Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Will supersede EN 60352-5:2008

Lötfreie Verbindungen - Teil 5: Einpressverbindungen - Allgemeine Anforderungen, Prüfverfahren und Anwendungshinweise

Connexions sans soudure - Partie 5: Connexions insérées à force - Exigences générales, méthodes d'essai et guide pratique

La CEI 60352-5:2012 est applicable aux connexions insérées à force sans soudure utilisées dans les équipements de télécommunication et les systèmes électroniques employant des techniques similaires. Une connexion insérée à force comprend une borne ayant une zone d'insertion à force adaptée qui est insérée dans un trou métallisé d'une carte imprimée double face ou multicouche. Des informations sur les matériaux et des résultats en retour d'expérience industrielle sont inclus en plus des méthodes d'essais, pour assurer des connexions électriquement stables dans les conditions d'environnement prescrites. L'objet de la présente partie de la CEI 60352 est de déterminer la conformité des connexions insérées à force dans des conditions mécaniques, électriques et atmosphériques spécifiées par le fabricant du contact inséré à force, et de fournir un moyen de comparaison des résultats d'essais lorsque les outils utilisés pour réaliser les connexions sont de conception ou de fabrication différente. La présente quatrième édition annule et remplace la troisième édition CEI 60352-2, parue en 2008, et constitue une révision technique. Les principales modifications techniques apportées par rapport à l'édition précédente sont: - amélioration de l'Annexe A et ajout de remarques d'application supplémentaires; - modifications rédactionnelles dans toute la norme pour empêcher que le document soit mal compris en tant que spécification pour l'établissement de la connexion insérée en totalité; - suppression de tous les tableaux avec des dimensions de trou. Historiquement, les dimensions des trous ont été contraintes en raison des dimensions de borne pour les connexions enroulées et les connexions par clip. Puisque ces technologies de connexion ne sont plus communément utilisées, les exigences de conception ne sont plus pratiques; - intégration de figures complémentaires et d'un tableau en 4.4.4 pour définir les plages de tolérance pour les trous dans la carte d'essai et pour les illustrer; - prise en compte d'une exigence sur l'épaisseur de la carte d'essai en 4.4.

Spoji brez spajke - 5. del: Vtisnjeni spoji - Splošne zahteve, preskusne metode in praktični napotki

Ta del standarda IEC 60352 se uporablja za vtisnjene spoje brez spajke, ki so namenjeni za uporabo v telekomunikacijski opremi in elektronskih napravah, ki delujejo na podlagi podobnih tehnik. Vtisnjen spoj je sestavljen iz sponke z ustreznim vtisnjenim območjem, ki se vstavi v prevlečeno luknjico dvostranskega ali večplastnega tiskanega vezja. Poleg preskusnih postopkov so vključene informacije o materialih in podatki na podlagi industrijskih izkušenj, da se zagotovijo stabilni električni spoji v skladu s predpisanimi okoljskimi pogoji. Cilj tega dela standarda IEC 60352 je določiti primernost vtisnjenih spojev v skladu z mehanskimi, električnimi in atmosferskimi pogoji, kot jih določi proizvajalec vtisnjene sponke, ter zagotoviti možnosti za primerjavo rezultatov preskusov, kadar so orodja za izdelavo spojev različno načrtovana ali izdelana.

General Information

Status
Published
Publication Date
22-May-2012
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
16-May-2012
Due Date
21-Jul-2012
Completion Date
23-May-2012

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SLOVENSKI STANDARD
SIST EN 60352-5:2012
01-julij-2012
1DGRPHãþD
SIST EN 60352-5:2008

6SRMLEUH]VSDMNHGHO9WLVQMHQLVSRML6SORãQH]DKWHYHSUHVNXVQHPHWRGHLQ

SUDNWLþQLQDSRWNL

Solderless connections - Part 5: Press-in connections - General requirements, test

methods and practical guidance
Lötfreie Verbindungen - Teil 5: Einpressverbindungen - Allgemeine Anforderungen,
Prüfverfahren und Anwendungshinweise
Connexions sans soudure - Partie 5: Connexions insérées à force - Exigences
générales, méthodes d'essai et guide pratique
Ta slovenski standard je istoveten z: EN 60352-5:2012
ICS:
29.120.20 Spojni elementi Connecting devices
SIST EN 60352-5:2012 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60352-5:2012
---------------------- Page: 2 ----------------------
SIST EN 60352-5:2012
EUROPEAN STANDARD
EN 60352-5
NORME EUROPÉENNE
May 2012
EUROPÄISCHE NORM
ICS 31.220.10 Supersedes EN 60352-5:2008
English version
Solderless connections -
Part 5: Press-in connections -
General requirements, test methods and practical guidance
(IEC 60352-5:2012)
Connexions sans soudure - Lötfreie Verbindungen -
Partie 5: Connexions insérées à force - Teil 5: Einpressverbindungen -
Exigences générales, méthodes d'essai et Allgemeine Anforderungen, Prüfverfahren
guide pratique und Anwendungshinweise
(CEI 60352-5:2012) (IEC 60352-5:2012)

This European Standard was approved by CENELEC on 2012-03-28. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,

Spain, Sweden, Switzerland, Turkey and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60352-5:2012 E
---------------------- Page: 3 ----------------------
SIST EN 60352-5:2012
EN 60352-5:2012 - 2 -
Foreword

The text of document 48B/2276/FDIS, future edition 4 of IEC 60352-5, prepared by SC 48B,

"Connectors", of IEC TC 48, "Electromechanical components and mechanical structures for electronic

equipment" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60352-

5:2012.
The following dates are fixed:
(dop) 2012-12-28
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2015-03-28
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60352-5:2008

EN 60352-5:2012 includes the following significant technical changes with respect to EN 60352-5:2008:

a) Enhancement of Annex A and further application remarks are added.

b) Editorial changes throughout the standard to prevent the document from being misunderstood as

specification for establishing press-in connection in total.

c) Deletion of all tables with hole dimensions. Historically the hole dimensions were constrained because

of the dimensions of the wire wrap and clip connections posts. Since these connection technologies are

no longer commonly used, the design requirements are no longer practical.

d) Inclusion of additional figures and one table in 4.4.4 to define tolerance ranges for holes in test-boards

and to illustrate them.
e) Inclusion of a requirement for the thickness of the test-board in 4.4.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent

rights.
Endorsement notice

The text of the International Standard IEC 60352-5:2012 was approved by CENELEC as a European

Standard without any modification.
---------------------- Page: 4 ----------------------
SIST EN 60352-5:2012
- 3 - EN 60352-5:2012
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60050-581 2008 International Electrotechnical Vocabulary - - -
Part 581: Electromechanical components for
electronic equipment
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
+ corr. October 1988 Part 1: General and guidance
+ A1 1992
IEC 60352-1 1997 Solderless connections - EN 60352-1 1997
+ corr. October 1998 Part 1: Wrapped connections - General
requirements, test methods and practical
guidance
IEC 60512 Series Connectors for electronic equipment - Tests EN 60512 Series
and measurements
IEC 60512-1-100 - Connectors for electronic equipment - Tests EN 60512-1-100 -
and measurements -
Part 1-100: General - Applicable publications
IEC 61188-5-1 - Printed boards and printed board assemblies -EN 61188-5-1 -
Design and use -
Part 5-1: Attachment (land/joint)
considerations - Generic requirements
IEC 61249 Series Materials for printed boards and other EN 61249 Series
interconnecting structures
IEC 62326-4 1996 Printed boards - EN 62326-4 1997
Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional specification
EN 60068-1 includes A1 to IEC 60068-1 + corr. October.
---------------------- Page: 5 ----------------------
SIST EN 60352-5:2012
---------------------- Page: 6 ----------------------
SIST EN 60352-5:2012
IEC 60352-5
Edition 4.0 2012-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical
guidance
Connexions sans soudure –
Partie 5: Connexions insérées à force – Exigences générales, méthodes d’essai
et guide pratique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX V
ICS 31.220.10 ISBN 978-2-88912-919-5

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN 60352-5:2012
– 2 – 60352-5 © IEC:2012
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope and object .............................................................................................................. 7

2 Normative references ....................................................................................................... 7

3 Terms and definitions ....................................................................................................... 8

4 Requirements ................................................................................................................... 9

4.1 General ................................................................................................................... 9

4.2 Tools ....................................................................................................................... 9

4.2.1 General ....................................................................................................... 9

4.2.2 Tools evaluation .......................................................................................... 9

4.3 Press-in terminations............................................................................................... 9

4.3.1 Materials ..................................................................................................... 9

4.3.2 Dimensions of the press-in zone .................................................................. 9

4.3.3 Dimensions of the plated through hole ......................................................... 9

4.3.4 Surface finishes ........................................................................................... 9

4.4 Test boards ........................................................................................................... 10

4.4.1 General ..................................................................................................... 10

4.4.2 Materials ................................................................................................... 10

4.4.3 Thickness of test boards ............................................................................ 10

4.4.4 Plated-through hole ................................................................................... 10

4.5 Press-in connections ............................................................................................. 12

4.6 Manufacturer´s specification .................................................................................. 12

5 Tests .............................................................................................................................. 13

5.1 General remarks.................................................................................................... 13

5.1.1 General ..................................................................................................... 13

5.1.2 Standard conditions for testing .................................................................. 13

5.1.3 Mounting of specimens .............................................................................. 14

5.2 Test and measuring methods ................................................................................ 14

5.2.1 General examination.................................................................................. 14

5.2.2 Mechanical tests ........................................................................................ 14

5.2.3 Electrical tests ........................................................................................... 18

5.2.4 Climatic tests ............................................................................................. 19

5.3 Test schedules ...................................................................................................... 20

5.3.1 General ..................................................................................................... 20

5.3.2 Qualification test schedule ......................................................................... 20

5.3.3 Flow chart ................................................................................................. 22

5.3.4 Application test schedule ........................................................................... 22

5.4 Test report ............................................................................................................ 23

5.4.1 Qualification test report ............................................................................. 23

5.4.2 Application test report ................................................................................ 24

Annex A (informative) Practical guidance ............................................................................. 25

Bibliography .......................................................................................................................... 32

Figure 1 – Plated-through hole .............................................................................................. 10

Figure 2 – Location and example of the transversal microsection for measuring the

copper thickness ................................................................................................................... 11

---------------------- Page: 8 ----------------------
SIST EN 60352-5:2012
60352-5 © IEC:2012 – 3 –

Figure 3 – Example of hole ranges ........................................................................................ 12

Figure 4 – Test arrangement, bending .................................................................................. 15

Figure 5 – Test arrangement – push-out force ...................................................................... 16

Figure 6 – Transverse section of a press-in connection ......................................................... 17

Figure 7 – Longitudinal section of a press-in connection ....................................................... 18

Figure 8 – Test arrangement for contact resistance .............................................................. 19

Figure 9 – Qualification test schedule ................................................................................... 22

Figure A.1 – Example of a termination removal tool .............................................................. 29

Figure A.2 – Conceptual composition of a four-layer printed circuit-board ............................. 30

Table 1 – Plated-through hole requirements for test boards .................................................. 11

Table 2 – Vibration, preferred test severities ......................................................................... 17

Table 3 – Qualification test schedule – Test group A............................................................. 20

Table 4 – Qualification test schedule – Test group B............................................................. 21

Table 5 – Qualification test schedule – Test group C ............................................................ 21

Table 6 – Application test schedule – Test group D ............................................................... 23

Table A.1 – Example for dimensioning the hole ..................................................................... 31

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SIST EN 60352-5:2012
– 4 – 60352-5 © IEC:2012
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections –
General requirements, test methods and practical guidance
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60352-5 has been prepared by subcommittee 48B: Connectors, of

IEC technical committee 48: Electromechanical components and mechanical structures for

electronic equipment.

This fourth edition cancels and replaces the third edition published in 2008. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) Enhancement of Annex A and further application remarks are added.
b) Editorial changes throughout the standard to prevent the document from being
misunderstood as specification for establishing press-in connection in total.

c) Deletion of all tables with hole dimensions. Historically the hole dimensions were

constrained because of the dimensions of the wire wrap and clip connections posts. Since

---------------------- Page: 10 ----------------------
SIST EN 60352-5:2012
60352-5 © IEC:2012 – 5 –

these connection technologies are no longer commonly used, the design requirements are

no longer practical.

d) Inclusion of additional figures and one table in 4.4.4 to define tolerance ranges for holes in

test-boards and to illustrate them.
e) Inclusion of a requirement for the thickness of the test-board in 4.4.
The text of this standard is based on the following documents:
FDIS Report on voting
48B/2276/FDIS 48B/2286/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 11 ----------------------
SIST EN 60352-5:2012
– 6 – 60352-5 © IEC:2012
INTRODUCTION

This part of IEC 60352 includes requirements, tests and practical guidance information.

Two test schedules are provided.

a) The qualification test schedule applies to individual press-in connections (press-in zone).

They are tested to the specification provided by the manufacturer of the press-in

termination (see 4.6) taking into account the requirements of Clause 4.

The qualification is independent of the application of the press-in zone in a component.

b) The application test schedule applies to press-in connections which are part of a

component and are already qualified to the qualification test schedule.

Test sequences focus on the performance of the press-in connection which is affected by

the implementation in a component.

As the manufacturer of the press-in termination has to provide the main part of the information

needed for qualification, the word "manufacturer" is used throughout this standard for

simplicity.

IEC Guide 109 advocates the need to minimise the impact of a product on the natural

environment throughout the product life cycle.
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SIST EN 60352-5:2012
60352-5 © IEC:2012 – 7 –
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections –
General requirements, test methods and practical guidance
1 Scope and object

This part of IEC 60352 is applicable to solderless press-in connections for use in tele-

communication equipment and in electronic devices employing similar techniques.

The press-in connection consists of a termination having a suitable press-in zone which is

inserted into a plated-through hole of a double-sided or multilayer printed board.

Information on materials and data from industrial experience is included in addition to the test

procedures to provide electrically stable connections under prescribed environmental

conditions.

The object of this part of IEC 60352 is to determine the suitability of press-in connections

under mechanical, electrical and atmospheric conditions as specified by the manufacturer of

the press-in termination and to provide a means of comparing test results when the tools used

to make the connections are of different designs or manufacture.
2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and

are indispensable for its application. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050(581):2008, International Electrotechnical Vocabulary (IEV) – Part 581:
Electromechanical components for electronic equipment
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992)

IEC 60352-1:1997, Solderless connections – Part 1: Wrapped connections – General require-

ments, test methods and practical guidance

IEC 60512 (all parts), Connectors for electronic equipment – Tests and measurements

IEC 60512-1-100, Connectors for electronic equipment – Tests and measurements –
Part 1-100: General – Applicable publications

IEC 61188-5-1: Printed boards and printed board assemblies – Design and use – Part 5-1:

Attachment (land/joint) considerations – Generic requirements

IEC 61249 (all parts), Materials for printed boards and other interconnecting structures

IEC 62326-4:1996, Printed boards – Part 4: Rigid multilayer printed boards with interlayer

connections – Sectional specification
---------------------- Page: 13 ----------------------
SIST EN 60352-5:2012
– 8 – 60352-5 © IEC:2012
3 Terms and definitions

For the purposes of this document, the terms and definitions of IEC 60050(581) and

IEC 60512-1 as well as the following apply.
3.1
press-in connection

solderless connection made by inserting a press-in termination into a plated-through hole of a

printed board
[IEC 60050-581: 2008, 581-03-46]
3.2
press-in termination (press-in post)

termination having a specially shaped zone suitable to provide for a solderless press-in

connection
[IEC 60050-581: 2008, 581-03-39]
3.2.1
solid press-in termination

press-in termination having a solid press-in zone which behaves primarily rigid and induces a

elastoplastic deflection of the through hole
[IEC 60050-581: 2008, 581-03-40]
3.2.2
compliant press-in termination

press-in termination having a compliant press-in zone which causes a limited elastoplastic

deflection of the through hole and a elastoplastic deformation of the press-in zone

[IEC 60050-581: 2008, 581-03-41, modified]
3.3
press-in zone

specially shaped section of a press-in termination which is suitable to provide for the press-in

connection
[IEC 60050-581: 2008, 581-03-52]
3.4
termination insertion tool
device used to insert press-in terminations or components equipped with press-in
terminations into a printed board
[IEC 60050-581: 2008, 581-05-22]
3.5
termination removal tool
device for removing a press-in termination from a printed board
[IEC 60050-581: 2008, 581-05-23]
3.6
set of parts

one press-in termination and a test-board with one or more plated-through holes. The press-in

termination is not mounted in the printed board
---------------------- Page: 14 ----------------------
SIST EN 60352-5:2012
60352-5 © IEC:2012 – 9 –
3.7
specimen

printed board, or a part of a printed board, with a mounted press-in termination, with or

without a component housing
3.8
manufacturer

manufacturer of the press-in termination, who performs the tests according to this standard

using a test board
4 Requirements
4.1 General

The connections shall be processed in a careful and workmanlike manner, in accordance with

best practice.
4.2 Tools
4.2.1 General

Tools shall be used and inspected according to the instructions and dimensions provided by

the manufacturer.
The tools shall be capable of making uniformly reliable connections.

The tools shall be so designed that they do not damage the press-in termination or the printed

board when correctly operated.
4.2.2 Tools evaluation

Tools are evaluated for performance by testing the connections made by them and carrying

out tests according to 4.5 and 5.1.2. They shall meet the requirements of 4.6d) and 5.2.1.3.

4.3 Press-in terminations
4.3.1 Materials
Material used in the press-in zone shall be specified by the manufacturer.
For information on materials, see A.4.3.
4.3.2 Dimensions of the press-in zone

The performance of a press-in connection depends on the dimensions of the specially shaped

press-in zone and the materials used for the press-in termination together with the dimensions

and materials of the plated-through hole in the printed board.
4.3.3 Dimensions of the plated through hole

The minimum thickness of copper plating of the printed circuit board shall be 25 µm. The

shape and dimensions including the tolerances of the plated through hole shall be specified

by the manufacturer.
4.3.4 Surface finishes

The press-in zone of the press-in termination shall be either unplated or plated. The surface

finish shall be specified by the manufacturer.
---------------------- Page: 15 ----------------------
SIST EN 60352-5:2012
– 10 – 60352-5 © IEC:2012
The surface shall be free of detrimental contamination or corrosion.
4.4 Test boards
4.4.1 General
For test purposes test boards according to IEC 61188-5-1 and IEC 62326-4 or to a
specification given by the manufacturer shall be used.

Four layer printed circuit test boards shall be used for testing unless otherwise specified in

the component specification or in the manufacturer’s specification.
4.4.2 Materials

The manufacturer shall specify the types of base material for which the press-in zone is

designed.
Examples of base materials may be found in IEC 61249.
4.4.3 Thickness of test boards

The thickness of the test-board shall be that for which the press-in connection is designed.

When a press-in connection is designed to be used with different board thicknesses, the test

board selected shall be of the thinnest nominal thickness for which the press-in connection is

intended to be used.

NOTE If a press-in connection is designed for board sizes of 1,6 mm to 2,4 mm, a test board with a nominal

thickness of 1,6 mm (within tolerance range) is used.
4.4.4 Plated-through hole

The minimum and the maximum plated hole diameter the press-in connection is intended for

shall be defined by the manufacturer. The tolerance range is then the range between the

minimum and the maximum plated hole diameter.
IEC 162/12
Figure 1 – Plated-through hole
The plated-through holes shall fulfil the requirements ac
...

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