SIST EN 62025-2:2005

High frequency inductive components - Non-electrical characteristics and measuring methods -- Part 2: Test methods for non-electrical characteristics

Specifies a test method for the non-electrical characteristics of the surface mounted device inductors to be used for electronic and telecommunication equipment. Defines methods for measuring mechanical performance only. To be used in conjunction with EN 62211.

Induktive Hochfrequenzbauelemente - Nichtelektrische Eigenschaften und Messmethoden -- Teil 2: Messverfahren für nichtelektrische Eigenschaften

Composants inductifs à haute fréquence - Caractéristiques non électriques et méthodes de mesure -- Partie 2: Méthodes d'éssai pour caractéristiques non électriques

Spécifie une méthode d'essai pour les caractéristiques non électriques pour inductances à montage en surface utilisées pour les équipements électroniques et de télécommunications. Concerne uniquement les méthodes de mesure de la performance mécanique. Est à utiliser conjointement avec la EN 62211.

Visokofrekvenčne induktivne komponente – Neelektrične karakteristike in merilne metode – 2. del: Preskusne metode za neelektrične karakteristike (IEC 62025-2:2005)

General Information

• Status: Published
• Publication Date: 30-Nov-2005
• ICS: 29.100.10 - Magnetic components
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Dec-2005
• Due Date: 01-Dec-2005
• Completion Date: 01-Dec-2005
• Ref Project: EN 62025-2:2005 - High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

Relations

• Replaced By: SIST EN IEC 62025-2:2021 - High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
• Effective Date: 19-Nov-2019
• Revised: SIST EN IEC 62025-2:2021 - High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
• Effective Date: 23-Oct-2018

Standards Content (Sample)

SLOVENSKI SIST EN 62025-2:2005

STANDARD
december 2005
Visokofrekvenčne induktivne komponente – Neelektrične karakteristike in
merilne metode – 2. del: Preskusne metode za neelektrične karakteristike (IEC
62025-2:2005)
High frequency inductive components – Non-electrical characteristics and
measuring methods – Part 2: Test methods for non-electrical characteristics (IEC
62025-2:2005)
ICS 29.100.10 Referenčna številka
SIST EN 62025-2:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 62025-2
NORME EUROPÉENNE
EUROPÄISCHE NORM February 2005

ICS 29.100.10


English version


High frequency inductive components –
Non-electrical characteristics and measuring methods
Part 2: Test methods for non-electrical characteristics
(IEC 62025-2:2005)


Composants inductifs à haute fréquence - Induktive Hochfrequenzbauelemente -
Caractéristiques non électriques Nichtelektrische Eigenschaften
et méthodes de mesure und Messmethoden
Partie 2: Méthodes d'éssai pour Teil 2: Messverfahren für nichtelektrische
caractéristiques non électriques Eigenschaften
(CEI 62025-2:2005) (IEC 62025-2:2005)






This European Standard was approved by CENELEC on 2005-02-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62025-2:2005 E

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EN 62025-2:2005 - 2 -
Foreword
The text of document 51/797/FDIS, future edition 1 of IEC 62025-2, prepared by IEC TC 51, Magnetic
components and ferrite materials, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 62025-2 on 2005-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-02-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62025-2:2005 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 62025-2:2005
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance

IEC 60068-2-6 1995 Part 2: Tests - Test Fc: Vibration
+ corr. March 1995 (sinusoidal) EN 60068-2-6 1995

2)
IEC 60068-2-20 1979 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988

IEC 60068-2-21 1999 Part 2-21: Tests - Test U: Robustness of EN 60068-2-21 1999
terminations and integral mounting
devices

IEC 60068-2-27 1987 Part 2: Tests - Test Ea and guidance: EN 60068-2-27 1993
Shock

IEC 60068-2-45 1980 Part 2: Tests - Test Xa and guidance: EN 60068-2-45 1992
Immersion in cleaning solvents

IEC 60068-2-58 2004 Part 2-58: Tests - Test Td: Test methods EN 60068-2-58 2004
for solderability, resistance to dissolution + corr. December 2004
of metallization and to soldering heat of
surface mounting devices (SMD)

3) 4)
IEC 60068-2-69 - Part 2: Tests - Test Te: Solderability EN 60068-2-69 1996
testing of electronic components for
surface mount technology by the wetting
balance method

IEC 60068-2-77 1999 Part 2-77: Tests - Test 77: Body strength EN 60068-2-77 1999
and impact shock

IEC 61188-5-2 2003 Printed boards and printed board EN 61188-5-2 2003
assemblies - Design and use
Part 5-2: Attachment (land/joint)
considerations - Discrete components

1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.
3)
Undated reference.
4)
Valid edition at date of issue.

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EN 62025-2:2005 - 4 -
Publication Year Title EN/HD Year
IEC 61190-1-2 2002 Attachment materials for electronic EN 61190-1-2 2002
assembly
Part 1-2: Requirements for solder pastes
for high-quality interconnections in
electronics assembly

IEC 61190-1-3 2002 Attachment materials for electronic EN 61190-1-3 2002
assembly
Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-
fluxed solid solders for electronic
soldering applications

IEC 62211 2003 Inductive components - Reliability EN 62211 2004
management

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NORME CEI

INTERNATIONALE IEC



62025-2
INTERNATIONAL


Première édition
STANDARD

First edition

2005-01


Composants inductifs à haute fréquence –
Caractéristiques non électriques
et méthodes de mesure –
Partie 2:
Méthodes d'essai pour caractéristiques
non électriques

High frequency inductive components –
Non-electrical characteristics and
measuring methods –
Part 2:
Test methods for non-electrical characteristics
 IEC 2005 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale PRICE CODE T
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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62025-2  IEC:2005 – 3 –
CONTENTS
FOREWORD.5

1 Scope .9
2 Normative references .9
3 Terms and definitions .11
4 Test conditions .11
4.1 Standard atmospheric conditions for test.11
4.2 Referee conditions.11
5 Mechanical characteristics test .13
5.1 Body strength test .13
5.2 Robustness of termination (electrode) .15
5.3 Solderability.27
5.4 Resistance to soldering heat.33
5.5 Resistance to dissolution of metallization .37
5.6 Vibration.39
5.7 Resistance to shock.41

Annex A (normative) Mounting of surface mounting inductor to test printed-circuit board .45

Figure 1 – Method for pressurizing body.13
Figure 2 – Pressurizing jig .15
Figure 3 – Example of printed-circuit board .17
Figure 4 – Layout.21
Figure 5 – Pressurizing jig .21
Figure 6 – Pressurizing .21
Figure 7 – Pressurizing and shape of jig.25
Figure 8 – Reflow temperature profile.31

Table 1 – Size of soldering lands by the code of multi-layer chip inductors.17
Table 2 – Thickness of solder paste by the size code of inductors.19
Table 3 – Conditions of immersion into solder .29
Table 4 – Reflow temperature .29
Table 5 – Severity.33
Table 6 – Reflow temperature .35
Table 7 – Conditions of vibration .41

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62025-2  IEC:2005 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND
MEASURING METHODS –

Part 2: Test methods for non-electrical characteristics


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62025-2 has been prepared by IEC technical committee 51:
Magnetic components and ferrite materials.
The text of this standard is based on the following documents:
FDIS Report on voting
51/797/FDIS 51/808/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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62025-2  IEC:2005 – 7 –
IEC 62025 consists of the following parts, under the general title High frequency inductive
components – Non-electrical characteristics and measuring methods
Part 1: Fixed, surface mounted inductors for use in electronic and telecommunication
equipment
Part 2: Test methods for non-electrical characteristics
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

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62025-2  IEC:2005 – 9 –
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND
MEASURING METHODS –

Part 2: Test methods for non-electrical characteristics



1 Scope
This part of IEC 62025 specifies a test method for the non-electrical characteristics of the
Surface Mounted Device (SMD) inductors to be used for electronic and telecommunication
equipment. The object of this part of IEC 62025 is to define methods for measuring
mechanical performance only. As the reliability performances and specifications relative to
non-electrical performances are defined in IEC 62211, detailed measuring methods for
mechanical performance of reliability testing are defined in this part of IEC 62025.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-6:1995, Environmental testing – Part 2: Tests – Test Fc : Vibration (sinusoidal)
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 60068-2-21:1999, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27:1987, Environmental testing – Part 2: Tests – Test Ea and guidance: Shock
IEC 60068-2-45:1980, Environmental testing – Part 2: Tests – Test XA and guidance:
Immersion in cleaning solvents
IEC 60068-2-58:2004, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-69, Environmental testing – Part 2: Tests – Test Te: Solderability testing of
electronic components for surface mount technology by the wetting balance method
IEC 60068-2-77:1999, Environmental testing – Part 2-77: Tests – Test 77: Body strength and
impact shock

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62025-2  IEC:2005 – 11 –
IEC 61188-5-2:2003, Printed boards and printed board assemblies – Design and use – Part 5-2:
Attachment (land/joint) considerations – Discrete components
IEC 61190-1-2:2002, Attachment materials for electronic assembly – Part 1-2: Requirements
for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3:2002, Attachment materials for electronic assembly – Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic
soldering applications
IEC 62211:2003, Inductive components – Reliability management
3 Terms and definitions
For the purpose of this part of IEC 62025, the terms and definitions given in the normative
references apply.
4 Test conditions
4.1 Standard atmospheric conditions for test
Unless otherwise specified in the detail specification, the tests and measurements shall be
carried out under standard atmospheric conditions for test as given in 5.3.1 of IEC 60068-1:
– temperature: 15 °C to 35 °C;
– relative humidity: 25 % to 75 %;
– air pressure: 86 kPa to 106 kPa.
In the event of dispute or where required, the measurements shall be repeated using the
referee temperatures (as given in 4.2) and such other conditions as are prescribed in this
standard.
In addition, when it is difficult to make measurements in standard atmospheric conditions,
unless a doubt arises about the validity of the result, the tests and measurements may be
performed in non-standard atmospheric conditions.
4.2 Referee conditions
For referee purposes, one of the standard atmospheric conditions for referee tests taken from
5.2 of IEC 60068-1, shall be selected and shall be as follows:
– temperature: 20 °C ± 2 °C;
– relative humidity: 60 % to 70 %;
– air pressure: 86 kPa to 106 kPa.

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62025-2  IEC:2005 – 13 –
5 Mechanical characteristics test
5.1 Body strength test
5.1.1 Body strength test procedures
The body strength test procedure, as referenced in IEC 60068-2-77, shall be as follows.
a) Preconditioning
If required, preconditioning shall be performed on the specimens in accordance with the
detail specification.
b) Initial measurement
The appearance of the specimen shall be checked with a magnification of at least 10×
under adequate light.
If specified in the detail specification, the electrical performances shall be measured.
c) Layout
Unless otherwise specified in the detail specification, the specimen shall be placed on
the supporting base, as shown in Figure 1, so that both ends of the specimen are
symmetrically positioned on the supporting base. The test table shall be placed on a plane,
robust platform so that the test result shall not be affected when a force is applied.
Dimensions in millimetres


Pressurizing jig (see Figure 2)
Force
R0,5
Specimen
R0,1 to R0,2
A
Magnification of part A
L
2
Supporting base steel L
IEC  073/05

NOTE The angle of the taper in part A shall be between 70° and 90°.
Figure 1 – Method for pressurizing body
d) Applied force
The force shall be applied to the centre of the specimen by the pressurizing jig as shown
in Figure 2, for a duration of (10 ± 1) s. Unless otherwise specified in the detail
specification, the force shall be selected from either (one of) 10 N, 20 N or 30 N.
If specified in the detail specification, the electrical performances shall be measured
during the application of the force.

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62025-2  IEC:2005 – 15 –

Dimensions in millimetres

W
R0,5
IEC  074/05


NOTE 1 Dimension W of the pressurizing jig is wider than the width of the specimen.
NOTE 2 Hardness: HV 500 and more.
NOTE 3 When the length of the specimen is 2 mm or less, the radius of the pressurizing jig should be 0,2 mm.
Figure 2 – Pressurizing jig
e) Recovery
If required, recovery conditioning shall be performed for the specimens in accordance with
the detail specification.
f) Final measurement
After the test, the appearance of the specimen shall be checked with a magnification of at
least 10× under adequate light. There shall be no signs of damage such as cracks or flaws.
If specified in the detail specification, the electrical performances shall be measured.
5.1.2 Information to be given in the detail specification
The following information shall be given in the detail specification.
a) Preconditioning (if required) – see 5.1.1.a);
b) initial measurement items, final measurement items (if required) – see 5.1.1.b) and f);
c) measurement during applied force (if required) – see 5.1.1.d);
d) recovery (if required) – see 5.1.1.e).
5.2 Robustness of termination (electrode)
5.2.1 Resistance to bending of printed circuit board
5.2.1.1 General
The test for resistance of terminations and electrodes mounted on a printed circuit board shall
be as follows.

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62025-2  IEC:2005 – 17 –
5.2.1.2 Specification of soldering lands
The soldering lands shall be designed according to Table 1, as specified in 11.5 of
IEC 61188-5-2. With regard to inductors, except for those specified in IEC 61188-5-2, the size
of the solder lands shall be specified in the detail specification.
Table 1 – Size of soldering lands by the code
of multi-layer chip inductors
Dimensions in millimetres
Size code a b c
1005 0,65 0,55 0,50
1608 0,95 0,85 0,50
2012 1,45 1,10 0,50
3216 1,80 1,30 1,20
3225 2,70 1,05 1,80
4532 3,40 1,10 3,00
5650 5,30 1,30 3,70
NOTE Tolerance: 0,05 mm and see Figure 3.

5.2.1.3 Specification of printed circuit board
The printed-circuit board shall be made of epoxide woven glass (FR4) as specified in
IEC 60068-2-21, and, unless specified in the detail specification, the printed circuit board
shall be as shown in Figure 3. The dimension of W shall be specified in the detail specification.
Dimensions in millimetres

15
A
10
9
8
7
6
5
4
3
2
c b
1
Magnification of part A
130
IEC  075/05

Key
         solderable areas
         non-solderable areas (covered with non-solderable lacquer)
Materials of substrate: epoxide woven glass (FR4)
 Thickness 1,6 mm ± 0,2 mm (for size code from 1608)
 Thickness 0,8 mm ± 0,1 mm (for size code up to 1005)
 Conductors: copper
Thickness 0,035 mm ± 0,010 mm
NOTE When the board is designed to mount more than 2 specimens, allow sufficient space between specimens
so as not to influence the test result. Dimensions not given shall be chosen according to the design and size of the
specimen to be tested.
Figure 3 – Example of printed circuit board
W
a

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62025-2  IEC:2005 – 19 –
5.2.1.4 Mounting of specimen
The specimen shall be mounted on the printed-circuit board in accordance with Annex A and
other specifications as mentioned below.
a) The solder paste shall be placed on the soldering lands. The applied solder paste shall
cover the soldering lands completely. The thickness of the solder paste by the size code
of inductors is recommended in Table 2. The appropriate height of the filet should be the
smaller value of either 50 % of the thickness of the specimen or 0,5 mm.
Table 2 – Thickness of solder paste by the size code of inductors
Thickness of solder paste
Size code
µm
Up to 1608 100 to 150
From 2012 150 to 200

b) The specimen shall then be placed on the printed-circuit board. The terminations of the
specimen shall be placed on the soldering lands symmetrically in both horizontal and
vertical directions.
c) The printed-circuit board with the specimen shall be reflow soldered. Care shall be taken
when mounting the inductor on the printed-circuit board so that warp or twist does not
occur.
d) If specified in the detail specification, the printed-circuit board shall be cleaned according
to Annex A.
5.2.1.5 Preconditioning
Preconditioning shall be carried out as specified in the detail specification when pre-
conditioning is necessary.
5.2.1.6 Initial measurement
Prior to conducting the mechanical test, the appearance of the specimen and the soldered
parts shall be checked by using a magnifier with a magnification of at least 10× under
adequate light. If an abnormal or rejectable appearance is found, the specimen shall be
excluded from the evaluation on this test. The electrical performances shall be measured if
specified in the detail specification.
5.2.1.7 Bending tool
The bending tool shall be a support jig as shown in Figure 4 and a pressurizing jig as shown
in Figure 5. The radius of the pressurizing jig should be 5 mm. If specified in the detail
specification, the radius of the pressurizing jig may be 340 mm or 230 mm.
5.2.1.8 Layout
The printed-circuit board with the soldered specimen is placed on the support jig as shown in
Figure 4.

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62025-2  IEC:2005 – 21 –
Dimensions in millimetres

Printed-circuit board
Specimen
Specimen
Printed-circuit board
W
Support jig
45 ± 2 45 ± 2
Support jig W + 10 and more radius 2,5
radius 2,5
IEC  076/05
(a) Front (b) Side
Figure 4 – Layout
5.2.1.9 Test
The printed-circuit board shall be bent by using the pressurizing jig as shown in Figure 5 at a
rate of (1 ± 0,5) mm per second and to the bending depth of 1 mm, 2 mm, 3 mm or 4 mm (see
Figure 6). The bending depth shall be specified in the detail specification. After reaching the
specified bending depth, it shall be maintained for (20 ± 1) s. Then the bending force shall be
relaxed. Unless specified in the detail specification, the number of bends shall be one.
Dimensions in millimetres

W + 10 and more
20
R5
IEC  077/05

Key
R radius
Figure 5 – Pressurizing jig

Pressurizing
Pressurizing jig
Printed-circuit board
Thickness of board
IEC  078/05

Figure 6 – Pressurizing
NOTE The relative position between the centre of the specimen on the soldering land of the printed-circuit board
and the contact-line of the pressurizing jig on the printed-circuit board should not exceed 0,5 mm.

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62025-2  IEC:2005 – 23 –
5.2.1.10 Measurement during pressurizing
If specified in the detail specification, the measurement shall be carried out during
pressurizing in accordance with the provisions of the detail specification.
5.2.1.11 Recovery
If specified in the detail specification, the recovery shall be carried out in accordance with the
provisions of the detail specification.
5.2.1.12 Final measurement
The appearance of the specimen and the soldered parts shall be checked by using a
magnifier with a magnification of at least 10× under adequate light. In this case, abnormalities
such as peel and crack found at the solder joint shall not be treated as defect of the inductor.
If specified in the detail specification, the electrical performances shall then be measured.
5.2.1.13 Items to be specified in detail specification
The following items shall be specified in the detail specification.
a) Dimensions of land, if different from Table 1 (see 5.2.1.2).
b) Dimension of W of the testing printed-circuit board (see 5.2.1.3).
c) Applied solder (see 5.2.1.4).
d) Cleaning (if necessary) (see 5.2.1.4).
e) Preconditioning (if neces
...