SIST EN 60664-3:2004
(Main)Insulation coordination for equipment within low-voltage systems -- Part 3: Use of coating, potting or moulding for protection against pollution
Insulation coordination for equipment within low-voltage systems -- Part 3: Use of coating, potting or moulding for protection against pollution
Applies to rigid printed board assemblies protected by a coating of insulating material on one or both sides. Describes the requirements and test procedures. Has the status of a basic safety publication in accordance with IEC Guide 104.
Isolationskoordination für elektrische Betriebsmittel in Niederspannungsanlagen -- Teil 3: Anwendung von Beschichtungen, Eingießen oder Vergießen zum Schutz gegen Verschmutzung
Coordination de l'isolement des matériels dans les systèmes (réseaux) à basse tension -- Partie 3: Utilisation de revêtement, d'empotage ou de moulage pour la protection contre la pollution
S'applique aux cartes imprimées rigides équipées protégées par un revêtement de matériau isolant déposé sur une de leurs faces ou sur les deux. Décrit les prescriptions et les modes opératoires des essais. A le statut d'une publication fondamentale de sécurité conformément au Guide 104.
Uskladitev izolacije za opremo v okviru nizkonapetostnih sistemov - 3. del: Zaščita pred onesnaženjem s prevlekami, zapiranjem v ohišja ali zalivanjem
Ta del velja za montaže, zaščitene pred onesnaževanjem s prevlekami, zapiranjem v ohišja ali z zalivanjem, kar omogoča zmanjševanje čiščenja in razdalj pri uhajanju, kot je opisano v Delu 1 ali Delu 2. Ta standard opisuje zahteve in preskusne postopke za dve metodi zaščite: - zaščita tipa 1 izboljšuje mikrookolje zaščitenih delov; zaščita tipa 2 se šteje za podobno trdni izolaciji. Ta standard velja tudi za vse vrste zaščitenih tiskanih plošč, vključno s površino notranjih plasti večplastnih plošč, substratov in podobno zaščitenih montaž, v primeru večplastnih tiskanih plošč pa so razdalje med notranjo plastjo zajete v zahtevah za trdno zaščito v Delu 1. Ta standard se nanaša le na stalno zaščito. Ne zajema montaž, ki so podvržene mehanski prilagoditvi ali popravilu. Načela tega standarda veljajo za funkcionalno, osnovno, nadomestno in okrepljeno izolacijo.
General Information
Relations
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.PIsolationskoordination für elektrische Betriebsmittel in Niederspannungsanlagen -- Teil 3: Anwendung von Beschichtungen, Eingießen oder Vergießen zum Schutz gegen VerschmutzungCoordination de l'isolement des matériels dans les systèmes (réseaux) à basse tension -- Partie 3: Utilisation de revêtement, d'empotage ou de moulage pour la protection contre la pollutionInsulation coordination for equipment within low-voltage systems -- Part 3: Use of coating, potting or moulding for protection against pollution29.080.30Izolacijski sistemiInsulation systemsICS:Ta slovenski standard je istoveten z:EN 60664-3:2003SIST EN 60664-3:2004en01-september-2004SIST EN 60664-3:2004SLOVENSKI
STANDARDSIST HD 625.3 S1:19991DGRPHãþD
SIST EN 60664-3:2004
EUROPEAN STANDARD
EN 60664-3 NORME EUROPÉENNE EUROPÄISCHE NORM
April 2003 CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60664-3:2003 E
ICS 29.080.30 Supersedes HD 625.3 S1:1997
English version
Insulation coordination for equipment
within low-voltage systems Part 3: Use of coating, potting or moulding
for protection against pollution (IEC 60664-3:2003)
Coordination de l'isolement des matériels dans les systèmes (réseaux)
à basse tension Partie 3: Utilisation de revêtement, d'empotage ou de moulage
pour la protection contre la pollution (CEI 60664-3:2003)
Isolationskoordination für elektrische Betriebsmittel in NiederspannungsanlagenTeil 3: Anwendung von Beschichtungen, Eingießen oder Vergießen zum Schutz gegen Verschmutzung (IEC 60664-3:2003)
This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
SIST EN 60664-3:2004
EN 60664-3:2003 - 2 - Foreword
The text of document 109/24/FDIS, future edition 2 of IEC 60664-3, prepared by IEC TC 109, Insulation co-ordination for low-voltage equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60664-3 on 2003-04-01.
This European Standard supersedes HD 625.3 S1:1997.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2006-04-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A, B, C and ZA are normative. Annex ZA has been added by CENELEC. __________
Endorsement notice
The text of the International Standard IEC 60664-3:2003 was approved by CENELEC as a European Standard without any modification. __________
SIST EN 60664-3:2004
- 3 - EN 60664-3:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-2-1 1990 Environmental testing Part 2: Tests - Tests A: Cold EN 60068-2-1 1993 A1 1993
A1 1993 A2 1994
A2 1994
IEC 60068-2-2 + IEC 60068-2-2A 1974 1976 Basic environmental testing proceduresPart 2: Tests - Test B: Dry heat
EN 60068-2-2
1993 A1 1993
A1 1993 A2 1994
A2 1994
IEC 60068-2-14 + A1 1984 1986 Part 2: Tests - Test N: Change of temperature
EN 60068-2-14
1999
IEC 60068-2-78 2001 Environmental testing
Part 2-78: Tests - Test Cab: Damp heat, steady state
EN 60068-2-78 2001 IEC 60249-1 1982 Base materials for printed circuits Part 1: Test methods EN 60249-1 1) 1993 A4 1993
A4 + corr. March 1994 1994
IEC 60249-2 Series Part 2: Specifications
EN 60249-2 Series IEC 60326-2 1990 Printed boards Part 2: Test methods - - A1 1992
- - IEC 60454-3-1 1998 Pressure-sensitive adhesive tapes for electrical purposes Part 3-1: Specifications for individual materials - PVC film tapes with pressure-sensitive adhesive
EN 60454-3-1 1998 IEC 60664-1 + A1 + A2 1992 2000 2002 Insulation coordination for equipment within low-voltage systems Part 1: Principles, requirements and tests
EN 60664-1
2003
1) EN 60249-1 includes A1:1984 + A2:1989 + A3:1991 to IEC 60249-1. SIST EN 60664-3:2004
EN 60664-3:2003 - 4 - Publication Year Title EN/HD Year IEC 60664-5 - 2) Part 5: A comprehensive method for determining clearances and creepage distances equal to or less than 2 mm
- - IEC Guide 104 1997 The preparation of safety publications and the use of basic safety publications and group safety publications
- -
2) At draft stage.
SIST EN 60664-3:2004
NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD60664-3Deuxième éditionSecond edition2003-02Coordination de l'isolement des matérielsdans les systèmes (réseaux) à basse tension –Partie 3:Utilisation de revêtement, d'empotage ou demoulage pour la protection contre la pollutionInsulation coordination for equipmentwithin low-voltage systems –Part 3:Use of coating, potting or mouldingfor protection against pollutionPour prix, voir catalogue en vigueurFor price, see current catalogue IEC 2003
Droits de reproduction réservés
Copyright - all rights reservedAucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photo-copie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11
Telefax: +41 22 919 03 00
E-mail: inmail@iec.ch
Web: www.iec.chCommission Electrotechnique InternationaleInternational Electrotechnical Commission
TCODE PRIXPRICE CODEPUBLICATION FONDAMENTALE DE SÉCURITÉBASIC SAFETY PUBLICATIONSIST EN 60664-3:2004
60664-3 IEC:2003– 3 –CONTENTSFOREWORD.5INTRODUCTION.111Scope.132Normative references.133Definitions.154Design requirements.174.1Principles.174.2Application range regarding environment.174.3Requirements for the types of protection.174.4Dimensioning procedures.195Tests.215.1General.215.2Specimens for testing coatings.235.3Specimens for testing mouldings and potting.235.4Preparation of test specimens.235.5Scratch resistance test.235.6Visual examination.255.7Conditioning of the test specimens.255.8Mechanical and electrical tests after conditioning and electromigration.295.9Additional tests.33Annex A (normative)
Test sequence.35Annex B (normative)
Technical committees' decisions.37Annex C (normative)
Printed wiring board for testing coatings.39Bibliography.47Figure 1 – Scratch resistance test for protecting layers.25Figure C.1 – Configuration of the test specimen.43Figure C.2 – Configuration of lands and adjacent conductors.45Table 1 − Minimum spacings for type 2 protection.21Table 2 – Dry heat conditioning.27Table 3 – Degrees of severities for rapid change of temperature.27SIST EN 60664-3:2004
60664-3 IEC:2003– 5 –INTERNATIONAL ELECTROTECHNICAL COMMISSION____________INSULATION COORDINATION FOR EQUIPMENTWITHIN LOW-VOLTAGE SYSTEMS –Part 3: Use of coating, potting or mouldingfor protection against pollutionFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the InternationalOrganization for Standardization (ISO) in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)
In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)
The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)
Attention is drawn to the possibility that some of the elements of this International Standard may be the subjectof patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 60664-3 has been prepared by IEC technical committee 109:Insulation coordination for low-voltage equipment.This second edition cancels and replaces the first edition, published in 1992, and constitutesa technical revision.It has the status of a basic safety publication in accordance with IEC Guide 104.The text of this standard is based on the following documents:FDISReport on voting109/24/FDIS109/31/RVDFull information on the voting for the approval of this standard can be found in the report onvoting indicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.SIST EN 60664-3:2004
60664-3 IEC:2003– 7 –The major changes made during the revision of IEC 60664-3 were the following:• Part 3 has been exactly aligned with Part 1 (including amendments 1 and 2). It has beenmade clear that Part 3 can only be used as a whole document together with Part 1 ofIEC 60664.• The scope of Part 3 has been greatly extended including now also potting and mouldingand similar procedures providing protection against pollution. The standard also applies toall kinds of coated printed boards including the surface of inner-layers of multi-layerboards, substrates and similar protected assemblies. The distances through an innerlayer of multi-layer boards however are covered by the requirements for solid insulationin Part 1.• The difference between the two types of protection has been clarified. Type 1 (formerlytype A) protection leads to a reduction of the pollution degree present beyond theprotection to pollution degree 1. Type 2 (formerly type B) protection introduces protectionsystems which can be considered similar to solid insulation. Consequently thedimensioning and test requirements have been aligned more correctly.• The area of application has been extended including now functional, basic, supplementaryand reinforced insulation.• Type 1 and type 2 protection now can both be used under the conditions of pollutiondegree 3 (formerly only type B).• Not only type 2 protection but also type 1 protection requires that between two conductiveparts 100 % of the distance across the spacing shall be covered by the protection.• For type 2 protection minimum distances have been introduced. In any case the spacingsshall not be lower than the minimum value of 10 µm.• Also the new Part 5 of IEC 60664 is referred to.• The tests follow much more closely the different requirements for type 1 and type 2protection. The protected assembly shall withstand the electrical tests for solid insulationin 4.1.2 of IEC 60664-1. For type 1 protection, the partial discharge test is not applicable.For type 2 protection, the partial discharge test is required. The required partial dischargeextinction voltage and the test method are specified in 4.1.2.4 of IEC 60664-1.• The requirements for the test specimen have been aligned with the extended scope.• The tests for the “adhesion of coating” and the “scratch resistance test” have beenupdated.IEC 60664 consists of the following parts under the general title Insulation coordination forequipment within low-voltage systems:Part 1: Principles, requirements and testsPart 2: Application guidePart 3: Use of coating, potting or moulding for protection against pollutionPart 4: Consideration of high-frequency voltage stressPart 5: A comprehensive method for determining clearances and creepage distances equalto or less than 2 mmSIST EN 60664-3:2004
60664-3 IEC:2003– 9 –The committee has decided that the contents of this publication will remain unchanged until 2008.At this date, the publication will be•reconfirmed;•withdrawn;•replaced by a revised edition, or•amended.SIST EN 60664-3:2004
60664-3 IEC:2003– 11 –INTRODUCTIONThis part of IEC 60664 details the conditions in which the reduction of clearance andcreepage distances can apply to rigid assemblies such as printed boards or terminals ofcomponents. Protection against pollution can be achieved by any kind of encapsulation suchas coating, potting or moulding. The protection may be applied to one or both sides of theassembly. This standard specifies the insulating properties of the protecting material.Between any two unprotected conductive parts, the clearance and creepage distancerequirements of IEC 60664-1 or IEC 60664-5 apply.This standard refers only to permanent protection. It does not cover assemblies after repair.Technical committees need to consider the influence on the protection of overheatedconductors and components, especially under fault conditions, and to decide if any additionalrequirements are necessary.Safe performance of assemblies is dependent upon a precise and controlled manufacturingprocess for the application of the protective system. Requirements for quality control, e.g. bysampling tests, should be considered by technical committees.SIST EN 60664-3:2004
60664-3 IEC:2003– 13 –INSULATION COORDINATION FOR EQUIPMENTWITHIN LOW-VOLTAGE SYSTEMS –Part 3: Use of coating, potting or mouldingfor protection against pollution1 ScopeThis part of IEC 60664 applies to assemblies protected against pollution by the use ofcoating, potting or moulding, thus allowing a reduction of clearance and creepage distancesas described in Part 1 or Part 5.NOTE 1
When reference is made to Part 1 or Part 5, IEC 60664-1 or IEC 60664-5 are meant.This standard describes the requirements and test procedures for two methods of protection:–type 1 protection improves the microenvironment of the parts under the protection;–type 2 protection is considered to be similar to solid insulation.This standard also applies to all kinds of protected printed boards, including the surface ofinner layers of multi-layer boards, substrates and similarly protected assemblies. In the caseof multi-layer printed boards, the distances through an inner layer are covered by therequirements for solid insulation in Part 1.NOTE 2
Examples of substrates are hybrid integrated circuits and thick-film technology.This standard refers only to permanent protection. It does not cover assemblies that aresubjected to mechanical adjustment or repair.The principles of this standard are applicable to functional, basic, supplementary andreinforced insulation.2 Normative referencesThe following referenced documents are indispensable for the application of this document.For dated references, only the edition cited applies. For undated references, the latest editionof the referenced document (including any amendments) applies.IEC 60068-2-1:1990, Environmental testing − Part 2: Tests − Tests A: ColdAmendment 1 (1993)Amendment 2 (1994)IEC 60068-2-2:1974, Basic environmental testing procedures − Part 2: Tests − Tests B:Dry heatAmendment 1 (1993)Amendment 2 (1994)IEC 60068-2-14:1984, Basic environmental testing procedures −
Part 2: Tests − Test N:Change of temperatureAmendment 1 (1986)IEC 60068-2-78:2001, Environmental testing − Part 2-78: Tests − Test Cab: Damp heat,steady stateSIST EN 60664-3:2004
60664-3 IEC:2003– 15 –IEC 60249-1:1982, Base materials for printed circuits – Part 1: Test methodsAmendment 4 (1993)IEC 60249-2 (all parts), Base materials for printed circuit – Part 2: SpecificationsIEC 60326-2:1990, Printed boards – Part 2: Test methodsAmendment 1 (1992)IEC 60454-3-1:1998, Pressure-sensitive adhesive tapes for electrical purposes – Part 3:Specifications for individual materials – Sheet 1: PVC film tapes with pressure-sensitiveadhesiveIEC 60664-1:1992, Insulation coordination for equipment within low-voltage systems – Part 1:Principles, requirements and testsAmendment 1 (2000)Amendment 2 (2002)IEC 60664-5:, Insulation coordination for equipment within low-voltage systems – Part 5:A comprehensive method for determining clearance and creepage distances equal to or lessthan 2 mm 1)IEC Guide 104:1997, The preparation of safety publications and the use of basic safetypublications and group safety publications3 DefinitionsFor the purposes of this document, the definitions given in IEC 60664-1 as well as thefollowing definitions apply.3.1base materialinsulating material upon which a conductive pattern may be formedNOTE
The base material may be rigid or flexible, or both. It may be a dielectric or an insulated metal sheet.(IEC 60194, definition 40.1334)3.2printed boardgeneral term for completely processed printed circuit and printed wiring configurationsNOTE
This includes single-sided, double-sided and multilayer boards with rigid, flexible, and rigid-flex basematerials(IEC 60194, definition 60.1485)3.3conductorsingle conductive path in a conductive pattern(IEC 60194, definition 22.0251)3.4protectionany kind of measure which reduces the influence of the environment———————1) To be published.SIST EN 60664-3:2004
60664-3 IEC:2003– 17 –3.5coatinginsulating material such as varnish or dry film laid on the surface of the assemblyNOTE
Coating and base material of a printed board form an insulating system that may have properties similar tosolid insulation.3.6solid insulationsolid insulating material interposed between two conductive partsNOTE
In the case of a printed board with a coating, solid insulation consists of the board itself as well as thecoating. In other cases, solid insulation consists of the encapsulating material.3.7spacingany combination of clearances, creepage distances and insulation distances throughinsulation4 Design requirements4.1 PrinciplesDimensioning of spacings between conductors depends on the type of protection used.When type 1 protection is used, dimensioning of clearances and creepage distances shallfollow the requirements of Part 1 or Part 5. If the requirements of this standard are met,pollution degree 1 applies under the protection.When type 2 protection is used, spacings between conductive parts shall meet therequirements and tests for solid insulation of Part 1 and their dimensions shall not be lessthan the minimum clearances specified in Part 1 or Part 5 for homogeneous field conditions.4.2 Application range regarding environmentThe design requirements are applicable in all microenvironments.Stresses such as temperature, chemical, mechanical or those listed in 3.3.2.3 of Part 1 shallbe taken into account when the protective material is selected.Absorption of humidity by the protective material shall not impair the insulation properties ofthe parts being protected.NOTE
Absorption of humidity can be checked by an insulation resistance measurement under humid conditions.4.3 Requirements for the types of protectionProtection is achieved in the following ways:–type 1 protection improves the microenvironment of the parts under the protection. Theclearance and creepage distance requirements of Part 1 or Part 5 for pollution degree 1apply under the protection. Between two conductive parts, it is a requirement that one orboth conductive parts, together with all the spacings between them, are covered by theprotection;SIST EN 60664-3:2004
60664-3 IEC:2003– 19 ––type 2 protection is considered to be similar to solid insulation. Under the protection, therequirements for solid insulation specified in Part 1 are applicable and the spacings shallbe not less than those specified in Table 1. The requirements for clearances and creepagedistances in Part 1 or Part 5 do not apply. Between two conductive parts, it is arequirement that both conductive parts, together with all the spacings between them, arecovered by the protection so that no airgap exists between the protective material, theconductive parts and the printed board.Clearance and creepage distance requirements according to Part 1 or Part 5 apply to allunprotected parts of the equipment.4.4 Dimensioning proceduresFor type 1 protection, the dimensioning requirements of 3.1 and 3.2 of Part 1 or Part 5 apply.For type 2 protection, the spacing between the conductors before the protection is appliedshall not be less than the values as specified in Table 1. These values apply to basicinsulation, supplementary insulation as well as reinforced insulation.NOTE
In case of multi-layer boards, the spacing between the conductors at the surface of inner layers isdimensioned as specified for type 1 protection or type 2 protection depending on the result of the tests on theprotection.SIST EN 60664-3:2004
60664-3 IEC:2003– 21 –Table 1 −−−− Minimum spacings for type 2 protectionMaximum peak valueof any voltage a)kVMinimum spacingsmm≤0,330,01>0,33 and ≤0,40,02>0,4 and ≤0,50,04>0,5 and ≤0,60,06>0,6 and ≤0,80,1>0,8 and ≤1,00,15>1,0 and ≤1,20,2>1,2 and ≤1,50,3>1,5 and ≤2,00,45>2,0 and ≤2,50,6>2,5 and ≤3,00,8>3,0 and ≤4,01,2>4,0 and ≤5,01,5>5,0 and ≤6,02>6,0 and ≤8,03>8,0 and ≤103,5>10 and ≤124,5>12 and ≤155,5>15 and ≤208>20 and ≤2510>25 and ≤3012,5>30 and ≤4017>40 and ≤5022>50 and ≤6027>60 and ≤8035>80 and ≤10045a) Transient overvoltages are disregarded since they are unlikelyto degrade the protected assembly.Compliance is checked by measurement of the spacing before applying the protection.5 Tests5.1 GeneralThe suitability of protection is evaluated by carrying out all the tests described in 5.8 after theconditioning described in 5.7.Six specimens are used unless otherwise specified by technical committees. In addition,technical committees may specify the additional tests of 5.9, each of which is carried outon a separate new specimen.SIST EN 60664-3:2004
60664-3 IEC:2003– 23 –These tests are designed for type testing. Technical committees should consider if any of thetests shall be specified for routine or sampling tests.The sequence of tests is shown in Annex A.No failure of any specimen under test is permitted.Annex B lists the decisions required to be taken by technical committees when referringto this standard.5.2 Specimens for testing coatingsTest specimens may be–test specimens according to Annex C, which specifically applies for printed wiring boards.The specimen used for testing shall have the same minimum distances as those fromproduction;–specimens from production;–any printed board, as long as the test specimens are representative of those fromproduction.5.3 Specimens for testing mouldings and pottingProduction specimens shall be used, or they shall be representative of those from production.5.4 Preparation of test specimensPrinted boards shall be cleaned and coated using the normal procedure of the manufacturer.The soldering procedure is carried out but without components being in place. Moulded andpotted specimens shall be tested without further preparation.5.5 Scratch resistance testScratches shall be made across five pairs of conducting parts and the intervening separationsat points where the separations will be subject to the maximum potential gradient during thetests.Protective layers shall be scratched by means of a hardened steel pin, the end of which hasthe form of a cone with an angle of 40°. Its tip shall be rounded and polished, with a radius of0,25 mm ± 0,02 mm. The pin shall be loaded so that the force exerted along its axis is 10 N ±0,5 N. The scratches shall be made by drawing the pin along the surface in a planeperpendicular to the conductor edges of the protective layer at a speed of approximately20 mm/s as shown in Figure 1. Five scratches shall be made at least 5 mm apart and at least5 mm from the edges.SIST EN 60664-3:2004
60664-3 IEC:2003– 25 –BCDAPinDirection of movementof pinSpecimenunder test80°-85°IEC
571/03NOTE
The pin is in the plane ABCD which is perpendicular to the specimen under test.Figure 1 – Scratch resistance test for protecting layers5.6 Visual examinationThe specimens shall be visually examined according to test 1b in 5.1.2 of IEC 60326-2.The specimens shall show no–blistering;–swelling;–separation from the base material;–cracks;–voids;–areas with adjacent unprotected conductive parts, with the exception of lands;–electromigration.5.7 Conditioning of the test specimensThe conditioning methods are suitable for the majority of applications. For particularapplications, a modification of the parameters specified for the conditioning may be appro-priate and should be considered by technical committees.NOTE
The climatic sequence from 5.7.1 to 5.7.4 is intended to simulate ageing.5.7.1 ColdThe cold conditioning (simulation of storage and transportation) is carried out according totest Ab of IEC 60068-2-1. The severities shall be specified by the technical committees andselected from the following:–10 °C–25 °C–40 °C–65 °CThe duration
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