SIST EN IEC 61189-2-803:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées

L'IEC 61189-2-803:2023 définit une méthode d'essai pour déterminer la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées en utilisant un analyseur thermomécanique (TMA - thermomechanical analyser).

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih podložnih materialov

Ta del standarda IEC 61189 določa preskusno metodo za ugotavljanje raztezanja po osi Z tankih podložnih materialov s termomehanskim analizatorjem (TMA).

General Information

• Status: Published
• Public Enquiry End Date: 26-Jan-2022
• Publication Date: 09-Oct-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 20-Sep-2023
• Due Date: 25-Nov-2023
• Completion Date: 10-Oct-2023
• Ref Project: EN IEC 61189-2-803:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-2-803:2023
01-november-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih
podložnih materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and
printed board
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von
Basismaterialien und Leiterplatten
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la
dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
Ta slovenski standard je istoveten z: EN IEC 61189-2-803:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
SIST EN IEC 61189-2-803:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-2-803:2023

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SIST EN IEC 61189-2-803:2023


EUROPEAN STANDARD EN IEC 61189-2-803

NORME EUROPÉENNE

EUROPÄISCHE NORM September 2023
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-803: Test
methods for Z-axis expansion of base materials and printed
boards
(IEC 61189-2-803:2023)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-803: Méthodes d'essai pour la 803: Prüfverfahren für die Z-Achsen-Ausdehnung von
dilatation suivant l'axe Z des matériaux de base et des Basismaterialien und Leiterplatten
cartes imprimées (IEC 61189-2-803:2023)
(IEC 61189-2-803:2023)
This European Standard was approved by CENELEC on 2023-08-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-2-803:2023 E

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SIST EN IEC 61189-2-803:2023
EN IEC 61189-2-803:2023 (E)
European foreword
The text of document 91/1760/CDV, future edition 1 of IEC 61189-2-803, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-803:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-05-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-08-30
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-803:2023 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN I
...

SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-803:2022
01-januar-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih
podložnih materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and
printed board
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la
dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
Ta slovenski standard je istoveten z: prEN IEC 61189-2-803:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-803:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 61189-2-803:2022

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oSIST prEN IEC 61189-2-803:2022
91/1760/CDV

COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-803 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-11-05 2022-01-28
SUPERSEDES DOCUMENTS:
91/1545/CD, 91/1612A/CC

IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:


Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:

EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.

TITLE:
Test methods for electrical materials, printed board and other interconnection structures and assemblies
– Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

PROPOSED STABILITY DATE: 2027

NOTE FROM TC/SC OFFICERS:


Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

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oSIST prEN IEC 61189-2-803:2022
61189-2-803/Ed1/CD  IEC        – 2 – 91/1760/CDV

1
2 CONTENTS
3 FOREWORD . 3
4 1 Scope. 5
5 2 Normative References . 5
6 3 Terms and definitions . 5
7 4 Preparation of Test Specimens. 5
8 5 Test Specimens . 5
9 6 Test Apparatus . 6
10 7 Test Procedure. 6
11 8 Calculation . 6
12 9 Report . 7
13
14 Figure 1 – Example TMA Data Output . 6
15
16

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oSIST prEN IEC 61189-2-803:2022
61189-2-803/Ed1/CD  IEC   – 3 – 91/1760/CDV
17
18 INTERNATIONAL ELECTROTECHNICAL COMMISSION
19                                   ____________
20 Test methods for
...