SIST EN 60603-7:2002
(Main)Connectors for frequencies below 3 MHz for use with printed boards -- Part 7: Detail specification for connectors, 8-way, including fixed and free connectors with common mating features, with assessed quality
Connectors for frequencies below 3 MHz for use with printed boards -- Part 7: Detail specification for connectors, 8-way, including fixed and free connectors with common mating features, with assessed quality
Covers an 8-way connector system of 4, 6 or 8 contacts consisting of a range of free and fixed connectors. The connectors cover a variety of different mounting configurations and termination types with a common mating configuration. Fixed connectors ate provided with terminations suitable for solder, insulation displacement, screw terminal, crimp, insulation piercing termination, printed board mounting and flying leads. Free connectors are provided for crimp, insulation piercing and insulation displacement termination to cable assemblies with tinsel, stranded or solid wire conductors.
Steckverbinder für Frequenzen unter 3 MHz für gedruckte Schaltungen -- Teil 7: Bauartspezifikation für Steckverbinder mit bewerteter Qualität, 8-polig, einschließlich fester und freier Steckverbinder mit gemeinsamen Steckmerkmalen
Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées -- Partie 7: Spécification particulière pour connecteurs à 8 voies, comprenant des embases et des fiches ayant des caractéristiques d'accouplement communes, avec assurance de la qualité
Concerne un système de connecteurs à 8 voies de 4, 6 ou 8 contacts comprenant une gamme de fiches et d'embases. Ces connecteurs couvrent une variété de différentes configurations de montage et de types de sorties avec une configuration d'accouplement commune. Les embases sont équipées de sorties à souder, à connexions autodénudantes (CAD) par déplacement d'isolant, à vis à sertir, à percement d'isolant, à montage sur carte imprimée et à fils volants. Les fiches sont équipées de sorties à sertir, à percement d'isolant et à connexions autodénudantes par déplacement d'isolant, pour des cordons avec des fils d'or faux, des conducteurs multibrins ou monobrins.
Connectors for frequencies below 3 MHz for use with printed boards - Part 7: Detail specification for connectors, 8-way, including fixed and free connectors with common mating features, with assessed quality (IEC 60603-7:1996)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60603-7:2002
01-september-2002
1DGRPHãþD
kSIST FprEN 60603-7:2008
Connectors for frequencies below 3 MHz for use with printed boards - Part 7:
Detail specification for connectors, 8-way, including fixed and free connectors
with common mating features, with assessed quality (IEC 60603-7:1996)
Connectors for frequencies below 3 MHz for use with printed boards -- Part 7: Detail
specification for connectors, 8-way, including fixed and free connectors with common
mating features, with assessed quality
Steckverbinder für Frequenzen unter 3 MHz für gedruckte Schaltungen -- Teil 7:
Bauartspezifikation für Steckverbinder mit bewerteter Qualität, 8-polig, einschließlich
fester und freier Steckverbinder mit gemeinsamen Steckmerkmalen
Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées
-- Partie 7: Spécification particulière pour connecteurs à 8 voies, comprenant des
embases et des fiches ayant des caractéristiques d'accouplement communes, avec
assurance de la qualité
Ta slovenski standard je istoveten z: EN 60603-7:1997
ICS:
31.220.10 9WLþLLQYWLþQLFHNRQHNWRUML Plug-and-socket devices.
Connectors
SIST EN 60603-7:2002 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST EN 60603-7:2002
---------------------- Page: 2 ----------------------
SIST EN 60603-7:2002
---------------------- Page: 3 ----------------------
SIST EN 60603-7:2002
---------------------- Page: 4 ----------------------
SIST EN 60603-7:2002
---------------------- Page: 5 ----------------------
SIST EN 60603-7:2002
---------------------- Page: 6 ----------------------
SIST EN 60603-7:2002
NORME
CEI
INTERNATIONALE
IEC
603-7
INTERNATIONAL
STANDARD
QC 010000XX0003
Deuxième édition
Second edition
1996-11
Connecteurs pour fréquences inférieures à 3 MHz
pour utilisation avec cartes imprimées –
Partie 7:
Spécification particulière pour connecteurs
à 8 voies, comprenant des embases et des fiches
ayant des caractéristiques d’accouplement
communes, avec assurance de la qualité
Connectors for frequencies below 3 MHz
for use with printed boards –
Part 7:
Detail specification for connectors, 8-way,
including fixed and free connectors with common
mating features, with assessed quality
CEI 1996 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized
utilisée sous quelque forme que ce soit et par aucun procédé, in any form or by any means, electronic or mechanical,
électronique ou mécanique, y compris la photocopie et les including photocopying and microfilm, without permission
microfilms, sans l'accord écrit de l'éditeur. in writing from the publisher
Bureau central de la Commission Electrotechnique Internationale 3, rue de Varembé Genève, Suisse
CODE PRIX
Commission Electrotechnique Internationale
XA
International Electrotechnical Commission PRICE CODE
Pour prix, voir catalogue en vigueur
For price, see current catalogue
---------------------- Page: 7 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 3 −
CONTENTS
Page
FOREWORD . 5
Clause
1 Scope. 9
2 IEC type designation. 13
3 Common features and isometric view . 14
3.1 Isometric view. 14
3.2 Mating information . 15
3.3 Survey of types. 25
4 Dimensions . 25
4.1 General . 25
4.2 Type A – Fixed connectors (panel-mounted) . 26
4.3 Type B – Fixed connectors (board-mounted) . 32
4.4 Type C – Free connectors. 47
4.5 Type D – Free coupler connectors (under consideration) . 48
4.6 Mounting information for type A fixed connectors (panel-mounted) . 49
4.7 Mounting information for type B fixed connectors (board-mounted) . 52
5 Gauges . 53
5.1 Fixed connectors . 53
5.2 Free connectors. 56
5.3 Test panels (for voltage proof test). 60
6 Characteristics . 61
6.1 Climatic category . 61
6.2 Electrical . 61
6.3 Mechanical . 65
7 Test schedule. 65
8 Quality assessment procedures . 83
8.1 Qualification approval testing . 83
8.2 Quality conformance inspection. 85
Annexes
A Gauging requirements . 89
B Locking device mechanical operation – Test procedure and requirements. 91
C Gauging continuity procedure. 93
D Flowing mixed gas corrosion test . 99
---------------------- Page: 8 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 5 −
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________
CONNECTORS FOR FREQUENCIES BELOW 3 MHz
FOR USE WITH PRINTED BOARDS –
Part 7: Detail specification for connectors, 8-way,
including fixed and free connectors with common mating features,
with assessed quality
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to
promote international co-operation on all questions concerning standardization in the electrical and electronic
fields. To this end and in addition to other activities, the IEC publishes International Standards. Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt
with may participate in this preparatory work. International, governmental and non-governmental organizations
liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the
form of standards, technical reports or guides and they are accepted by the National Committees in that
sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the
subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 603-7 has been prepared by subcommittee 48B: Connectors, of IEC
technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
This second edition cancels and replaces the first edition published in 1990 and constitutes a
technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
48B/489/FDIS 48B/546/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
---------------------- Page: 9 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 7 −
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this International Standard may involve the use of a patent
concerning connectors, 8-way, for interconnect systems given in clauses 3 and 4.
The IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he is willing to negotiate licences under
reasonable and non-discriminatory terms and conditions with applicants throughout the world.
In this respect, the statement of the holder of this patent right is registered with the IEC.
Information may be obtained from:
AT&T
Intellectual Property Licensing and Management Organization
10 Independence Boulevard
P.O. Box 4911
Warren, New Jersey 07060-0911
United States of America
Attention is drawn to the possibility that some of the elements of this International Standard
may be the subject of patent rights other than those identified above. IEC shall not be held
responsible for identifying any or all such patent rights.
Annexes A, B, C and D form an integral part of this document.
The QC number that appears on the front cover of this publication is the specification number in
the IEC Quality Assessment Systems for Electronic Components (IECQ).
---------------------- Page: 10 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 9 −
CONNECTORS FOR FREQUENCIES BELOW 3 MHz
FOR USE WITH PRINTED BOARDS –
Part 7: Detail specification for connectors, 8-way,
including fixed and free connectors with common mating features,
with assessed quality
1 Scope
This part of IEC 603 covers an 8-way connector system of 4, 6 or 8 contacts consisting of a
range of free and fixed connectors. The connectors cover a variety of different mounting
configurations and termination types with a common mating configuration.
Fixed connectors are provided with terminations suitable for solder, insulation displacement,
screw terminal, crimp, insulation piercing termination, printed-board mounting and flying leads.
Free connectors are provided for crimp, insulation piercing and insulation displacement
terminations to cable assemblies with tinsel, stranded or solid wire conductors. At the present
time, free connectors may only be available with a limited range of terminations and variants.
1.1 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 603. At the time of publication, the editions indicated
were valid. All normative documents are subject to revision, and parties to agreements based
on this part of IEC 603 are encouraged to investigate the possibility of applying the most recent
editions of the normative documents indicated below. Members of IEC and ISO maintain
registers of currently valid International Standards.
IEC 50(581): 1978, International Electrotechnical Vocabulary (IEV) – Chapter 581: Electro-
mechanical components for electronic equipment
IEC 68-1: 1988, Environmental testing – Part 1: General and guidance
IEC 326-3: 1991, Printed boards – Part 3: Design and use of printed boards
IEC 352-2: 1990, Solderless connections – Part 2: Solderless crimped connections − General
requirements, test methods and practical guidance
IEC 352-3: 1993, Solderless connections – Part 3: Solderless accessible insulation
displacement connections − General requirements, test methods and practical guidance
IEC 352-4: 1994, Solderless connections – Part 4: Solderless non-accessible insulation
displacement connections – General requirements, test methods and practical guidance
IEC 410: 1973, Sampling plans and procedures for inspection by attributes
---------------------- Page: 11 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 11 −
IEC 512-2: 1985, Electromechanical components for electronic equipment, basic testing
procedures and measuring methods – Part 2: General examination, electrical continuity and
contact resistance tests, insulation tests and voltage stress tests
IEC 512-3: 1976, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 3: Current-carrying capacity tests
IEC 512-4: 1976, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 4: Dynamic stress tests
IEC 512-5: 1992, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 5: Impact tests (free components), static load tests
(fixed components), endurance tests and overload tests
IEC 512-6: 1984, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 6: Climatic tests and soldering tests
IEC 512-7: 1988, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 7: Mechanical operating tests and sealing tests
IEC 512-8: 1993, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 8: Connector tests (mechanical) and mechanical
tests on contacts and terminations
IEC 603-1: 1991, Connectors for frequencies below 3 MHz for use with printed boards – Part 1:
Generic specification – General requirements and guide for the preparation of detail
specifications, with assessed quality
Amendment 1 (1992)
IEC 664-1: 1992, Insulation coordination for equipment within low-voltage systems – Part 1:
Principles, requirements and tests
IEC 807-1: 1991, Rectangular connectors for frequencies below 3 MHz – Part 1: Generic
specification – General requirements and guide for the preparation of detail specifications for
connectors with assessed quality
IEC QC 001001: 1986, Basic rules of the IEC quality assessment system for electronic
components (IECQ)
Amendment 2 (1994)
Amendment 3 (1995)
IEC QC 001002: 1986, Rules of procedure of the IEC quality assessment system for electronic
components (IECQ)
Amendment 2 (1994)
ISO 468: 1982, Surface roughness – Parameters, their values and general rules for specifying
requirements
ITU-T K20: 1984, Resistibility of telecommunication switching equipment to overvoltages and
overcurrents
---------------------- Page: 12 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 13 −
2 IEC type designation
Connectors, connector bodies and connectors with pre-inserted contacts according to this
standard shall be designated by the following system:
IEC 603-7 L N L L L L N N N N L
Reference to
this standard
Letters denoting
connector type
Letter denoting assessment level
Fixed panel mounted
A
and unkeyed version A
Fixed board mounted G
and unkeyed version B
Free and unkeyed
version C
Free coupler and
Number denoting performance level (PL)
unkeyed version D
1 750 operations
Fixed panel mounted
and keyed version E
2 2500 operations
Fixed board mounted
and keyed version F
Number denoting variant
Free and keyed
01
version G
02
03
For details see clause 4
04
4
05
Number of contacts 6
06
8
07
Standard A
Contact position
Number denoting contact finish
Variant B
1 Gold, gold-alloy
Letters denoting type of contact
Female F
Contact Male M
Letter denoting type of conductor
accommodation, flying lead or cable
Letter denoting type of termination
A Tinsel wire
Screw terminal A
B Stranded wire
Crimp C
C Solid wire
Insulation displacement D
D Tinsel or stranded wire
Flying lead F
E Stranded or solid wire
Insulation piercing P
F Tinsel, stranded or solid wire
Solder S
G Board-mounted, boards up to 1,6 mm (0,063) thick nominal
NOTE “L” stands for letter
X Customer specific requirements for flying leads or cables
“N” stands for number
Example:
IEC 603-7 B8AFS-G101- 2G: Fixed connector, board mounted, unkeyed having 8 female
contacts in standard contact positions, gold plated to be soldered into a printed board having a
thickness of 1,6 mm nominal variant 01, meeting performance level 2, assessment level G.
---------------------- Page: 13 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 15 −
3.2 Informations concernant la face 3.2 Mating information
d’accouplement
Pour les besoins de cette spécification, les For the purpose of this specification,
informations concernant les dimensions dimensional information in excess of that
sont détaillées en plus de celles qui sont specified in IEC 603-1 (and IEC 807-1) is
spécifiées dans la CEI 603-1 (et dans la detailed. It is, therefore, necessary to read
CEI 807-1). Il est donc nécessaire de lire 3.2.1 to 3.2.3 inclusive in conjunction with
ensemble 3.2.1 à 3.2.3 inclus. each other.
3.2.1 Contacts 3.2.1 Contacts
Angle facultatif
Optional angle
(voir également 3.2.2 et 3.2.3)
(see also 3.2.2 and 3.2.3)
IEC 889/96
NOTE − Les informations montrées concernant la NOTE − The mating information shown can only be
face d’accouplement ne peuvent être respectées achieved with a free connector with cable attached.
qu’avec une fiche équipée de câble.
---------------------- Page: 14 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 17 −
3.2.2 Embase 3.2.2 Fixed connector
Coupe A-A
(voir figure 3b)
Section A-A
(see figure 3b)
Version sans codage
Unkeyed version
Dépouille maximale 0,15
0,15 maximum taper
Allégement admis
sur les deux côtés
Relief permitted on
both sides
SD
1 SA
1 AD
1
Six endroits
Six places
SE
SB
1
1
Version avec codage
Keyed version
IEC 890/96
Figure 3a – Vue de la zone de contact
View of contact zone
---------------------- Page: 15 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 19 −
Tableau 2 Table 2
Lettre Maximum Minimum Nominal (ref)
Letter
mm in mm in mm in
A 1,47 0,058
1
B 0,71 0,028
1
K 5,84 0,230
1
S 12,04 0,474 11,84 0,466 11,94 0,470
1
T 4,19 0,165 3,94 0,155
1
W 6,38 0,251 6,22 0,245
1
X 6,86 0,270 6,68 0,263
1
Y 2,34 0,092
1
Z 2,08 0,082
1
AA 1,24 0,049
1
AB 0,38 0,015
1
AC 6,96 0,274 6,76 0,266 6,86 0,270
1
AD 0,13 0,005
1
AH 1,02 0,040
1
PV 1) PV 1)
TP 2) TP 2)
AK 8,66 0,341 8,38 0,330
1
AL 1,40 0,055
1
AM 1,52 0,060
1
AP 1,27 0,050
1
AQ 0,97 0,038
1
AR 0,71 0,028
1
AS 0,08 0,003
1
AT 0,76 0,030
1
SA 1,32 0,052 1,22 0,048
1
SB 2,54 0,100 2,29 0,090
1
SD 0,79 0,031 0,74 0,029
1
SE 1,32 0,052 1,22 0,048
1
1)
PV indique la position vraie.
2)
TP indicates true position.
---------------------- Page: 16 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 21 −
3.2.3 Fiche (équipée de câble) 3.2.3 Free connector (with cable attached)
Version sans codage
Unkeyed version
2
AH
2
AH
G
7
SH
2
SM
2
Deux endroits
SK
2
Two places
Version avec codage
Keyed version
SA
2
SL
2
SD
2
SC
2
2
2 2
SE
SF
SB
Méthode de projection: troisième dièdre
IEC 892/96
Projection method: third angle
Figure 4
---------------------- Page: 17 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 23 −
Tableau 3 (fin) Table 3 (concluded)
AY 2,87 0,113 2,67 0,105
2
AZ 0,64 0,025
2
BA 12,32 0,485
2
BB 1,14 0,045 0,38 0,015
2
BC 1,02 0,040 0,51 0,020
2
BD 0,51 0,020
2
BE 1,09 0,043
2
BF 0,64 0,025
2
BG 0,64 0,025 0,38 0,015
2
BH 0,13 0,005
2
BL 8,36 0,329
2
BM 15,88 0,625 14,61 0,575
2
BN 8,00 0,315
2
BP 23,11 0,910
2
Lettre Maximum Nominal (ref)
Letter
BJ Rayon complet
2
Full radius
BK 3°30'
2
---------------------- Page: 18 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 25 −
3.3 Survey of types
Table 4
Type and number of contacts A8F B8F C8M
Number of variants 3 7 1
Current-carrying capacity at 70 °C (see clause 6) 0,2 A
1)
Minimum creepage and clearance distances
Creepage distance between contacts and chassis 1,4 mm (0,055 in)
Clearance distance between contacts and chassis 0,51 mm (0,020 in)
Creepage distance between adjacent contacts 0,36 mm (0,014 in)
Clearance distance between adjacent contacts 0,36 mm (0,014 in)
1)
Application information:
Permissible operating voltages depend on the application or specified safety requirements.
Insulation co-ordination is not required for this connector; therefore, the creepage and clearance distance in
IEC 664-1 are reduced and covered by overall performance requirements.
Reductions in creepage or clearance distances may occur due to the printed board or the wiring used and
shall duly be taken into account.
4 Dimensions
General
4.1
Dimensions are given in milimetres, with inch equivalents. The original dimensions are in
inches. Drawings are shown in third angle projection. The shape of connectors may deviate
from those shapes given in the following figures as long as the specified dimensions are not
influenced.
4.1.1 Contact arrangement of all connector types
Table 5
Number of contacts Contact position designation Contact position
1 234 567 8
4 A xx xx
6 A xxx xxx
8 A x xxx xxx x
---------------------- Page: 19 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 27 −
Tableau 6 Table 6
Lettre Maximum Minimum Nominal (ref)
Letter
mm in mm in mm in
a 18,54 0,730 18,03 0,710
1
b 22,86 0,900
1
c 16,10 0,634 15,60 0,614
1
e 12,70 0,500 12,19 0,480
1
g 4,45 0,175 4,19 0,165
1
h 8,51 0,335
1
j 2,16 0,085 1,91 0,075
1
k 5,08 0,200 4,57 0,180
1
l 1,91 0,075 1,65 0,065
1
m 2,41 0,095 2,16 0,085
1
n 2,16 0,085 1,91 0,075
1
p 7,87 0,310 7,37 0,290
1
q 3,35 0,132 2,84 0,112
1
r 10,01 0,394
1
t 5,72 0,225
1
w 1,02 0,040
1
S 11,94 0,470
1
---------------------- Page: 20 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 29 −
Tableau 7 Table 7
Lettre Maximum Minimum Nominal (ref)
Letter mm in mm in mm in
a 18,29 0,720 17,78 0,700
1
c 13,92 0,548 13,77 0,542
1
d 16,26 0,640 15,75 0,620
1
e 13,08 0,515 12,45 0,490
1
g 4,19 0,165 3,94 0,155
1
h 8,51 0,335 8,38 0,330
1
j 0,76 0,030
1
k 13,84 0,545
1
l 5,41 0,213 4,75 0,187
1
m 1,57 0,062 0,81 0,032
1
n 1,35 0,053 1,19 0,047
1
r 10,01 0,394
1
t 5,72 0,225
1
w 1,02 0,040
1
S 11,94 0,470
1
---------------------- Page: 21 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 31 −
Tableau 8 Table 8
Lettre Maximum Minimum Nominal (ref)
Letter mm in mm in mm in
a 16,26 0,640 16,00 0,630
1
b 22,33 0,879 22,07 0,869
1
c 12,65 0,498 12,40 0,488
1
d 32,39 1,275 32,13 1,265
1
f 26,16 1,030 25,91 1,020
1
g 4,55 0,179 3,63 0,143
1
h 8,43 0,332 8,00 0,315
1
j 1,65 0,065 1,52 0,060
1
k 9,78 0,385 9,53 0,375
1
l 1,68 0,066 1,55 0,061
1
m 5,46 0,215 5,21 0,205
1
p 14,61 0,575 14,35 0,565
1
r 29,46 1,160 29,21 1,150
1
t 9,02 0,355 8,76 0,345
1
S 11,94 0,470
1
4.2.2 Sorties 4.2.2 Terminations
4.2.2.1 Sorties à souder (à l'étude) 4.2.2.1 Solder terminations (under
consideration)
4.2.2.2 Sorties pour connexion 4.2.2.2 Insulation displacement
autodénudante (à l'étude) terminations (under consideration)
Voir la CEI 352-3 ou la CEI 352-4 See IEC 352-3 or IEC 352-4
4.2.2.3 Sorties avec bornes à vis 4.2.2.3 Screw terminal terminations
(à l'étude) (under consideration)
4.2.2.4 Sorties à sertir (à l'étude) 4.2.2.4 Crimp terminations (under
Voir la CEI 352-2 consideration)
See IEC 352-2
4.2.2.5 Sorties pour connexion par 4.2.2.5 Insulation piercing terminations
percement d’isolant (à l'étude) (under consideration)
4.2.2.6 Sorties avec fils volants 4.2.2.6 Flying lead terminations
Le client doit spécifier les détails Customer shall specify lead details:
concernant les fils de sortie: longueur, length and colour of leads, lead end
couleur, cosses d'extrémité, etc. terminals, etc.
---------------------- Page: 22 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 33 −
Tableau 9 Table 9
Lettre Maximum Minimum Nominal (ref)
Letter mm in mm in mm in
a 16,46 0,648 16,05 0,632
1
b 17,30 0,681 16,61 0,654
1
c 15,62 0,615 15,49 0,610
1
d 17,98 0,708
1
e 21,13 0,832 20,32 0,800
1
g 4,72 0,186 4,47 0,176
1
h 9,30 0,336
1
j 1,85 0,073 1,78 0,070
1
k 2,49 0,098 2,29 0,090
1
l 1,88 0,074 1,68 0,066
1
m 3,25 0,128 3,18 0,125
1
n 2,54 0,100
1
p 11,48 0,452 11,38 0,448
1
q 11,46 0,451 9,96 0,392
1
r 8,89 0,350
1
t 17,30 0,681
1
w 3,94 0,155
1
x 16,21 0,638
1
y 1,27 0,050
1
z 2,54 0,100
1
aa 2,54 0,100
1
S 11,94 0,470
1
---------------------- Page: 23 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 35 −
Tableau 10 Table 10
Lettre Maximum Minimum Nominal (ref)
Letter mm in mmin mmin
a 16,21 0,638 15,80 0,622
1
b 20,73 0,816
1
c 15,62 0,615 15,49 0,610
1
d 18,06 0,711 17,63 0,694
1
e 21,06 0,829 20,32 0,800
1
g 4,72 0,186 4,47 0,176
1
h 9,30 0,366 9,04 0,356
1
j 1,85 0,073 1,78 0,070
1
k 2,49 0,098 2,29 0,090
1
l 1,88 0,074 1,68 0,066
1
m 3,25 0,128 3,18 0,125
1
n 2,54 0,100
1
p 11,48 0,452 11,38 0,448
1
q 11,30 0,445 9,93 0,391
1
r 8,89 0,350
1
t 16,79 0,661 15,42 0,607
1
w 3,94 0,155
1
x 16,21 0,638 15,80 0,622
1
y 1,27 0,050
1
z 2,54 0,100
1
aa 2,54 0,100
1
S 11,94 0,470
1
---------------------- Page: 24 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 37 −
Tableau 11 Table 11
Lettre Maximum Minimum Nominal (ref)
Letter mm in mmin mmin
a 11,23 0,442 10,82 0,426
1
b 18,59 0,732 18,19 0,716
1
c 15,62 0,615 15,49 0,610
1
d 18,75 0,738 18,34 0,722
1
e 16,48 0,649 15,77 0,621
1
f 20,98 0,826
1
g 4,32 0,170 4,06 0,160
1
h 10,64 0,419 10,34 0,407
1
j 1,88 0,074 1,70 0,067
1
k 2,13 0,084 1,93 0,076
1
l 1,63 0,064 1,42 0,056
1
m 3,25 0,128 3,18 0,125
1
n 2,54 0,100
1
p 11,48 0,452 11,38 0,448
1
q 7,62 0,300 6,81 0,268
1
r 8,89 0,350
1
w 3,94 0,155
1
x 16,21 0,638 15,80 0,622
1
y 1,27 0,050
1
z 2,54 0,100
1
aa 2,54 0,100
1
S 11,94 0,470
1
---------------------- Page: 25 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 39 −
Tableau 12 Table 12
Lettre Maximum Minimum Nominal (ref)
Letter mm in mmin mmin
a 15,11 0,595 14,86 0,585
1
b 16,13 0,635 15,88 0,625
1
c 15,37 0,605 15,11 0,595
1
e 20,83 0,820 20,57 0,810
1
g 5,46 0,215 4,95 0,195
1
h 11,56 0,455 11,13 0,438
1
j 1,88 0,074 1,70 0,067
1
m 3,02 0,119 2,87 0,113
1
n 2,54 0,100
1
p 11,43 0,450
1
q 10,67 0,420 10,41 0,410
1
r 8,89 0,350
1
w 3,30 0,130 3,05 0,120
1
y 1,27 0,050
1
z 2,54 0,100
1
aa 2,54 0,100
1
S 11,94 0,470
1
---------------------- Page: 26 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 41 −
Tableau 13 Table 13
Lettre Maximum Minimum Nominal (ref)
Letter mm in mmin mmin
a 15,11 0,595 14,86 0,585
1
b 16,13 0,635 15,88 0,625
1
c 15,37 0,605 15,11 0,595
1
d 17,91 0,705 17,65 0,695
1
e 20,83 0,820 20,57 0,810
1
g 5,46 0,215 4,95 0,195
1
h 11,56 0,455 11,13 0,438
1
j 1,88 0,074 1,70 0,067
1
k 2,49 0,098 2,24 0,088
1
l 1,40 0,055 1,14 0,045
1
m 3,02 0,119 2,87 0,113
1
n 2,54 0,100
1
p 11,43 0,450
1
r 8,89 0,350
1
w 3,30 0,130 3,05 0,120
1
y 1,27 0,050
1
z 2,54 0,100
1
aa 2,54 0,100
1
S 11,94 0,470
1
---------------------- Page: 27 ----------------------
SIST EN 60603-7:2002
603-7 IEC:1996 − 43 −
Tableau 14 Table 14
Lettre Maximum Minimum Nominal (ref)
Letter mm in mm in mm in
a 17,40 0,685 17,15 0,675
1
b 19,13 0,753 18,87 0,743
1
c 15,37 0,605 15,11 0,595
1
d 18,67 0,735 18,42 0,725
1
e 20,70 0,815 20,45 0,805
1
f 16,13 0,635 15,88 0,625
1
g 6,86 0,270 6,35 0,250
1
h 11,56 0,455 11,13 0,438
1
k 3,56 0,140 3,30 0,130
1
l 1,14 0,045 0,89 0,035
1
m 3,02 0,119 2,87 0,113
1
n 2,54 0,100
1
p 11,43 0,450
1
r 8,89 0,350
1
t 16,64 0,655 16,38 0,645
1
w 4,19 0,165 3,94 0,155
1
x 1,78 0,070 1,52 0,060
1
y 1,27 0,050
1
z 2,54 0,100
1
aa 2,54 0,100
1
S 11,94 0,470
1
---------------------- Page: 28 ----------------------
SIST EN 60603-7:2002
60
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.