EN 60191-1:2007

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Gives guidelines on the preparation of outline drawings of discrete devices. For preparation of outline drawings of surface mounted discrete devices, IEC 60191-6 should be referred to as well. The main changes from the previous edition are as follows: - requirement added for SI-dimensions for new drawings to be published; - former rules concerning inch-dimensions are given in an informative annex; - former rules for coding are given in an informative annex; - incorporation of the supplements; - updating of references; - restructuring and renumbering.

Mechanische Normung von Halbleiterbauelementen - Teil 1: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen

Normalisation mécanique des dispositifs à semi-conducteurs - Partie 1: Règles générales pour la préparation des dessins d'encombrement des dispositifs discrets

La CEI 60191-1:2007 donne des lignes directrices pour la préparation des dessins d'encombrement des dispositifs discrets. Il convient également de se référer à la CEI 60191-6 pour la préparation des dessins d'encombrement des dispositifs discrets pour montage en surface. Les principales modifications par rapport à l'édition précédente sont les suivantes: - exigence ajoutée relative aux dimensions SI pour de nouveaux dessins à publier; - les anciennes règles concernant les dimensions en pouces sont indiquées dans une annexe informative; - les anciennes règles relatives à la codification sont indiquées dans une annexe informative; - incorporation des suppléments; - mise à jour des références et - restructuration et nouvelle numérotation.

Mehanska standardizacija polprevodniških elementov - 1. del: Splošna pravila za pripravo tehničnih risb diskretnih elementov (IEC 60191-1:2007)

General Information

• Status: Withdrawn
• Publication Date: 19-Jun-2007
• Withdrawal Date: 30-Apr-2010
• ICS: 01.100.20 - Mechanical engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 27-Feb-2021
• Completion Date: 27-Feb-2021
• Ref Project: SIST EN 60191-1:2008 - Mechanical standardization of semiconductor devices -- Part 1: General rules for the preparation of outline drawings of discrete devices

Relations

• Replaced By: EN IEC 60191-1:2018 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
• Effective Date: 01-Nov-2016

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2008
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Mechanical standardization of semiconductor devices -- Part 1: General rules for the
preparation of outline drawings of discrete devices
Mechanische Normung von Halbleiterbauelementen -- Teil 1: Allgemeine Regeln für die
Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen
Normalisation mécanique des dispositifs à semi-conducteurs. - Partie 1: Règles
générales pour la préparation du dessin des boîtiers des dispositifs à semi-conducteurs
Ta slovenski standard je istoveten z: EN 60191-1:2007
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60191-1
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices -
Part 1: General rules for the preparation
of outline drawings of discrete devices
(IEC 60191-1:2007)
Normalisation mécanique des dispositifs  Mechanische Normung
à semi-conducteurs - von Halbleiterbauelementen -
Partie 1: Règles générales Teil 1: Allgemeine Regeln
pour la préparation du dessin für die Erstellung
des boîtiers des dispositifs von Gehäusezeichnungen
à semi-conducteurs von Einzelhalbleiterbauelementen
(CEI 60191-1:2007) (IEC 60191-1:2007)

This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-1:2007 E
Foreword
The text of document 47D/678/FDIS, future edition 2 of IEC 60191-1, prepared by SC 47D, Mechanical
standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the
IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-1 on 2007-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-1:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60191-6 NOTE  Harmonized as EN 60191-6:2004 (not modified).
__________
- 3 - EN 60191-1:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60191-2 1966 Mechanical standardization of semiconductor - -
+ supplements devices -
+ amendments Part 2: Dimensions

1) 2)
IEC 60191-4 - Mechanical standardization of semiconductor EN 60191-4 1999
devices -
Part 4: Coding system and classification into
forms of package outlines for semiconductor
device packages
3) 1)
ISO 370 - Toleranced dimensions - Conversion from - -
inches into millimetres and vice versa

1)
Undated reference.
2)
Valid edition at date of issue.
3)
ISO 370 has been withdrawn on 2000-05-18.

INTERNATIONAL IEC
STANDARD 60191-1
Second edition
2007-04
Mechanical standardization of semiconductor
devices –
Part 1:
General rules for the preparation of outline
drawings of discrete devices
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60191-1 © IEC:2007(E)
CONTENTS
FOREWORD.4

1 Scope and object.6
2 Normative references .6
3 Terms and definitions .6
4 General rules for all drawings .8
4.1 Drawing layout .8
4.2 Dimensions and tolerances .8
4.3 Methods for locating the datum .10
4.4 Numbering of terminals .10
5 Additional rules .12
5.1 Rules for device and case outline drawings .12
5.2 Rules to specify the dimensions and positions of terminals.12
5.3 Rules for gauge drawings.13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off.13
7 Rules for coding .14

Annex A (informative) Reference letter symbols.15
Annex B (normative) Standardization philosophy .18
Annex C (informative) Rules to specify the dimensions and positions of terminals on a
base drawing .23
Annex D (normative) General philosophy of flat base devices .30
Annex E (informative) Examples of semiconductor device drawing .32
Annex F (informative) Former rules for rounding off .36
Annex G (informative) Former rules for coding.38

Bibliography.39

Figure 1 – Numbering of terminals of lozenge – shaped bases.11
Figure 2 – System to indicate the dimensions of the terminals .13
Figure B.1 − Example of rigid lug device .21
Figure B.2 − Example of flexible terminal device .22
Figure C.1 – Circular base outline with no tab.27
Figure C.2 – Tolerances of terminals .27
Figure C.3 – Gauge for a circular base outline with no tab .28
Figure C.4 – Circular base outline with tab.29
Figure C.5 – Gauge for a circular base outline with tab .29
Figure D.1 − Example of flat base outline.31
Figure E.1 − Long form package .32
Figure E.2 − 3 types of post/stud mount packages .32
Figure E.3 − 2 types of cylindric packages .33
Figure E.4 − Oval package, terminals in line .34

60191-1 © IEC:2007(E) – 3 –
Figure E.5 − Cylindric package with different terminations .34
Figure E.6 − Flange mount package.34
Figure E.7 − Disk button package with 3 terminations .35
Figure E.8 − Special shape for bolt-fixture .35

Table A.1 – Dimensions of reference letter symbols.15

– 4 – 60191-1 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 1: General rules for the preparation of outline drawings
of discrete devices
FOREWORD
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