SIST EN 61188-5-3:2008

Printed boards and printed board assemblies - Design and use -- Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-3: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit Gullwing-Anschlüssen auf zwei Seiten

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-3: Considérations sur les liaisons pistes- soudures - Composants à sorties en aile de mouette sur deux côtés

La CEI 61188-5-3:2007 fournit des informations sur la géométrie des plages d'accueil utilisées pour la fixation en surface des composants électronique à sorties en aile de mouette sur deux côtés. Le but des informations indiquées dans la présente norme est de fournir les dimensions, formes et tolérances appropriées des plages d'accueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure et pour permettre l'inspection, la mise en essai et les retouches des joints de brasure. Chaque article contient une série de critères particuliers de telle façon que l'information présentée soit cohérente et fournisse des informations sur le composant, ses dimensions, la conception du joint de brasure ainsi que les dimensions de la plage d'accueil.
Cette publication doit être lue conjointement avec la CEI 61188-5-1 :2002.

Tiskane plošče in sestavi tiskanih plošč - Načrtovanje in uporaba - 5-3. del: Zahteve za posamezne dele - Pregledovanje povezav (ploskev/stik) - Komponente z gull-wing vodili na dveh straneh (IEC 61188-5-3:2007)

General Information

• Status: Published
• Publication Date: 11-May-2008
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 03-Dec-2007
• Due Date: 07-Feb-2008
• Completion Date: 12-May-2008
• Ref Project: EN 61188-5-3:2007 - Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61188-5-3:2008
01-junij-2008
7LVNDQHSORãþHLQVHVWDYLWLVNDQLKSORãþ1DþUWRYDQMHLQXSRUDEDGHO
=DKWHYH]DSRVDPH]QHGHOH3UHJOHGRYDQMHSRYH]DYSORVNHYVWLN.RPSRQHQWH
]JXOOZLQJYRGLOLQDGYHKVWUDQHK,(&
Printed boards and printed board assemblies - Design and use - Part 5-3: Sectional
requirements - Attachment (land/joint) considerations - Components with gull-wing leads
on two sides
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-3:
Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit Gullwing-
Anschlüssen auf zwei Seiten
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-3:
Considérations sur les liaisons pistes-soudures - Composants a sorties en aile de
mouette sur deux côtés
Ta slovenski standard je istoveten z: EN 61188-5-3:2007
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61188-5-3:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

EUROPEAN STANDARD
EN 61188-5-3

NORME EUROPÉENNE
November 2007
EUROPÄISCHE NORM

ICS 31.180


English version


Printed boards and printed board assemblies -
Design and use -
Part 5-3: Attachment (land/joint) considerations -
Components with gull-wing leads on two sides
(IEC 61188-5-3:2007)


Cartes imprimées et  Leiterplatten und Flachbaugruppen -
cartes imprimées équipées - Konstruktion und Anwendung -
Conception et utilisation - Teil 5-3: Betrachtungen zur Montage
Partie 5-3: Considérations (Anschlussfläche/Verbindung) -
sur les liaisons pistes-soudures - Bauelemente mit
Composants à sorties Gullwing-Anschlüssen
en aile de mouette sur deux côtés auf zwei Seiten
(CEI 61188-5-3:2007) (IEC 61188-5-3:2007)




This European Standard was approved by CENELEC on 2007-11-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-5-3:2007 E

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EN 61188-5-3:2007 - 2 -
Foreword
The text of document 91/702/FDIS, future edition 1 of IEC 61188-5-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61188-5-3 on 2007-11-01.
This standard is to be used in conjunction with EN 61188-5-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-08-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2010-11-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61188-5-3:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-58 NOTE  Harmonized as EN 60068-2-58:2004 (not modified).
IEC 61191-1 NOTE  Harmonized as EN 61191-1:1998 (not modified).
IEC 61191-2 NOTE  Harmonized as EN 61191-2:1998 (not modified).
__________

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- 3 - EN 61188-5-3:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1) 2)
IEC 61188-5-1 - Printed boards and printed board EN 61188-5-1 2002
assemblies - Design and use -
Part 5-1: Attachment (land/joint)
considerations - Generic requirements




1)
Undated reference.
2)
Valid edition at date of issue.

---------------------- Page: 4 ----------------------

IEC 61188-5-3
Edition 1.0 2007-10
INTERNATIONAL
STANDARD

Printed boards and printed board assemblies – Design and use –
Part 5-3: Attachment (land/joint) considerations – Components with gull-wing
leads on two sides


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.180 ISBN 2-8318-9340-2

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– 2 – 61188-5-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .7
3.4 Process considerations .7
4 TSOP (Type 1) .8
4.1 Field of application .8
4.2 Component description.8
4.3 Component dimensions .8
4.4 Solder joint fillet design .9
4.5 Land pattern dimensions .11
5 TSOP (Type 2) .13
5.1 Field of application .13
5.2 Component description.13
5.3 Component dimensions .13
5.4 Solder joint fillet design .14
5.5 Land pattern dimensions .16
6 SOP .18
6.1 Field of application .18
6.2 Component description.18
6.3 Component dimensions .18
6.4 Solder joint fillet design .19
6.5 Land pattern dimensions .21
7 SSOP .23
7.1 Field of application .23
7.2 Component description.23
7.3 Component dimensions .24
7.4 Solder joint fillet design .24
7.5 Land pattern dimensions .26

Bibliography.29

Figure 1 – TSOP (Type 1) construction .8
Figure 2 – TSOP (Type 1) – Component dimensions.9
Figure 3 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) .11
Figure 4 – TSOP (Type 1) – Land pattern dimensions.13
Figure 5 – TSOP (Type 2) construction .13
Figure 6 – TSOP (Type 2) – Component dimensions.14
Figure 7 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) .16
Figure 8 – TSOP (Type 2) – Land pattern dimensions.18

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61188-5-3 © IEC:2007(E) – 3 –
Figure 9 – SOPIC construction.18
Figure 10 – SOP component dimensions .19
Figure 11 – Solder joint fillet design (see IEC 61188-5-1, Table 2).21
Figure 12 – SOP Land pattern dimensions .23
Figure 13 – SSOP construction .23
Figure 14 – Component dimensions .24
Figure 15 – Solder joint fillet design (see IEC 61188-5-1, Table 2).26
Figure 16 – Land pattern dimensions .28

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– 4 – 61188-5-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –

Part 5-3: Attachment (land/joint) considerations –
Components with gull-wing leads on two sides


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/702/FDIS 91/734/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-3 is to be read in conjunction with IEC 61188-5-1.

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61188-5-3 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this standard may be issued at a later date.

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– 6 – 61188-5-3 © IEC:2007(E)
INTRODUCTION
This part of IEC 61188 covers land patterns for components with gull-wing leads on two sides.
Each clause contains information in accordance with the following format:
The proposed land pattern dimensions in this standard are based upon the fundamental
tolerance calculation combined with the given land protrusions and courtyard excesses (see
IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal
manufacturing necessities.
The unaltered land pattern dimensions of this part are generally applicable for the solder
paste application plus reflow soldering process. For application of the wave soldering process,
the land pattern dimensions normally have to be modified. Orientation parallel to the wave
direction is preferable and special, suitably dimensioned solder thieves should be added.
This standard offers a threefold land pattern dimensioning (levels 1, 2, and 3) on the basis of
a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn)
and minimum (min.). Each land pattern has been assigned an identification number to indicate
the characteristics of the specific robustness of the land patterns. Users also have the
opportunity to organize the information so that it is most useful for their particular design.
If a user has good reason to use a concept different from that of IEC 61188-5-1 or if the user
prefers unusual land protrusions, this standard should be used for checking the resulting
solder fillet size.
It is the responsibility of the user to verify the SMD land patterns used for achieving an
undisturbed mounting process including testing and an ensured reliability for the product
stress conditions in use.
Component dimensions listed in this standard are those available on the market and regarded
as for reference only.

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61188-5-3 © IEC:2007(E) – 7 –
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –

Part 5-3: Attachment (land/joint) considerations –
Components with gull-wing leads on two sides



1 Scope
This part of IEC 61188 provides information on land pattern geometries used for the surface
attachment of electronic components with gull-wing leads on two sides. The intent of the
information presented herein is to provide the appropriate size, shape and tolerances of
surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also
allow for inspection, testing and reworking of those solder joints.
Each clause contains a specific set of criteria such that the information presented is
consistent, providing information on the component, the component dimensions, the solder
joint design, and the land pattern dimensions.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61188-5-1, Printed boards and printed board assemblies – Design and use – Part 5-1:
Attachment (land/joint) considerations – Generic requirements
3 General information
3.1 General component description
The acronyms TSOP (thin small outline package), SOP (small outline package) and SSOP
(shrink small outline package) are also used to describe the family.
3.2 Marking
The TSOP, SOP and SSOP families of parts are generally marked with the manufacturer’s
part numbers, manufacturer’s name or symbol, and a pin 1 indicator. Some parts may have a
pin 1 feature in the case shape instead of pin 1 marking. Additional markings may include
date-code manufacturing lot and/or manufacturing location.
3.3 Carrier packaging format
Carrier packaging format may be provided in a tray carrier, but tape and reel carriers are
preferred for best handling and high volume applications. Bulk packaging is not acceptable
because of lead co-planarity required for placement and soldering.
3.4 Process considerations
TSOP, SOP and SSOP packages are normally processed by reflow solder operations.
The land pattern dimensions are based on a mathematical model that establishes a platform
for a solder joint attachment to the printed board. The existing models create a platform that is

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– 8 – 61188-5-3 © IEC:2007(E)
capable of establishing a reliable solder joint no matter what solder alloy is used to make that
joint (lead-free, tin lead, etc.)
Process requirements for solder reflow are different based on the solder alloy and should be
analyzed in order that the process is above the liquidus temperature of the alloy, and remains
above that temperature a sufficient time to form a reliable metallurgical bond.
4 TSOP (Type 1)
4.1 Field of application
This clause provides the component and land pattern dimensions for TSOP (Type 1)
components. Basic construction is also covered. Subclause 4.4 lists the tolerances and target
solder joint dimensions used to arrive at the land pattern dimensions.
4.2 Component description
Figure 1 shows a typical construction example.


IEC  2009/07

Figure 1 – TSOP (Type 1) construction
4.3 Component dimensions
Figure 2 shows the component dimensions for TSOP (Type 1) components.
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA data sheets.

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61188-5-3 © IEC:2007(E) – 9 –
L
S
T
B
IEC  2010/07
Dimensions in millimetres
Component Pin L W T S* A B H P
identification count
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic
0,27 0,40
TSOP 6x14 16 13,8 14,2 0,17 0,75 12,3 12,94 5,80 6,20 12,2 12,6 1,20 0,65
TSOP 6x16 24 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 5,80 6,20 14,2 14,6 1,20 0,5
TSOP 6x18 28 17,8 18,2 0,13 0,19 0,40 0,75 16,3 16,94 5,80 6,20 16,2 16,6 1,20 0,4
0,15 0,40
TSOP 6x20 36 19,8 20,2 0,09 0,75 18,3 18,94 5,80 6,20 18,2 18,6 1,20 0,3
0,27 0,40
TSOP 8x14 24 13,8 14,2 0,17 0,75 12,3 12,94 7,80 8,20 12,2 12,6 1,20 0,65
TSOP 8x16 32 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 7,80 8,20 14,2 14,6 1,20 0,5
0,19 0,40
TSOP 8x18 40 17,8 18,2 0,13 0,75 16,3 16,94 7,80 8,20 16,2 16,6 1,20 0,4
0,15 0,40
TSOP 8x20 52 19,8 20,2 0,09 0,75 18,3 18,94 7,80 8,20 18,2 18,6 1,20 0,3
TSOP 10x14 28 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 9,80 10,20 12,2 12,6 1,20 0,65
0,23 0,40
TSOP 10x16 40 15,8 16,2 0,17 0,75 14,3 14,94 9,80 10,20 14,2 14,6 1,20 0,5
0,19 0,40
TSOP 10x18 48 17,8 18,2 0,13 0,75 16,3 16,94 9,80 10,20 16,2 16,6 1,20 0,4
0,15 0,40
TSOP 10x20 64 19,8 20,2 0,09 0,75 18,3 18,94 9,80 10,20 18,2 18,6 1,20 0,3
TSOP 12x14 36 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 11,80 12,20 12,2 12,6 1,20 0,65
0,23 0,40
TSOP 12x16 48 15,8 16,2 0,17 0,75 14,3 14,94 11,80 12,20 14,2 14,6 1,20 0,5
0,19 0,40
TSOP 12x18 60 17,8 18,2 0,13 0,75 16,3 16,94 11,80 12,20 16,2 16,6 1,20 0,4
TSOP 12x20 76 19,8 20,2 0,09 0,15 0,40 0,75 18,3 18,94 11,80 12,20 18,2 18,6 1,20 0,3
* Calculated value.
Figure 2 – TSOP (Type 1) – Component dimensions
4.4 Solder joint fillet design
Figure 3 shows the dimensions of the solder fillet after the soldering process. The minimum,
median and maximum dimensions of each of toe, heel and side fillet are determined by taking
into consideration solder joint reliability and also quality and productivity in the mounting
process of parts.
In designing land patterns, three accuracy factors need to be taken into consideration:
– parts dimensions accuracy (C);
– parts mount accuracy on PWBs (P);
– land shape accuracy of PWBs (F),
in addition to fillet dimensions. The formulae to obtain the tolerance resulting from these
factors are basically as follows:
a) Design consideration when soldered without self-alignment effect (level 1)
In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot
be simplified but remain the same, as follows:
W
P
A

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– 10 – 61188-5-3 © IEC:2007(E)
2 2 2
T = + +
Zmax = Lmin + 2J max + T
F P C
T L1 L1 L
T T
2 2 2
Gmin = Smax (rms) – 2J max – T T = + +
F P C
H H H L1 L1 S
2 2 2
Xmax = Wmin + 2J max + T T = + +
F P C
S S S L1 L1 W
b) Design consideration when soldered without self-alignment effect (Level 2)
2 2 2
Zmax = Lmin + 2J mdn + T T = + +
F P C
L2 L2 L
T T T
2 2 2
Gmin = Smax(rms) – 2J mdn – T T = + +
F P C
L2 L2 S
H H H
2 2 2
Xmax = Wmin + 2J mdn + T T = + +
F P C
L2 L2 W
S S S
c) Design consideration when soldered with self-alignment effect (Level 3)

2 2 2
T = + +
Zmax = Lmin + 2J min + T
F P C
T L3 L3 L
T T
2 2 2
T = + +
Gmin = Smax(rms) – 2J min – T
F P C
H L3 L3 S
H H
2 2 2
Xmax = Wmin + 2 J min + T T = + +
F P C
S S S L3 L3 W

In the reflow soldering process, there is a self-alignment effect. In the surface mount process
of reflow soldering, parts mount displacement when soldered can be cancelled by self-
alignment effect (therefore factor P can be regarded as 0). In addition, the tolerance of the
land shape accuracy of PWBs is about ±30 µm, and this is extremely small when compared
with that of the parts dimensions accuracy (therefore factor F can be regarded also as 0).
Thus, the formulae can be simplified as follows:
T = C Zmax = Lmin + 2J min + C = Lmax + 2J min
T L, T L T
T = C Gmin = Smax (rms) – 2J min – C
H S, H S
T = C Xmax = Wmin + 2J min + C = Wmax + 2J min
S W, S W S
In addition, the value Gmin ≥ B is also necessary so that the land should not be hidden under
the TSOP. The stand-off of the component mould is nearly zero. The land pattern design
should be made to prevent the lead from floating caused by the solder under the component.
Any tolerance other than the above may be used depending on the soldering strength
required, the capability of the production process used, and so on.

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61188-5-3 © IEC:2007(E) – 11 –

J J
T S W
J
Zmax.
H Xmax.
IEC  2011/07

Dimensions in millimetres
Solder joint
Tolerance
assumptions
Toe Heel Side
Component
F P J J J
T H S
L-1/L- L-1/L-
C Max. Mdn Min. C Max. Mdn Min. C Max. Mdn Min.
L S W
2/L-3 2/L-3
0,65 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,50 0,35 0,20 0,10 0,05 0,0 0,0
0,50 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,20 0,20 0,20 0,06 0,0 0,0 0,0
0,40 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,20 0,20 0,20 0,06 0,0 0,0 0,0
0,30 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,20 0,20 0,20 0,06 0,0 0,0 0,0
Figure 3 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3)

4.5 Land pattern dimensions
Figure 4 shows the land pattern dimensions for TSOP (Type 1) for reflow and flow soldering.
These values are calculated based on the formula for the solder joint fillet design of 4.4.
The courtyard is calculated using the following formula and rounded up (round up factor is to
the nearest 0,05 mm for minimum values and to the nearest 0,5 mm for maximum values).
2 2 2
CY =(Amin + F + P + C ) + (courtyard excess × 2)
A
1
2 2 2
CY ={whichever larger [Lmin + F + P + C ] or [Z]} + (courtyard excess × 2)
L
2

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– 12 – 61188-5-3 © IEC:2007(E)

CY2
Courtyard
C
G Y
Z
IEC  2012/07

Dimensions in millimetres
Level 1
Pattern Component
Z G X Y C D P CY1 CY2
identifier identifier
3000M TSOP 6x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 8,0 17,0
3001M TSOP 6x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 8,0 19,0
3002M TSOP 6x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 8,0 21,0
3004M TSOP 8x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 10,0 17,0
3005M TSOP 8x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 10,0 19,0
3006M TSOP 8x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 10,0 21,0
3008M TSOP 10x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 12,0 17,0
3009M TSOP 10x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 12,0 19,0
3010M TSOP 10x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 12,0 21,0
3012M TSOP 12x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 14,0 17,0
3013M TSOP 12x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 14,0 19,0
3014M TSOP 12x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 14,0 21,0
Level 2
Pattern Component
Z G X Y C D P CY1 CY2
identifier identifier
3000N TSOP 6x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 7,0 15,5
3001N TSOP 6x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 7,0 17,5
3002N TSOP 6x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 7,0 19,5
3004N TSOP 8x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 9,0 15,5
3005N TSOP 8x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 9,0 17,5
3006N TSOP 8x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 9,0 19,5
3008N TSOP 10x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 11,0 15,5
3009N TSOP 10x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 11,0 17,5
3010N TSOP 10x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 11,0 19,5
3012N TSOP 12x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 13,0 15,5
3013N TSOP 12x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 13,0 17,5
3014N TSOP 12x18 19,0 16,4 0,29 1,3 17,7 3,2 0,4
...