SIST EN IEC 63093-9:2020
(Main)Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 9: Planar cores
Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 9: Planar cores
This part of IEC 63093 specifies the shapes and dimensions of ferrite cores for inductive
components (transformers and chokes), whose the coil is typically made of multi-layer boards
(or the coil is part of the motherboard), and the effective parameter values used in
calculations. This document gives guidelines on allowable limits of surface irregularities
applicable to planar-cores as well.
This document is considered as a sectional specification useful in the negotiation between
ferrite core suppliers and users about surface irregularities.
The general consideration upon which the design of this range of cores is based is given in
Annex A.
Ferritkerne – Richtlinien zu Maßen und Grenzen von Oberflächenbeschädigungen - Teil 9: Planarkerne
Noyaux ferrites - Lignes directrices relatives aux dimensions et aux limites des irrégularités de surface - Partie 9: Noyaux planaires
L’IEC 63093-9:2020 spécifie les formes et dimensions des noyaux ferrites pour les composants inductifs (transformateurs et inductances) dont la bobine est généralement composée de la carte multicouche (ou la bobine fait partie de la carte mère) et des valeurs de paramètres effectifs utilisés dans les calculs. Le présent document donne des lignes directrices relatives aux limites admissibles des irrégularités de surface applicables également aux noyaux planaires.
Le présent document est considéré comme une spécification intermédiaire utile dans les négociations entre les fournisseurs de noyaux ferrites et leurs utilisateurs portant sur les irrégularités de surface.
Cette première édition annule et remplace la première édition de l’IEC 60424-5 parue en 2009 et la première édition de l’IEC 62317-9 parue en 2006 et son Amendement 1:2007. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport aux éditions précédentes de l’IEC 60424-5 et l’IEC 62317-9:
a) l’IEC 63093-9 réunit l’IEC 60424-5 et l’IEC 62317-9;
b) le Tableau 1, le Tableau 2 et le Tableau 3 contenus dans l’IEC 60424-5:2009 ont été déplacés vers l’Annexe B;
c) certains chiffres du Tableau 4 sont corrigés;
d) le Tableau 6 est modifié sur la base de l’IEC 60205.
Feritna jedra - Smernice o merah in mejnih vrednostih površinskih nepravilnosti - 9. del: Planarna jedra
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 63093-9:2020
01-oktober-2020
Nadomešča:
SIST EN 60424-5:2009
SIST EN 62317-9:2007
SIST EN 62317-9:2007/A1:2007
Feritna jedra - Smernice o merah in mejnih vrednostih površinskih nepravilnosti -
9. del: Planarna jedra
Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 9:
Planar cores
Ta slovenski standard je istoveten z: EN IEC 63093-9:2020
ICS:
29.100.10 Magnetne komponente Magnetic components
SIST EN IEC 63093-9:2020 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 63093-9:2020
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SIST EN IEC 63093-9:2020
EUROPEAN STANDARD EN IEC 63093-9
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2020
ICS 29.100.10 Supersedes EN 60424-5:2009, EN 62317-9:2006 and all
of its amendments and corrigenda (if any)
English Version
Ferrite cores - Guidelines on dimensions and the limits of
surface irregularities - Part 9: Planar cores
(IEC 63093-9:2020)
Noyaux ferrites - Lignes directrices relatives aux Ferritkerne - Richtlinien zu Maßen und Grenzen von
dimensions et aux limites des irrégularités de surface - Oberflächenbeschädigungen - Teil 9: Planarkerne
Partie 9: Noyaux planaires (IEC 63093-9:2020)
(IEC 63093-9:2020)
This European Standard was approved by CENELEC on 2020-05-21. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63093-9:2020 E
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SIST EN IEC 63093-9:2020
EN IEC 63093-9:2020 (E)
European foreword
The text of document 51/1308/CDV, future edition 1 of IEC 63093-9, prepared by IEC/TC 51
"Magnetic components, ferrite and magnetic powder materials" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 63093-9:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-02-21
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-05-21
document have to be withdrawn
This document supersedes EN 60424-5:2009 and EN 62317-9:2006 and all of its amendments and
corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 63093-9:2020 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60424-5:2009 NOTE Harmonized as EN 60424-5:2009 (not modified)
IEC 63093-4 NOTE Harmonized as EN IEC 63093-4
2
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SIST EN IEC 63093-9:2020
EN IEC 63093-9:2020 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60205 2016 Calculation of the effective parameters of EN 60205 2017
magnetic piece parts
IEC 60401-1 - Terms and nomenclature for cores made of - -
magnetically soft ferrites - Part 1: Terms used
for physical irregularities and reference of
dimensions
IEC 60424-1 - Ferrite cores - Guidelines on the limits of EN 60424-1 -
surface irregularities - Part 1: General
specification
3
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SIST EN IEC 63093-9:2020
IEC 63093-9
®
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Ferrite cores – Guidelines on dimensions and the limits of
surface irregularities –
Part 9: Planar-cores
Noyaux ferrites – Lignes directrices relatives aux dimensions
et aux limites des irrégularités de surface –
Partie 9: Noyaux planaires
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10 ISBN 978-2-8322-8080-5
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 63093-9:2020
– 2 – IEC 63093-9:2020 © IEC 2020
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Primary dimensions . 7
4.1 Planar shapes and dimensions . 7
4.2 Dimensions and effective parameters of planar EL-core and mating PLT-core . 8
4.3 Dimensions and effective parameters of low-profile E-core and mating PLT-
core . 10
4.4 Dimensions and effective parameters of low-profile ER-core and mating
PLT-core . 12
5 Limits of surface irregularities . 15
5.1 General . 15
5.2 Examples of surface irregularities . 16
5.3 Chips and ragged edges . 17
5.3.1 General . 17
5.3.2 Chips and ragged edges on the mating surfaces . 17
5.3.3 Chips and ragged edges on other surfaces . 18
5.4 Cracks . 20
5.5 Flash . 20
5.6 Pull-outs . 20
5.7 Crystallites . 24
5.8 Pores . 24
Annex A (normative) Low-profile core design . 26
A.1 General design . 26
A.2 EL-core design . 26
A.3 ER-core design . 27
Annex B (informative) Reference values of allowable areas of chips . 29
Bibliography . 31
Figure 1 – Planar EL-core and mating PLT-core. 8
Figure 2 – Low-profile E-core and mating PLT-core . 10
Figure 3 – Low-profile ER-core and mating PLT-core . 12
Figure 4 – Examples of surface irregularities for planar EL-core . 16
Figure 5 – Examples of surface irregularities for low-profile E-core . 16
Figure 6 – Examples of surface irregularities for low-profile ER-core. 16
Figure 7 – Chip location for planar EL-core . 17
Figure 8 – Chip location for low-profile E-core . 17
Figure 9 – Chip location for low-profile ER-core . 17
Figure 10 – Cracks and pull-out location for planar EL-core . 20
Figure 11 – Cracks and pull-out location for low-profile E-core . 21
Figure 12 – Cracks and pull-out location for low-profile ER-core . 21
Figure 13 – Reference dimensions for EL-core . 21
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IEC 63093-9:2020 © IEC 2020 – 3 –
Figure 14 – Reference dimensions for E-core . 22
Figure 15 – Reference dimensions for ER-core . 23
Figure 16 – Example of the location of a crystallite on planar EL-core . 24
Figure 17 – Example of the location of a crystallite on low-profile E-core . 24
Figure 18 – Example of the location of a crystallite on low-profile ER-core . 24
Figure 19 – Example of the location of a pore on planar EL-core . 25
Figure 20 – Example of the location of a pore on low-profile E-core . 25
Figure 21 – Example of the location of a pore on low-profile ER-core . 25
Table 1 – Dimensions of planar EL-core EL and mating PLT-core . 9
Table 2 – Effective parameter values and A values . 10
min
Table 3 – Dimensions of low-profile E-core and mating PLT-core . 11
Table 4 – Effective parameter values and A values . 12
min
Table 5 – Dimensions of low-profile ER-core and mating PLT-core . 13
Table 6 – Effective parameter values and A values . 14
min
Table 7 – Area and length reference for visual inspection . 19
Table 8 – Limits of cracks for planar EL-core . 22
Table 9 – Limits of cracks for low-profile E-core . 23
Table 10 – Limits of cracks for low-profile ER-core . 23
Table A.1 – Sizes and design ratios for ER-core . 28
Table B.1 – Allowable areas of chips for planar EL-core . 29
Table B.2 – Allowable areas of chips for low-profile E-core . 29
Table B.3 – Allowable areas of chips for low-profile ER-core. 30
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FERRITE CORES – GUIDELINES ON DIMENSIONS AND
THE LIMITS OF SURFACE IRREGULARITIES –
Part 9: Planar-cores
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 63093-9 has been prepared by IEC technical committee 51:
Magnetic components, ferrite and magnetic powder materials.
This first edition cancels and replaces the first edition of IEC 60424-5 published in 2009 and
first edition of IEC 62317-9 published in 2006 and its Amendment 1:2007. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
editions of IEC 60424-5 and IEC 62317-9:
a) IEC 63093-9 integrates IEC 60424-5 and IEC 62317-9;
b) Table 1, Table 2 and Table 3 in IEC 60424-5:2009 have been moved to Annex B;
c) some numbers are corrected in Table 4;
d) Table 6 is amended following IEC 60205.
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SIST EN IEC 63093-9:2020
IEC 63093-9:2020 © IEC 2020 – 5 –
The text of this International Standard is based on the following documents:
CDV Report on voting
51/1308/CDV 51/1326/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 63093 series, published under the general title Ferrite cores –
Guidelines on dimensions and the limits of surface irregularities, can be found on the IEC
website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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INTRODUCTION
Today, DC-to-DC converter power supplies increasingly employ transformers and chokes, the
windings of which are made of multi-layer printed circuit boards or are constructed in the
motherboard, rather than the transformers wound by conventional copper wires. This
document specifies the optimum shapes and dimensions of cores for surface mounted devices
(SMDs) and of cores for which the windings are constructed in the motherboard. The
motherboard has slots cut out to accept the ferrite cores. This is called the total integration in
a multi-layer motherboard. The core shape specified in this document satisfies the demand for
lower profile as well as for smaller floor space.
The relations between the main dimensions of planar E-, ER- and EL-cores differ from those
of standard cores. For example, the width of planar-cores is larger while the total height is
much smaller. Also the thickness of the legs is in most cases smaller than compared to
standard cores. Therefore the concept of fixed reference dimensions to determine the length
of crack limits yields crack lengths which are not acceptable for this type of core. This
document follows another concept which relates the crack length to dimensions of the surface
on which the crack occurs.
Also the concept to determine the maximum area of chips based on the total mating surface
fails in the case of planar-cores. The outer legs of planar-cores are much thinner than those
of standard cores which makes overlapping and gluing much more difficult. A single chip of
maximum size on the outer leg can affect the functionality of the core set. Therefore this
document uses as a reference the mating surface on which the chip occurs.
Windings of planar-cores are often PCBs which are glued to the inner surfaces of the planar-
core. For this reason the inner surfaces of the planar-cores should have a better quality than
the inner surfaces of standard cores. This was taken into account by reducing the maximum
allowable area of pull-outs in the inner surfaces.
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IEC 63093-9:2020 © IEC 2020 – 7 –
FERRITE CORES – GUIDELINES ON DIMENSIONS AND
THE LIMITS OF SURFACE IRREGULARITIES –
Part 9: Planar-cores
1 Scope
This part of IEC 63093 specifies the shapes and dimensions of ferrite cores for inductive
components (transformers and chokes), whose the coil is typically made of multi-layer boards
(or the coil is part of the motherboard), and the effective parameter values used in
calculations. This document gives guidelines on allowable limits of surface irregularities
applicable to planar-cores as well.
This document is considered as a sectional specification useful in the negotiation between
ferrite core suppliers and users about surface irregularities.
The general consideration upon which the design of this range of cores is based is given in
Annex A.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60205:2016, Calculation of the effective parameters of magnetic piece parts
IEC 60401-1, Terms and nomenclature for cores made of magnetically soft ferrites – Part 1:
Terms used for physical irregularities
IEC 60424-1, Ferrite cores – Guidelines on the limits of surface irregularities – Part 1:
General specification
3 Terms and definitions
For the purpose of this document, the terms and definitions given in IEC 60401-1 and
IEC 60424-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Primary dimensions
4.1 Planar shapes and dimensions
The main shapes and dimensions shall be as given in the following figures and tables.
The main shapes, dimensions, and parameters for EL-cores are given in:
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• Figure 1 – Planar EL-core- and mating PLT-core;
• Table 1 – Dimensions of planar EL-core and mating PLT-core;
• Table 2 – Effective parameter values and A values.
min
The main shape, dimensions, and parameters for low-profile E-cores are given in:
• Figure 2 – Low-profile E-core and mating PLT-core;
• Table 3 – Dimensions of low-profile E-core and mating PLT-core;
• Table 4 – Effective parameter values and A values.
min
The main shape, dimensions, and parameters for ER-cores are given in:
• Figure 3 – Low-profile ER-core and mating PLT-core;
• Table 5 – Dimensions of low-profile ER-core and mating PLT-core;
• Table 6 – Effective parameter values and A values.
min
A uniform dimensional nomenclature has been chosen in order to facilitate a comparison of
major physical attributes among the different core shapes.
4.2 Dimensions and effective parameters of planar EL-core and mating PLT-core
For the definitions of effective parameters and their calculations, reference shall be made to
IEC 60205.
Figure 1 – Planar EL-core and mating PLT-core
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IEC 63093-9:2020 © IEC 2020 – 9 –
Table 1 – Dimensions of planar EL-core EL and mating PLT-core
Dimensions in millimetres
Size A B B C D E F F R
1 2 1 2 2
10,80 1,91 8,60 0,90 8,97 2,68 6,25
0,3
EL11 × 2,0 min.
11,20 2,11 9,00 1,10 9,37 2,88 6,55
max.
EL11 × 3,0 min. 10,80 2,91 8,60 1,90 8,97 2,68 6,25
0,3
max. 11,20 3,11 9,00 2,10 9,37 2,88 6,55
PLT11 × 1,0 min. 10,80 0,96 8,60
max. 11,20 1,06 9,00
EL13 × 2,2 min. 12,75 2,09 10,20 0,90 10,63 3,19 7,41
0,3
max. 13,25 2,29 10,60 1,10 11,03 3,39 7,71
EL13 × 3,2 min. 12,75 3,09 10,20 1,90 10,63 3,19 7,41
0,3
max. 13,25 3,29 10,60 2,10 11,03 3,39 7,71
PLT13 × 1,2 min. 12,75 1,14 10,20
max. 13,25 1,24 10,60
EL15,5 × 2,9 min. 15,20 2,82 12,15 1,40 12,67 3,82 8,81
0,3
max. 15,80 3,02 12,65 1,60 13,17 4,02 9,21
EL15,5 × 4,4 min. 15,20 4,32 12,15 2,90 12,67 3,82 8,81
0,3
max. 15,80 4,52 12,65 3,10 13,17 4,02 9,21
PLT15,5 × 1,4 min. 15,20 1,32 12,15
max. 15,80 1,52 12,65
EL18 × 3,7 min. 17,70 3,55 14,15 1,90 14,70 4,45 10,27
0,3
max. 18,30 3,75 14,65 2,10 15,30 4,65 10,67
EL18 × 5,7 min. 17,70 5,55 14,15 3,85 14,70 4,45 10,27
0,3
max. 18,30 5,75 14,65 4,15 15,30 4,65 10,67
PLT18 × 1,7 min. 17,70 1,55 14,15
max. 18,30 1,75 14,65
EL20 × 3,8 min. 19,65 3,73 15,70 1,90 16,37 4,91 11,43
0,5
max. 20,35 3,93 16,30 2,10 16,97 5,21 11,83
EL20 × 5,8 min. 19,65 5,68 15,70 3,85 16,37 4,91 11,43
0,5
max. 20,35 5,98 16,30 4,15 16,97 5,21 11,83
PLT20 × 1,8 min. 19,65 1,73 15,70
max. 20,35 1,93 16,30
EL22 × 4,0 min. 21,60 3,92 17,30 1,90 17,98 5,41 12,54
0,5
max. 22,40 4,12 17,90 2,10 18,68 5,71 13,04
EL22 × 6,0 min. 21,60 5,87 17,30 3,85 17,98 5,41 12,54
0,5
max. 22,40 6,17 17,90 4,15 18,68 5,71 13,04
PLT22 × 2,0 min. 21,60 1,92 17,30
max. 22,40 2,12 17,90
EL25 × 4,3 min. 24,55 4,19 19,65 1,90 20,48 6,17 14,29
0,5
max. 25,45 4,39 20,35 2,10 21,18 6,47 14,79
EL25 × 6,3 min. 24,55 6,14 19,65 3,85 20,48 6,17 14,29
0,5
max 25,45 6,44 20,35 4,15 21,18 6,47 14,79
PLT25 × 2,3 min. 24,55 2,19 19,65
max. 25,45 2,39 20,35
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Table 2 – Effective parameter values and A values
min
a
C C l A V A
min
1 2 e e e
Size Remarks
–1 –3 2 3 2
mm mm mm mm mm mm
–3
EL-EL11 × 4,0 0,826 45 49,923 × 10 13,7 16,5 226 15,9 The
combination
–3
EL-EL13 × 4,4 0,666 66 28,815 × 10 15,4 23,1 357 22,4
EL-EL refers
–3
EL-EL15,5 × 5,8 0,596 74 18,143 × 10 19,6 32,9 646 31,9
to two shorter
height EL-
–3
EL-EL18 × 7,3 0,538 30 12,162 × 10 23,8 44,3 1 050 43,0
cores for
size-
–3
EL-EL20 × 7,7 0,468 64 8,586 6 × 10 25,6 54,6 1 400 52,9
designation.
–3
EL-EL22 × 8,0 0,412 80 6,231 4 × 10 27,3 66,2 1 810 64,2 The
combination
–3
EL-EL25 × 8,6 0,350 34 4,094 2 × 10 30,0 85,6 2 570 83,0
EL-PLT refers
–3
EL-PLT11 × 4,0 0,826 45 49,943 × 10 13,7 16,5 226 15,9
to one taller
height EL
–3
EL-PLT13 × 4,4 0,666 66 28,815 × 10 15,4 23,1 357 22,4
core paired
–3
with one PLT-
EL-PLT15,5 × 5,8 0,569 74 18,143 × 10 19,6 32,9 646 31,9
core for each
–3
EL-PLT18 × 7,3 0,538 30 12,162 × 10 23,8 44,3 1 050 43,0
size-
designation.
–3
EL-PLT20 × 7,7 0,468 64 8,586 6 × 10 25,6 54,6 1 400 52,9
–3
EL-PLT22 × 8,0 0,412 80 6,231 4 × 10 27,3 66,2 1 810 64,2
–3
EL-PLT25 × 8,6 0,350 34 4,094 2 × 10 30,0 85,6 2 570 83,0
–3
EL-PLT11 × 3,0 0,701 76 42,170 × 10 11,7 16,6 194 15,9
–3
EL-PLT13 × 3,4 0,577 71 24,857 × 10 13,4 23,2 312 22,4
–3
EL-PLT15,5 × 4,3 0,502 96 15,212 × 10 16,6 33,1 550 31,9
–3
EL-PLT18 × 5,3 0,445 54 10,011 × 10 19,8 44,5 882 43,0
–3
EL-PLT20 × 5,7 0,392 32 7,167 9 × 10 21,6 54,9 1 180 52,9
–3
EL-PLT22 × 6,0 0,350 61 5,264 5 × 10 23,4 66,6 1 560 64,2
–3
EL-PLT25 × 6,6 0,302 22 3,515 6 × 10 26,0 86,0 2 230 83,0
a
See 4.2 of IEC 60205:2016
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