Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019)

This standard specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

Halbleiterbauelemente - Teil 16-6: Integrierte Mikrowellenschaltkreise - Frequenzvervielfachung (IEC 60747-16-6:2019)

Dispositifs à semiconducteurs - Partie 16-6: Circuits intégrés hyperfréquences - Multiplicateurs de fréquence (IEC 60747-16-6:2019)

L’IEC 60747-16-6:2019 spécifie la terminologie, les valeurs assignées et caractéristiques essentielles, ainsi que les méthodes de mesure des multiplicateurs hyperfréquences à circuits intégrés.

Polprevodniški elementi - 16-6. del: Mikrovalovna integrirana vezja - Frekvenčni množitelji (IEC 60747-16-6:2019)

Ta standard določa terminologijo, bistvene vrednosti in lastnosti ter merilne metode za frekvenčne množitelje mikrovalovnih integriranih vezij.

General Information

Status
Published
Publication Date
10-Sep-2019
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
02-Sep-2019
Due Date
07-Nov-2019
Completion Date
11-Sep-2019

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SLOVENSKI STANDARD
SIST EN IEC 60747-16-6:2019
01-november-2019
Polprevodniški elementi - 16-6. del: Mikrovalovna integrirana vezja - Frekvenčni
množitelji (IEC 60747-16-6:2019)

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers

(IEC 60747-16-6:2019)
Halbleiterbauelemente - Teil 16-6: Integrierte Mikrowellenschaltkreise -
Frequenzvervielfachung (IEC 60747-16-6:2019)
Dispositifs à semiconducteurs - Partie 16-6: Circuits intégrés hyperfréquences -
Multiplicateurs de fréquence (IEC 60747-16-6:2019)
Ta slovenski standard je istoveten z: EN IEC 60747-16-6:2019
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN IEC 60747-16-6:2019 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 60747-16-6:2019
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SIST EN IEC 60747-16-6:2019
EUROPEAN STANDARD EN IEC 60747-16-6
NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2019
ICS 31.080.99
English Version
Semiconductor devices - Part 16-6: Microwave integrated
circuits - Frequency multipliers
(IEC 60747-16-6:2019)

Dispositifs à semiconducteurs - Partie 16-6: Circuits Halbleiterbauelemente - Teil 16-6: Integrierte

intégrés hyperfréquences - Multiplicateurs de fréquence Mikrowellenschaltkreise - Frequenzvervielfachung

(IEC 60747-16-6:2019) (IEC 60747-16-6:2019)

This European Standard was approved by CENELEC on 2019-07-31. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 60747-16-6:2019 E
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SIST EN IEC 60747-16-6:2019
EN IEC 60747-16-6:2019 (E)
European foreword

The text of document 47E/602/CDV, future edition 1 of IEC 60747-16-6, prepared by SC 47E "Discrete

semiconductor devices" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC

parallel vote and approved by CENELEC as EN IEC 60747-16-6:2019.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2020-04-30

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2022-07-31

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60747-16-6:2019 was approved by CENELEC as a

European Standard without any modification.
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SIST EN IEC 60747-16-6:2019
EN IEC 60747-16-6:2019 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60617 - Graphical symbols for diagrams - -
IEC 60747-1 2006 Semiconductor devices - Part 1: General - -
+ A1 2010 - -
IEC 60747-4 - Semiconductor devices - Discrete devices - - -
Part 4: Microwave diodes and transistors
IEC 60747-16-3 2002 Semiconductor devices - Part 16-3: EN 60747-16-3 2002
Microwave integrated circuits - Frequency
converters
+ A1 2009 + A1 2009
+ A2 2017 + A2 2017
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements

IEC/TR 61340-5-2 - Electrostatics -- Part 5-2: Protection of CLC/TR 61340-5-2 -

electronic devices from electrostatic
phenomena - User guide
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SIST EN IEC 60747-16-6:2019
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SIST EN IEC 60747-16-6:2019
IEC 60747-16-6
Edition 1.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-6: Microwave integrated circuits – Frequency multipliers
Dispositifs à semiconducteurs –
Partie 16-6: Circuits intégrés hyperfréquences – Multiplicateurs de fréquence
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-7081-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 60747-16-6:2019
– 2 – IEC 60747-16-6:2019  IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Essential ratings and characteristics ................................................................................ 8

4.1 General requirements ............................................................................................. 8

4.1.1 Circuit identification and types ......................................................................... 8

4.1.2 General function description ............................................................................ 8

4.1.3 Manufacturing technology ................................................................................ 8

4.1.4 Package identification ...................................................................................... 8

4.2 Application description ............................................................................................ 8

4.2.1 Conformance to system and/or interface information ....................................... 8

4.2.2 Overall block diagram ...................................................................................... 8

4.2.3 Reference data ................................................................................................ 8

4.2.4 Electrical compatibility ..................................................................................... 8

4.2.5 Associated devices .......................................................................................... 9

4.3 Specification of the function .................................................................................... 9

4.3.1 Detailed block diagram – Functional blocks ..................................................... 9

4.3.2 Identification and function of terminals ............................................................. 9

4.3.3 Function description ...................................................................................... 10

4.4 Limiting values (absolute maximum rating system) ................................................ 10

4.4.1 Requirements ................................................................................................ 10

4.4.2 Electrical limiting values ................................................................................ 10

4.4.3 Temperatures ................................................................................................ 11

4.5 Operating conditions (within the specified operating temperature range) ............... 11

4.6 Electrical characteristics ....................................................................................... 12

4.7 Mechanical and environmental ratings, characteristics and data ........................... 12

4.8 Additional information ........................................................................................... 12

5 Measuring methods ....................................................................................................... 13

5.1 General ................................................................................................................. 13

5.1.1 General precautions ...................................................................................... 13

5.1.2 Characteristic impedance .............................................................................. 13

5.1.3 Handling precautions ..................................................................................... 13

5.1.4 Types ............................................................................................................ 13

5.2 Output power (P ) ................................................................................................. 13

5.2.1 Purpose ......................................................................................................... 13

5.2.2 Circuit diagram .............................................................................................. 13

5.2.3 Principle of measurement .............................................................................. 13

5.2.4 Circuit description and requirements .............................................................. 14

5.2.5 Precautions to be observed ........................................................................... 14

5.2.6 Measurement procedure ................................................................................ 14

5.2.7 Specified conditions ....................................................................................... 14

5.3 Conversion gain (G ) ............................................................................................ 14

5.3.1 Purpose ......................................................................................................... 14

5.3.2 Circuit diagram .............................................................................................. 15

5.3.3 Principle of measurement .............................................................................. 15

5.3.4 Circuit description and requirements .............................................................. 15

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IEC 60747-16-6:2019  IEC 2019 – 3 –

5.3.5 Precautions to be observed ........................................................................... 15

5.3.6 Measurement procedure ................................................................................ 15

5.3.7 Specified conditions ....................................................................................... 15

5.4 Input return loss (L ) ..................................................................................... 15

ret(in)

5.4.1 Purpose ......................................................................................................... 15

5.4.2 Circuit diagram .............................................................................................. 15

5.4.3 Principle of measurement .............................................................................. 16

5.4.4 Circuit description and requirements .............................................................. 16

5.4.5 Precautions to be observed ........................................................................... 16

5.4.6 Measurement procedure ................................................................................ 16

5.4.7 Specified conditions ....................................................................................... 17

5.5 Output return loss (L ) ................................................................................ 17

ret(out)

5.5.1 Purpose ......................................................................................................... 17

5.5.2 Circuit diagram .............................................................................................. 17

5.5.3 Principle of measurement .............................................................................. 17

5.5.4 Circuit description and requirements .............................................................. 18

5.5.5 Precautions to be observed ........................................................................... 18

5.5.6 Measurement procedure ................................................................................ 18

5.5.7 Specified conditions ....................................................................................... 18

5.6 Fundamental isolation (P /P ) .............................................................................. 19

o 1

5.6.1 Purpose ......................................................................................................... 19

5.6.2 Circuit diagram .............................................................................................. 19

5.6.3 Principle of measurement .............................................................................. 19

5.6.4 Circuit description and requirements .............................................................. 19

5.6.5 Precautions to be observed ........................................................................... 19

5.6.6 Measurement procedure ................................................................................ 19

5.6.7 Specified conditions ....................................................................................... 20

5.7 n-th order harmonic isolation (P /P ) ................................................................. 20

o nth

5.7.1 Purpose ......................................................................................................... 20

5.7.2 Circuit diagram .............................................................................................. 20

5.7.3 Principle of measurement .............................................................................. 20

5.7.4 Circuit description and requirements .............................................................. 20

5.7.5 Precautions to be observed ........................................................................... 20

5.7.6 Measurement procedure ................................................................................ 20

5.7.7 Specified conditions ....................................................................................... 21

5.8 Phase noise (L (f)) ................................................................................................ 21

5.8.1 Purpose ......................................................................................................... 21

5.8.2 Measuring methods ....................................................................................... 21

Figure 1 – Circuit diagram for the measurement of the output power ..................................... 13

Figure 2 – Circuit diagram for the measurement of the input return loss ................................ 16

Figure 3 – Circuit diagram for the measurement of the output return loss .............................. 17

Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 1) ............. 22

Figure 5 – Circuit diagram for the measurement of the phase noise L (f) (method 2) ............. 23

Figure 6 – Circuit diagram for the measurement of the phase noise L (f) (method 3) ............. 24

Table 1 – Comparison of phase noise measuring methods .................................................... 21

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SIST EN IEC 60747-16-6:2019
– 4 – IEC 60747-16-6:2019  IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-6: Microwave integrated circuits –
Frequency multipliers
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60747-16-6 has been prepared by subcommittee 47E: Discrete

semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
CDV Report on voting
47E/602/CDV 47E/622A/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.
The French version of this standard has not been voted upon.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN IEC 60747-16-6:2019
IEC 60747-16-6:2019  IEC 2019 – 5 –

A list of all parts in the IEC 60747 series, published under the general title Semiconductor

devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SIST EN IEC 60747-16-6:2019
– 6 – IEC 60747-16-6:2019  IEC 2019
SEMICONDUCTOR DEVICES –
Part 16-6: Microwave integrated circuits –
Frequency multipliers
1 Scope

This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and

measuring methods of microwave integrated circuit frequency multipliers.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 60617, Graphical symbols for diagrams (available at http://std.iec.ch/iec60617>)

IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-1:2006/AMD 1:2010

IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave diodes and

transistors

IEC 60747-16-3:2002, Semiconductor devices – Part 16-3: Microwave integrated circuits –

Frequency converters
IEC 60747-16-3:2002/AMD 1:2009
IEC 60747-16-3:2002/AMD 2:2017

IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic

phenomena – General requirements

IEC TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from

electrostatic phenomena – User guide
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
output frequency

frequency which equals the input frequency multiplied by the multiplying factor N, where N is

an integer
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SIST EN IEC 60747-16-6:2019
IEC 60747-16-6:2019  IEC 2019 – 7 –
3.2
output power
RF power measured at the output port at the output frequency
3.3
conversion gain
ratio of the output power to the input power
3.4
input return loss
ret(in)

ratio of the incident power at the input port to the reflected power at the input port

3.5
output return loss
ret(out)

ratio of the incident power at the output port to the reflected power at the output port

3.6
fundamental isolation
P /P
o 1

ratio of the output power to the power of fundamental component at the input frequency at the

output port
3.7
n-th order harmonic isolation
o nth

ratio of the output power to the power of the n-th order harmonic component at the output port

3.8
phase noise
L (f)
frequency-domain measure of the short-term frequency stability of an output

Note 1 to entry: This phase noise is normally expressed as the power spectral density of the phase fluctuations,

S (f), where the phase fluctuation function is φ(t) = 2πFt − 2πF t. The spectral density of phase fluctuation can be

φ 0

directly related to the spectral density of frequency fluctuation by the following formula:

F
Sf = S f rad /Hz
( ) ( )
φ  y
where
F is the output frequency;
F is the average output frequency;
f is the Fourier frequency.
Note 2 to entry: L (f) is pronounced "script-ell of f".

[SOURCE: IEC 60050-561:2014, 561-03-22, modified – A symbol and Note 2 to entry have

been added. "Oscillator" has been replaced by "output."]
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SIST EN IEC 60747-16-6:2019
– 8 – IEC 60747-16-6:2019  IEC 2019
4 Essential ratings and characteristics
4.1 General requirements
4.1.1 Circuit identification and types

The identification of type (device name), the category of circuit and technology applied shall

be given.
Microwave frequency multipliers comprise one category.
4.1.2 General function description

A general description of the function performed by the integrated circuit microwave frequency

multipliers and the features for the application shall be made.
4.1.3 Manufacturing technology

The manufacturing technology, for example semiconductor monolithic integrated circuit, thin

film integrated circuit, micro-assembly. shall be stated. This statement shall include details of

the semiconductor technologies such as Schottky-barrier diode, metal-semi-conductor-field-

effect-transistor (MESFET), Si bipolar transistor.

IEC 60747-4 shall be referred to for terminology and letter symbols, essential ratings and

characteristics and measuring methods of such microwave devices.
4.1.4 Package identification
The following statements shall be made:
a) chip or packaged form;

b) IEC and/or national reference number of the outline drawing, or drawing of non-standard

package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
4.2 Application description
4.2.1 Conformance to system and/or interface information

It should be stated whether the integrated circuit conforms to an application system and/or an

interface standard or a recommendation.

Detailed information concerning application systems, equipment and circuits such as very

small aperture terminal (VSAT) systems, broadcasting satellite (BS) receivers, microwave

landing systems should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data

The most important properties that permit comparison between derivative types should be

given.
4.2.4 Electrical compatibility

It should be stated whether the integrated circuit is electrically compatible with other particular

integrated circuits, or families of integrated circuits, or whether special interfaces are required.

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SIST EN IEC 60747-16-6:2019
IEC 60747-16-6:2019  IEC 2019 – 9 –

Details should be given concerning the type of input and output circuits, for example

input/output impedances, DC block, open-drain. Interchangeability with other devices, if any,

should also be given.
4.2.5 Associated devices
If applicable, the following should be stated:

– devices necessary for correct operation (list with type number, name and function);

– peripheral devices with direct interfacing (list with type number, name and function).

4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks

A detail block diagram or equivalent circuit information of the integrated circuit microwave

frequency multipliers shall be given. The block diagram shall be composed of the following:

a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.

The block diagram shall identify the function of each external connection and, where no

ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has

metallic parts, any connection to them from external terminals shall be indicated. The

connections with any associated external electrical elements shall be stated, where necessary.

As additional information, the complete electrica
...

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