SIST EN 60749-21:2011

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 21: Brasabilité

La CEI 60749-21:2011 établit une procédure normalisée pour déterminer la brasabilité des sorties des boîtiers de dispositifs qui sont destinées à être fixées sur une autre surface en utilisant de la brasure étain-plomb (SnPb) ou sans-plomb pour réaliser cette fixation. Cette méthode d'essai décrit une procédure pour les essais de brasabilité par 'immersion puis examen visuel' des dispositifs à montage en surface (CMS) par trous traversants, axial et en surface, ainsi qu'une procédure optionnelle d'essai de brasabilité pour des CMS pour montage en surface sur carte afin de permettre la simulation du processus de brasage devant être utilisé dans l'application du dispositif. La méthode d'essai fournit également des conditions optionnelles pour le vieillissement. Cet essai est considéré comme destructif sauf indication contraire dans la spécification applicable.
NOTE 1 Cette méthode d'essai est en accord général avec la CEI 60068, mais c'est le texte ci-dessous qui s'applique compte tenu des exigences spécifiques que présentent les semiconducteurs.
NOTE 2 Cette méthode d'essai ne prend pas en compte l'effet des contraintes thermiques qui peuvent se produire pendant la procédure de brasage. Il convient de faire référence à la CEI 60749-15 ou à la CEI 60749-20.
La présente norme annule et remplace la première édition publiée en 2004 et constitue une révision technique. La modification importante qui a été apportée est l'ajout de la compatibilité descendante de la brasure sans plomb (Pb).

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 21. del: Spajkljivost

Ta del IEC 60749 vzpostavlja standardni postopek za določanje spajkljivosti končnikov paketa elementov, ki se združujejo na drugo površino z uporabo kositrovo-svinčene (SnPb) ali nesvinčene (brez Pb) spajke za pritrditev. Ta preskusna metoda zagotavlja postopek za preskušanje spajkljivosti s »potapljanjem in opazovanjem« skozi luknje, osno in površinsko nameščenih elementov (SMD) ter izbirni postopek za preskus spajkljivosti s priklopom na ploščo za SMD, ki omogoča simulacijo spajkalnega postopka pri uporabi elementov. Preskusna metoda podaja tudi optimalne pogoje za staranje. Ta preskus velja za porušitvenega, razen če je v ustrezni specifikaciji navedeno drugače.

General Information

• Status: Published
• Publication Date: 14-Sep-2011
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 07-Sep-2011
• Due Date: 12-Nov-2011
• Completion Date: 15-Sep-2011
• Ref Project: EN 60749-21:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Relations

• Revised: SIST EN 60749-21:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability
• Effective Date: 05-Feb-2010
• Replaces: SIST EN 60749-21:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability
• Effective Date: 29-Jan-2023
• Revised: SIST EN 60749-21:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability
• Effective Date: 06-May-2014

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-21:2011
01-oktober-2011
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 21. del:
Spajkljivost
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
21: Brasabilité
Ta slovenski standard je istoveten z: EN 60749-21:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-21:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-21:2011

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SIST EN 60749-21:2011

EUROPEAN STANDARD
EN 60749-21
NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM

ICS 31.080.01 Supersedes EN 60749-21:2005


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 21: Solderability
(IEC 60749-21:2011)


Dispositifs à semiconducteur - Halbleiterbauelemente -
Méthodes d'essai mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 21: Brasabilité Teil 21: Lötbarkeit
(CEI 60749-21:2011) (IEC 60749-21:2011)





This European Standard was approved by CENELEC on 2011-05-12. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-21:2011 E

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SIST EN 60749-21:2011
EN 60749-21:2011 - 2 -

Foreword
The text of document 47/2082/FDIS, future edition 2 of IEC 60749-21, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-21 on 2011-05-12.
This European Standard supersedes EN 60749-21:2005.
EN 60749-21:2011 cancels and replaces EN 60749-21:2005 and constitutes a technical revision. The
significant change is the inclusion of Pb (lead)–free backward compatibility.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-02-12
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-05-12
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-21:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068 series NOTE  Harmonized in EN 60068 series.
IEC 60068-2-69:2007 NOTE  Harmonized as EN 60068-2-69:2007 (not modified).
IEC 60749 series NOTE  Harmonized in EN 60749 series.
IEC 60749-15:2003 NOTE  Harmonized as EN 60749-15:2003 (not modified).
IEC 60749-20:2008 NOTE  Harmonized as EN 60749-20:2009 (not modified).
__________

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SIST EN 60749-21:2011
- 3 - EN 60749-21:2011
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 61190-1-2 2007 Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics
assembly


IEC 61190-1-3 2007 Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

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SIST EN 60749-21:2011

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SIST EN 60749-21:2011
IEC 60749-21
®

Edition 2.0 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Semiconductor devices – Mechanical and climatic test methods –
Part 21: Solderability

Dispositifs à semiconducteur – Méthodes d’essai mécaniques et climatiques –
Partie 21: Brasabilité


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX S
ICS 31.080.01 ISBN 978-2-88912-433-6

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 60749-21:2011
– 2 – 60749-21  IEC:2011
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Test apparatus . 6
3.1 Solder bath. 6
3.2 Dipping device. 6
3.3 Optical equipment . 7
3.4 Steam ageing equipment . 7
3.5 Lighting equipment . 7
3.6 Materials . 7
3.6.1 Flux . 7
3.6.2 Solder . 7
3.7 SMD reflow equipment . 8
3.7.1 Stencil or screen . 8
3.7.2 Rubber squeegee or metal spatula . 8
3.7.3 Test substrate . 8
3.7.4 Solder paste . 9
3.7.5 Reflow equipment . 9
3.7.6 Flux removal solvent . 9
4 Procedure . 9
4.1 Lead-free backward compatibility . 9
4.2 Preconditioning . 10
4.2.1 General . 10
4.2.2 Preconditioning by steam ageing . 10
4.2.3 Preconditioning by high temperature storage . 11
4.3 Procedure for dip and look solderability testing . 11
4.3.1 General . 11
4.3.2 Solder dip conditions . 11
4.3.3 Procedure . 11
4.4 Procedure for simulated board mounting reflow solderability testing of SMDs . 19
4.4.1 General . 19
4.4.2 Test equipment set-up . 19
4.4.3 Specimen preparation and surface condition . 20
4.4.4 Visual inspection . 21
5 Summary . 21
Bibliography . 22

Figure 1 – Areas to be inspected for gullwing packages . 15
Figure 2 – Areas to be inspected for J-lead packages . 16
Figure 3 – Areas to be inspected in rectangular components (SMD method) . 17
Figure 4 – Areas to be inspected in SOIC and QFP packages (SMD method) . 18
Figure 5 – Flat peak type reflow profile . 20

Table 1 – Steam ageing conditions . 10
Table 2 – Altitude versus steam temperature . 10

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SIST EN 60749-21:2011
60749-21  IEC:2011 – 3 –
Table 3 – Solder dip test conditions . 11
Table 4 – Maximum limits of solder bath contaminant . 13

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SIST EN 60749-21:2011
– 4 – 60749-21  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 21: Solderability


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-21 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard cancels and replaces the first edition published in 2004 and constitutes a
technical revision. The significant change is the inclusion of Pb (lead)–free backward
compatibility.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2082/FDIS 47/2089/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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SIST EN 60749-21:2011
60749-21  IEC:2011 – 5 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 60749-21:2011
– 6 – 60749-21  IEC:2011
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 21: Solderability



1 Scope
This part of IEC 60749 establishes a standard procedure for determining the solderability of
device package terminations that are intended to be joined to another surface using tin-lead
(SnPb) or lead-free (Pb-free) solder for the attachment.
This test method provides a procedure for ‘dip and look’ solderability testing of through hole,
axial and surface mount devices (SMDs) as well as an optional procedure for a board
mounting solderability test for SMDs for the purpose of allowing simulation of the soldering
process to be used in the device application. The test method also provides optional
conditions for ageing.
This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors,
the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering
process. Reference should be made IEC 60749-15 or IEC 60749-20.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61190-1-2:2007, Attachment materials for electronic assembly – Part 1-2: Requirements
for soldering pastes for high-quality interconnects in electronics assembly
IEC 61190-1-3:2007, Attachment materials for electronic assembly – Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic
soldering applications
3 Test apparatus
This test method requires the following equipment.
3.1 Solder bath
The solder bath shall be not less than 40 mm in depth and not less than 300 ml in volume
such that it can contain at least 1 kg of solder. The apparatus shall be capable of maintaining
the solder at the specified temperature within ±5 °C.
3.2 Dipping device
A mechanical dipping device capable of controlling the rates of immersion and emersion of
the terminations and providing a dwell time (time of total immersion to the required depth) in
the solder bath as specified shall be used.

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SIST EN 60749-21:2011
60749-21  IEC:2011 – 7 –
3.3 Optical equipment
An optical microscope capable of providing magnification inspection from 10× to 20× shall be
used.
3.4 Steam ageing equipment
A non-corrodible container and cover of sufficient size to allow the placement of specimens
inside the vessel shall be used. The specimens shall be placed such that the lowest portion of
the specimen is a minimum of 40 mm above the surface of the water. A suitable method of
supporting the specimens shall be improvised using non-contaminating material.
NOTE During steam ageing, the test devices should be located in a manner so as to prevent water (steam
condensate) from dripping on them.
3.5 Lighting equipment
A lighting system shall be used that will provide a uniform, non-glare, non-directional
illumination of the specimen.
3.6 Materials
3.6.1 Flux
Unless otherwise detailed in the relevant specification, the flux shall be a standard activated
rosin flux (type ROL1 in accordance with IEC 61190-1-3 (2007), Table 2, Flux type and
designating symbols) having a composition of 25 % ± 0,5 % by weight of colophony and
0,15 % ± 0,01 % by weight diethylammonium hydrochloride, in 74,85 % ± 0,5 % by weight of
in 2-propanol (isopropanol). The specific gravity of the standard activated rosin flux shall be
0,843 ± 0,005 at 25 °C ± 2 °C.
The specification shall be as follows:
Colophony
Colour To WW colour specification or paler
Acid value (mg KOH/g colophony) 155 (minimum)
Softening point (ball and ring) 70 °C (minimum)
Flow point (Ubbelohde) 76 °C (minimum)
Ash 0,05 % (maximum)
Solubility A solution of the colophony in an equal part by weight
of 2-propanol (isopropanol) shall be clear, and after a
week at room temperature there shall be no sign of a
deposit.
2-propanol (isopropanol)
Purity Minimum 99,5 % 2-propanol (isopropanol) by weight
Acidity as acetic acid Maximum 0,002 % weight (other than carbon dioxide)
Non-volatile matter Maximum 2 mg per 100 ml.
3.6.2 Solder
3.6.2.1 Tin-lead
Unless otherwise detailed in the relevant specification, the solder specification for SnPb shall
be as follows:
Chemical composition

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SIST EN 60749-21:2011
– 8 – 60749-21  IEC:2011
The composition in percentage by weight shall be as follows:
Tin 59 % to 61 %
Antimony 0,5 % maximum
Copper 0,1 % maximum
Arsenic 0,05 % maximum
Iron 0,02 % maximum
Lead the remainder.
The solder shall not contain such impurities as aluminium, zinc or cadmium in amounts which
will adversely affect the properties of the solder.
Melting temperature range
The melting temperature range of the 60 % solder is as follows:
Completely solid 183 °C
Completely liquid 188 °C.
3.
...