SIST EN IEC 63287-2:2023

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023)

This part of IEC 63287 gives guidelines for the development of reliability qualification plans
using the concept of mission profile, based on the environmental conditioning and proposed
usage of the product. This document is not intended for military- and space-related applications.

Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des Einsatzprofils (IEC 63287-2:2023)

Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification de la fiabilité - Partie 2: Concept de profil de mission (IEC 63287-2:2023)

L’IEC 63287-2:2023 fournit des lignes directrices pour l'élaboration de plans de qualification de la fiabilité à l’aide du concept de profil de mission, sur la base des conditions environnementales et de l’utilisation prévue du produit. Le présent document n’est pas destiné aux applications militaires et spatiales.

Polprevodniški elementi - Smernice za načrtovanje ocenjevanja zanesljivosti - 2. del: Koncept profila namembnosti (IEC 63287-2:2023)

Ta del standarda IEC 63287 določa smernice za načrtovanje ocenjevanja zanesljivosti z uporabo koncepta profila namembnosti na podlagi okoljskega kondicioniranja in predlagane uporabe izdelka. Ta dokument ni namenjen za vojaško uporabo in uporabo v vesolju.

General Information

• Status: Published
• Publication Date: 28-May-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 17-May-2023
• Due Date: 22-Jul-2023
• Completion Date: 29-May-2023
• Ref Project: EN IEC 63287-2:2023 - Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 63287-2:2023
01-julij-2023
Polprevodniški elementi - Smernice za načrtovanje ocenjevanja zanesljivosti - 2.
del: Koncept profila namembnosti (IEC 63287-2:2023)
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of
mission profile (IEC 63287-2:2023)
Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2:
Konzept des Einsatzprofils (IEC 63287-2:2023)
Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification
de la fiabilité - Partie 2: Concept de profil de mission (IEC 63287-2:2023)
Ta slovenski standard je istoveten z: EN IEC 63287-2:2023
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 63287-2:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 63287-2:2023

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SIST EN IEC 63287-2:2023


EUROPEAN STANDARD EN IEC 63287-2

NORME EUROPÉENNE

EUROPÄISCHE NORM May 2023
ICS 31.080.01

English Version
Semiconductor devices - Guidelines for reliability qualification
plans - Part 2: Concept of mission profile
(IEC 63287-2:2023)
Dispositifs à semiconducteurs - Lignes directrices Halbleiterbauelemente - Richtlinien für
concernant les plans de qualification de la fiabilité - Partie 2: Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des
Concept de profil de mission Einsatzprofils
(IEC 63287-2:2023) (IEC 63287-2:2023)
This European Standard was approved by CENELEC on 2023-05-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 63287-2:2023 E

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SIST EN IEC 63287-2:2023
EN IEC 63287-2:2023 (E)
European foreword
The text of document 47/2796/FDIS, future edition 1 of IEC 63287-2, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63287-2:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-02-03
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-05-03
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document is read in conjunction with EN IEC 63287-1.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63287-2:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60068-2-1 NOTE Approved as EN 60068-2-1
IEC 60068-2-30 NOTE Approved as EN 60068-2-30
IEC 60749-11 NOTE Approved as EN 60749-11
2

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SIST EN IEC 63287-2:2023
EN IEC 63287-2:2023 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 63287-1 2021 Semiconductor devices - Generic EN IEC 63287-1 2021
semiconductor qualification guidelines -
Part 1: Guidelines for IC reliability
qualification

3

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SIST EN IEC 63287-2:2023




IEC 63287-2

®


Edition 1.0 2023-03




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Semiconductor devices – Guidelines for reliability qualification plans –

Part 2: Concept of mission profile



Dispositifs à semiconducteurs – Lignes directrices concernant les plans de

qualification de la fiabilité –

Partie 2: Concept de profil de mission














INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE





ICS 31.080.01  ISBN 978-2-8322-6708-0




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 63287-2:2023
– 2 – IEC 63287-2:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Mission profile . 5
4.1 Concept of mission profile . 5
4.2 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (1) . 6
4.3 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (2) . 8
4.4 Example of reliability test plan considering the mission profile of automotive
cabin peripherals application . 9
5 Calculation examples of mission profiles (Calculation of sample and test time of
life tests) . 10
Bibliography . 15

Figure 1 – Example of mission profile for automotive application . 6

Table 1 – Trial calculation example of equivalent time under operating life test based
on consideration of the mission profile (automotive application in the engine
peripheral) . 7
Table 2 – Trial calculation example of number of samples/test time of operating life
test with consideration of the mission profile (Automotive application in the engine
peripheral) . 7
Table 3 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the engine peripheral) . 8
Table 4 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (Automotive application in the engine peripheral) . 9
Table 5 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the cabin peripheral) . 9
Table 6 – Trial calculation example of number of samples/test time of high temperature
operating life test with consideration of the mission profile (Automotive application in
the cabin peripheral) . 10
Table 7 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 11
Table 8 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 13

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SIST EN IEC 63287-2:2023
IEC 63287-2:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
GUIDELINES FOR RELIABILITY QUALIFICATION PLANS –

Part 2: Concept of mission profile

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 63287 Part 2 has been prepared by IEC technical committee 47: Semiconductor devices.
It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2796/FDIS 47/2803/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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SIST EN IEC 63287-2:2023
– 4 – IEC 63287-2:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
This International Standard is to be read in conjunction with IEC 63287-1.
A list of all parts in the IEC 63287 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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SIST EN IEC 63287-2:2023
IEC 63287-2:2023 © IEC 2023 – 5 –
SEMICONDUCTOR DEVICES –
GUIDELINES FOR RELIABILITY QUALIFICATION PLANS –

Part 2: Concept of mission profile



1 Scope
This part of IEC 63287 gives guidelines for the development of reliability qualification plans
using the concept of mission profile, based on the environmental conditioning and proposed
usage of the product. This document is not intended for military- and space-related applications.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 63287-1:2021, Semiconductor devices – Generic semiconductor qualification guidelines –
Part 1: Guidelines for IC reliability qualification
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
failure mode
style classification of a fault phenomenon which causes product failure
Note 1 to entry: Disconnection, a short circuit, occasional loss, abrasion, characteristic deterioration, etc. are typical
items considered as failure modes.
4 Mission profile
4.1 Concept of mission profile
In designing the reliability test plan, the test plan greatly changes depending on how the
environmental conditions of the LSI is assumed. For example, in the case of electronic units for
automotive application installed in the vicinity of the engine, operational temperature gradually
rises by the heat generated by the engine but the temperature decreases after the engine stops,
meaning that the unit is not always subjected to sever temperature conditions. The set of
changing environmental temperature conditions and their time ratio is called the “mission
profile”. Because mission profile depends on multiple factors such as operational duty of LSI,
installation environment, generation of heat by peripheral parts, etc., it cannot be
unconditionally standardized. Therefore, it is important to agree the mission profile between the
LSI vendor and the user and decide on accurate test conditions.

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SIST EN IEC 63287-2:2023
– 6 – IEC 63287-2:2023 © IEC 2023
Figure 1 shows an example of mission profile, with the ambient temperature and the estimated
hours of operation at that temperature differing between installation around the engine and
around the cabin for cases of automotive application with an estimated lifetime of 15 years
(7 500 operational hours). A design method for the reliability test plan using the mission profile
shown in Figure 1 is giv
...