SIST EN 60068-2-69:2008
Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
Essais d'environnement - Partie 2-69 : Essais - Essai Te : Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage
La CEI 60068-2-69:2007 spécifie l'essai Te, la méthode de la balance de mouillage en bain d'alliage et méthode de la balance de mouillage à la goutte d'alliage, applicables aux composants de montage en surface. Ces méthodes permettent de déterminer quantitativement la brasabilité des sorties sur les composants de montage en surface. La CEI 60068-2-54, qu'il convient de consulter le cas échéant, est également disponible pour les composants de montage en surface. Les modes opératoires décrivent la méthode de la balance de mouillage en bain d'alliage ainsi que la méthode de la balance de mouillage à la goutte d'alliage, ces deux méthodes étant par ailleurs applicables aux composants munis de sorties métalliques et plots de soudage métallisés. La présente norme fournit les modes opératoires normalisés pour les alliages de brasage tendre contenant du plomb (Pb) et pour les alliages de brasage sans plomb. Cette deuxième édition annule et remplace la première édition parue en 1995, dont elle constitue une révision technique. Les principales modifications apportées par rapport à l'édition précédente sont les suivantes: - Intégration des conditions d'essai des alliages sans plomb; - Intégration de nouveaux flux à des fins d'essai, avec description de l'évolution des flux développés dans l'industrie au cours des 20 dernières années; - Intégration de nouveaux types de composants, et actualisation des paramètres d'essai pour la liste complète des composants.
Okoljski preskusi - 2. del: Preskusi - Preskus Te: Preskus spajkanja elektronskih komponent za površinsko montažo (SMD) z metodo za določanje omočljivosti (IEC 60068-2-69:2007)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60068-2-69:2008
01-februar-2008
1DGRPHãþD
SIST EN 60068-2-69:2001
2NROMVNLSUHVNXVLGHO 3UHVNXVL3UHVNXV7H 3UHVNXVVSDMNDQMDHOHNWURQVNLK
NRPSRQHQW]DSRYUãLQVNRPRQWDåR 60' ]PHWRGR]DGRORþDQMHRPRþOMLYRVWL ,(&
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method
Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
Essais d'environnement - Partie 2-69: Essais - Essai Te: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage
Ta slovenski standard je istoveten z: EN 60068-2-69:2007
ICS:
19.040
31.190
SIST EN 60068-2-69:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
EUROPEAN STANDARD
EN 60068-2-69
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 19.040; 31.190 Supersedes EN 60068-2-69:1996
English version
Environmental testing -
Part 2-69: Tests -
Test Te: Solderability testing of electronic components
for surface mounting devices (SMD) by the wetting balance method
(IEC 60068-2-69:2007)
Essais d'environnement - Umgebungseinflüsse -
Partie 2-69: Essais - Teil 2-69: Prüfungen -
Essai Te: Essai de brasabilité Prüfung Te: Prüfung der Lötbarkeit
des composants électroniques von Bauelementen der Elektronik
pour les composants pour montage für Oberflächenmontage (SMD)
en surface (CMS) par la méthode mit der Benetzungswaage
de la balance de mouillage (IEC 60068-2-69:2007)
(CEI 60068-2-69:2007)
This European Standard was approved by CENELEC on 2007-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-69:2007 E
---------------------- Page: 2 ----------------------
EN 60068-2-69:2007 - 2 -
Foreword
The text of document 91/648/FDIS, future edition 2 of IEC 60068-2-69, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60068-2-69 on 2007-06-01.
This European Standard supersedes EN 60068-2-69:1996.
The main changes from EN 60068-2-69:1996 are as follows:
– inclusion of lead-free alloy test conditions;
– inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry
in the past 20 years;
– inclusion of new component types, and updating test parameters for the whole component list.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60068-2-69:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-44 NOTE Harmonized as EN 60068-2-44:1995 (not modified).
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1:2002 (not modified).
ISO 9453 NOTE Harmonized as EN ISO 9453:2006 (not modified).
ISO 9454-1 NOTE Harmonized as EN 29454-1:1993 (not modified).
__________
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- 3 - EN 60068-2-69:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-1 - Environmental testing - EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-20 1979 Environmental testing -
+ A2 1987 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988
IEC 60068-2-54 2006 Environmental testing - EN 60068-2-54 2006
Part 2-54: Tests - Test Ta: Solderability
testing of electronic components by the
wetting balance method
IEC 61190-1-3 2002 Attachment materials for electronic EN 61190-1-3 2002
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications
ISO 683 Series Heat-treatable steels, alloy steels and - -
free-cutting steels
ISO 6362 Series Wrought aluminium and aluminium alloy - -
extruded rods/bars, tubes and profiles
1)
Undated reference.
2)
Valid edition at date of issue.
---------------------- Page: 4 ----------------------
INTERNATIONAL IEC
STANDARD 60068-2-69
Second edition
2007-05
Environmental testing –
Part 2-69:
Tests – Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
PRICE CODE
Commission Electrotechnique Internationale T
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
---------------------- Page: 5 ----------------------
– 2 – 60068-2-69 © IEC:2007(E)
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .6
4 General description of the method .6
5 Description of the test apparatus .6
6 Preconditioning .7
6.1 Preparation of specimens .7
6.2 Ageing.7
7 Materials .7
7.1 Solder .7
7.2 Flux.8
8 Procedures.8
8.1 Test temperature.8
8.2 Solder bath wetting balance procedure.8
8.3 Solder globule wetting balance procedure .11
9 Presentation of results.14
9.1 Form of force versus time trace .14
9.2 Test requirements .15
10 Information to be given in the relevant specification .15
Annex A (normative) Equipment specification .16
Annex B (informative) Use of the wetting balance for SMD solderability testing .18
Bibliography.25
Figure 1 – Test apparatus.6
Figure 2 – Typical wetting balance trace .14
Table 1 – Recommended solder bath wetting balance test conditions .10
Table 2 – Time sequence of the test (solder bath) .11
Table 3 – Recommended solder globule wetting balance test conditions.12
Table 4 – Time sequence of the test (Solder globule) .13
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60068-2-69 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-69 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1995 and constitutes a
technical revision. The main changes from the previous edition are as follows:
– Inclusion of lead-free alloy test conditions;
– Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in
the industry in the past 20 years;
– Inclusion of new component types, and updating test parameters for the whole component
list.
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– 4 – 60068-2-69 © IEC:2007(E)
The text of this standard is based on the following documents:
FDIS Report on voting
91/648/FDIS 91/680/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
A list of all the parts in the IEC 60068 series, under the general title Environmental testing,
can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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60068-2-69 © IEC:2007(E) – 5 –
ENVIRONMENTAL TESTING –
Part 2-69: Tests –
Test Te: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method
1 Scope
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder
globule wetting balance method, applicable for surface mounting devices. These methods
determine quantitatively the solderability of terminations on surface mounting devices.
IEC 60068-2-54 is also available for surface mounting devices and should be consulted if
applicable.
The procedures describe the solder bath wetting balance method and the solder globule
wetting balance method and are both applicable to components with metallic terminations and
metallized solder pads.
This standard provides the standard procedures for solder alloys containing lead (Pb) and for
lead-free solder alloys.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:1979, Basic environmental testing procedures – Part 2: Tests – Test T:
Soldering
Amendment 2 (1987 )
IEC 60068-2-54:2006, Environmental testing – Part 2-54: Tests – Test Ta: Solderability
testing of electronic components by the wetting balance method
IEC 61190-1-3:2002, Attachment materials for electronic assemblies – Part 1-3: Requirements
for electronic grade solder alloys and fluxed/non-fluxed solid solder for electronic soldering
applications
ISO 683 (all parts), Heat-treatable steels, alloy steels and free-cutting steels
ISO 6362 (all parts), Wrought aluminium and aluminium alloy extruded rods/bars, tubes and
profiles
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– 6 – 60068-2-69 © IEC:2007(E)
3 Terms and definitions
For the purpose of this document, the terms and definitions as defined in IEC 60068-1 and
IEC 60068-2-20 apply.
4 General description of the method
After applying the liquid flux to the component termination and mounting the component in a
suitable holder, the specimen is suspended from a sensitive balance. The component
termination is brought into contact with the cleaned surface of a solder bath or the apex of a
solder globule, and immersed to the prescribed depth.
The resultant forces of buoyancy and surface tension acting upon the immersed termination
are detected by a transducer and converted to a signal which is continuously monitored as a
function of time, and recorded on a high speed chart recorder or displayed on a computer
screen.
The wetting speed and the extent of wetting are derived from the force against time curve.
5 Description of the test apparatus
A diagram showing a suitable arrangement for the test apparatus is shown in Figure 1. The
specimen is suspended from a sensitive balance and a mechanism used to either raise the
solder to meet the specimen or lower the specimen into the solder.
After conditioning, the transducer signal is passed to either a chart recorder or a computer,
where the force against time curve may be displayed and analysed.
Balance or
Signal
Computer or chart recorder
transducer
conditioner
Specimen
Globule block
or solder bath
Control box
Lift mechanism
IEC 602/07
Figure 1 – Test apparatus
Any other system capable of measuring the vertical forces acting on a specimen is admissible,
providing that the system has the characteristics given in A.1, and the solder bath and globule
support block meet the requirements of A.2 and A.3 respectively.
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60068-2-69 © IEC:2007(E) – 7 –
6 Preconditioning
6.1 Preparation of specimens
Unless otherwise specified, the specimen shall be tested in the as-received condition and
care should be taken to ensure that no part of the surface to be tested becomes contaminated,
particularly by contact with the fingers, during the preparation and handling of the specimen.
If required by the component specification, the specimen may be cleaned by immersion in a
neutral organic solvent at room temperature. The specimen should be allowed to dry in air
before testing. No other cleaning is permitted.
6.2 Ageing
If required by the component specification, the component may be subjected to accelerated
ageing before testing. Ageing shall be performed in accordance with one of the following
conditions:
– ageing 1a of IEC 60068-2-20, Subclause 4.5.1;
– ageing 1b of IEC 60068-2-20, Subclause 4.5.1;
– ageing 3 of IEC 60068-2-20, Subclause 4.5.3;
– ageing according to method 1 of IEC 60068-2-20, but for 8 h.
7 Materials
7.1 Solder
7.1.1 General
The solder to be used for both the solder bath and for the solder globule wetting balance test
shall be as specified in 7.1.2 and 7.1.3.
7.1.2 Solder alloy containing lead
The solder shall be Sn60Pb40A, Sn63Pb37A or Sn62Pb36Ag02B (Refer to IEC 61190-1-3
alloy name).
NOTE The presence of silver in the solder reduces the dissolution effect on silver containing metallization on
components and therefore should be used when required by the relevant component specification.
7.1.3 Lead-free solder alloy
The preferred alloy composition to be used should consist of either 3,0 wt% Ag, 0,5 wt% Cu,
96,5 wt% Sn (Sn96,5Ag3Cu,5) or 0,7 wt% Cu, 99,3 wt% Sn (Sn99,3Cu,7). (Refer to
IEC 61190-1-3 for alloy name.)
NOTE A solder alloy consisting of 3,0 wt% to 4,0 wt% Ag, 0,5 wt% to 1,0 wt% Cu and the remainder of Sn may
also be used instead of Sn96,5Ag3Cu,5. The solder alloys consist of 0,45 wt% to 0,9 wt% Cu and the remainder of
Sn may be used instead of Sn99,3Cu,7.
7.1.4 Solder mass for solder globule wetting balance method
For the solder globule wetting balance method, the solder shall be in the form of pellets or cut
wire with a mass of 200 mg ± 10 mg for use on the 4 mm diameter pin globule support
block,100 mg ± 10 mg for use on 3,2 mm diameter pin support block or 25 mg ± 2,5 mg for
use on the 2 mm diameter pin globule support block.
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– 8 – 60068-2-69 © IEC:2007(E)
Pellet mass
Pin diameter Pellet mass
tolerance
mm mg
mg
2 25
±2,5
3,2 100 ±10
4 200 ±10
7.2 Flux
7.2.1 General
The flux used for the test shall be either rosin based or carboxylic acid based. The rosin
based flux is either non-activated or activated. The carboxylic acid based flux is either water
solution or alcohol solution.
Information about the used flux type shall be specified in the relevant specification.
7.2.2 Rosin based flux
a) Non-activated: consist of 25 wt% colophony in 75 wt% of 2-propanol (isopropanol) or of
ethyl alcohol (as specified in Appendix C of IEC 60068-2-20).
b) Activated flux: the activated flux which is above flux with the addition of diethylammonium
chloride (analytical reagent grade), up to amount of 0,2 % or 0,5 % chloride (expressed as
free chlorine based on the colophony content).
7.2.3 Carboxylic acid based flux
a) Water solution: consist of 90,1 % De-ionised Water, 5,0% Glycol Ester (CAS
No. 34590-94-8) 1,6 % Adipic Acid, 1,6 % Succinic Acid, 1,6 % Glutaric Acid and 0,1 %
alcohol ethoxylate surfactant (CAS no 68131-39–5).
b) Alcohol solution: consist of 94 % Propan-2-ol, 1,5 % Adipic Acid, 1,5 % Succinic Acid,
1,5 % Glutaric Acid and 1,5 % Rosin.
NOTE These fluxes reflect modern flux formulations and have similar discriminating powers to the rosin test
fluxes.
8 Procedures
8.1 Test temperature
8.1.1 Solder alloy containing lead
Solder temperature prior to test and during test shall be 235 °C ± 3 °C.
8.1.2 Lead-free solder alloy
Unless otherwise specified in the relevant specification, the temperature of the solder prior to
the test shall be 245 °C ± 3 °C for Sn96,5Ag3Cu,5 solder and 250 °C ± 3 °C for Sn99,3Cu,7
solder.
8.2 Solder bath wetting balance procedure
The specimen is mounted in a suitable holder to give the desired dipping angle and the
termination(s) is/are centred above the solder bath. Preferred dipping angles are given in Table 1.
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60068-2-69 © IEC:2007(E) – 9 –
The temperature of the solder prior to the test shall be as described in 8.1.
Prior to testing, a continuous layer of the appropriate flux is applied to the portion of the
component termination to be tested, using a cocktail stick, cotton bud or similar applicator,
and excess flux droplets are removed by touching against absorbent paper. It is very
important that excess flux is not allowed to enter the specimen holder or remain on the
component. The presence of excess flux will cause explosive boiling as the flux solvent
makes contact with the molten solder.
Immediately prior to testing, wipe the oxide from the solder surface with a non-wettable blade.
If required, the apparatus suspension and chart recorder are adjusted to the zero position.
Hang the specimen on the apparatus so that the lower edge of the component is 20 mm ± 5 mm
above the solder surface during the preheat period and allow the specimen to preheat/dry for 30 s
± 15 s prior to immersion in the solder. This period is required to remove the solvent from the
flux prior to the test and to prevent explosive boiling when the solder, specimen and flux come
into contact.
After preheating, the specimen and solder are brought into contact at a speed between
1 mm/s and 5 mm/s. The recommended immersion depth into the solder of the surface to be
tested shall be as specified in Table 1.
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– 10 – 60068-2-69 © IEC:2007(E)
Table 1 – Recommended solder bath wetting balance test conditions
a
Component Dipping angle Figure reference Immersion depth
mm
b
Capacitors 1608 (0603)
b
2012 (0805) Horizontal, Vertical
1A,1B, 1C
b
3216 (1206) or 20° to 45°
b
4532 (1812)
b
Resistors 1608 (0603)
Horizontal, Vertical 1A, 1B,1C,
b
2012 (0805)
d d
b or 20° to 45° 1G ,1H
3216 (1206)
SOT 23
SOT 89
SOT 223
0,04 to 0,10
c
SOIC 16
c
1D, 1E, 1F
SOIC 28
Leaded SMD Vertical or 20° to 45°
c
VSO 40
c
QFP 48
c
QFP 160
c
PLCC 44
c
PLCC 84
Cylindrical SMD Horizontal, Vertical
1A,1B, 1C
or 20° to 45°
SOD 80 Vertical or 20° to 45° 1B, 1C
Not recommended for sizes below 1608 (0603).
The recommended dwell time is 5 s, except for SOT 89 and SOT 223 components, where 10 s is recommended.
The recommended immersion speed for all components is between 1 mm/s and 5 mm/s.
a
Orientation of the specimen terminals or leads towards the solder surface.
b
Component names in parentheses, dimensions are expressed in Imperial.
c
These leads may be cut and tested individually, but care should be taken not to deform the part of the lead to
be tested. This operation should be performed after ageing, if any ageing procedure is applied.
d
Figures 1G and 1H are applicable to the components which do not have electrode toward the solder surface
when use Figure 1B.
1A 1B 1C 1G
d
Horizontal Vertical 20°to 45° Vertical
1D 1E 1F 1H
d
20° to 45° Vertical 20° to 45° 20° to 45°
IEC 603/07
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60068-2-69 © IEC:2007(E) – 11 –
The solder and specimen are held in this position for not less than 5 s and then separated.
The withdrawal rate is not specified as the force curve is not analysed once the specimen
starts to separate from the solder.
Time sequence of the test is shown in Table 2. The test sequence should be made in the
minimum time whilst maintaining repeatability.
Table 2 – Time sequence of the test (solder bath)
Procedure Time Duration
1) Fluxing 0 s 5 s
2) Hang the specimen on the apparatus ~15 s --
3) Wipe the oxide from the solder surface ~20 s --
4) Preheat ~30 s 30 s ± 15 s
5) Start ~75 s 3 s to 25 s
6) Solder immersion 100 s max. 5 s
The vertical force acting on the specimen is recorded during the period of contact between the
solder and the specimen. The force during withdrawal need not be recorded as the withdrawal
part of the curve is not analysed.
Once the specimen has cooled, the flux residues are washed from the specimen, using a
neutral organic solvent. The specimen is visually examined using a magnification of 10 ×.
Special attention should be paid to de-wetting, as de-wetting does not often occur until the
specimen is withdrawn from the solder.
Note that de-wetting may be obscured by the presence of solder icicles frozen onto the
termination as it is withdrawn from the solder.
8.3 Solder globule wetting balance procedure
Select the appropriate globule block for the component to be tested. Recommended globule
support block pin sizes are given in Table 3.
Set the temperature of the solder as specified in 8.1. Note that the globule blocks should
never be heated without solder covering the iron pin. Heating the uncovered pin could cause
the iron to become oxidized and difficult to wet.
The specimen is mounted in the appropriate holder, to give the desired dipping angle, and the
termination to be tested is centred above the solder globule. Recommended dipping angles
and immersion depths for a typical range of components are given in Table 3.
Prior to testing, a continuous layer of the appropriate flux is applied to the portion of the
component termination to be tested, using a cocktail stick, cotton bud or similar applicator and
excess flux droplets are removed by touching against absorbent paper. It is very important
that excess flux is not allowed to enter the specimen holder or remain on the component. The
presence of excess flux will cause explosive boiling as the flux solvent makes contact with the
molten solder.
Immediately before the test, the solder from the previous test should be removed, by wiping
the globule block with a cotton bud, and replaced with a new pellet of the appropriate mass.
Sufficient activated rosin flux (0,5 % halide, as specified in 7.2) shall be applied to the solder
globule. This maintains a clean surface for
...
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