Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (IEC 62435-4:2018)

This part of IEC 62435 specifies long-term storage methods and recommended conditions for
long-term storage of electronic components including logistics, controls and security related to
the storage facility. Long-term storage refers to a duration that may be more than 12 months
for products scheduled for long duration storage. The philosophy of such storage, good
working practices and general means to facilitate the successful long-term storage of
electronic components are also addressed.

Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 4: Lagerung

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Part 4: Stockage

L’IEC 62435-4:2018 spécifie les méthodes de stockage de longue durée et les conditions recommandées pour le stockage de longue durée de composants électroniques comprenant les logistiques, les contrôles et la sécurité de l’installation de stockage. Le stockage de longue durée fait référence à une durée qui peut être supérieure à 12 mois, pour des produits destinés à être stockés pendant une durée prolongée. Les concepts d’un tel stockage, les bonnes pratiques et les moyens généraux de nature à faciliter la réussite d’un stockage de longue durée de composants électroniques sont aussi abordés.

Elektronske komponente - Dolgoročno skladiščenje elektronskih polprevodniških elementov - 4. del: Skladiščenje (IEC 62435-4:2018)

Ta del standarda IEC 62435 določa metode dolgoročnega skladiščenja elektronskih komponent in priporočene pogoje za dolgoročno skladiščenje elektronskih komponent, vključno z logistiko, kontrolo in varnostjo v skladišču. Dolgoročno skladiščenje se nanaša na obdobje, ki je lahko daljše od 12 mesecev, za izdelke, namenjene za dolgoročno skladiščenje. Obravnavana so tudi načela takega skladiščenja, dobra delovna praksa in splošna sredstva za lažjo uspešno dolgoročno skladiščenje elektronskih komponent.

General Information

Status
Published
Public Enquiry End Date
31-Aug-2017
Publication Date
06-Sep-2018
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
22-Aug-2018
Due Date
27-Oct-2018
Completion Date
07-Sep-2018

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SLOVENSKI STANDARD
SIST EN IEC 62435-4:2018
01-oktober-2018
(OHNWURQVNHNRPSRQHQWH'ROJRURþQRVNODGLãþHQMHHOHNWURQVNLKSROSUHYRGQLãNLK
HOHPHQWRYGHO6NODGLãþHQMH ,(&

Electronic components - Long-term storage of electronic semiconductor devices - Part 4:

Storage (IEC 62435-4:2018)
Ta slovenski standard je istoveten z: EN IEC 62435-4:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 62435-4:2018 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62435-4:2018
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SIST EN IEC 62435-4:2018
EUROPEAN STANDARD EN IEC 62435-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2018
ICS 31.020
English Version
Electronic components - Long-term storage of electronic
semiconductor devices - Part 4: Storage
(IEC 62435-4:2018)

Composants électroniques - Stockage de longue durée des Elektronische Bauteile - Langzeitlagerung elektronischer

dispositifs électroniques à semiconducteurs - Part 4: Halbleiterbauelemente - Teil 4: Lagerung

Stockage (IEC 62435-4:2018)
(IEC 62435-4:2018)

This European Standard was approved by CENELEC on 2018-07-10. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62435-4:2018 E
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SIST EN IEC 62435-4:2018
EN IEC 62435-4:2018 (E)
European foreword

The text of document 47/2469/FDIS, future edition 1 of IEC 62435-4, prepared by IEC/TC 47

"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 62435-4:2018.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2019-04-10

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2021-07-10

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such

patent rights.
Endorsement notice

The text of the International Standard IEC 62435-4:2018 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 60068-2-17 NOTE Harmonized as EN 60068-2-17
IEC 60721-3-1 NOTE Harmonized as EN IEC 60721-3-1
IEC 60749-30 NOTE Harmonized as EN 60749-30
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1
IEC 61340-5-3 NOTE Harmonized as EN 61340-5-3
IEC 61760-2 NOTE Harmonized as EN 61760-2
IEC 62258 series NOTE Harmonized as EN 62258 series
IEC 62435 series NOTE Harmonized as EN 62435 series
IEC 62435-2 NOTE Harmonized as EN 62435-2
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SIST EN IEC 62435-4:2018
EN IEC 62435-4:2018 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is

available here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-20-1 - Semiconductor devices - Mechanical and EN 60749-20-1 -
climatic test methods - Part 20-1: Handling,
packing, labelling and shipping of surface-
mount devices sensitive to the combined
effect of moisture and soldering heat

IEC/TR 61340-5-2 - Electrostatics -- Part 5-2: Protection of CLC/TR 61340-5-2 -

electronic devices from electrostatic
phenomena - User guide
IEC/TR 62258-3 - Semiconductor die products -- Part 3: - -
Recommendations for good practice in
handling, packing and storage
JEDEC J-STD-033 - Standard for handling, packing, shipping,
and use of moisture/reflow sensitive
surface mount devices
MIL-PRF-27401 - Propellant pressurizing agent nitrogen
MIL-PRF-81705 - ESD Materials, Bags and Performance
Specification
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SIST EN IEC 62435-4:2018
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SIST EN IEC 62435-4:2018
IEC 62435-4
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
Electronic components – Long-term storage of electronic semiconductor
devices –
Part 4: Storage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020 ISBN 978-2-8322-5768-5

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
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SIST EN IEC 62435-4:2018
– 2 – IEC 62435-4:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 8

2 Normative references ...................................................................................................... 8

3 Terms and definitions ...................................................................................................... 8

4 Purpose of storage (facility) ........................................................................................... 10

4.1 General ................................................................................................................. 10

4.2 Cost of ownership ................................................................................................. 10

4.3 Security ................................................................................................................ 10

4.4 Location and ambient environment ........................................................................ 10

4.5 Incorrect control of reliability during storage .......................................................... 10

5 Storage ......................................................................................................................... 10

5.1 General ................................................................................................................. 10

5.2 Type of environment ............................................................................................. 11

5.3 Storage identification – traceability ....................................................................... 11

5.4 Initial packaging .................................................................................................... 11

5.5 Storage conditions ................................................................................................ 12

5.5.1 General ......................................................................................................... 12

5.5.2 Storage area .................................................................................................. 12

5.6 Maintaining storage conditions .............................................................................. 13

6 Periodic check of the components ................................................................................. 13

6.1 Objectives ............................................................................................................. 13

6.2 Periodicity ............................................................................................................. 13

6.3 Tests during periodic check .................................................................................. 14

7 Removal from storage ................................................................................................... 14

7.1 Precautions ........................................................................................................... 14

7.2 Electrostatic discharges ........................................................................................ 14

8 Materials used in storage regimes ................................................................................. 14

8.1 General ................................................................................................................. 14

8.2 Moisture barrier bags (MBB) ................................................................................. 14

8.3 Desiccant .............................................................................................................. 15

8.4 Humidity indicator card (HIC) ................................................................................ 15

8.5 Dry nitrogen atmosphere ....................................................................................... 15

8.6 High purity dry air atmosphere .............................................................................. 15

8.7 Storage containers ................................................................................................ 16

8.8 Foams, packing material and protective cushioning .............................................. 16

9 General storage environment ......................................................................................... 16

10 LTS methods ................................................................................................................. 16

10.1 General ................................................................................................................. 16

10.2 Dry cabinet storage ............................................................................................... 17

10.2.1 General ......................................................................................................... 17

10.2.2 Humidity controlled storage ........................................................................... 17

10.2.3 Oxygen (O )-controlled storage ..................................................................... 17

10.2.4 Outgassing-controlled storage ....................................................................... 17

10.3 MBB storage ......................................................................................................... 17

10.3.1 General ......................................................................................................... 17

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10.3.2 Humidity-controlled storage ........................................................................... 17

10.3.3 Oxygen (O )-voided storage .......................................................................... 17

10.3.4 Outgassing controlled storage ....................................................................... 18

10.3.5 Nitrogen (N ) positive-pressure MBB storage ................................................ 18

11 LTS double containment redundancy ............................................................................. 18

Annex A (normative) Example checklist for long-term storage facilities ................................ 19

Bibliography .......................................................................................................................... 20

Table A.1 – Example checklist for storage facilities ............................................................... 19

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –
Part 4: Storage
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62435-4 has been prepared by IEC technical committee 47:

Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2469/FDIS 47/2486/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN IEC 62435-4:2018
IEC 62435-4:2018 © IEC 2018 – 5 –

A list of all parts in the IEC 62435 series, published under the general title Electronic

components – Long-term storage of electronic semiconductor devices, can be found on the

IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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SIST EN IEC 62435-4:2018
– 6 – IEC 62435-4:2018 © IEC 2018
INTRODUCTION
This standard applies to the long-term storage of electronic components.

This is a standard for long-term storage (LTS) of electronic devices drawing on the best long-

term storage practices currently known. For the purposes of this document, LTS is defined as

any device storage whose duration may be more than 12 months for products scheduled for

long duration storage. While intended to address the storage of unpackaged semiconductors

and packaged electronic devices, nothing in this document precludes the storage of other

items under the storage levels defined herein.

Although it has always existed to some extent, obsolescence of electronic components and

particularly of integrated circuits, has become increasingly intense over the last few years.

Indeed, with the existing technological boom, the commercial life of a component has become

very short compared with the life of industrial equipment such as that encountered in the

aeronautical field, the railway industry or the energy sector.

The many solutions enabling obsolescence to be resolved are now identified. However,

selection of one of these solutions should be preceded by a case-by-case technical and

economic feasibility study, depending on whether storage is envisaged for field service or

production, for example:
• remedial storage as soon as components are no longer marketed;
• preventative storage anticipating declaration of obsolescence.

Taking into account the expected life of some installations, sometimes covering several

decades, the qualification times and the unavailability costs, which can also be very high, the

solution to be adopted to resolve obsolescence should often be rapidly implemented. This is

why the solution retained in most cases consists in systematically storing components which

are in the process of becoming obsolescent.

The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery

of the implemented process and especially of the storage environment, although this mastery

becomes critical when it comes to long-term storage.

All handling, protection, storage and test operations are recommended to be performed

according to the state of the art.

The application of the approach proposed in this document in no way guarantees that the

stored components are in perfect operating condition at the end of this storage. It only

comprises a means of minimizing potential and probable degradation factors.

Some electronic device users have the need to store electronic devices for long periods of

time. Lifetime buys are commonly made to support production runs of assemblies that well

exceed the production timeframe of their individual parts. This puts the user in a situation

requiring careful and adequate storage of such parts to maintain the as-received solderability

and to minimize any degradation effects to the part over time. Major degradation concerns are

moisture, electrostatic fields, ultra-violet light, large variations in temperature, air-borne

contaminants and outgassing.

Warranties and sparing also present a challenge for the user or repair agency, as some

systems have been designated to be used for long periods of time, in some cases for up to

40 years or more. Some of the devices needed for repair of these systems will not be

available from the original supplier for the lifetime of the system, or the spare assembly can

be built with the original production run but then require long-term storage. This document

was developed to provide a standard for storing electronic devices for long periods of time.

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SIST EN IEC 62435-4:2018
IEC 62435-4:2018 © IEC 2018 – 7 –

The storage of devices that are moisture sensitive but that do not need to be stored for long

periods of time is dealt with in IEC TR 62258-3.

Long-term storage assumes that the device is going to be placed in uninterrupted storage for

a number of years. It is essential that it be useable after storage. It is important that storage

media and the local environment are considered together.

These guidelines do not imply any warranty of product or guarantee of operation beyond the

storage time given by the manufacturer.

The IEC 62435 series is intended to ensure that adequate reliability is achieved for devices in

user applications after long-term storage. Users are encouraged to request data from

suppliers to applicable specifications to demonstrate a successful storage life as requested by

the user. These standards are not intended to address built-in failure mechanisms that would

take place regardless of storage conditions.

These standards are intended to give practical guidance on methods of long-duration storage

of electronic components, where this is intentional or involves planned storage of a product

for a number of years. Storage regimes for work-in-progress production are managed

according to company internal process requirements and are not detailed in this series of

standards.

The overall standard series is split into a number of parts. Parts 1 to 4 apply to any long-term

storage and contain general requirements and guidance, whereas Parts 5 to 9 are specific to

the type of product being stored.

Electronic components requiring different storage conditions are covered separately starting

with Part 5.

The structure of the IEC 62435 series as currently planned consists of the following:

Part 1 – General
Part 2 – Deterioration mechanisms
Part 3 – Data
Part 4 – Storage
Part 5 – Die and wafer devices
Part 6 – Packaged or finished devices
Part 7 – MEMS
Part 8 – Passive electronic devices
Part 9 – Special cases
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SIST EN IEC 62435-4:2018
– 8 – IEC 62435-4:2018 © IEC 2018
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –
Part 4: Storage
1 Scope

This part of IEC 62435 specifies long-term storage methods and recommended conditions for

long-term storage of electronic components including logistics, controls and security related to

the storage facility. Long-term storage refers to a duration that may be more than 12 months

for products scheduled for long duration storage. The philosophy of such storage, good

working practices and general means to facilitate the successful long-term storage of

electronic components are also addressed.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 60749-20-1, Semiconductor devices – Mechanical and climatic test methods – Part 20-1:

Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined

effect of moisture and soldering heat

IEC TR 62258-3, Semiconductor die products – Part 3: Recommendations for good practice in

handling, packing and storage

IEC 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic

phenomena – User guide

JEDEC J-STD-033, Standard for handling, packing, shipping, and use of moisture/reflow

sensitive surface mount devices
MIL-PRF-27401, Propellant pressurizing agent nitrogen
MIL-PRF-81705, ESD Materials, Bags and Performance Specification
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
storage environment

specially controlled storage area, with particular control of temperature, humidity, atmosphere

and any other conditions depending on the product requirements
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SIST EN IEC 62435-4:2018
IEC 62435-4:2018 © IEC 2018 – 9 –
3.2
moisture sensitivity level
MSL

rated and verified moisture sensitivity level assigned to a component that defines the

maximum safe equilibrium moisture exposure for a specific encapsulated device prior to

reflow assembly or rework
3.3
long-term storage
LTS

planned storage of components to extend the life-cycle for a duration with the intention of

supporting future use
3.4
LTS storeroom

area containing components that have additional packaging for storage to protect from

moisture or from mechanical impact or for ease of identification or handling
3.5
moisture-sensitive device
MSD

device that has moisture absorption or moisture retention and whose quality or reliability is

affected by moisture
3.6
electronic device

packaged electrical, electronic, electro-mechanical (EEE) item, or assemblies using such

items
[SOURCE: IEC 60050-551:1998, 551-14-01, modified]
3.7
desiccant
hygroscopic substance used to remove moisture from an atmosphere
3.8
moisture barrier bag
MBB

storage bag manufactured with a flexible laminated vapour barrier film that restricts the

transmission of water vapour

Note 1 to entry: Refer to IEC 60749-20-1 for packaging of moisture sensitive products.

3.9
humidity indicator card
HIC

card printed with a moisture sensitive chemical that changes from blue to pink in the presence

of water vapour
3.10
water vapour transmission rate
WVTR
measure of permeability of MBBs to water vapour
3.11
electrostatic discharge
ESD

transfer of electric charge between bodies of different electrostatic potentials in proximity or

through direct contact
[SOURCE: IEC 60050-561:2014, 561-03-06]
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4 Purpose of storage (facility)
4.1 General

Successful long-term storage is dependent upon sustained control of the environment and its

physical and data security. Costs associated with handling, maintaining traceability, physical

accounting and environmental conditions should be accounted for from the outset of long-term

storage.
4.2 Cost of ownership

Cost will be determined by type of storage facility, cabinet, continuous nitrogen flow or inert

gas flow and periodical examination on a representative sample.
4.3 Security

Access to controlled areas should be limited to a small number of persons to ensure adequate

security. Controlled areas shall be secure from theft, tampering and environmental

disturbances.
4.4 Location and ambient environment

The LTS storeroom should be located away from any vibration, electromagnetic fields,

ultraviolet rays and other strong light. Consideration should be given to any catastrophic

events likely to occur near or at the physical locale of the storage facility. For example,

seismically active locations may have building safety and control mitigation measures in place.

4.5 Incorrect control of reliability during storage

Storage conditions should be precisely defined and controlled, to ensure the reliability of the

components (see Clause 5).

Component integrity may be reduced by improper storage conditions. Potential causes of

storage risk are related to poor control of environmental conditions. Proper control should

consider temperature, humidity, moisture, pressure, atmospheric gases
...

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