SIST EN 60917-2-3:2007

Modular order for the development of mechanical structures for electronic equipment practices -- Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units

This part of IEC 60917 provides additional dimensions for a modular range of subracks and associated plug-in units based on IEC 60917-2-2. A typical subrack consists of a frame design with mounting dimensions for installation into racks or cabinets in accordance with IEC 60917-2-1. The aperture dimensions of a subrack are specified in order to meet the mounting dimensions of front plug-in units. This part of IEC 60917 comprises - additional dimensions for subracks and subrack associated plug-in units with injector/ extractor handle; - dimensions for basic electromagnetic shielding provisions; - dimensions of the key/coding system for subrack and plug-in units; - dimensions of the alignment pin for front panel and plug-in unit; - dimensions of electrostatic discharge provisions; - dimensions of rear-mounted plug-in units. Connector-related dimensions are given in Annex A. In order to ensure the compatibility of plug-in units into the subrack, inspection dimensions and connector-dependent dimensions are defined.

Modulordnung für die Entwicklung von Bauweisen für elektronische Einrichtungen -- Teil 2-3: Strukturnorm - Schnittstellen-Koordinationsmaße für die 25-mm-Bauweise - Erweiterte Maßnorm - Maße für Baugruppenträger, Einschübe, Rückplatten, Frontplatten und steckbare Baugruppen

Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques -- Partie 2-3: Norme intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Spécification particulière étendue - Dimensions pour bacs, châssis, fonds de panier, faces avant et blocs enfichables

La CEI 60917-2-3:2006 Fournit d'autres dimensions pour une gamme modulaire de bacs et d'unités enfichables associées basées sur la CEI 60917-2-2. Un bac typique est constitué d'un cadre avec des dimensions de montage pour l'installation dans des bâtis ou des baies selon la CEI 60917-2-1. Les dimensions des ouvertures d'un bac sont spécifiées pour satisfaire aux dimensions de montage des unités enfichables avant. La présente partie de la CEI 60917 comprend d'autres dimensions pour des bacs et des unités enfichables associées aux bacs avec une poignée d'introduction/extraction, des dimensions de dispositifs de blindage électromagnétiques de base, des dimensions de système de codage/verrouillage pour les bacs et les unités enfichables, des dimensions de tige d'alignement pour les panneaux avant et les unités enfichables, des dimensions de dispositifs de décharge électrostatique et des dimensions d'unités enfichables montées sur l'arrière. La présente version bilingue (2013-06) correspond à la version anglaise monolingue publiée en 2006-05.
Mots-clés : bac, unités enfichables, châssis

Modulno zaporedje pri razvoju mehanskih struktur po izkušnjah za elektronsko opremo - 2-3. del: Področna specifikacija - Usklajevanje vmesnikovih mer za 25 mm-sko opremo - Razširjena podrobna specifikacija - Mere za šasije stojal/okvirov, hrbtne plošče, čelne plošče in vtične enote (IEC 60917-2-3:2006)

General Information

• Status: Published
• Publication Date: 31-Dec-2006
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Jan-2007
• Due Date: 01-Jan-2007
• Completion Date: 01-Jan-2007
• Ref Project: EN 60917-2-3:2006 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units

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EUROPEAN STANDARD
EN 60917-2-3

NORME EUROPÉENNE
July 2006
EUROPÄISCHE NORM

ICS 31.240
English version

Modular order for the development of mechanical structures
for electronic equipment practices
Part 2-3: Sectional specification -
Interface co-ordination dimensions for the 25 mm equipment practice -
Extended detail specification -
Dimensions for subracks, chassis, backplanes, front panels
and plug-in units
(IEC 60917-2-3:2006)

Ordre modulaire pour le développement Modulordnung für die Entwicklung
des structures mécaniques pour von Bauweisen für
les infrastructures électroniques elektronische Einrichtungen
Partie 2-3: Norme intermédiaire - Teil 2-3: Strukturnorm –
Dimensions de coordination pour Schnittstellen-Koordinationsmaße für
les interfaces des infrastructures die 25-mm-Bauweise –
au pas de 25 mm - Erweiterte Maßnorm –
Spécification particulière étendue - Maße für Baugruppenträger, Einschübe,
Dimensions pour bacs, châssis, fonds de Rückplatten, Frontplatten und
panier, faces avant et blocs enfichables steckbare Baugruppen
(CEI 60917-2-3:2006) (IEC 60917-2-3:2006)

This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60917-2-3:2006 E

---------------------- Page: 2 ----------------------

EN 60917-2-3:2006 - 2 -
Foreword
The text of document 48D/338/FDIS, future edition 1 of IEC 60917-2-3, prepared by SC 48D, Mechanical
structures for electronic equipment, of IEC TC 48, Electromechanical components and mechanical
structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved
by CENELEC as EN 60917-2-3 on 2006-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-03-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-06-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60917-2-3:2006 was approved by CENELEC as a European
Standard without any modification.
__________

---------------------- Page: 3 ----------------------

- 3 - EN 60917-2-3:2006
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.


Publication Year Title EN/HD Year

IEC 60917-1 1998 Modular order for the development of EN 60917-1 1998
mechanical structures for electronic
equipment practices
Part 1: Generic standard


IEC 60917-2-1 1993 Modular order for the development of EN 60917-2-1 1995
mechanical structures for electronic
equipment practices
Part 2: Sectional specification - Interface
co-ordination dimensions for the 25 mm
equipment practice
Section 1: Detail specification - Dimensions
for cabinets and racks


IEC 60917-2-2 1994 Modular order for the development of EN 60917-2-2 1996
mechanical structures for electronic
equipment practices
Part 2: Sectional specification - Interface
co-ordination dimensions for the 25 mm
equipment practice
Section 2: Detail specification - Dimensions
for subracks, chassis, backplanes, front
panels and plug-in units


IEC 61076-4-100 2001 Connectors for electronic equipment EN 61076-4-100 2001
Part 4-100: Printed board connectors with
assessed quality - Detail specification for
two-part connector modules having a grid of
2,5 mm for printed boards and backplanes


IEC 61076-4-101 2001 Connectors for electronic equipment EN 61076-4-101 2001
+ corr. November 2003 Part 4-101: Printed board connectors with
assessed quality - Detail specification for
two-part connector modules, having a basic
grid of 2,0 mm for printed boards and
backplanes in accordance with IEC 60917


IEC 61076-4-104 1999 Connectors for use in d.c. low-frequency EN 61076-4-104 1999
analogue and digital high speed data
applications
Part 4-104: Printed board connectors with
assessed quality - Detail specification for
two-part modular connectors, basic grid of
2,0 mm, with terminations on a multiple grid
of 0,5 mm

---------------------- Page: 4 ----------------------

INTERNATIONAL IEC


STANDARD 60917-2-3





First edition
2006-05


Modular order for the development
of mechanical structures
for electronic equipment practices –

Part 2-3:
Sectional specification –
Interface co-ordination dimensions
for the 25 mm equipment practice –
Extended detail specification –
Dimensions for subracks, chassis, backplanes,
front panels and plug-in units

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale V
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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– 2 – 60917-2-3  IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object.8
2 Normative references .8
3 Terms and definitions .9
4 Arrangement overview.9
5 Subrack dimensions for injector/extractor handle of plug-in units.10
5.1 Subrack interface dimensions.10
6 Dimensions of injector/extractor handle for plug-in units .12
6.1 Injector/extractor handle interface dimensions.12
6.2 Handle-locking function .14
7 Subrack and plug-in units with electromagnetic shielding provision .14
7.1 Subrack interface dimensions for electromagnetic shielding provision .14
7.2 Front panel/plug-in unit interface dimensions .17
8 Key/coding system for subrack and plug-in units .18
8.1 Subrack interface dimensions – Key/coding system on the plug-in unit guides .19
8.2 Key dimensions – Key/coding system on the plug-in unit guides.20
8.3 Programming of key – Key/coding system on the plug-in guides.22
8.4 Keying chamber inspection dimensions .22
9 Alignment pin and/or electrical contact for front panels and plug-in units .23
9.1 Alignment pins and receptacle plates on the subrack horizontal members .24
9.2 Alignment and/or electrical contact pins and receptacles on the subrack
plug-in unit guides.25
10 Electrostatic discharge provision for plug-in units and subracks.27
10.1 ESD contact interface dimensions .28
10.2 ESD strip interface dimensions.28
11 Subrack dimensions for rear-mounted plug-in units .32

Annex A Subrack, plug-in unit and backplane dimensions for using metric connectors.33

Figure 1 – Typical example of large subracks in a wide cabinet, equipped mass
volume of copper/optical cables installation .7
Figure 2 – Subject for development of extended connector application packaging and
key elements of interconnection between functional plug-in modules via backplane in
the future packaging system .7
Figure 3 – Arrangement overview .9
Figure 4 – Subrack interface dimensions, injector/extractor handles for plug-in units .11
Figure 5 – Detail X and detail Y, subrack interface dimensions, injection/extraction
handles for plug-in units.12
Figure 6 – Plug-in units interface dimensions, injection/extraction handle for plug-in units .13
Figure 7 – Detail X and detail Y, plug-in interface dimensions, injector/extractor
handles for plug-in units.14
Figure 8 – Subrack interface dimensions, electromagnetic shielding provisions .15

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60917-2-3  IEC:2006(E) – 3 –
Figure 9 – Detail X and detail Y, subrack interface dimensions, electromagnetic
shielding provisions .16
Figure 10 – Front panel/plug-in unit interface dimensions, electromagnetic shielding
provisions .17
Figure 11 – Arrangement of key/coding system for plug-in units.18
Figure 12 – Subrack interface dimensions – Key/coding system on the plug-in unit
guides.19
Figure 13 – Plug-in unit interface dimensions – Key/coding system on the plug-in unit
guides.20
Figure 14 – Key dimensions and rotated key positions – Key/coding system on the
plug-in unit guides .21
Figure 15 – Programming of keys .22
Figure 16 – Arrangement of alignment pin system for subracks and plug-in units.23
Figure 17 – Subrack interface dimensions, alignment pins and receptacle plates on
the horizontal members .24
Figure 18 – Plug-in unit interface dimensions, alignment pins and receptacle plates on
the horizontal members .25
Figure 19 – Subrack interface dimensions, alignment and/or electrical contact pin
receptacles on the plug-in unit guides.26
Figure 20 – Plug-in unit interface dimensions, alignment and/or electrical contact pin
receptacles on the plug-in unit guides.27
Figure 21 – Subrack interface dimensions, ESD contacts on the plug-in guides .28
Figure 22 – Plug-in unit interface dimensions, ESD strips on the plug-in boards .29
Figure 23 – Subrack dimensions for rear mounted plug-in units .32
Figure A.1 – Subrack, plug-in unit and backplane dimensions for using 2,5 mm metric
connectors in accordance with IEC 61076-4-100.33
Figure A.2 – Subrack, plug-in unit and backplane dimensions for using 2 mm metric
connectors in accordance with IEC 61076-4-101.34
Figure A.3 – Subrack, plug-in unit and backplane dimensions for using 2 mm metric
connectors in accordance with IEC 61076-4-104.35

Table 1 – Inspection dimensions of subrack and plug-in unit keying chambers.22
Table 2 – Dimensions of subracks and plug-in units based on IEC 60917-2-2 .30
Table 3 – Dimensions of subracks and boards for rear-mounted plug-in units .32

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– 4 – 60917-2-3  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISION
___________

MODULAR ORDER FOR THE DEVELOPMENT
OF MECHANICAL STRUCTURES
FOR ELECTRONIC EQUIPMENT PRACTICES –

Part 2-3: Sectional specification – Interface co-ordination dimensions
for the 25 mm equipment practice – Extended detail specification –
Dimensions for subracks, chassis, backplanes, front panels
and plug-in units


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60917-2-3 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
The text of this standard is based on following documents:
FDIS Report on voting
48D/338/FDIS 48D/342/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

---------------------- Page: 8 ----------------------

60917-2-3  IEC:2006(E) – 5 –
IEC 60917 consists of the following parts, under the general title Modular order for the
development of mechanical structures for electronic equipment practices:
Part 1: Generic standard
Part 2: Sectional specification – Interface co-ordination dimensions for the 25 mm
equipment practice
Part 2-1: Sectional specification – Interface co-ordination dimensions for the 25 mm
equipment practice – Detail specification – Dimensions for cabinets and racks
Part 2-2: Sectional specification – Interface co-ordination dimensions for the 25 mm
equipment practice – Detail specification – Dimensions for subracks, chassis,
backplanes, front panels and plug-in units
Part 2-3: Sectional specification – Interface co-ordination dimensions for the 25 mm
equipment practice – Extended detail specification – Dimensions for subracks,
chassis, backplanes, front panels and plug-in units
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

---------------------- Page: 9 ----------------------

– 6 – 60917-2-3  IEC:2006(E)
INTRODUCTION
The dimensions in the detail specification for the 25 mm equipment practice standard are laid
down in the IEC 60917-2 series.
Significant progress in electronics circuitry, with increasing signal speed and the demand for
high availability of the electronics systems, has made an impact on the structural parts of the
equipment, as specified in IEC 60917-2-2.
a) Considerations on the general tendency of the enclosure system
At the moment, the general tendencies of the enclosure system for telecom/IT equipment
application and associated application are considered to be:
– the changing form of conventional centralized networking for telecommunication to
flexible distributed networking to realize ubiquitous communication and computing
environment by broad-band/IP and photonics-networking-based technology;
– flexible configuration of networking equipment from the open market is requested;
– a scalable and high-performance packaging/enclosure system is requested for new
networking equipment;
– in addition, such a packaging/enclosure system will be widely applied for general
electronic equipment, because IP networking technology is becoming one of the
common interfaces for all of industrial systems.
Consequently, the following general requirements for the new enclosure system arise.
– Standard-based but various sized networking/IT equipment from the open market
should be installed in one cabinet (see figure 1).
– The mass volume of copper/optical cables from the equipment should be managed in
the cabinet.
– Networking/IT cabinets will be increasingly sited at general offices in enterprise
buildings rather than at traditional technical rooms in telecom-central offices.
In order to meet these market needs, the implementation of additional specified
dimensions for extended features based on IEC 60917-2-2 became necessary.
b) Subject for development of extended connector application packaging based on
IEC 60917 series
The existing IEC 60917 series, which is structured on the modular concept of 25 mm, is
based on the IEC standardized metric connector. However, the system packaging uses to
many non-standardized enhanced connectors, which are necessary to realize the system
functions and level of performance (see Figure 2).
NOTE IEC Subcommittee 48D, Working Group 2, reviews the trends in system packaging, in which key elements
are electrical/optical signal interfaces and connectors, as well as the general tendency of the new enclosure
system. From these aspects, the IEC Subcommittee 48D, Working Group 2 has recently developed IEC 60917-2-3
which will be applicable to system packaging for high-speed and other system applications in the near future.

---------------------- Page: 10 ----------------------

60917-2-3  IEC:2006(E) – 7 –
IEC  681/06

Figure 1 – Typical example of large subracks in a wide cabinet,
equipped mass volume of copper/optical cables installation
Metal wired/fibre-optic

Rear plug-in
linked backplane or
module
middleplane

Internal interface
inter SMDs/BGAs
on the module
High density and
high speed
connector
Functional module
unit with high density
multi-chip module BGA
High speed fibre
optic connector
High density multi-chip
Front plug-in
module (3D structured IC
module
mounted functional
SMD/BGA unit)
IEC  682/06

Key
SMD: Surface Mount Device.
BGA: Ball Grid Array.
Figure 2 – Subject for development of extended connector application packaging
and key elements of interconnection between functional plug-in modules
via backplane in the future packaging system

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– 8 – 60917-2-3  IEC:2006(E)
MODULAR ORDER FOR THE DEVELOPMENT
OF MECHANICAL STRUCTURES
FOR ELECTRONIC EQUIPMENT PRACTICES –

Part 2-3: Sectional specification – Interface co-ordination dimensions
for the 25 mm equipment practice – Extended detail specification –
Dimensions for subracks, chassis, backplanes, front panels
and plug-in units


1 Scope and object
This part of IEC 60917 provides additional dimensions for a modular range of subracks and
associated plug-in units based on IEC 60917-2-2.
A typical subrack consists of a frame design with mounting dimensions for installation into
racks or cabinets in accordance with IEC 60917-2-1. The aperture dimensions of a subrack
are specified in order to meet the mounting dimensions of front plug-in units.
This part of IEC 60917 comprises
– additional dimensions for subracks and subrack associated plug-in units with injector/
extractor handle;
– dimensions for basic electromagnetic shielding provisions;
– dimensions of the key/coding system for subrack and plug-in units;
– dimensions of the alignment pin for front panel and plug-in unit;
– dimensions of electrostatic discharge provisions;
– dimensions of rear-mounted plug-in units.
Connector-related dimensions are given in Annex A.
In order to ensure the compatibility of plug-in units into the subrack, inspection dimensions
and connector-dependent dimensions are defined.
NOTE The drawings used in this part of IEC 60917 are not intended to indicate product design, only the specific
dimensions that are used.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60917-1:1998, Modular order for the development of mechanical structures for electronic
equipment practices – Part 1: Generic standard
IEC 60917-2-1:1993, Modular order for the development of mechanical structures for
electronic equipment practice – Part 2: Sectional specification – Interface co-ordination
dimensions for the 25 mm equipment practice – Section 1: Detail specification – Dimensions
for cabinets and racks
IEC 60917-2-2:1994, Modular order for the development of mechanical structures for
electronic equipment practice – Part 2: Sectional specification – Interface co-ordination
dimensions for the 25 mm equipment practice – Section 2: Detail specification – Dimensions
for subracks, chassis, backplanes, front panels and plug-in units

---------------------- Page: 12 ----------------------

60917-2-3  IEC:2006(E) – 9 –
IEC 61076-4-100:2001, Connectors for electronic equipment – Part 4-100: Printed board
connectors with assessed quality – Detail specification for two-part connector modules having
a grid of 2,5 mm for printed boards and backplanes
IEC 61076-4-101:2001, Connectors for electronic equipment – Part 4-101: Printed board
connectors with assessed quality – Detail specification for two-part connector modules,
having a basic grid of 2,0 mm for printed boards and backplane in accordance with IEC 60917
IEC 61076-4-104:1999, Connectors for use in d.c., low frequency analogue and digital high
speed data application – Part 4-104: Printed board connectors with assessed quality – Detail
specification for two-part modular connectors, basic grid of 2,0 mm, with terminations on a
multiple grid of 0,5 mm
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60917-1 apply.
4 Arrangement overview
Typical subrack with front and rear plug-in units (see Figure 3).

Typical rear
plug-in unit
Typical front
plug-in unit
Side
panel
Printed
board
Typical backplane/
middleplane
Front panel
Typical subrack
mounting flange
Typical plug-in unit
Typical injector/extractor
guide with subrack
handle mounted on
key chamber and
front panel
Typical horizontal member
alignment and/or
for injector/extractor handle
earth pin receptacle
IEC  683/06

Figure 3 – Arrangement overview

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– 10 – 60917-2-3  IEC:2006(E)
5 Subrack dimensions for injector/extractor handle of plug-in units
5.1 Subrack interface dimensions
The following subrack interface dimensions shall be used only for applications with enhanced
injector/extractor handles that are defined in Clause 6 of this part of IEC 60917.
The basic dimensions of the subrack are in accordance with IEC 60917-2-2. Only the
additional dimens
...