDS, M1/M2, daughtercard and backplane ............................................................. 16

Figure 12 – Multiple daughtercards populated with M1/M2 and PDS in multiple slots

on a system backplane ......................................................................................................... 17

Figure A.1 – Example of cross-project deployment of mezzanine test card [3] ....................... 18

Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project........... 20

Table 1 – Critical relative dimensions .................................................................................... 11

Table 2 – Voltages and low-power signal designations .......................................................... 16

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IEC 62150-6:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –
Part 6: Universal mezzanine boards for test and
measurement of photonic devices
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 62150-6 has been prepared by subcommittee SC 86C: Fibre optic systems and active

devices of IEC technical committee 86: Fibre optics. It is an International Standard.

The text of this International Standard is based on the following documents:
Draft Report on voting
86C/1721/CDV 86C/1752/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
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– 4 – IEC 62150-6:2022 © IEC 2022

A list of all parts in the IEC 62150 series, published under the general title Fibre optic active

components and devices – Test and measurement procedures, can be found on the IEC

website.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/publications.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under webstore.iec.ch in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it

contains colours which are considered to be useful for the correct understanding of its

contents. Users should therefore print this document using a colour printer.
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SIST EN IEC 62150-6:2022
IEC 62150-6:2022 © IEC 2022 – 5 –
INTRODUCTION

This document defines a generic electro-optic mezzanine board for the test and measurement

of micro-optical and micro-photonic devices, including a wide diversity of photonic integrated

circuit (PIC) technologies including, but not limited to, transceivers, switches, sensors,

neuromorphic networks, LiDAR and quantum integrated circuits. The board size and shape

would allow two mezzanine boards to be mounted, side-by-side, on a larger Eurocard form

factor daughtercard, which itself can be docked into and powered from a backplane system.

Alternatively, each mezzanine board can be operated alone, for example on a lab bench

powered from a bench supply.

The purpose of this generic mezzanine board concept is to allow like-for-like comparative

characterisation of devices under test (DUTs) with respect to one another and to measure the

performance of DUTs within larger test environments, relevant to their targeted application,

such as data centre systems, high performance computers, automotive or 5G cabinets. The

mezzanine board PCB will be designed to accommodate very high-speed electronic signals and

a high-speed electronic signal interface to allow external test equipment such as test pattern

generators, bit error rate testers and communication signal analysers to drive the device under

test (DUT).

This approach will be instrumental in accelerating commercial adoption of micro-photonic

devices as they will provide a common benchmark, against which to evaluate the true

performance of a DUT. For example, power consumption is an increasingly important figure of

merit for optical micro-transceivers in ICT systems; however, the declared values of power

consumption as interpreted by the developer often do not reflect the true power consumption of

a device under test in operation. The mezzanine board will therefore include provision for a

smaller detachable power distribution and sensor mezzanine board allowing multiple tuneable

voltages to be provided to the device under test and real-time current or power measurement

for each voltage.

Variants of these mezzanine boards have been successfully developed and adopted within the

European research and development projects European FP7 project PhoxTrot [1] , European

H2020 Nephele [2] and European H2020 COSMICC [3]. Annex A provides an introduction to

these projects.
___________
Numbers in square brackets refer to the Bibliography.
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– 6 – IEC 62150-6:2022 © IEC 2022
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –
Part 6: Universal mezzanine boards for test and
measurement of photonic devices
1 Scope

This part of IEC 62150 specifies a generic mezzanine board system to support test and

measurement of devices based on micro-optical and micro-photonic technologies, including but

not limited to photonic integrated circuit (PIC) devices.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.

IEC 60050-731, International Electrotechnical Vocabulary – Part 731: Optical fibre

communication (available at www.electropedia.org)

IEC 62150-1, Fibre optic active components and devices – Test and measurement procedures

– Part 1: General and guidance

IEC TR 63072-1, Photonic integrated circuits – Part 1: Introduction and roadmap for

standardization
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60050-731,

IEC 62150-1, IEC TR 63072-1 and the following apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
mezzanine board

electronic, optical, or electro-optical printed circuit board designed to be docked onto a larger

board such that the surfaces of the mezzanine board and larger board are parallel

3.2
photonic integrated circuit
PIC

integrated circuit that contains optical structures to guide and process optical signals

Note 1 to entry: See IEC TR 63072-1.
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IEC 62150-6:2022 © IEC 2022 – 7 –
3.3
device under test
DUT
single component or combination of components as defined to be tested
4 Mezzanine board requirements
4.1 Functional description
This document specifies three categories of mezzanine boards:
• half-width mezzanine test board 1 (M1);
• full-width mezzanine test board 2 (M2);
• power distribution and sensor board (PDS).

Figure 1 shows the outline shapes of these three mezzanine boards with electric power and

other low-speed electric connectors on the top and bottom surfaces.

This document defines the outline boundary of the three boards, as shown by the solid thick

line in Figure 1, but the designer is free to adopt any shape within the defined boundary, as

long as it does not interfere with the positions of the power and low-speed connectors on the

top and/or bottom surfaces. M2 is shown with optional example cut-outs along the edges. The

purpose of such cut-outs typically is to allow the user to access components on the underlying

host board over which the mezzanine board is attached. For example, during operation, the

user may require transient access to connectors on the underlying host board for low-speed

diagnostic read-outs from the PDS.
Figure 1 – Outlines of mezzanine test boards

M1 and M2 are mezzanine test boards with areas assigned for micro-optical or micro-photonic

devices under test (DUTs) and the associated electronic and optical test interfaces.

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For example, the DUT on a mezzanine test board (M1 or M2) could be an experimental photonic

integrated circuit (PIC) optical transceiver. The associated electronic test interface could be a

high RF electronic signal header connector array through which high-speed test signals

generated from an external electronic signal pattern generator could be conveyed to the optical

transmit section of the transceiver DUT and through which electronic high-speed signals

generated from the optical receiver section of the transceiver DUT could be conveyed off the

mezzanine test board to an external electronic communications signal analyser or bit error rate

tester. The associated optical test interface could be an optical array connector attached by an

optical fibre ribbon to the optical transceiver DUT through which high-speed optical signals from

an external optical signal pattern generator could be conveyed to the optical receiver section

of the transceiver DUT and through which optical high-speed optical signals generated from the

optical transmit section of the transceiver DUT could be conveyed off the mezzanine test board

to an external optical communications signal analyser or optical bit error rate tester.

The PDS is a power distribution and sensor board that attaches onto a full width mezzanine

card (M1) or across one or two half-width mezzanine test boards (M1) and provides the requisite

voltage or separate voltages to the device under test on its host mezzanine test board or boards.

In addition, the PDS provides a current sensor for each voltage provided to the mezzanine test

board(s), allowing the power consumption of the corresponding DUT to be measured. Typically,

the current sensor will communicate the readings of current in real-time across a low-speed

signal interface, for example a serial wire interface such as I2C. Figure 2 shows a PDS attaching

to an M2 board.
Figure 2 – Attachment of PDS onto M2 board
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4.2 Critical dimensions

This document defines the outline board dimensions and the relative positions of the origin

points of the power and low-speed signal connectors on the top and bottom surfaces with

respect to one another and the board origin points. The connector origin points are always

defined by the centre position of pin 1. In Figure 2, as well as in Figure 3 to Figure 10, the

connector origin points are represented by a corner of the package shape itself, but as

connectors may vary, the package sizes may also vary.

Figure 3 shows the relative positions of the origin points of the power and low-speed signal

connectors on top and bottom surfaces and the mezzanine board origin point on M1.

Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal

connectors on top and bottom surfaces and mezzanine board origin

Figure 4 shows the relative positions of the origin points of the power and low-speed signal

connectors on top and bottom surfaces and the mezzanine board origin point on M2.

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Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal

connectors on top and bottom surfaces and mezzanine board origin

Figure 5 shows the relative positions of power and low-speed signal header connectors on

bottom surfaces and the mezzanine board origin point on the PDS.

Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power and

low speed signal connectors on bottom surfaces and mezzanine board origin

Table 1 shows the values of the critical relative dimensions of the board outline and relative

positions of the power and low-speed signal connectors on the top and bottom surfaces with

respect to one another and the board origin points.
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Table 1 – Critical relative dimensions
Value
Designation Description
Mezzanine board 1 (M1)
a Length of M1 145
b Width of M1 Maximum 53
c Vertical distance between bottom connector 1 and top connector 3 48
d Vertical distance between top connector 3 and bottom connector 2 86,35
e Vertical distance between bottom connector 2 and board origin point 8,25
f Horizontal distance between bottom connector 2 and board origin point 15
Mezzanine board 2 (M2)
g Length of M2 145
h Width of M2 Maximum 112
i Horizontal distance between bottom connectors 4 and 5 70
j Horizontal distance between top connectors 8 and 9 70
k Vertical distance between bottom connectors 4 and 6 134
l Vertical distance between bottom connector 4 and top connector 8 48
m Vertical distance between top connector 8 and bottom connector 6 86,35
n Vertical distance between bottom connector 6 and board origin point 8,25
o Horizontal distance between bottom connector 6 and board origin point 15
Power distribution and sensor board (PDS)
p Length of PDS 112
q Width of PDS Maximum 145
r Horizontal distance between bottom connectors 10 and 11 70
s Vertical distance between bottom connector 10 and board origin point 14,75
t Horizontal distance between bottom connector 10 and board origin point 16,5
4.3 Daughtercard and extended system

The M1 and M2 boards populated with PDS can be used stand-alone, for example on a lab

bench powered by an external power supply.

Alternatively, the M1 and M2 boards can be incorporated into a wider rack-scale test system,

whereby they are mounted onto a test daughtercard, and the test daughtercard, in turn, could

be electro-optically plugged into the backplane of the test enclosure.

The M1 and M2 board dimensions were designed to allow either four M1 or two M2 boards to

be populated onto a daughtercard with "extended double Eurocard form factor", which is a

common industrial form factor appropriate for deployment in rack-scale enclosures.

Figure 6 shows the outline dimensions of an extended double Eurocard form factor

daughtercard with example electrical edge connectors and example cut-outs to accommodate

optical backplane connectors.
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Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard

with electrical edge connectors and cut-outs to accommodate optical backplane
connectors
Figure 7 shows two M2 boards being attached to a test daughtercard.
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SIST EN IEC 62150-6
...

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