WG 1 - TC 47/SC 47E/WG 1

IEC 60747-18-4:2023(E) specifies the evaluation method for noise characteristics of lens-free CMOS photonic array sensors. This document includes the measurement setup, test procedure, test items, evaluation method, and test report for noise characteristics of lens-free CMOS photonic array sensors.

IEC 60747-18-5:2023(E) specifies the evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light. This document includes the test setup, test procedure, test item, and test report for lens-free CMOS photonic array sensor package modules.

IEC TS 60747-19-2:2021 provides a guideline of indication of specifications of a low-power sensor being a device or a module allowing autonomous power supply operation, which contributes to the low-power design of a smart sensing unit. Here, the smart sensing unit comprises a smart sensor, a terminal module, and a power supply, which can send output data of the smart sensor to the outside. This part also provides a guideline of indication of specifications of the power supply to drive the smart sensor(s) in the smart sensing unit. Based on these, the three components of the smart sensing unit can be easily selected and combined from the point-of-view of newly designed, low-power, smart sensing units.

IEC 60747-18-2:2020(E) specifies the evaluation process of lens-free CMOS photonic array sensor package modules. This document includes the measurement environment of each process, statistical analysis of test data, middle layer effect under various user light, evaluation of calibrated lens-free CMOS photonic array sensor package modules, and test report.

IEC 60747-18-3:2019(E) specifies the fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system for bio analysis. This document includes the measurement set-up, measurement and calculation at initial state flow, criteria of the fluidic system for quality assurance, measurement and calculation at steady-state flow, and test report.

IEC 60747-19-1:2019(E) specifies the control scheme of a sensor which is a device or a module which achieves a sensing function, data processing function and data output function, by employing a digital processing unit and a means of bidirectional communication between the sensor and an external terminal module

IEC 60747-14-10:2019 specifies the terms, definitions, symbols, tests, and performance evaluation methods used to determine the performance characteristics of wearable electrochemical-glucose sensors for practical use. This document is applicable to all wearable electrochemical-glucose sensors for consumers and manufacturers, without any limitations on device technology and size.

IEC 60747-18-1:2019 (E) specifies the test methods and data analysis for the calibration of lens-free CMOS photonic array sensors. This document includes the test conditions of each process, configuration of lens-free CMOS photonic array sensors, statistical analysis of test data, calibration for planarization and linearity, and test reports.

IEC 60747-14-4:2011 applies to semiconductor accelerometers for all types of products. This standard applies not only to typical semiconductor accelerometers with built-in electric circuits, but also to semiconductor accelerometers accompanied by external circuits. This standard does not (or should not) violate (or interfere with) the agreement between customers and suppliers in terms of a new model or parameters for business.
NOTE 1: This standard, although directed toward semiconductor accelerometers, may be applied in whole or in part to any mass produced type of accelerometer.
NOTE 2: The purpose of this standard is to allow for a systematic description, which covers the subjects initiated by the advent of semiconductor accelerometers. The tasks imposed on the semiconductor accelerometers are not only common to all accelerometers but also inherent to them and not yet totally solved. The descriptions are based on latest research results. One typical example is the multi-axis accelerometer. This standard states the method of measuring acceleration as a vector quantity using multi-axis accelerometers.
NOTE 3: This standard does not conflict in any way with any existing parts of either ISO 16063 or ISO 5347. This standard intends to provide the concepts and the procedures of calibration of the semiconductor multi-axis accelerometers which are used not only for the measurement of acceleration but also for the control of motion in the wide frequencies ranging from DC.
This publication is to be read in conjunction with IEC 60747-1:2006.

IEC 60747-14-5:2010 is applicable to semiconductor PN-junction temperature sensors and defines terms, definitions, symbols, essential ratings, characteristics and test methods that can be used to determine the characteristics of semiconductor types of PN-junction temperature sensors.

IEC 60747-14-1:2009 describes general items concerning the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors. Sensors described in this standard are basically made of semiconductor materials, however, the statements made in this standard are also applicable to sensors using materials other than semiconductor, for example dielectric and ferroelectric materials. The major changes with regard to the previous edition are as follows: a) Title change from "Semiconductor sensors - General and classification" to "Semiconductor sensors - Generic specification for sensors"; b) Clause 3 has been divided into three Clauses 3, 4 and 5; c) Added new terms from IEC 60747-14-5; d) Added a new Clause relating to Quality assessment procedures; e) Added a Bibliography; f) Added a new Annex for the sampling procedure.

IEC 60747-14-3:2009 specifies requirements for semiconductor pressure sensors measuring absolute, gauge or differential pressures. The major technical change with regard to the previous edition is the addition of a new subclause 5.9 (measuring method of linearity).
This publication should be read in conjunction with IE C 60747-1:2006.

Provides standards for packaged semiconductor Hall elements which utilize the Hall effect.